Segmented cooling circulation type ultraviolet curing electrodeless light source case

Abstract

The utility model discloses a subsection cooling circulation type ultraviolet curing electrodeless light source case, and relates to the technical field of ultraviolet curing, the upper end of a case body is provided with a cooling air inlet pipe butt joint port, and the lower end of the cooling air inlet pipe butt joint port is provided with a subsection type air guide component; a circuit board and a connector in the case are isolated in a weak airflow cooling small space by the sectional air guide part, and a small amount of air is guided into the weak airflow cooling small space through a small air inlet of the main air guide plate to cool an internal circuit assembly. And then the weak air flow is exhausted from two small air outlets in the two sides of the lower part of the small isolation space and converges back to the main air duct. Cooling air of the main air guiding channel is blown downwards from the side end into the cooling fin set of the magnetron, the waveguide cavity and the electrodeless light source irradiation part for cooling, and finally the cooling air is discharged out of the case body from the lower end of the case body. The temperature of a top end circuit component in the light source box body is greatly reduced by adopting a simple isolation and air guide structure, and the reliability, the service life and the safety of long-time operation of equipment are improved.

Description

Technical Field

[0001] This utility model relates to the field of ultraviolet curing technology, specifically to a segmented cooling circulation type ultraviolet curing electrodeless light source chassis. Background Technology

[0002] Ultraviolet (UV) curing technology is a process that uses ultraviolet light to cure specific coatings or adhesives, and it is widely used in electronic components, printing, packaging, and other fields. The UV curing enclosure, as the core component of a UV light source device, is mainly used to support and physically arrange the various components of the UV light source lamp head, while also providing effective heat dissipation management to ensure that the components inside the lamp head operate stably at a suitable operating temperature.

[0003] Traditional UV curing enclosures typically include core components such as a waveguide cavity, magnetron, and irradiation unit. UV light is generated within the irradiation unit and directed onto the object to be treated via a reflector. However, the magnetron and irradiation unit generate significant heat during operation, and insufficient heat dissipation can lead to excessively high internal temperatures, affecting the reliability and lifespan of internal circuit components and connectors. Therefore, UV curing enclosures are usually equipped with a high-pressure cooling system that introduces high-pressure cold air into the enclosure to achieve cooling.

[0004] like Figure 5 As shown, while existing UV curing enclosures can maintain stable long-term operation of the light source through cooling systems, they still suffer from a relatively high failure rate of internal sensors. Taking the semi-focusing mounting mechanism for the UV curing electrodeless light source tube disclosed in CN215997399U as an example, its structural design involves cooling air entering the cavity from the air inlet duct at the top of the enclosure, passing sequentially through the magnetron heat sink assembly, the waveguide cavity, and the electrode light source irradiation section. Due to this air-cooling method, the wind pressure sensor and photosensitive sensor inside the enclosure are exposed to the cooling airflow passing through the magnetron heat sink assembly. This airflow is heated to a high temperature, resulting in the entire enclosure operating at a high temperature for extended periods, reaching approximately 80°C. This causes the photosensitive sensor, its circuit board, and system electrical connectors to operate at high temperatures for extended periods, making them prone to failure, accelerating aging, and reducing equipment stability.

[0005] Based on the above issues, the heat dissipation design of existing UV curing enclosures urgently needs optimization. Isolating the circuit components and their connectors in a small space and cooling them with the air inlet will greatly reduce the operating temperature of these electrical components, thereby improving their reliability and enhancing the overall stability and safety of the equipment. Utility Model Content

[0006] The problem this invention aims to solve is to change the operation of circuit components and electrical connectors in existing UV curing enclosures from hot air to cold air, and to address issues such as high operating temperature, high failure rate, and short lifespan of internal sensors. The invention provides a segmented cooling circulating UV curing electrodeless light source enclosure.

[0007] To address the aforementioned issues, this invention provides a segmented cooling circulation type UV curing electrodeless light source chassis, comprising a chassis body. Inside the chassis body are a magnetron, a heat sink assembly located in the middle of the magnetron, a waveguide cavity located at the lower end of the heat sink assembly, and an electrodeless light source irradiation section located inside the bottom of the waveguide cavity. A cooling air inlet duct interface is provided at the upper end of the chassis body. A circuit board with a photosensitive sensor and an electrical connector are located at the upper end of the magnetron. A segmented air guide component is located at the lower end of the cooling air inlet duct interface. This segmented air guide component is fixedly located at the upper end of the magnetron and isolates the photosensitive sensor circuit board within the chassis in a small, weak airflow circulation space. A small amount of air is introduced into this small space by the segmented air guide component to cool the photosensitive sensor circuit board. The remaining large amount of air is blown downwards through the main side air duct by the segmented air guide component to the heat sink assembly, waveguide cavity, and electrodeless light source irradiation section of the magnetron for cooling, and finally discharged from the bottom of the chassis.

[0008] Preferably, the segmented air guiding component includes a main air guide plate. A segmented air guiding mechanism is provided on the main air guide plate at the lower end of the cooling air inlet pipe interface. An isolation plate is fixedly connected to the lower side of the main air guide plate. The segmented air guiding mechanism includes an air inlet slot at the upper end of the main air guide plate and air outlet slots on both sides of its lower end. The main air guide plate and the isolation plate form a small, weak airflow circulation space, enclosing the circuit board of the photosensitive sensor within it. A small amount of air is introduced into the small, weak airflow circulation space through the air inlet and outlet slots on the main air guide plate to cool the circuit board of the photosensitive sensor. By setting the main air guide plate and the isolation plate, the internal circuit components such as the photosensitive sensor are isolated in a small, airflow-circulating cooling space, and the cooling air is rationally guided into the airflow circulation space to circulate and cool the photosensitive sensor. The main air guide plate is provided with an air inlet slot and an air outlet slot. The air inlet slot is connected to the interior of the small, weak airflow circulation space, thereby allowing the cooling air to effectively enter the photosensitive sensor and be discharged through the air outlet slot after effective heat dissipation. Compared to traditional single-cooling-path chassis, the segmented structure avoids the inability of externally introduced cooling air to directly and effectively cool the upper side photosensitive sensor. This allows for even distribution of cooling air to the photosensitive sensor, magnetron, waveguide cavity, and lower components, ensuring effective cooling for each part. This achieves uniform heat dissipation for critical components, preventing localized overheating and improving equipment stability and lifespan. Through airflow diversion and channel optimization, the cooling air circulates thoroughly within the chassis. Compared to existing technologies, the cooling airflow path is more rational, not only improving heat dissipation efficiency but also preventing disordered airflow within the cavity that could affect overall heat dissipation, further guaranteeing the equipment's cooling efficiency and operational stability.

[0009] Preferably, the isolation plate has a flat plate structure and is fixedly installed on the upper end of the magnetron. The flat plate structure isolates the circuit part inside the chassis in a small, sealed space to achieve independent air cooling, thereby further extending the life of the circuit components.

[0010] Preferably, the main airflow deflector has an angled plate structure, and the air inlet slot communicates with the inner end of the small space with weak airflow circulation. The angled main airflow deflector allows cooling air to enter the airflow circulation space more smoothly through the air inlet slot and generate a cooling cycle for photosensitive sensors and other components within the space. Compared to traditional straight-line air duct designs, the angled plate structure can effectively reduce airflow resistance, increase the flow speed of cooling air, improve cooling efficiency, and make airflow smoother, further reducing the temperature of photosensitive sensors and enhancing the cooling efficiency of the equipment.

[0011] Preferably, the isolation plate is provided with a light-transmitting window, and a photosensitive sensor is set at the upper end of the light-transmitting window. The light leaking from the air hole at the top of the irradiation part is reflected multiple times inside the chassis to form slow reflection light. The photosensitive sensor can detect whether the irradiation part is emitting light through the light-transmitting window.

[0012] Compared with the prior art, the present invention achieves the following beneficial technical effects:

[0013] This invention optimizes the flow path of cooling air through a segmented air guide component, rationally distributing the cooling air to the photosensitive sensor, magnetron, waveguide cavity, and electrodeless light source irradiation section. The segmented air guide component directs a small amount of airflow into a weak airflow circulation space to cool the internal circuit components such as the photosensitive sensor. The majority of the airflow flows downwards from the side through the segmented air guide component into the magnetron, waveguide cavity, and electrodeless light source irradiation section for cooling circulation. This segmented cooling structure avoids the problem in existing technologies where the cooling air cannot effectively dissipate heat from the upper side of the photosensitive sensor, ensuring uniform heat dissipation throughout the chassis, effectively reducing the temperature of the photosensitive sensor and other circuit components, lowering the failure rate of circuit components, and extending the service life of the equipment.

[0014] This invention utilizes a segmented cooling circulation system with segmented airflow components to effectively control the temperature near the sensitive sensors inside the chassis, avoiding the undesirable situation in existing technologies where the temperature near the circuitry components such as the internal photosensors reaches as high as 80°C. The significant temperature reduction decreases the aging of internal circuitry components such as plastic connectors and circuit boards, delaying component wear and tear, and improving the stability and lifespan of the equipment. Simultaneously, the significantly lower internal chassis temperature reduces the risk of burns to operators during maintenance and repair, enhancing equipment safety.

[0015] This invention optimizes the distribution of cooling air, making its use more efficient. The segmented airflow ensures that each critical component receives adequate cooling, achieving ideal heat dissipation without requiring additional airflow, thus improving equipment heat dissipation capacity while saving energy. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the internal structure of the segmented cooling circulating ultraviolet curing electrodeless light source chassis of this utility model.

[0017] Figure 2 This is a schematic diagram of the back of the segmented cooling circulating ultraviolet curing electrodeless light source chassis of this utility model.

[0018] Figure 3 This is a magnified view of the interface between the cooling air intake duct and the chassis.

[0019] Figure 4 This is a schematic diagram of a segmented air guide component.

[0020] Figure 5 This is a schematic diagram of the airflow direction of an existing UV curing electrodeless light source chassis.

[0021] Figure 6 This is a structural schematic diagram of the airflow direction of the segmented cooling circulating UV curing electrodeless light source chassis of this utility model.

[0022] In the diagram: 1-Chassis body, 2-Magnetron, 3-Heat sink assembly, 4-Waveguide cavity, 5-Electronic light source irradiation section, 6-Cooling air inlet duct interface, 7-Segmented air guide component, 701-Isolation plate, 702-Main airflow plate, 703-Air inlet slot, 704-Air outlet slot, 8-Photosensitive sensor, 9-Light-transmitting window. Detailed Implementation

[0023] The present invention will be further explained below with reference to the accompanying drawings and embodiments.

[0024] Reference Figure 1 , Figure 2 , Figure 6 As shown, this utility model provides a segmented cooling circulation type UV curing electrodeless light source chassis, including a chassis body 1. The chassis body 1 is provided with a magnetron 2, a heat sink assembly 3 located in the middle of the magnetron 2, a waveguide cavity 4 located at the lower end of the heat sink assembly 3, and an electrodeless light source irradiation part 5 located inside the bottom end of the waveguide cavity 4. A cooling air inlet duct interface 6 is provided at the upper end of the chassis body 1. A photosensitive sensor 8 is provided at the upper end of the magnetron 2. A segmented air guide component 7 is provided at the lower end of the cooling air inlet duct interface 6. The segmented air guide component 7 is fixedly installed at the upper end of the magnetron 2 and isolates the photosensitive sensor 8 in a small space with weak airflow circulation. A small amount of air enters the small space with weak airflow circulation through the segmented air guide component 7 to cool and circulate the photosensitive sensor 8. The remaining air volume enters the magnetron 2, the waveguide cavity 4, and the electrodeless light source irradiation part 5 from the side through the segmented air guide component 7 for cooling and circulation. The segmented airflow path of the cooling air is optimized by using the segmented airflow guide component 7. This allows for the rational distribution of cooling air to the segmented airflow guide component 7, which isolates the photosensitive sensor 8 into a separate airflow circulation space, as well as the magnetron 2, waveguide cavity 4, and electrodeless light source irradiation section 5. The segmented structure avoids the problem of the cooling air not being able to effectively dissipate heat from the upper side of the photosensitive sensor 8, ensuring uniform heat dissipation throughout the chassis, effectively reducing the temperature of the photosensitive sensor, and extending the service life of the equipment.

[0025] Reference Figure 1 , 3As shown in Figures 4 and 6, the segmented air guide component 7 includes an isolation plate 701, which is fixedly mounted on the upper end of the magnetron 2. A main air guide plate 702 is connected to the upper end of the isolation plate 701. An air inlet slot 703 is provided on the upper end of the main air guide plate 702, and air outlet slots 704 are provided on both sides of the lower end of the main air guide plate 702. By setting the isolation plate, the photosensitive sensor 8 is isolated in a small space with weak airflow circulation, and the cooling air is reasonably guided into the small space with weak airflow circulation to circulate and cool the photosensitive sensor 8. The main air guide plate 702 is provided with an air inlet slot 703 and an air outlet slot 704. The air inlet slot 703 is connected to the interior of the small space with weak airflow circulation, so that the cooling air can effectively enter the photosensitive sensor 8 and be discharged from the air outlet slot 704 after effective heat dissipation. Compared to traditional single cooling airflow paths, the segmented structure prevents cooling air from failing to effectively dissipate heat from the upper side photosensitive sensor 8. This allows for even distribution of cooling air to the photosensitive sensor 8, the magnetron, the waveguide cavity, and the lower components, ensuring effective cooling for each part. This achieves uniform heat dissipation for key components, preventing localized overheating and improving the equipment's operational stability and lifespan. Through airflow diversion and channel optimization, the cooling airflow is ensured to circulate fully within the chassis. Compared to existing technologies, the cooling airflow path is more rational, not only improving heat dissipation efficiency but also preventing disordered airflow within the cavity that could affect overall heat dissipation, further guaranteeing the equipment's cooling efficiency and operational stability.

[0026] The isolation plate 701 has a flat plate structure and is located on the upper end of the magnetron 2. The flat plate structure of the isolation plate serves the dual purpose of stabilizing the structure and guiding airflow. The flat plate structure can more evenly divide and guide the airflow, reduce airflow turbulence, ensure the accuracy of airflow distribution, avoid airflow leakage and uneven heat dissipation, and make the cooling of the entire chassis more uniform, thereby further extending the life of the equipment.

[0027] The main air deflector 702 is arranged in an inclined plate structure. The air inlet slot 703 is connected to the inner end of the weak airflow circulation small space. The inclined main air deflector allows the cooling air to enter the weak airflow circulation small space more smoothly through the air inlet slot and generate a cooling cycle for the photosensitive sensor 8 in the space. Compared with the traditional straight air duct design, the inclined plate structure can effectively reduce airflow resistance, increase the flow speed of cooling air, improve cooling efficiency, and make the airflow smoother. This further reduces the temperature of the photosensitive sensor 8, reduces the failure rate of circuit components, and enhances the operating efficiency of the equipment.

[0028] Reference Figure 2As shown, the isolation plate 701 is provided with a light-transmitting window 9, and the photosensitive sensor 8 is located at the upper end of the light-transmitting window 9. The light leaking from the air hole at the top of the irradiation part is reflected multiple times inside the chassis to form slow reflection light. The photosensitive sensor 8 can detect whether the irradiation part 5 emits light through the light-transmitting window 9.

[0029] To facilitate understanding of the above technical solutions of this utility model, the following detailed description of the above technical solutions of this utility model is provided through specific usage methods.

[0030] The specific working process is as follows: Place the chassis body 1 in the working area, connect the cooling air inlet pipe to the cooling air inlet pipe interface 6, and connect the external cooling fan to the cooling air inlet pipe interface 6 through a hose. At this time, the cooling air will enter the chassis through the inlet pipe to provide cooling for the internal photosensitive sensor 8, magnetron 2, waveguide cavity 4, and electrodeless light source irradiation part 5. After the equipment is powered on, the ultraviolet light source starts to work and generates heat. The cooling air enters the chassis through the inlet pipe and is reasonably distributed by the segmented air guide component 7. A small part of the cooling air enters the weak airflow circulation small space isolated by the segmented air guide component 7 through the air inlet slot 703 to provide cooling for each component of the photosensitive sensor 8, and then is discharged from the air outlet slot 704. The remaining cooling air is guided by the main air plate 702 and passes through the magnetron 2, waveguide cavity 4, and electrodeless light source irradiation part 5 to provide cooling for each component in these three parts. Thanks to the rational design of the segmented air guide structure, the cooling air is evenly distributed, avoiding local overheating. The temperature of all circuit components inside the equipment is kept at a low level, ensuring the safe operation of electronic components and light sources. When the equipment is shut down, the power is turned off first, and then the cooling air input is stopped.

[0031] Through the above operating procedures, the segmented cooling circulation UV curing electrodeless light source chassis can effectively control the temperature of the internal circuitry, improve the heat dissipation efficiency, service life and operational safety of the equipment, and ensure the stability and reliability of the equipment during long-term operation.

[0032] In the description of this utility model, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0033] It should be noted that in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0034] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features of the present invention.

Claims

1. A segmented cooling circulation type ultraviolet curing electrodeless light source chassis, comprising a chassis body (1), wherein the chassis body (1) is provided with a magnetron (2), a heat sink assembly (3) located in the middle of the magnetron (2), a waveguide cavity (4) disposed at the lower end of the heat sink assembly (3), and an electrodeless light source irradiation part (5) disposed inside the bottom end of the waveguide cavity (4), wherein a cooling air inlet duct interface (6) is provided at the upper end of the chassis body (1), and a circuit board with a photosensitive sensor (8) is disposed at the upper end of the magnetron (2), characterized in that, The cooling air inlet pipe is provided with a segmented air guide component (7) at the lower end of the interface (6). The segmented air guide component (7) is fixedly installed on the upper end of the magnetron (2) and isolates the circuit board of the photosensitive sensor (8) in the chassis in a small space with weak airflow circulation. A small amount of air is introduced into the small space with weak airflow circulation through the segmented air guide component (7) to cool the circuit board of the photosensitive sensor (8). The remaining large amount of air is blown down from the side main air duct through the segmented air guide component (7) to the heat sink assembly (3) of the magnetron (2), the waveguide cavity (4) and the electrodeless light source irradiation part (5) for cooling. Finally, it is discharged from the bottom of the chassis.

2. The segmented cooling circulating UV curing electrodeless light source chassis according to claim 1, characterized in that, The segmented air guide component (7) includes a main air guide plate (702). A segmented air guide mechanism is provided on the main air guide plate (702) at the lower end of the cooling air inlet pipe interface (6). An isolation plate (701) is fixedly connected to the lower side of the main air guide plate (702).

3. The segmented cooling circulating UV curing electrodeless light source chassis according to claim 2, characterized in that, The segmented air guiding mechanism includes an air inlet slot (703) set on the upper end of the main air guide plate (702) and air outlet slots (704) opened on both sides of the lower end of the air guide plate (702). The main air guide plate (702) and the isolation plate (701) form a small space for weak airflow circulation, which encloses the circuit board of the photosensitive sensor (8). A small amount of air is introduced into the small space for weak airflow circulation through the air inlet slot (703) and the air outlet slot (704) on the main air guide plate (702) to cool the circuit board of the photosensitive sensor (8).

4. The segmented cooling circulating UV curing electrodeless light source chassis according to claim 2, characterized in that, The isolation plate (701) has a flat plate structure and is fixedly installed on the upper end of the magnetron (2).

5. The segmented cooling circulating UV curing electrodeless light source chassis according to claim 3, characterized in that, The main airflow plate (702) has an inclined plate structure, and the air inlet slot (703) is connected to the inner end of the weak airflow circulation small space.

6. The segmented cooling circulating UV curing electrodeless light source chassis according to claim 2, characterized in that, The isolation plate (701) is provided with a light-transmitting window (9).

7. The segmented cooling circulating UV curing electrodeless light source chassis according to claim 6, characterized in that, The photosensitive sensor (8) is located at the top of the light-transmitting window (9). The light leaking from the top air hole of the electrodeless light source irradiation part (5) is reflected multiple times inside the chassis body (1) to form slow reflection light. The photosensitive sensor (8) can detect whether the irradiation part (5) emits light through the light-transmitting window (9).

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