Semiconductor lead frame copper strip surface cleaning device

Abstract

The utility model provides a copper strip surface cleaning device for a semiconductor lead frame. Relates to the technical field of copper strip cleaning. The device comprises a copper strip for processing the semiconductor lead frame, a bottom plate, an impurity removal mechanism, a washing mechanism and a control module, a cleaning bin is arranged on the bottom plate, the impurity removing mechanism and the flushing mechanism are both arranged on the cleaning bin, one end of the copper strip penetrates through the cleaning bin and is connected with the impurity removing mechanism and the flushing mechanism, a control module is arranged on the cleaning bin, and the impurity removing mechanism and the flushing mechanism are both connected with the control module; the impurity removing mechanism comprises a brush roller, a motor, a dry and wet dust collector and a transmission assembly. The semiconductor lead frame copper strip surface cleaning device has the advantages that through cooperation of all the components, the copper strip can be cleaned for multiple times, the cleaned sundries and dust can be collected, and practicability is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of copper strip cleaning technology, and in particular to a device for cleaning the surface of copper strips in semiconductor lead frames. Background Technology

[0002] As a chip carrier for integrated circuits, the lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit leads of the chip and the external leads, forming an electrical circuit. It acts as a bridge to connect with external wires. Most semiconductor integrated circuits require the use of lead frames, which are an important basic material in the electronic information industry.

[0003] In the existing technology, during the stamping process, a leveling machine is placed between the feeding machine and the loader. The lead frame raw material is leveled by the extrusion of the upper and lower rollers of the leveling machine. The lead frame raw material, irregularly shaped copper strips, is wrapped with a layer of sulfur-free paper. When the sulfur-free paper comes into contact with the raw copper strips, the friction between them generates debris and impurities that adhere to the surface of the raw copper strips. After being extruded by the rollers of the leveling machine, pits are formed on the surface of the copper strips, which seriously affects the product quality. To address the above problem, the document with application number 202322871553.1 discloses a semiconductor lead frame copper strip surface cleaning device, which includes a lower clamping plate and an upper clamping plate installed at the inlet end of the leveling machine. A first screw is vertically and movably inserted through the upper clamping plate and is threadedly connected to the lower clamping plate. Cleaning brushes are provided on the upper surface of the lower clamping plate and the lower surface of the upper clamping plate.

[0004] However, a thorough reading of the aforementioned patent documents reveals the following shortcomings: during use, it is inconvenient to clean and collect the dust and impurities, causing impurities to fall around and impacting the surrounding environment; moreover, its wiping structure does not clean thoroughly, resulting in poor cleaning performance and easy adhesion of debris.

[0005] Therefore, this invention provides a device for cleaning the surface of copper strips in semiconductor lead frames to solve the above-mentioned problems. Utility Model Content

[0006] To solve the above-mentioned technical problems, the present invention provides a semiconductor lead frame copper strip surface cleaning device, comprising: a copper strip for semiconductor lead frame processing, a base plate, a cleaning mechanism, a rinsing mechanism, and a control module;

[0007] The base plate is provided with a cleaning chamber, and the impurity removal mechanism and the rinsing mechanism are both set on the cleaning chamber. One end of the copper strip passes through the cleaning chamber and is connected to the impurity removal mechanism and the rinsing mechanism. The cleaning chamber is provided with a control module, and the impurity removal mechanism and the rinsing mechanism are both connected to the control module.

[0008] The impurity removal mechanism includes brush rollers, a motor, a wet / dry vacuum cleaner, and a transmission assembly. Four brush rollers are rotatably connected inside the cleaning chamber, and all four brush rollers are connected to the copper strip. The cleaning chamber has two cavities, which are located on both sides of the copper strip and correspond to it. The wet / dry vacuum cleaner is fixedly installed in the cleaning chamber and connected to the two cavities. Through the coordinated design of the cleaning chamber, impurity removal mechanism, rinsing mechanism, water-absorbing sponge, and control module, not only can the copper strip be cleaned multiple times, but the removed debris and dust can also be collected, greatly improving practicality.

[0009] Preferably, the cleaning chamber has multiple through holes on its inner side, each connected to one of the two cavities. A vacuum cleaner with a sealed suction pipe is connected to each of the two cavities, facilitating the vacuum cleaner's collection of debris and dust. The motor is fixedly mounted on the cleaning chamber, and its output is connected to one end of one of the four brush rollers. The motor drives the corresponding brush roller, thereby drawing air from the two cavities and creating negative pressure. Under this negative pressure, air from the cleaning chamber enters the two cavities through the multiple through holes. During this process, the airflow carries debris and dust removed by the four brush rollers into the two cavities, achieving the effect of collecting debris and dust.

[0010] Preferably, both the motor and the wet / dry vacuum cleaner are connected to the control module, which controls and drives them. The transmission assembly is mounted on the four brush rollers and the cleaning chamber for transmission and is detachably connected.

[0011] Preferably, the transmission assembly includes a gear, a bevel gear one, a bevel gear two, and a transmission rod. One end of each of the four brush rollers is fixedly connected to a gear and meshes with it. Two of the four brush rollers have a bevel gear one fixedly fitted onto one end. Both bevel gears one are meshed with bevel gears two. A common transmission rod is fixedly connected between the two bevel gears two. Two fixed plates one are rotatably connected to the transmission rod. Both fixed plates one are fixedly connected to the cleaning chamber. While the motor drives the corresponding brush roller, one end of each brush roller drives the corresponding gear to rotate synchronously. Simultaneously, the gear and the corresponding... The gears mesh and drive each other, causing the two corresponding brush rollers to rotate. Simultaneously, one of the brush rollers drives one of the two bevel gears to rotate synchronously. At this time, the first bevel gear meshes with the corresponding second bevel gear and drives the other second bevel gear to rotate through the action of the transmission rod. At the same time, the second bevel gear drives the corresponding first bevel gear, causing the corresponding brush roller to rotate and drive the corresponding gear to rotate. The gear meshes with the corresponding gear, thus achieving the effect of simultaneously driving the four brush rollers.

[0012] Preferably, the rinsing mechanism includes spray washing modules, a water collection tank, and a water pump. Two spray washing modules are fixedly installed in the cleaning chamber and located on both sides of the copper strip. A water collection tank is provided in the cleaning chamber and corresponds to the two spray washing modules. The water pump is fixedly installed on the cleaning chamber. One end of the water pump is provided with a water pipe connected to the two spray washing modules, and the other end of the water pump is provided with a water pipe connected to the water collection tank. The cleaning chamber is sealed with two partitions, which are located on both sides of the water collection tank. One end of the copper strip passes through the two partitions. The water pump is connected to the control module. Driven by the water pump and by the action of the water pipes, water in the water collection tank is delivered to the two spray washing modules and sprayed out by multiple nozzles on the two spray washing modules, acting on both sides of the copper strip to achieve the effect of rinsing both sides of the copper strip; thereby achieving the purpose of cleaning the copper strip in the second step.

[0013] Preferably, two arc-shaped covers are fixedly connected inside the cleaning chamber and located on both sides of the copper strip. A water suction pipe is fixedly installed inside each of the two arc-shaped covers, and a water-absorbing sponge is fixedly fitted onto each of the two water suction pipes. The two water-absorbing sponges are respectively fixedly connected to the two arc-shaped covers. One end of each water suction pipe is sealed and connected to the same connecting pipe, one end of which is connected to the wet / dry vacuum cleaner. The two water-absorbing sponges effectively absorb the water adhering to both sides of the copper strip. Simultaneously, the wet / dry vacuum cleaner, through the connecting pipe and the two water suction pipes, effectively absorbs the water from the two water-absorbing sponges, thus achieving the third step of cleaning the copper strip.

[0014] Preferably, the cleaning chamber has two cavities, and the inner side of the cleaning chamber has multiple through holes connected to the two cavities. A hot air blower is fixedly installed on the cleaning chamber, and the hot air blower is connected to two air pipes connected to the two cavities. The hot air blower is connected to the control module. Driven by the hot air blower and the two air pipes, hot air is delivered to the two cavities. At the same time, the hot air is discharged through the multiple through holes on the cleaning chamber and acts on both sides of the copper strip, thereby achieving the effect of drying the copper strip.

[0015] Compared with related technologies, the semiconductor lead frame copper strip surface cleaning device provided by this utility model has the following beneficial effects:

[0016] This invention provides a surface cleaning device for copper strips of semiconductor lead frames. Driven by a motor, corresponding brush rollers rotate within the cleaning chamber and interact with the copper strip. Simultaneously, the four brush rollers rotate on the cleaning chamber and interact with the copper strip via a transmission assembly. This process allows for simultaneous cleaning of both sides of the copper strip, and the removed debris and dust accumulate in the center of the four brush rollers, achieving the first step of cleaning the copper strip. Simultaneously, the wet / dry vacuum cleaner extracts air from the two cavities, thereby collecting and removing debris and dust.

[0017] This utility model provides a surface cleaning device for copper strips of semiconductor lead frames. Driven by a water pump and the action of water pipes one and two, water from the collection tank is delivered to two spray cleaning modules. The water is then sprayed out by multiple nozzles on the two spray cleaning modules, acting on both sides of the copper strip to achieve a rinsing effect, thus achieving the second step of cleaning the copper strip. Two absorbent sponges absorb the water adhering to both sides of the copper strip. Simultaneously, a wet / dry vacuum cleaner, through the connecting pipe and the two suction pipes, absorbs the water from the two absorbent sponges, thus achieving the third step of cleaning the copper strip. Attached Figure Description

[0018] Figure 1 A three-dimensional structural schematic diagram of a semiconductor lead frame copper strip surface cleaning device provided by this utility model;

[0019] Figure 2 A schematic diagram of the front view structure of a semiconductor lead frame copper strip surface cleaning device provided by this utility model;

[0020] Figure 3 A rear view structural schematic diagram of a semiconductor lead frame copper strip surface cleaning device provided by this utility model;

[0021] Figure 4 This is a schematic diagram of the arc-shaped cover and the water suction pipe.

[0022] Numbered in the diagram: 1. Base plate; 2. Cleaning chamber; 3. Brush roller; 4. Motor; 5. Cavity 1; 6. Wet and dry vacuum cleaner; 7. Spray washing module; 8. Water collection tank; 9. Water pump; 10. Arc-shaped cover; 11. Absorbent sponge; 12. Suction pipe; 13. Partition; 14. Cavity 2; 15. Hot air blower; 16. Copper strip; 17. Control module; 18. Gear; 19. Bevel gear 1; 20. Bevel gear 2; 21. Transmission rod. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] Please refer to the following: Figures 1-4 A semiconductor lead frame copper strip surface cleaning device includes: a copper strip 16 for semiconductor lead frame processing, a base plate 1, a cleaning mechanism, a rinsing mechanism, and a control module 17.

[0025] A cleaning chamber 2 is provided on the base plate 1. The impurity removal mechanism and the rinsing mechanism are both set on the cleaning chamber 2. One end of the copper strip 16 passes through the cleaning chamber 2 and is connected to the impurity removal mechanism and the rinsing mechanism. A control module 17 is provided on the cleaning chamber 2. The impurity removal mechanism and the rinsing mechanism are both connected to the control module 17.

[0026] The cleaning mechanism includes a brush roller 3, a motor 4, a wet / dry vacuum cleaner 6, and a transmission assembly. Four brush rollers 3 are rotatably connected inside the cleaning chamber 2, and all four brush rollers 3 are connected to the copper strip 16. Two cavities 5 are opened on the cleaning chamber 2, which are located on both sides of the copper strip 16 and correspond to the copper strip 16. The wet / dry vacuum cleaner 6 is fixedly installed in the cleaning chamber 2 and connected to the two cavities 5. Through the coordinated design of the cleaning chamber 2, the cleaning mechanism, the rinsing mechanism, the water-absorbing sponge 11, the water-absorbing pipe, and the control module 17, not only can the copper strip 16 be cleaned multiple times, but the cleaned debris and dust can also be collected, greatly improving practicality.

[0027] In this method, the inner side of the cleaning chamber 2 has multiple through holes, which are respectively connected to two cavities 5. The wet and dry vacuum cleaner 6 is sealed with a suction pipe, which is also connected to the two cavities 5, so that the wet and dry vacuum cleaner 6 can suck up and collect debris and dust. The motor 4 is fixedly installed on the cleaning chamber 2. The output end of the motor 4 is connected to one end of one of the four brush rollers 3. The motor 4 drives the corresponding brush roller 3. The wet and dry vacuum cleaner 6 drives the air in the two cavities 5, thereby creating a negative pressure in the two cavities 5. Under the action of the negative pressure, the air in the cleaning chamber 2 enters the two cavities 5 through the multiple through holes on the cleaning chamber 2. During this process, the air flow carries the debris and dust cleaned by the four brush rollers 3 into the two cavities 5, thereby achieving the effect of sucking up and collecting debris and dust.

[0028] In this method, both the motor 4 and the wet and dry vacuum cleaner 6 are connected to the control module 17. The control module controls and drives the motor 4 and the wet and dry vacuum cleaner 6. The transmission components are set on the four brush rollers 3 and the cleaning chamber 2 for transmission and are detachably connected.

[0029] In this method, the transmission assembly includes a gear 18, a first bevel gear 19, a second bevel gear 20, and a transmission rod 21. One end of each of the four brush rollers 3 is fixedly connected to and meshed with a gear 18. One end of each of the four brush rollers 3 is fixedly fitted with a first bevel gear 19, and the two first bevel gears 19 are meshed with second bevel gears 20. The two second bevel gears 20 are fixedly connected to the same transmission rod 21. Two fixed plates 1 are rotatably connected to the transmission rod 21, and both fixed plates 1 are fixedly connected to the cleaning chamber 2. When the motor 4 drives the corresponding brush roller 3, one end of the brush roller 3 drives the corresponding gear 18 to rotate synchronously. Simultaneously, the gear 18 and the corresponding... The corresponding gear 18 engages in transmission, causing the two corresponding brush rollers 3 to rotate. Simultaneously, one of the brush rollers 3 drives one of the two bevel gears 19 to rotate synchronously. At this time, bevel gear 19 engages in transmission with the corresponding bevel gear 20 and drives the other bevel gear 20 to rotate through the action of the transmission rod 21. At the same time, bevel gear 20 drives the corresponding bevel gear 19, causing the corresponding brush roller 3 to rotate and drive the corresponding gear 18 to rotate. The gear 18 then engages in transmission with the corresponding gear 18. In summary, this achieves the effect of simultaneously driving the four brush rollers 3.

[0030] In this method, the rinsing mechanism includes a spray washing module 7, a water collection tank 8, and a water pump 9. Two spray washing modules 7 are fixedly installed inside the cleaning chamber 2 and located on both sides of the copper strip 16. A water collection tank 8 is provided inside the cleaning chamber 2 and corresponds to the two spray washing modules 7. The water pump 9 is fixedly installed on the cleaning chamber 2. One end of the water pump 9 is provided with a water pipe and connected to the two spray washing modules 7, and the other end of the water pump 9 is provided with a water pipe and connected to the water collection tank 8. The cleaning chamber 2 is sealed with two partitions 13. Plates 13 are located on both sides of the water collection tank 8. One end of the copper strip 16 passes through the two partitions 13. The water pump 9 is connected to the control module 17. Driven by the water pump 9 and the action of water pipe one and water pipe two, the water in the water collection tank 8 is transported to the two spray washing modules 7 and sprayed out by multiple nozzles on the two spray washing modules 7, acting on both sides of the copper strip 16, thereby achieving the effect of rinsing both sides of the copper strip 16; thus achieving the purpose of the second step of cleaning the copper strip 16.

[0031] In this method, two arc-shaped covers 10 are fixedly connected inside the cleaning chamber 2 and located on both sides of the copper strip 16. A water suction pipe 12 is fixedly installed inside each of the two arc-shaped covers 10, and a water-absorbing sponge 11 is fixedly fitted onto each of the two water suction pipes 12. The two water-absorbing sponges 11 are fixedly connected to the two arc-shaped covers 10 respectively. One end of each water suction pipe 12 is sealed to the same connecting pipe, and one end of the connecting pipe is connected to a wet / dry vacuum cleaner 6. The two water-absorbing sponges 11 effectively absorb the water adhering to both sides of the copper strip 16. Simultaneously, while the wet / dry vacuum cleaner 6 is working, the connecting pipe and the two water suction pipes 12 allow the wet / dry vacuum cleaner 6 to absorb the water from the two water-absorbing sponges 11, thus achieving the third step of cleaning the copper strip 16.

[0032] In this method, the cleaning chamber 2 has two cavities 14. The inner side of the cleaning chamber 2 has multiple through holes connected to the two cavities 14 respectively. A hot air blower 15 is fixedly installed on the cleaning chamber 2. The hot air blower 15 is connected to two air pipes and connected to the two cavities 14 respectively. The hot air blower 15 is connected to the control module 17. Through the drive of the hot air blower 15 and the action of the two air pipes, hot air is delivered to the two cavities 14 respectively. At the same time, the hot air is discharged through the multiple through holes 2 on the cleaning chamber 2 and acts on both sides of the copper strip 16, thereby achieving the effect of drying the copper strip 16.

[0033] The working principle of the semiconductor lead frame copper strip surface cleaning device provided by this utility model is as follows: When in use, first connect the device to the power supply, and then drive and control the motor 4, dry and wet vacuum cleaner 6, water pump 9 and hot air blower 15 through the control module 17.

[0034] Then, one end of the copper strip 16 is passed through the cleaning chamber 2 and connected to the traction device, so that the copper strip 16 passes between the four brush rollers 3, the two spray washing modules 7 and the two water-absorbing sponges 11. Then, the copper strip 16 is moved in the cleaning chamber 2 by the traction device.

[0035] At the same time, the corresponding brush rollers 3 are driven by the motor 4 to rotate in the cleaning chamber 2 and act on the copper strip 16. At this time, the four brush rollers 3 are driven by the transmission component to rotate on the cleaning chamber 2 and act on the copper strip 16 at the same time. In this process, the action of the four brush rollers 3 can achieve the effect of cleaning both sides of the copper strip 16 at the same time, and the debris and dust that are cleaned up will gather in the middle of the four brush rollers 3, thereby achieving the first step of cleaning the copper strip 16.

[0036] At the same time, the dry and wet vacuum cleaner 6 drives the air in the two cavities 5 to create negative pressure in the two cavities 5. Under the action of negative pressure, the air in the cleaning chamber 2 enters the two cavities 5 through the multiple through holes on the cleaning chamber 2. During this process, the air flow carries the debris and dust cleaned by the four brush rollers 3 into the two cavities 5, thereby achieving the effect of sucking up and collecting debris and dust.

[0037] Subsequently, driven by the water pump 9 and the action of water pipe one and water pipe two, the water in the water collection tank 8 is transported to the two spray washing modules 7 respectively, and sprayed out by multiple nozzles on the two spray washing modules 7 and acted on both sides of the copper strip 16, thereby achieving the effect of rinsing both sides of the copper strip 16; thus achieving the purpose of cleaning the copper strip 16 in the second step.

[0038] Then, the two absorbent sponges 11 absorb the water adhering to both sides of the copper strip 16. At this time, while the wet and dry vacuum cleaner 6 is working, the connecting pipe and the two suction pipes 12 allow the wet and dry vacuum cleaner 6 to absorb the water in the two absorbent sponges 11; thus achieving the third step of cleaning the copper strip 16.

[0039] Finally, hot air is delivered into the two cavities 14 by the hot air blower 15 and the two air pipes. At the same time, the hot air is discharged through the multiple through holes on the cleaning chamber 2 and acts on both sides of the copper strip 16, thereby achieving the effect of drying the copper strip 16.

[0040] Compared with related technologies, the semiconductor lead frame copper strip surface cleaning device provided by this utility model has the following beneficial effects: through the cooperation of various components, it can not only achieve the effect of cleaning the copper strip 16 multiple times, but also achieve the effect of collecting the cleaned debris and dust, which greatly improves the practicality.

[0041] The above are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A device for cleaning the surface of copper strips in a semiconductor lead frame, characterized in that, Includes copper strip (16) for semiconductor lead frame processing, base plate (1), impurity removal mechanism, rinsing mechanism and control module (17). The base plate (1) is provided with a cleaning chamber (2), the impurity removal mechanism and the rinsing mechanism are both provided on the cleaning chamber (2), one end of the copper strip (16) passes through the cleaning chamber (2) and is connected to the impurity removal mechanism and the rinsing mechanism, the cleaning chamber (2) is provided with a control module (17), and the impurity removal mechanism and the rinsing mechanism are both connected to the control module (17); The cleaning mechanism includes a brush roller (3), a motor (4), a wet and dry vacuum cleaner (6), and a transmission assembly. Four brush rollers (3) are rotatably connected inside the cleaning chamber (2). All four brush rollers (3) are connected to the copper strip (16). Two cavities (5) are opened on the cleaning chamber (2). The two cavities are located on both sides of the copper strip (16) and correspond to the copper strip (16). The wet and dry vacuum cleaner (6) is fixedly installed in the cleaning chamber (2) and connected to the two cavities (5).

2. The semiconductor lead frame copper strip surface cleaning device according to claim 1, characterized in that, The cleaning chamber (2) has multiple through holes on its inner side, which are respectively connected to two cavities (5). The wet and dry vacuum cleaner (6) is sealed with a vacuum tube, which is respectively connected to two cavities (5). The motor (4) is fixedly installed on the cleaning chamber (2). The output end of the motor (4) is connected to one end of one of the four brush rollers (3).

3. The semiconductor lead frame copper strip surface cleaning device according to claim 2, characterized in that, The electric motor (4) and the wet and dry vacuum cleaner (6) are both connected to the control module (17), and the transmission assembly is set on the four brush rollers (3) and the cleaning chamber (2).

4. The semiconductor lead frame copper strip surface cleaning device according to claim 3, characterized in that, The transmission assembly includes a gear (18), a bevel gear one (19), a bevel gear two (20), and a transmission rod (21). One end of each of the four brush rollers (3) is fixedly connected to a gear (18) and meshes with it. One end of each of the four brush rollers (3) is fixedly fitted with a bevel gear one (19). Both bevel gears one (19) are meshed with bevel gears two (20). The same transmission rod (21) is fixedly connected between the two bevel gears two (20). Two fixing plates one are rotatably connected to the transmission rod (21). Both fixing plates one are fixedly connected to the cleaning chamber (2).

5. The semiconductor lead frame copper strip surface cleaning device according to claim 1, characterized in that, The rinsing mechanism includes a spray washing module (7), a water collection tank (8), and a water pump (9). Two spray washing modules (7) are fixedly installed in the cleaning chamber (2) and located on both sides of the copper strip (16). A water collection tank (8) is provided in the cleaning chamber (2) and corresponds to the two spray washing modules (7). The water pump (9) is fixedly installed on the cleaning chamber (2). One end of the water pump (9) is provided with a water pipe and connected to the two spray washing modules (7). The other end of the water pump (9) is provided with a water pipe and connected to the water collection tank (8). The cleaning chamber (2) is sealed with two partitions (13). The two partitions (13) are located on both sides of the water collection tank (8). One end of the copper strip (16) passes through the two partitions (13). The water pump (9) is connected to the control module (17).

6. The semiconductor lead frame copper strip surface cleaning device according to claim 2, characterized in that, The cleaning chamber (2) has two arc-shaped covers (10) fixedly connected inside and located on both sides of the copper strip (16). Each of the two arc-shaped covers (10) has a water suction pipe (12) fixedly installed inside. Each of the two water suction pipes (12) has a water-absorbing sponge (11) fixedly fitted on it. The two water-absorbing sponges (11) are fixedly connected to the two arc-shaped covers (10) respectively. One end of each of the two water suction pipes (12) is sealed to the same connecting pipe. One end of the connecting pipe is connected to the wet and dry vacuum cleaner (6).

7. The semiconductor lead frame copper strip surface cleaning device according to claim 1, characterized in that, The cleaning chamber (2) has two cavities (14) and multiple through holes are provided on the inner side of the cleaning chamber (2) and are respectively connected to the two cavities (14). A hot air blower (15) is fixedly installed on the cleaning chamber (2). The hot air blower (15) has two air pipes connected to it and are respectively connected to the two cavities (14). The hot air blower (15) is connected to the control module (17).

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