Energy storage energy management system control unit based on MCU architecture

Abstract

The utility model provides an energy storage energy management system control unit based on an MCU architecture. The energy storage energy management system control unit comprises an MCU control module; the RTC clock module, the SDRAM memory module, the Flash storage module, the power supply module and the peripheral interface group are connected with the MCU control module. According to the utility model, the industrial adaptability is at least improved.

Description

Technical Field

[0001] This utility model relates to data processing technology, and in particular to a control unit for an energy storage management system based on an MCU architecture. Background Technology

[0002] As the core equipment of the user-side energy storage system, the energy storage system control unit (EMS) plays an irreplaceable role in the efficient use of energy and the stable operation of the power grid. Its core functions not only cover the energy scheduling and optimization management of the energy storage system, but also include real-time status monitoring of key equipment such as battery packs and converters, as well as the coordinated operation control between various components, so as to ensure the maximum overall efficiency of the system through precise regulation.

[0003] These types of equipment are widely used in high-energy-consuming enterprises, integrated industrial parks, and remote off-grid power supply scenarios. Therefore, the equipment must have industrial-grade environmental adaptability to ensure long-term stable operation.

[0004] Therefore, there is an urgent need for a control unit for an energy storage management system based on an MCU architecture that can improve industrial adaptability. Utility Model Content

[0005] Based on the above problems, this utility model is proposed to provide a control unit for an energy storage management system based on an MCU architecture that overcomes or at least partially solves the above problems.

[0006] According to one aspect of the present invention, a control unit for an energy storage management system based on an MCU architecture is provided, comprising:

[0007] MCU control module; and

[0008] The RTC clock module, SDRAM memory module, Flash storage module, power supply module, and peripheral interface group are connected to the MCU control module.

[0009] Optionally, in the unit according to the present invention, the RTC clock module adopts the IIC communication protocol.

[0010] Optionally, in the unit according to the present invention, the power module includes a power interface and a supercapacitor connected to the power interface.

[0011] Optionally, in the unit according to this utility model, the peripheral interface group includes:

[0012] SD storage interface, Console debugging interface, RS485 interface, CAN interface, digital output interface, digital input interface, and communication module.

[0013] Optionally, in the unit according to the present invention, the baud rate of the RS485 interface includes a configuration range consisting of 2400bps and 115200bps.

[0014] Optionally, in the unit according to the present invention, the switch output interface includes 4 relay output interfaces, wherein the isolation voltage of the relay output circuit is 5000V.

[0015] Optionally, in the unit according to the present invention, the switch input interface includes 8 optocoupler input interfaces, wherein the isolation voltage of the optocoupler input interfaces is 5000V.

[0016] Optionally, in the unit according to the present invention, the communication module includes a WIFI module and / or a 4G module, wherein the 4G module is a CAT1 module.

[0017] Optionally, in the unit according to the present invention, the peripheral interface group further includes two 100Mbps Ethernet ports, wherein the 100Mbps Ethernet ports are RJ45 socket interfaces.

[0018] Optionally, in the unit according to the present invention, the peripheral interface group further includes a DIP switch.

[0019] According to the solution of this utility model, through innovative hardware architecture and design optimization, it achieves a significant technical improvement compared with the prior art, and the specific effects are as follows:

[0020] 1. Replacing the ARM solution with the AT32F435ZGT7 MCU can reduce the cost per unit.

[0021] 2. Multi-device cascading efficiency: Supports 8 address configurations and fast master-slave switching via 4-bit DIP switches, enabling multi-device cascading deployment and shortening on-site installation time accordingly;

[0022] 3. Power failure data protection: The built-in supercapacitor (5.5V / 1F) can support 100ms power failure recovery and has passed the GB / T15153.1-2024 standard test.

[0023] 4. Electromagnetic compatibility: Multi-level isolated power supply and TVS diode design can meet EMC Level 3 testing;

[0024] 6. The hardware LED indicator (PCA9536PW) and self-ejecting SD card slot design can shorten the troubleshooting time accordingly; that is, the modular board structure can reduce the cost of repair spare parts (only the faulty board needs to be replaced, without replacing the whole machine).

[0025] 7. Economic efficiency: The life cycle cost (including maintenance) of a single unit of equipment can be reduced accordingly, making it suitable for small and medium-sized industrial and commercial users, and the investment payback period can also be shortened accordingly;

[0026] 8. The multi-module composition improves reliability and industrial adaptability. Attached Figure Description

[0027] Figure 1 A structural block diagram of a control unit for an energy storage management system based on an MCU architecture according to an embodiment of the present invention is shown.

[0028] Figure 2 A schematic diagram of interface distribution A in this embodiment is shown;

[0029] Figure 3 A schematic diagram of interface distribution B in this embodiment is shown. Detailed Implementation

[0030] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0031] To address the problems existing in the prior art, the present invention provides a solution. One embodiment of the present invention provides a control unit for an energy storage management system based on an MCU architecture, wherein... Figure 1 The structural block diagram corresponding to this unit is shown.

[0032] like Figure 1 As shown, the control unit of the energy storage management system based on MCU architecture mentioned in this embodiment includes: an MCU control module; and an RTC clock module, an SDRAM memory module, a Flash storage module, a power supply module, and a peripheral interface group connected to the MCU control module. The following is a detailed description of each different unit component:

[0033] Regarding the MCU control module, the MCU control module involved in this embodiment can specifically adopt the AT32F435 series high-performance M4 core processor, with a main frequency of 288MHz, and use the RT-thread operating system to be responsible for the control and management of the overall device.

[0034] For the RTC clock module, the RTC clock module involved in this embodiment can adopt the IIC communication protocol, thereby providing an accurate time reference for device clock calibration and synchronization.

[0035] Regarding the SDRAM memory module, the SDRAM memory module involved in this embodiment has a capacity of up to 32MB and a read / write speed of over 10MB / s.

[0036] Regarding the Flash storage module, the capacity of the Flash storage module involved in this embodiment can reach 64MB.

[0037] Regarding the power module, the power module mentioned in this embodiment includes a power interface and a supercapacitor connected to the power interface. It can be noted that the power interface meets the requirements of 9~36V voltage input and is equipped with a 5.5V / 1F supercapacitor, which supports normal operation within 100ms after the system is powered off.

[0038] Furthermore, based on the above, in addition to the MCU control module, RTC clock module, SDRAM memory module, Flash storage module, and power supply module mentioned above, the MCU-based energy storage management system control unit mentioned in this embodiment may also include a peripheral interface group, wherein the peripheral interface group may include:

[0039] SD storage interface, Console debugging interface, RS485 interface, CAN interface, digital output interface, digital input interface, and communication module.

[0040] It can be noted that the peripheral interface group has multiple functional interfaces compatible with multiple communication protocols, and is suitable for power quality management application scenarios with single-cabinet integration. The equipment is flexible in application, has extremely low application cost, is simple to maintain, has a low failure rate, and is easy to use.

[0041] The following is a detailed introduction to the different unit components included in the peripheral interface group:

[0042] For the SD storage interface, the SD storage interface can adopt a self-spring-loaded metal TF card sleeve, and the maximum storage space supported is 32GB.

[0043] Regarding the Console debugging interface, the Console port uses UART to USB technology to convert the internal serial port into a TYPE-C external USB interface. By connecting to a PC, it supports debugging command input and debugging information printing at a baud rate of 115200bps.

[0044] Regarding the RS485 interface, the RS485 interface involved in this embodiment may include 4 channels, and the corresponding baud rate includes a configuration range consisting of 2400bps and 115200bps, that is, the corresponding baud rate can be configured based on 2400bps~115200bps, and the bus supports a maximum of 128 devices.

[0045] Regarding the CAN interface, this embodiment specifically includes one CAN interface, and the bus supports a maximum of 120 devices.

[0046] Regarding the digital output interface, the digital output interface involved in this embodiment includes 4 relay output interfaces, wherein the isolation voltage of the relay output circuit is 5000V.

[0047] It can be noted that in this embodiment, the digital output interface can be expanded to a maximum of 8 channels, and each channel is independent of each other. The internal and external isolation voltage of the relay is as high as 5000V, and the load capacity can reach 10A / 250VAC.

[0048] Regarding the digital input interface, the digital input interface involved in this embodiment includes 8 optocoupler input interfaces, wherein the isolation voltage of the optocoupler input interface is 5000V.

[0049] It can be noted that in this embodiment, the digital input interface includes 8 optocoupler input interfaces, each of which is independent of each other, and the internal and external isolation voltage of the optocoupler is as high as 5000V.

[0050] For example, Figure 2 This diagram illustrates the interface distribution A in this embodiment, where, as shown... Figure 2 As shown, interface distribution A includes a digital input interface, a digital output interface, a SIM card slot, a console debugging interface, an SD storage interface, and a power module.

[0051] Regarding the communication module, the communication module involved in this embodiment may include a WIFI module and / or a 4G module, that is, WiFi or 4G can be selected according to actual needs. Among them, the 4G module can be the EC200M CAT1 module.

[0052] Furthermore, in this embodiment, the peripheral interface group involved in this embodiment may also include a 100 Mbps Ethernet port, wherein the 100 Mbps Ethernet port may include two ports, which may specifically adopt an RJ45 socket interface, and each port has the same communication function.

[0053] For example, Figure 3 A schematic diagram of interface distribution B in this embodiment is shown, wherein, as Figure 3 As shown, interface distribution B includes two 100Mbps Ethernet ports (100Mbps Ethernet port 1 and 100Mbps Ethernet port 2), a DIP switch, an RS485 interface, and a CAN interface.

[0054] Similarly, in this embodiment, the peripheral interface group involved in this embodiment may also include a DIP switch, wherein the DIP switch may include 4 channels, thereby supporting one master-slave switching and the setting of another 8 device addresses.

[0055] In addition, this embodiment also includes a corresponding LED indicator, which can specifically be a PCA9536PW. The LED indicator mainly responds to the input indicator signal to provide light indication.

[0056] It can be noted that all the unit components of the MCU-based energy storage management system control unit in this embodiment can be domestically produced devices with an operating temperature range of -25℃ to 60℃. The overall hardware cost is lower than that of similar products on the market. Furthermore, all the unit components of the peripheral interface group involved in this embodiment are designed with interface protection that meets the Level 3 standard for sports terminals.

[0057] In summary, this utility model, through innovative hardware architecture and design optimization, achieves significant technological improvements compared to existing technologies. Specific effects are as follows:

[0058] 1. Replacing the ARM solution with the AT32F435ZGT7 MCU can reduce the cost per unit (for example, by 50%).

[0059] 2. Multi-device cascading efficiency: Supports 8 address configurations and fast master-slave switching through 4-bit DIP switches, enabling multi-device cascading deployment and correspondingly shortening on-site installation time (e.g., by 50%).

[0060] 3. Power failure data protection: The built-in supercapacitor (5.5V / 1F) can support 100ms power failure recovery and has passed the GB / T15153.1-2024 standard test.

[0061] 4. Electromagnetic compatibility: Multi-level isolated power supply and TVS diode design can meet EMC Level 3 testing;

[0062] 6. The hardware LED indicator (PCA9536PW) and self-ejecting SD card slot design can shorten the troubleshooting time (for example, from an average of 2 hours to 20 minutes); that is, the modular board structure can reduce the cost of repair spare parts (for example, by 40%, and only the faulty board needs to be replaced, without replacing the whole machine).

[0063] 7. Economic efficiency: The life cycle cost (including maintenance) of a single unit can be reduced accordingly, making it suitable for small and medium-sized industrial and commercial users. The investment payback period can also be shortened accordingly (for example, compared with the traditional solution, it can be shortened from 3.5 years to 2 years).

[0064] 8. The multi-module composition improves reliability and industrial adaptability.

[0065] In the specification provided herein, the algorithms and displays are not inherently related to any particular computer, virtual system, or other device. Various general-purpose systems can also be used with the examples of this invention. The required structure for constructing such a system is apparent from the above description. Furthermore, this invention is not directed to any particular programming language. It should be understood that the contents of this invention described herein can be implemented using various programming languages, and the above description of specific languages ​​is for the purpose of disclosing preferred embodiments of this invention.

[0066] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0067] Similarly, it should be understood that, in order to simplify this disclosure and aid in understanding one or more of the various aspects of the invention, in the description of exemplary embodiments of the invention above, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof.

[0068] Those skilled in the art will understand that modules, units, or components of the devices disclosed in the examples herein can be arranged in the devices described in this embodiment, or alternatively, can be located in one or more devices different from the devices in this example. The modules in the foregoing examples can be combined into a single module or further divided into multiple sub-modules.

[0069] Those skilled in the art will understand that the modules in the device of the embodiment can be adaptively changed and placed in one or more devices different from that embodiment. Modules, units, or components in the embodiment can be combined into a single module, unit, or component, and further, they can be divided into multiple sub-modules, sub-units, or sub-components.

[0070] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features included in other embodiments but not others, combinations of features from different embodiments are meant to be within the scope of this invention and form different embodiments.

[0071] Furthermore, some of the embodiments described herein are methods or combinations of method elements that can be implemented by a processor of a computer system or by other means of performing the functions. Therefore, a processor having the necessary instructions for implementing the methods or method elements forms means for implementing the methods or method elements. Moreover, the elements described herein in the apparatus embodiments are examples of means for implementing the functions performed by elements for the purposes of implementing this invention.

[0072] As used herein, unless otherwise specified, the use of ordinal numbers such as “first,” “second,” “third,” etc., to describe ordinary objects merely indicates different instances of similar objects and is not intended to imply that the objects being described must have a given order in time, space, ordering, or any other manner.

[0073] Although the present invention has been described with reference to a limited number of embodiments, those skilled in the art will understand from the foregoing description that other embodiments can be conceived within the scope of the present invention described herein. Furthermore, it should be noted that the language used in this specification has been chosen primarily for readability and instructional purposes, and not for the purpose of interpreting or limiting the subject matter of the present invention.

Claims

1. A control unit for an energy storage management system based on an MCU architecture, characterized in that, include: MCU control module; as well as The RTC clock module, SDRAM memory module, Flash storage module, power supply module, and peripheral interface group are connected to the MCU control module.

2. The control unit of the energy storage management system based on MCU architecture according to claim 1, characterized in that, The RTC clock module uses the IIC communication protocol.

3. The control unit of the energy storage management system based on MCU architecture according to claim 1, characterized in that, The power module includes a power interface and a supercapacitor connected to the power interface.

4. The control unit of the energy storage management system based on MCU architecture according to claim 1, characterized in that, The peripheral interface group includes: SD storage interface, Console debugging interface, RS485 interface, CAN interface, digital output interface, digital input interface, and communication module.

5. The control unit of the energy storage management system based on MCU architecture according to claim 4, characterized in that, The baud rate of the RS485 interface includes a configuration range consisting of 2400bps and 115200bps.

6. The control unit of the energy storage management system based on MCU architecture according to claim 4, characterized in that, The digital output interface includes four relay output interfaces, wherein the isolation voltage of the relay output circuit is 5000V.

7. The control unit of the energy storage management system based on MCU architecture according to claim 4, characterized in that, The digital input interface includes 8 optocoupler input interfaces, wherein the isolation voltage of the optocoupler input interfaces is 5000V.

8. The control unit of the energy storage management system based on MCU architecture according to claim 4, characterized in that, The communication module includes a WIFI module and / or a 4G module, wherein the 4G module is a CAT1 module.

9. The control unit of the energy storage management system based on MCU architecture according to claim 4, characterized in that, The peripheral interface group also includes two 100Mbps Ethernet ports, wherein the 100Mbps Ethernet ports are RJ45 socket interfaces.

10. The control unit of the energy storage management system based on MCU architecture according to claim 4, characterized in that, The peripheral interface group also includes DIP switches.

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