Signal isolation transmission packaging structure and isolator

Abstract

The utility model provides a signal isolation transmission packaging structure and an isolator. The packaging structure comprises a first base island, a second base island, a first chip, a second chip, a first transmit-receive unit, a second transmit-receive unit and a first plastic package body. The first chip and the first transceiver unit are arranged on the first base island; the first chip, the first transceiver unit, the first base island and the second base island are plastically packaged in the first plastic package body; the second chip and the second transmit-receive unit are arranged on the first plastic package body, and the second transmit-receive unit corresponds to the first transmit-receive unit in the stacking direction of the package structure. According to the utility model, vertical face-to-face isolation transmission is realized by adopting a vertical stacking mode, so that the size of the packaging structure can be reduced, and the isolation transmission performance can be optimized.

Description

Technical Field

[0001] This utility model relates to the field of packaging technology, specifically to a signal isolation transmission packaging structure and an isolator. Background Technology

[0002] Existing signal isolation transmission structures typically employ traditional frame encapsulation, and their structures are as follows: Figure 1 As shown, the chip in the package structure is bonded to two independent frame base islands on the left and right sides in a flat manner. After being connected by wire bonding, the whole package is molded into a finished packaged chip with the function of signal transmission between the two sides.

[0003] The existing signal isolation transmission packaging structure has an isolation strength that depends on the base island spacing and has a large overall size. Furthermore, its isolation transmission path is unidirectional and dependent on the frame. In addition, its wire bonding is relatively complex, resulting in large wire bonding parasitic parameters, which can easily affect the coupling performance of the isolation transmission. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a signal isolation transmission packaging structure and isolator that can reduce the size of the packaging structure and optimize the isolation transmission performance.

[0005] To solve the above-mentioned technical problems, the first technical solution adopted by this utility model is as follows:

[0006] A signal isolation transmission packaging structure includes: a first base island, a second base island, a first chip, a second chip, a first transceiver unit, a second transceiver unit, and a first plastic package; the first base island and the second base island are spaced apart by a preset distance;

[0007] The first chip and the first transceiver unit are disposed on the first base island; the first chip, the first transceiver unit, the first base island, and the second base island are encapsulated within the first encapsulation body;

[0008] The second chip and the second transceiver unit are disposed on the first plastic package, and the second transceiver unit corresponds to the first transceiver unit in the stacking direction of the package structure.

[0009] Optionally, it also includes pads; the pads are disposed on the first molding compound and are connected to the second base island; the second chip is connected to the second base island through the pads.

[0010] Optionally, in the stacking direction of the package structure, the second chip, the pad, and the second base island correspond to each other.

[0011] Optionally, in the stacking direction of the package structure, the pads correspond to the second base island, and the pads are offset from the second chip; the second chip is connected to the pads via wire bonding.

[0012] Optionally, a portion of the second base island is encapsulated within the first encapsulation body; the second chip is connected to the unencapsulated portion of the second base island via wire bonding.

[0013] Optionally, the first transceiver unit, the first chip, and the first base island are sequentially connected by wire bonding; the second transceiver unit and the second chip are connected by wire bonding.

[0014] Optionally, the first chip and the first transceiver unit are disposed on the first base island in a flat manner, and / or the second chip and the second transceiver unit are disposed on the first encapsulation in a flat manner.

[0015] Optionally, it also includes a second molding compound; the first molding compound, the second chip, and the second transceiver unit are encapsulated within the second molding compound.

[0016] Optionally, the first transceiver unit is an antenna or a coil; the second transceiver unit is an antenna or a coil.

[0017] Another technical solution provided by this utility model is:

[0018] An isolator includes the signal isolation transmission encapsulation structure described above.

[0019] The beneficial effects of this invention are as follows: By encapsulating a secondary structure on one side within a first encapsulation body, and vertically stacking the secondary structures above the first encapsulation body, with the first transceiver unit in the primary structure and the second transceiver unit in the secondary structure corresponding in the stacking direction, this invention not only ensures effective isolation transmission between the primary and secondary sides, but also shortens the signal path, guaranteeing transmission matching performance. Furthermore, it allows for adjustments to the thickness of the first encapsulation body to meet various isolation transmission path directions and isolation strength requirements without increasing the footprint. Additionally, it significantly reduces the horizontal dimensions of the encapsulation structure. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a signal isolation transmission encapsulation structure in the prior art;

[0021] Figure 2 Schematic diagram of the signal isolation transmission packaging structure provided in the embodiments of this utility model Figure 1 ;

[0022] Figure 3Schematic diagram of the signal isolation transmission packaging structure provided in the embodiments of this utility model Figure 2 ;

[0023] Figure 4 Schematic diagram of the signal isolation transmission packaging structure provided in the embodiments of this utility model Figure 3 ;

[0024] Figure 5 for Figure 2 The diagram shows the manufacturing process of the signal isolation transmission packaging structure.

[0025] Figure 6 for Figure 3 and Figure 4 The diagram shows the manufacturing process of the signal isolation transmission packaging structure.

[0026] Label Explanation:

[0027] 10. First molding compound; 20. Second molding compound;

[0028] 11. First base island; 12. First chip; 13. First transceiver unit; 14. Solder pad;

[0029] 21. Second base island; 22. Second chip; 23. Second transceiver unit; 24. Unencapsulated portion. Detailed Implementation

[0030] To explain in detail the technical content, objectives, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0031] Example 1

[0032] Please refer to Figure 2 and Figure 3 This embodiment provides a signal isolation transmission packaging structure, including: a first base island 11, a second base island 21, a first chip 12, a second chip 22, a first transceiver unit 13, a second transceiver unit 23, and a first molding compound 10; the first base island 11 and the second base island 21 are spaced apart by a preset distance;

[0033] The first chip 12 and the first transceiver unit 13 are disposed on the first base island 11. Preferably, the first chip 12 and the first transceiver unit 13 are disposed on the first base island 11 in a flat manner.

[0034] The first chip 12, the first transceiver unit 13, the first base island 11 and the second base island 21 are encapsulated within the first encapsulation body 10;

[0035] The second chip 22 and the second transceiver unit 23 are disposed on the first molding compound 10, and the second transceiver unit 23 corresponds to the first transceiver unit 13 in the stacking direction of the packaging structure. Preferably, the second chip 22 and the second transceiver unit 23 are disposed on the first molding compound 10 in a flat manner.

[0036] In this embodiment, the stacking direction refers to the layer stacking direction of the packaging structure, that is, the Z-axis direction of the packaging structure. Assuming that the layer where the first base island and the second base island are located is the first layer, then the layer where the first chip and the first transceiver unit are laid flat on the first base island is the second layer stacked on the first layer, and so on. By stacking in the Z-axis direction of the overall structure, a vertically stacked packaging structure is formed.

[0037] In this embodiment, the second transceiver unit corresponds to the first transceiver unit in the stacking direction of the package structure, meaning that the signal transmission and reception directions of the first and second transceiver units correspond to each other in the Z-axis direction of the package structure. This can also be understood as the second transceiver unit being positioned directly above the first transceiver unit. This layout design ensures optimal isolation transmission between the primary and secondary sides.

[0038] In this embodiment, the primary-side structure includes a first chip, a first transceiver unit, and a first base island; the secondary-side structure includes a second chip, a second transceiver unit, and a second base island. The primary-side structure transmits signals wirelessly in isolation from the secondary-side structure via the first transceiver unit; the first and second base islands serve as carriers for this isolated transmission.

[0039] It is understood that the signal isolation transmission packaging structure provided in this embodiment achieves effective isolation transmission between the primary and secondary structures in the stacking direction by vertically stacking. At the same time, it can shorten the signal path, ensure transmission matching performance, and meet the requirements of various isolation transmission path directions and isolation strength by adjusting the thickness of the first molding compound without increasing the footprint. Furthermore, it can significantly reduce the size of the packaging structure in the horizontal direction.

[0040] In some specific embodiments of this example, the first transceiver unit is an antenna or a coil; the second transceiver unit is an antenna or a coil. In particular, the first transceiver unit and the second transceiver unit can also be implemented directly by electroplating on the first encapsulation.

[0041] In some specific implementations of this embodiment, such as Figure 2 and Figure 3As shown, the packaging structure further includes a second molding compound 20; the first molding compound 10, the second chip 22, and the second transceiver unit 23 are encapsulated within the second molding compound 20. Here, the first molding compound 10 serves both to fix the first chip 12 and the first transceiver unit 13, and to physically isolate the primary-side structure from the secondary-side structure. Specifically, by adjusting the thickness of the second molding compound, the "isolation distance" between the primary-side structure and the secondary-side structure can be adjusted, thereby adjusting the isolation strength. The second molding compound serves to fix the secondary-side structure and the overall packaging structure.

[0042] Example 2

[0043] Please refer to Figures 2 to 4 This embodiment is a further extension of the signal isolation transmission encapsulation structure provided in Embodiment 1, and the connection method of the secondary side structure is explained in detail.

[0044] It is understood that in the signal isolation transmission packaging structure provided in Embodiment 1, the first chip, the first transceiver unit, and the first base island in the primary side structure need to be connected in sequence; and the second chip, the second transceiver unit, and the second base island in the secondary side structure need to be connected in sequence.

[0045] In some specific implementations of this embodiment, such as Figures 2 to 4 As shown, before the first chip 12, the first transceiver unit 13, and the first base island 11 in the primary side structure are encapsulated within the first molding compound 10, the connection between the first chip 12 and the first transceiver unit 13, and the connection between the first transceiver unit 13 and the first base island 11, can be established by wire bonding. Since the first chip 12 and the first transceiver unit 13 are at the same level, and the first chip 12 and the first base island 11 are within the same molding compound, establishing the connection using wire bonding is easier to implement in terms of manufacturing process and more convenient to operate.

[0046] In some other specific embodiments of this example, the first chip and the first base island in the primary side structure can also be connected in other ways. For example, a pad can be brought out by drilling holes and electroplating on the surface of the first base island to connect the first chip; or, the first chip can be a flip chip with built-in solder joints, and the solder joints of the flip chip can be ground flat and then used as a pad to connect to the first base island.

[0047] In some specific implementations of this embodiment, such as Figures 2 to 4 As shown, the second transceiver unit 23 and the second chip 22 in the secondary side structure can also be connected by wire bonding. Similarly, since the second chip 22 and the second transceiver unit 23 are at the same level, it is easier to implement in terms of manufacturing process and more convenient to operate by using wire bonding to establish the connection.

[0048] Specifically, in this embodiment, the second chip and the second base island in the secondary side structure are at different levels and located in different plastic packages. Therefore, this embodiment provides the following two feasible implementation methods for the connection between the second chip and the second base island:

[0049] (1) The second chip is connected to the second base island via wire bonding.

[0050] like Figure 2 As shown, in this specific embodiment, the packaging structure does not require additional solder pads 14. Instead, it only needs to reserve the wire bonding position in advance when the first molding compound 10 is formed during the first molding process. That is, during the first molding process, only a portion of the second base island 21 is molded into the first molding compound 10, while a portion remains unmolded, referred to as the unmolded portion 24. Subsequently, the connection between the second chip 22 and the second base island 21 can be achieved by connecting the second chip 22 to the unmolded portion 24 on the second base island 21 through wire bonding during the wire bonding stage. Preferably, the portion of the second base island 21 opposite to the first base island 11 is molded into the first molding compound 10, while the portion opposite to the first base island 11 is not molded, so as to make the connection line layout more reasonable.

[0051] It is understandable that the above layout design, which only requires wire bonding, does not require special process support. It only requires changing the size of the first molding compound to ensure that it can provide a carrier for the second chip and the second transceiver unit on the secondary side while also reserving space for wire bonding of the second chip. Therefore, compared to a layout design that requires additional pad connections, it eliminates the pad fabrication step in the process flow and achieves the connection between the second chip and the second base island without adding any new steps, thus simplifying the implementation process.

[0052] (2) The second chip is connected to the second base island via solder pads.

[0053] like Figure 3 and Figure 4 As shown, in this specific embodiment, the packaging structure further includes a pad 14; the pad 14 is disposed on the first molding compound 10 and is connected to the second base island 21. It can be understood that one end of the pad 14 is connected to the surface of the second chip 22 on the first molding compound 10, and the other end is connected to the second base island 21. Preferably, the pad is a vertical pad, that is, perpendicular to each layer of the packaging structure, or it can be understood as being consistent with the stacking direction.

[0054] Based on the above pad settings, such as Figure 3As shown, in the stacking direction of the package structure, the second chip 22 and the second base island 21 are staggered. The pad 14 can then be positioned corresponding to the second base island 21. That is, in the stacking direction of the package structure, the second chip 22 and the pad 14 are staggered, while the pad 14 is positioned corresponding to the second base island 21. In this case, during the wire bonding stage, the second chip 22 on the first molding compound 10 can first be connected to one end of the pad 14 on the first molding compound 10 via wire bonding, and then connected to the second base island 21 via the other end of the pad 14, making the wiring more efficient.

[0055] Based on the above pad settings, such as Figure 4 As shown, in the stacking direction of the package structure, the second chip 22 and the second base island 21 are correspondingly arranged. Therefore, the pad 14 can be directly disposed between the second chip 22 and the second base island 21. That is, the second chip 22, the pad 14, and the second base island 21 are correspondingly arranged in the stacking direction. In this case, the second chip 22 on the first molding compound 10 can be directly connected to the second base island 21 via the pad 14, reducing one connection line in the wire bonding process.

[0056] It is understandable that the above Figure 4 In the stacking direction of the package structure shown, the second chip 22, the pad 14 and the second base island 21 are arranged correspondingly. The second chip 22 can be directly connected to the second base island 21 through the pad 14. This connection design can reduce the number of connection lines and help to further reduce the size of the package structure in the horizontal direction, making the overall package structure more compact and more conducive to the miniaturization design of the package structure.

[0057] Example 3

[0058] This embodiment is a further extension of Embodiment 2, providing its manufacturing process.

[0059] Please see Figure 5 Corresponding to Figure 2 The manufacturing process of the signal isolation transmission packaging structure shown includes:

[0060] S1: Create the framework;

[0061] S2: First chip installation: The first chip and the first transceiver unit are set on the top of the first base island by means of bonding or other methods;

[0062] S3: First wire bonding: For the primary side structure, wire bonding is performed to connect the first chip to the first transceiver unit, and the first transceiver unit to the first base island;

[0063] S4: First molding: The first molding body is formed through molding methods such as injection molding. It is important to note that this molding only encapsulates the front part of the second base island. The portion molded into the first molding body must be able to provide a carrier for the second chip and the second transceiver unit on the secondary side. The rear part of the second base island is left unmolded, and the unmolded portion only needs to meet the space requirements for wire bonding of the second chip.

[0064] S5: Second chip installation: The second chip and the second transceiver unit are mounted on the first molded body by means of bonding or other methods; here, the second transceiver unit needs to correspond to the first transceiver unit in the stacking direction in the first molded body, that is, it is located directly above the first transceiver unit, in order to ensure the best isolation transmission effect.

[0065] S6: Second wire bonding: For the secondary side structure, wire bonding connects the second chip to the second transceiver unit, as well as the unencapsulated part of the second chip to the second base island.

[0066] S7: Second Molding: The first molding compound, the second chip, the second transceiver unit, and the unmolded portions of the second base island are encapsulated using molding methods such as injection molding to form a second molding compound. Here, the portions that were not encapsulated during the first molding are encapsulated together by the second molding compound, which ensures that the overall package structure has the greatest possible stability.

[0067] S8: Rib cutting and shaping.

[0068] The above process flow achieves effective vertical isolation between the primary and secondary structures by vertically stacking a first molded package with a primary side structure and a second molded package with a secondary side structure. Simultaneously, space is reserved on the second base island during the first molding process to wire-connect the second chip and the second base island located within different molded packages. The signal isolation transmission package structure manufactured using this process not only ensures effective isolation between the primary and secondary sides but also shortens the signal path, guaranteeing transmission matching performance. Furthermore, it allows for adjustments to the thickness of the first molded package to meet various isolation transmission path directions and isolation strength requirements without increasing the footprint. It also significantly reduces the horizontal dimensions of the package structure. Moreover, it ensures an effective and stable connection between the second chip and the second base island located within different molded packages and simplifies the manufacturing process, thereby achieving the secondary side function of isolated transmission.

[0069] Please see Figure 6 ,correspond Figure 3 and Figure 4 The manufacturing process of the signal isolation transmission packaging structure shown includes:

[0070] S1: Create the framework;

[0071] S2: First chip installation: The first chip and the first transceiver unit are set on the top of the first base island by means of bonding or other methods;

[0072] S3: First wire bonding: For the primary side structure, wire bonding is performed to connect the first chip to the first transceiver unit, and the first transceiver unit to the first base island;

[0073] S4: First molding: The first molding body is formed by molding methods such as injection molding. Here, the first molding body can completely cover the second base island to ensure that the packaging structure obtains the maximum stability.

[0074] S5: Laser + Electroplating + Surface Treatment: Solder joints connecting to the second base island are formed by electroplating through holes in the upper surface of the first molding compound; then, surface treatment is performed to form pads. The purpose of this step is to allow the signals of the second chip to be led out from the pins of the second base island through the pads.

[0075] S6: Second Chip Mounting: The second chip and the second transceiver unit are mounted on the first molding compound using methods such as bonding. Here, the second transceiver unit needs to correspond to the first transceiver unit within the first molding compound on the stacking line, i.e., located directly above the first transceiver unit, to ensure effective isolation transmission. Additionally, depending on different layout design requirements, the second chip can be staggered from the pads (and the second base island) (e.g., ...). Figure 6 As shown), it can also be set corresponding to the pads (and the second base island). Figure 6 (Not shown). These correspond to the two pad settings in Embodiment 2 above.

[0076] S7: Second wire bonding: For the secondary side structure, wire bonding is performed to connect the second chip to the second transceiver unit, and the second chip to the pads on the first molding compound.

[0077] S8: Second encapsulation: The first encapsulation body, the second chip, and the second transceiver unit are encapsulated by encapsulation methods such as injection molding to form a second encapsulation body;

[0078] S9: Rib cutting and shaping.

[0079] The above process utilizes a vertically stacked layout design of a first molded package with a primary side structure and a second molded package with a secondary side structure to achieve effective vertical isolation between the primary and secondary side structures. Simultaneously, pads are added to the first molded package to connect the second chip and the second base island located within different molded packages. The signal isolation transmission package structure manufactured using this process not only ensures effective isolation between the primary and secondary sides but also shortens the signal path, guaranteeing transmission matching performance. Furthermore, it allows for adjustments to the thickness of the first molded package to meet various isolation transmission path directions and isolation strength requirements without increasing the footprint. It also significantly reduces the horizontal dimensions of the package structure and ensures an effective and stable connection between the second chip and the second base island located within different molded packages, thus achieving the secondary side function of isolated transmission.

[0080] Example 4

[0081] This embodiment further extends any of the above embodiments to provide an isolator. The isolator enables face-to-face isolation of communication transmissions in the vertical direction.

[0082] The isolator provided in this embodiment includes the signal isolation transmission packaging structure described in any of the above embodiments. The specific structure of the signal isolation transmission packaging structure and its corresponding manufacturing process are not detailed here; please refer to the descriptions in the above embodiments for more information.

[0083] The isolator provided in this embodiment encapsulates a secondary structure on one side within a first encapsulation body, and the secondary structure is vertically stacked on top of the first encapsulation body. The first transceiver unit in the primary structure corresponds to the second transceiver unit in the secondary structure in the stacking direction. This not only ensures effective isolation transmission between the primary and secondary sides, but also, this vertical stacking structure design shortens the signal path, ensuring transmission matching performance. Furthermore, it allows for adjustments to the thickness of the first encapsulation body to meet various isolation transmission path directions and isolation strength requirements without increasing the footprint. Additionally, it significantly reduces the horizontal dimensions of the encapsulation structure.

[0084] The isolator in this embodiment is well-suited for scenarios requiring wireless isolation transmission, such as high- and low-voltage wireless isolation in power systems.

[0085] In summary, the signal isolation transmission packaging structure and isolator provided by this utility model achieve vertical face-to-face isolation transmission by vertical stacking. This not only ensures effective isolation transmission between the primary and secondary sides, but also shortens the signal path, ensuring transmission matching performance. Furthermore, it meets the requirements of various isolation transmission path directions and isolation strengths. Moreover, it can significantly reduce the size of the packaging structure in the horizontal direction.

[0086] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A signal isolation transmission encapsulation structure, characterized in that, include: The system comprises a first base island, a second base island, a first chip, a second chip, a first transceiver unit, a second transceiver unit, and a first plastic package. The first base island and the second base island are spaced at a preset distance; The first chip and the first transceiver unit are disposed on the first base island; the first chip, the first transceiver unit, the first base island, and the second base island are encapsulated within the first encapsulation body; The second chip and the second transceiver unit are disposed on the first plastic package, and the second transceiver unit corresponds to the first transceiver unit in the stacking direction of the package structure.

2. The signal isolation transmission encapsulation structure as described in claim 1, characterized in that, It also includes pads; the pads are disposed on the first molding compound and are connected to the second base island; the second chip is connected to the second base island through the pads.

3. The signal isolation transmission encapsulation structure as described in claim 2, characterized in that, In the stacking direction of the package structure, the second chip, the pad, and the second base island correspond to each other.

4. The signal isolation transmission encapsulation structure as described in claim 2, characterized in that, In the stacking direction of the package structure, the pads correspond to the second base island, and the pads are offset from the second chip; the second chip is connected to the pads via wire bonding.

5. The signal isolation transmission encapsulation structure as described in claim 1, characterized in that, The second base island is partially encapsulated within the first encapsulation body; the second chip is connected to the unencapsulated portion of the second base island via wire bonding.

6. The signal isolation transmission encapsulation structure as described in claim 1, characterized in that, The first transceiver unit, the first chip, and the first base island are connected sequentially by wire bonding; the second transceiver unit and the second chip are connected by wire bonding.

7. The signal isolation transmission encapsulation structure as described in claim 1, characterized in that, The first chip and the first transceiver unit are disposed on the first base island in a flat manner, and / or the second chip and the second transceiver unit are disposed on the first encapsulation body in a flat manner.

8. The signal isolation transmission encapsulation structure as described in claim 1, characterized in that, It also includes a second molding compound; the first molding compound, the second chip, and the second transceiver unit are encapsulated within the second molding compound.

9. The signal isolation transmission encapsulation structure as described in claim 1, characterized in that, The first transceiver unit is an antenna or a coil; the second transceiver unit is an antenna or a coil.

10. An isolator, characterized in that, Includes the signal isolation transmission encapsulation structure described in any one of claims 1 to 9.

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