Heating assembly with grounding structure

Abstract

The utility model relates to the technical field of electric heating, in particular to a heating assembly with a grounding structure, which comprises a base material, a grounding layer for conductive grounding, an insulating layer and a conductive heating layer, the grounding layer and the insulating layer are both arranged on the surface A or the surface B of the base material, the conductive heating layer is arranged on the surface A of the base material, and the insulating layer is arranged on the surface B of the base material. The edge of the grounding layer extends to the edge of the outer side of the base material, and the insulating layer is located on the side, away from the base material, of the grounding layer. According to the utility model, the grounding layer used for conductive grounding is arranged on the base material, so that when a heated object or the conductive heating layer leaks electricity in the heating process of the conductive heating layer, current can be guided to a grounding position through the grounding layer at the first time, the grounding response efficiency is high, and the structure is simple and ingenious; and on the basis of guaranteeing the use safety, production and manufacturing are easy, the production cost is effectively reduced, and the method is suitable for large-batch production.

Description

Technical Field

[0001] This utility model relates to the field of electric heating technology, specifically a heating component with a grounding structure. Background Art

[0002] There is a wide variety of electric heating products on the market, such as heating plates for electric stoves, heating bases for electric kettles, and heating elements for baking equipment. They are very convenient to use. However, electric heating products can also pose safety hazards during use. The material covering the heating element is insulating at room temperature, but at high temperatures, some objects that are originally insulating may exhibit slight conductivity. This conductivity makes it easy for leakage current to occur on the surface of the material, leading to electric shock to users or short circuits in the equipment, which affects user safety and usability.

[0003] To address the above shortcomings, we need to develop a heating component with a grounding structure to meet the needs of a wide range of users. Utility Model Content

[0004] Regarding the aforementioned problem of electrical conductivity and leakage in existing electric heating products during heating, the technical solution adopted by this utility model to solve this problem is as follows:

[0005] A heating assembly with a grounding structure includes a substrate, a grounding layer for conductive grounding, an insulating layer, and a conductive heating layer. The grounding layer and the insulating layer are both disposed on surface A or surface B of the substrate. The conductive heating layer is disposed on surface A of the substrate. The edge of the grounding layer extends to the outer edge of the substrate. The insulating layer is located on the side of the grounding layer away from the substrate.

[0006] Furthermore, the conductive heating layer includes a heating layer for heating by electricity and an electrode layer for connecting to a power source, with at least two separate electrode layers located on opposite sides of the heating layer.

[0007] Furthermore, when the grounding layer and the insulating layer are located on surface A, the conductive heating layer is located on the side of the insulating layer away from the grounding layer.

[0008] Furthermore, the substrate has mounting holes for easy installation, and the heating layer includes independently arranged heating zones c, d, e, and f, which are arranged circumferentially around the mounting holes.

[0009] Furthermore, the grounding layer extends in a grid pattern from the center of the substrate toward the outer edge of the substrate.

[0010] Furthermore, the grounding layer extends in a linear shape from the center of the substrate toward the outer edge of the substrate.

[0011] Furthermore, the insulating layer has through holes located within the laying range of the grounding layer.

[0012] Furthermore, the substrate is provided with the grounding layer, the insulating layer and the conductive heating layer sequentially from the inside out.

[0013] Furthermore, the substrate has a panel structure or a cylindrical structure.

[0014] Furthermore, the conductive heating layer is formed into a planar heating layer using one of the following materials: nano-metal oxide, nano-semiconductor oxide, graphene, or carbon paste.

[0015] The beneficial effects of the utility model are as follows:

[0016] 1. This utility model provides a grounding layer for conductive grounding on the substrate. When the heated object or the conductive heating layer leaks current during the heating process, the current can be guided to the grounding position through the grounding layer in the first time. The grounding response is fast, the structure is simple and ingenious, and it is easy to manufacture while ensuring safety, effectively reducing production costs and making it suitable for mass production.

[0017] 2. The conductive heating layer of this utility model can use one of the following as the heating material: nano metal oxide, nano semiconductor metal oxide, graphene material, carbon paste material, etc. The planar heating layer has a smaller thickness and volume, and the surface contact form can further ensure sufficient heating area. Nano semiconductor metal oxide is preferred. Nano semiconductor metal oxide has a smaller thickness when attached to the substrate, and its conductivity and heating performance are also better. The attachment process is simple, which reduces production costs, improves production efficiency, and can meet the needs of mass production.

[0018] 3. In addition to ensuring safety, this utility model can also design the grounding layer in a grid or line-like structure, and can also form visually rich and beautiful patterns on the product appearance for users to choose from. Compared with a fully covered surface grounding layer, the grid or line-like pattern can also save on the grounding layer material due to the hollow or empty areas, further saving material waste and reducing production costs.

[0019] 4. The heating layer of this utility model can be set up in a partitioned manner, with multiple heating zones including heating zone c, heating zone d, heating zone e and heating zone f. Multiple dispersed heating zones connected in parallel or in series can expand the heating range and avoid the mounting holes required for the substrate, making it easier for the substrate to be installed on other equipment or devices, and also making it easier for other equipment or devices to be installed on the substrate. Attached Figure Description

[0020] Figure 1 This is a perspective view of a heating component with a grounding structure according to the present invention.

[0021] Figure 2 This is one of the exploded perspective views of a heating component with a grounding structure according to the present invention.

[0022] Figure 3 This is one of the front views of a heating assembly with a grounding structure according to the present invention.

[0023] Figure 4 for Figure 3 AA section view.

[0024] Figure 5 This is the second exploded perspective view of a heating component with a grounding structure according to the present invention.

[0025] Figure 6 This is one of the structural diagrams showing the layout of the grounding layer of this utility model.

[0026] Figure 7 This is the second diagram showing the layout structure of the grounding layer of this utility model.

[0027] Figure 8 The third diagram shows the layout structure of the grounding layer of this utility model.

[0028] Figure 9 The fourth diagram shows the layout structure of the grounding layer of this utility model.

[0029] Figure 10 This is the fifth diagram showing the layout structure of the grounding layer of this utility model.

[0030] Figure 11 This is the sixth diagram showing the layout structure of the grounding layer of this utility model.

[0031] Figure 12 This is a second perspective view of a heating component with a grounding structure according to the present invention.

[0032] Figure 13 This is a second front view of a heating assembly with a grounding structure according to this utility model.

[0033] Figure 14This is the third exploded perspective view of a heating component with a grounding structure according to the present invention.

[0034] Figure 15 This is a third perspective view of a heating component with a grounding structure according to the present invention.

[0035] Figure 16 This is the third front view of a heating assembly with a grounding structure according to this utility model. DETAILED DESCRIPTION

[0036] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0037] Optionally, in some embodiments, the substrate 1 may be made of one of the following materials: glass (calcium carbonate glass, borosilicate glass, microcrystalline glass, quartz glass), ceramic, stone (slab, marble), plastic, rubber, etc. Preferably, the substrate 1 is made of microcrystalline glass, which has good vertical thermal conductivity and light transmittance. Vertical thermal conductivity effectively enhances the efficiency and speed of heat transfer, making the overall heating rapid and uniform. On this basis, microcrystalline glass has good aesthetic appeal when applied to the product appearance, has good resistance to most chemicals, is not easily corroded, and has high hardness, so it will not easily wear down after long-term use. Microcrystalline glass has a low coefficient of thermal expansion at high temperatures, so it is not easy to deform or crack.

[0038] Optionally, in some embodiments, the grounding layer 2 or the electrode layer 42 can be made of one of the following materials with good conductivity: gold, silver, copper, aluminum, etc. Preferably, the grounding layer 2 and / or the electrode layer 42 are laid with silver paste. Silver paste has high conductivity, can effectively conduct current, reduce power loss, and is easy to form on the surface of the substrate 1, which is convenient for processing and production.

[0039] Optionally, in some embodiments, the conductive heating layer 4 can be formed into a planar heating layer using one of the following materials: nano-metal oxide, nano-semiconductor metal oxide, graphene, carbon paste, etc. Preferably, the conductive heating layer 4 uses nano-semiconductor metal oxide as the main material of the planar heating layer. Nano-semiconductor metal oxide has good electrical and thermal conductivity. After the circuit is turned on, it can achieve rapid heating response efficiency. It can work for a long time in a high-temperature environment without easily decomposing or losing conductivity, and has good high-temperature stability. The planar heating layer can be formed by using nano-semiconductor metal oxide through physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), far-infrared spectroscopy (FI), etc., which can reduce the thickness, increase the heating area, and facilitate user use.

[0040] Example 1:

[0041] like Figures 1 to 4 The heating assembly shown includes a base material 1, a grounding layer 2 for conductive grounding, an insulating layer 3, and a conductive heating layer 4. The base material 1 is a hard and brittle substrate that supports the grounding layer 2, the insulating layer 3, and the conductive heating layer 4. It has good structural stability, is not easily deformed or bent, and allows users to stably place heated objects for subsequent heating. The surface of the base material 1 can be divided into at least surface A and surface B. Surface A and surface B are independent surfaces on the base material 1. Surface A is one of the front and back sides of the base material 1, and surface B is the other of the front and back sides of the base material 1. The grounding layer 2, the insulating layer 3, and the conductive heating layer 4 are all disposed on surface A of the base material 1. The grounding layer 2 is a conductive material that covers and adheres to the base material 1. The thickness of the grounding layer 2 is less than 1 mm. The laying range of the grounding layer 2 extends to the outer edge of the base material 1 for grounding protection. When leakage occurs, the current can be conducted from the grounding layer 2 to the grounding position to avoid safety hazards to users and achieve safety protection against leakage.

[0042] An insulating layer 3 is attached to the surface of the grounding layer 2 away from the substrate 1. The insulating layer 3 can be made of insulating materials such as polyester film or epoxy resin. The thickness of the insulating layer 3 is less than 1 mm. The insulating layer 3 is used to isolate the grounding layer 2 from the conductive heating layer 4, or to prevent the user from directly contacting the grounding layer 2, so that the conductive heating layer 4 can be used normally. The conductive heating layer 4 is located on the surface of the insulating layer 3 away from the grounding layer 2. After the conductive heating layer 4 is connected to an external power source, it can generate heat to form a high-temperature area. The conductive heating layer 4 directly heats the user's heated object, so that the temperature of the heated object gradually increases, thereby achieving the heating effect.

[0043] More specifically, the heating material of the conductive heating layer 4 is a nano-semiconductor metal oxide as the conductive heating material. The nano-semiconductor metal oxide can be one or a combination of materials such as tin, antimony, nickel, and ammonium as nanoparticles. During the fabrication, the nano-semiconductor metal oxide can be attached to the surface of the insulating layer 3 by one of the following methods: physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), far-infrared spectroscopy (FI). The thickness of the conductive heating layer 4 is less than 1 mm, and a fixed heating area is formed after high-temperature sintering.

[0044] As another embodiment of Example 1, the substrate 1 can be made of one of the microcrystalline materials such as microcrystalline glass or microcrystalline ceramic. Preferably, the substrate 1 uses microcrystalline glass as the main preparation material. Microcrystalline glass has good vertical thermal conductivity and light transmittance. Vertical thermal conductivity effectively enhances the efficiency and speed of heat transfer, making the overall heating rapid and uniform. Microcrystalline glass has a low coefficient of thermal expansion and hardly deforms when the temperature changes, making it suitable for heating components with frequent temperature changes.

[0045] As another embodiment 101 of embodiment 1, such as Figure 15 and Figure 16 As shown, the grounding layer 2 is a conductive material formed on the substrate 1 by means of coating, film or adhesive adhesion, etc., and is a conductive open ring structure with non-overlapping start and end points. The thickness of the grounding layer 2 is less than 1 mm. The conductive heating layer 4 is located in the heating area surrounded by the grounding layer 2. The grounding layer 2 is located in the space or area between the outer edge of the substrate 1 and the outer edge of the conductive heating layer 4. The grounding layer 2 and the conductive heating layer 4 are spaced apart, that is, they are not connected or in contact with each other, so as to avoid mutual influence after the grounding layer 2 and the conductive heating layer 4 come into contact.

[0046] In use, the grounding layer 2 can be electrically connected to an external electrical control device used to trigger power failure protection to form a power-on circuit. The external electrical control device can detect the integrity of the power-on circuit in real time to determine whether the substrate 1 has been damaged or broken. When the substrate 1 is intact, the power-on circuit is conducting and is in normal use. When the substrate 1 is damaged or broken, the grounding layer 2 is simultaneously disconnected due to the damage to the substrate 1, causing the power-on circuit to be disconnected, which can be judged as an abnormal use state. Since the grounding layer 2 is formed on the substrate 1 by means of coating, adhesion, screen printing or physical vapor deposition, the grounding layer 2 itself does not have toughness and ductility. Therefore, when the substrate 1 is damaged or broken and affects the normal heating of the conductive heating layer 4, the damaged or broken part will inevitably pass through the grounding layer 2 surrounding it first, and then enter the heating area to damage the conductive heating layer 4. On this basis, when the substrate 1 is damaged or broken, it will affect the breakage of the attachment layer of the grounding layer 2. The breakage of the attachment layer of the grounding layer 2 also means that the power supply circuit is broken. The power supply circuit is broken, which can immediately trigger the power-off protection mechanism of the external electrical control equipment, thereby achieving a power-off protection effect with fast response speed and high protection efficiency.

[0047] As another embodiment 102 of embodiment 101, such as Figure 15 and Figure 16 As shown, the grounding layer 2 can extend a grounding lead towards the outside of the substrate 1. The grounding lead can guide the current when the conductive heating layer 4 or the grounding layer 2 leaks to the grounding position, forming an independent leakage protection. On this basis, the grounding layer 2 can also extend a conductive lead towards the conductive heating layer 4 to shorten the distance between the grounding layer 2 and the conductive heating layer 4. When the substrate exhibits conductivity at a specific temperature, causing the conductive heating layer 4 to connect to the conductive lead through the substrate 1, a short circuit in the power-on circuit can be triggered. The short circuit in the power-on circuit triggers the power-off protection of the external electrical control equipment, thereby achieving power-off protection to prevent the conductive heating layer 4 from overheating.

[0048] Example 2:

[0049] Based on Embodiment 1, unlike Embodiment 1, in this embodiment, the conductive heating layer 4 is disposed on the surface A of the substrate 1, and the grounding layer 2 and the insulating layer 3 are disposed on the surface B of the substrate 1. The side of the grounding layer 2 away from the substrate 1 is covered with the insulating layer 3. This embodiment is applicable when the substrate 1 is made of a material that may have conductive properties. When the substrate 1 becomes a conductor in a specific state, it can avoid the risk of leakage on the side of the substrate 1 away from the conductive heating layer 4.

[0050] Example 3:

[0051] Based on Example 1 or Example 2, the difference is that the heating material of the conductive heating layer 4 in this example is made of graphene material to form a film structure. Graphene has a high thermal conductivity and excellent electrical conductivity. During the manufacturing process, the graphene film is formed on the surface of the insulating layer 3 to form a fixed heating area.

[0052] Example 4:

[0053] Based on the above embodiments, such as Figure 2 and Figure 3 The heating assembly shown has a grounded structure. The conductive heating layer 4 includes a heating layer 41 for electrically heated surfaces and an electrode layer 42 for connecting to a power source. The heating layer 41 can be formed from one of the following materials: nano-metal oxide, nano-semiconductor metal oxide, graphene, or carbon paste, creating a planar heating layer for conductive heating. Preferably, the heating layer 41 uses nano-semiconductor metal oxide as the conductive heating material. The thickness of the heating layer 41 and electrode layer 42 is less than 1 mm. The nano-semiconductor metal oxide can be one or a combination of materials such as tin, antimony, nickel, or ammonium as nanoparticles. During fabrication, the nano-semiconductor metal oxide can be produced through a physical vapor phase... The electrode layer 41 is attached to the surface A or the insulating layer 3 by methods such as photopolymerization (PVD), chemical vapor deposition (CVD), screen printing (SS), and far-infrared spectroscopy (FI). After high-temperature sintering, a fixed heating area is formed. At least two separate electrode layers 42 are located on both sides of the heating layer 41. The electrode layer 42 includes a first electrode 421 and a second electrode 422. The first electrode 421 and the second electrode 422 are respectively disposed on both sides of the heating layer 41 to facilitate connection to an external power source. Preferably, the electrode layer 42 can also use silver paste as a conductive material. Silver paste has high conductivity, can effectively conduct current, reduce power loss, and is easy to form on the surface of the insulating layer 3, which is convenient for processing and production.

[0054] Example 5:

[0055] Based on Example 4, such as Figures 12 to 14The heating assembly shown has a grounded structure. The substrate 1 has mounting holes 11 for easy installation. The mounting holes 11 can be set at any position on the substrate 1. The mounting holes 11 can be used to install the substrate 1 on other equipment or devices, or to install other equipment or devices on the substrate 1. For example, a temperature probe can be installed on the substrate 1 through the mounting holes 11.

[0056] More specifically, for ease of installation, the mounting hole 11 may also have one of the following connection structures to enhance installation stability: straight hole wall, tapered hole wall, curved hole wall, thread, snap, or undercut.

[0057] More specifically, the heating layer 41 includes at least three independently arranged heating zones: c, d, e, and f. The heating zones c, d, e, and f are arranged circumferentially around the mounting hole 11. The multiple independently arranged heating zones can expand the heating range of the heating layer 41 to accommodate larger heated objects.

[0058] More specifically, heating zone e and heating zone f are connected by a third electrode. The third electrode extends from one of heating zones e and heating zone f, around the mounting hole 11, and towards the other of heating zones e and heating zone f. Heating zone e, heating zone f, and the third electrode form a central heating zone. At this time, heating zone c, heating zone d, and the same side of the central heating zone are respectively connected to the first electrode 421, and the other side of heating zone c, heating zone d, and the central heating zone are respectively connected to the second electrode 422, so as to form a parallel connection relationship.

[0059] As another embodiment of Example 5, heating zones c, d, e and f can also be connected in series. More specifically, current flows into one of the first electrode 421 and the second electrode 422 and passes through heating zones c, e, the third electrode, f and d in sequence, and then flows out from the other of the first electrode 421 and the second electrode 422, forming a series circuit.

[0060] As another embodiment of Example 5, the heating layer 41 can be provided with multiple heating zones independently to increase the heating area of ​​the heating layer 41.

[0061] As another embodiment of Example 5, the shapes of heating zones c, d, e, and f can be the shapes of the regions enclosed by straight lines and / or curves to meet the heating contact surface requirements of different users.

[0062] As another embodiment of Example 5, the length of heating zone e and the length of heating zone f are added together to equal the length of heating zone c. This structural design is more aesthetically pleasing in terms of partitioning.

[0063] As another embodiment of Example 5, the length of heating zone e and the length of heating zone f are added together to equal the length of heating zone d. This design is more aesthetically pleasing in terms of partitioning.

[0064] As another embodiment of Example 5, the area of ​​heating zone e is the same as the area of ​​heating zone f. This structural design is more aesthetically pleasing in terms of partitioning.

[0065] As another embodiment of Example 5, the shape of heating zone e is the same as that of heating zone f. This design is more aesthetically pleasing in terms of partitioning.

[0066] As another embodiment of Example 5, the shape of heating zone e and the shape of heating zone f are symmetrically arranged with the mounting hole 11 as the center. This structural design is more aesthetically pleasing and visually symmetrical in terms of partitioning.

[0067] As another embodiment of Example 5, the shape of heating zone c is the same as that of heating zone d. This design is more aesthetically pleasing in terms of partitioning.

[0068] As another embodiment of Example 5, the shape of heating zone c and the shape of heating zone d are symmetrically arranged with the mounting hole 11 as the center. This structural design is more aesthetically pleasing and visually symmetrical in terms of partitioning.

[0069] As another embodiment of Example 5, the shape of heating zone c is symmetrical to that of heating zone d with respect to the mounting hole 11, and the shape of heating zone e is symmetrical to that of heating zone f with respect to the mounting hole 11. The center line of symmetry of heating zone c and heating zone d is perpendicular to the center line of symmetry of heating zone e and heating zone f. This design is more aesthetically pleasing and visually symmetrical in terms of partitioning.

[0070] Example 6:

[0071] Based on Example 2, such as Figure 14 The heating component shown has a grounding structure. When the insulating layer 3 is located on surface B, in order to further improve the insulation effect, at least two insulating layers 3 are provided on the side of the grounding layer 2 away from the substrate 1. There can also be three, four, five, etc. By increasing the number of insulating layers 3, the insulation effect of the insulating layer 3 is improved, so as to adapt to the use scenarios with higher current and voltage and ensure user safety.

[0072] Example 7:

[0073] Based on the above embodiments, the difference is as follows: Figure 6 and Figure 8The heating assembly shown has a grounding structure. The grounding layer 2 extends in a grid pattern from the center of the substrate 1 toward the outer edge of the substrate 1. More specifically, the grounding layer 2 can be laid in a grid pattern. The grid structure is formed by the material of the grounding layer 2 enclosing multiple hollow grid units of the same shape. The shape of the grid unit can be a polygon such as a triangle, quadrilateral, pentagon, or hexagon. Compared with the grounding layer 2 covering the entire surface in the above embodiment, the grid-shaped grounding layer 2 in this embodiment has a better appearance. On the basis of grounding effect, the grid-shaped appearance is designed for users to choose from, which improves the product's visual appeal. Compared with the fully covered surface grounding layer, the grid pattern can also save material for the grounding layer due to the hollow or empty areas, further saving material waste and reducing production costs.

[0074] As another embodiment of Example 7, the shape of the grid unit can be a shape formed by straight lines and / or curves enclosing the grid outline. The design of this grid unit structure is more visually appealing and can also avoid gaps in the holes opened in the substrate 1.

[0075] Example 8:

[0076] Based on the above embodiments, the difference is as follows: Figure 7 and Figure 9 The heating assembly shown has a grounding structure. The grounding layer 2 extends in a linear pattern from the center of the substrate 1 toward the outer edge of the substrate 1. More specifically, the grounding layer 2 can be laid in a linear pattern. The linear structure is made of the same material as the grounding layer 2. The linear structure extends from the center of the substrate 1 toward the outer edge of the substrate 1. The linear structure can be a straight line, curve, broken line, spiral line, or other linear shape trajectory. Compared with the grounding layer 2 covering the entire surface in the above embodiment, the linear grounding layer 2 in this embodiment has a better appearance. On the basis of grounding effect, a grid-like appearance is designed for users to choose from, which improves the product's visual appeal. Compared with the fully covered surface grounding layer, the linear pattern can also save on the grounding layer material due to the empty areas, further saving material waste and reducing production costs.

[0077] Example 9:

[0078] Based on the above embodiments, such as Figures 1 to 3 as well as Figure 5 and Figure 12The heating assembly shown has a grounding structure. The insulating layer 3 has a through hole 31. The through hole 31 is located within the laying range of the grounding layer 2. The through hole 31 can be used for the grounding layer 2 to pass through and extend toward the conductive heating layer 4, or for the grounding layer 2 to pass through and lead out to the grounding position, or for other equipment or devices to connect to the grounding layer 2 from the through hole 31.

[0079] As another embodiment of Example 9, the number of through holes 31 can be one or more to accommodate different connection needs.

[0080] Example 10:

[0081] Based on the above embodiments, such as Figures 1 to 14 The heating assembly with a grounding structure shown can have a panel structure of substrate 1 that can be a flat panel structure or a curved panel structure. The panel structure can be a panel shape formed by straight lines and / or curves. Surface A is one of the front and back sides of the flat panel structure, and surface B is the other of the front and back sides of the flat panel structure. The flat panel structure makes it easier for users to place the heated object stably, so that the heated object can be in stable contact with the conductive heating layer 4, thereby improving heating stability and heating efficiency.

[0082] More specifically, the planar plate structure of the substrate 1 can adopt a shape composed of straight lines and / or curves, such as a circle, ellipse, rectangle, trapezoid, etc.

[0083] As another embodiment of Example 10, compared with a flat surface structure, when the heated object has an irregular bottom, the contact area between the flat surface structure and the heated object is limited, and the heat transfer function is not better utilized. Therefore, the panel structure of the substrate 1 can also adopt a curved panel structure, and the surface used to place the heated object adopts a curved and uneven curved surface structure to adapt to the irregular bottom of individual heated objects.

[0084] Example 11:

[0085] Based on the above embodiments, a heating component (not shown) with a grounding structure is provided. The substrate 1 adopts a cylindrical structure, which can be one of the following: a hollow through-structure, a hollow blind hole structure, or a solid structure. The cylindrical structure can be a cylindrical structure with different cross-sectional contours, such as a cylinder or a square cylinder. In this case, when the cylindrical structure is hollow, surface A is one of the outer and inner surfaces of the cylindrical structure, and surface B is the other of the outer and inner surfaces of the cylindrical structure. The cylindrical structure facilitates the user to insert liquid items for heating. The conductive end of the conductive heating layer 4 is protected by a waterproof layer, leaving only the heating end in contact with the liquid. This allows the heated object to maintain stable contact with the conductive heating layer 4, improving heating stability and heating efficiency.

[0086] like Figures 1 to 4 As shown, one specific embodiment of this utility model is as follows:

[0087] During manufacturing, the substrate 1 is made of an insulator. The outer shape of the substrate 1 is first processed to form surface A. The grounding layer 2 is attached to and covers surface A. The grounding layer 2 extends to the outer edge of the substrate 1 and extends to ground. An insulating layer 3 is attached to and covers the side of the grounding layer 2 away from surface A. A conductive heating layer 4 is attached to and covers the side of the insulating layer 3 away from surface A. Electrode layers 42 are provided on both sides of the heating layer 41 of the conductive heating layer 4.

[0088] In use, the first electrode 421 and the second electrode 422 of the electrode layer 42 are electrically connected to an external power source so that the current is conducted through the heating layer 41, and the heating layer 41 generates heat to achieve a normal heating effect.

[0089] When leakage occurs, grounding layer 2 will conduct the current to the grounding location to achieve grounding protection.

[0090] like Figure 5 As shown, another specific embodiment of this utility model is as follows:

[0091] During manufacturing, substrate 1 is made of a conductive material. The outer shape of substrate 1 is first processed to form surface A and surface B. One of surface A and surface B is the front, and the other is the back. A conductive heating layer 4 is attached to and covers surface A. Electrode layers 42 are provided on both sides of the heating layer 41 of the conductive heating layer 4. A grounding layer 2 is attached to and covers surface B, extending to the outer edge of substrate 1 and protruding to ground. An insulating layer 3 is attached to and covers the side of the grounding layer 2 away from surface B.

[0092] In use, the first electrode 421 and the second electrode 422 of the electrode layer 42 are electrically connected to an external power source so that the current is conducted through the heating layer 41, and the heating layer 41 generates heat to achieve a normal heating effect.

[0093] When leakage occurs, the grounding layer 2 conducts the current to the grounding location through the substrate 1, thereby achieving grounding protection.

[0094] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A heating assembly with a grounding structure, characterized in that: It includes a substrate (1), a grounding layer (2) for conductive grounding, an insulating layer (3) and a conductive heating layer (4). The grounding layer (2) and the insulating layer (3) are both disposed on surface A or surface B of the substrate (1). The conductive heating layer (4) is disposed on surface A of the substrate (1). The edge of the grounding layer (2) extends to the outer edge of the substrate (1). The insulating layer (3) is located on the side of the grounding layer (2) away from the substrate (1).

2. A heating assembly with a grounding structure according to claim 1, characterized in that: The conductive heating layer (4) includes a heating layer (41) for heating by electricity and an electrode layer (42) for connecting to a power source, with at least two separate electrode layers (42) located on both sides of the heating layer (41).

3. A heating assembly with a grounding structure according to claim 1, characterized in that: When the grounding layer (2) and the insulating layer (3) are located on surface A, the conductive heating layer (4) is located on the side of the insulating layer (3) away from the grounding layer (2).

4. A heating assembly with a grounding structure according to claim 2, characterized in that: The substrate (1) has mounting holes (11) for easy installation. The heating layer (41) includes heating zones c, d, e and f, which are independently arranged. The heating zones c, d, e and f are arranged around the mounting holes (11) in a circumferential manner.

5. A heating assembly with a grounding structure according to claim 1, characterized in that: The grounding layer (2) extends in a grid pattern from the center of the substrate (1) toward the outer edge of the substrate (1).

6. A heating assembly with a grounding structure according to claim 1, characterized in that: The grounding layer (2) extends in a linear shape from the center of the substrate (1) toward the outer edge of the substrate (1).

7. A heating assembly with a grounding structure according to claim 1, characterized in that: The insulating layer (3) has through holes (31) located within the laying range of the grounding layer (2).

8. A heating assembly with a grounding structure according to claim 1, characterized in that: The substrate (1) is provided with the grounding layer (2), the insulating layer (3) and the conductive heating layer (4) in sequence from the inside to the outside.

9. A heating assembly with a grounding structure according to claim 1, characterized in that: The substrate (1) has a panel structure or a cylindrical structure.

10. A heating assembly with a grounding structure according to any one of claims 1-9, characterized in that: The conductive heating layer (4) is formed into a planar heating layer using one of the following materials: nano metal oxide, nano semiconductor metal oxide, graphene material, or carbon paste material.

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