Moisture-proof device and LED system device assembly

Abstract

The utility model provides a moisture-proof device of an LED packaging structure. The moisture-proof device comprises a heating moisture-removing layer, a room temperature sensor used for sensing the room temperature of the space, a device temperature sensor used for sensing the temperature of a device in the LED packaging structure, and a temperature measuring and controlling circuit. The device temperature sensor and the heating moisture-removing layer are arranged in the LED packaging structure, and the room temperature sensor is arranged outside the LED packaging structure; and the heating moisture-removing layer, the room temperature sensor and the device temperature sensor are respectively connected with the temperature measuring and controlling circuit. The utility model further provides a moisture-proof LED system device assembly. The moisture-proof protection can be carried out on the KSF fluorescent powder.

Description

Technical Field

[0001] This utility model relates to the technical field of LED packaging structure, and in particular to a moisture-proof device and an LED system assembly. Background Technology

[0002] Because KSF phosphor is susceptible to moisture and hydrolysis, when KSF phosphor-containing packages are exposed to moisture in the environment during service, the KSF substance hydrolyzes, turns black, or turns white, leading to device failure. LED device packages containing KSF phosphor usually require certain protective measures or special designs to make the KSF phosphor less susceptible to moisture and water, thus slowing down its moisture and hydrolysis process and extending its service life.

[0003] The following methods are generally used to protect KSF phosphor:

[0004] 1. Inorganically coat KSF phosphor;

[0005] 2. Encapsulate KSF phosphor at the core of the LED device, making it as far away from the outer edge of the encapsulation body as possible;

[0006] 3. Use one or more layers of material to isolate KSF fluorescent powder in a "sandwich" manner. These materials are usually silicone-based materials that are dotted or sprayed, or moisture-proof film layers that are dotted or sprayed.

[0007] 4. Place the KSF phosphor in a specially designed space within the package to conform to certain physical principles and avoid the influence of external electric fields and other factors.

[0008] However, the above methods still have limitations and drawbacks, as follows:

[0009] 1. The packaged components are mostly tiny, with their dimensions mostly in the millimeter range, and some modules are packaged in the centimeter range. This means that no matter what protection methods mentioned above are applied, their protection effect can only "delay" failure, and cannot completely prevent moisture intrusion.

[0010] 2. At the current level of technological advancement, the encapsulation materials used exhibit a trade-off between waterproof and moisture-proof performance and mechanical protection performance. That is to say, encapsulation materials with good waterproof and moisture-proof performance (usually high-refractive-index rigid silicone) sacrifice mechanical bonding protection performance (they are more prone to separation from the encapsulation shell under thermal shock), and vice versa;

[0011] 3. During the service life of the device, the output of light and heat, as well as environmental factors such as temperature changes, corrosive substances, and natural light, all cause the device to slowly age naturally, and the protective measures for KSF phosphor will gradually fail.

[0012] Therefore, the current problem to be solved is to find an effective way to protect KSF phosphor from moisture. Utility Model Content

[0013] In order to solve the problems existing in the prior art, the purpose of this utility model is to provide an LED packaging structure including a moisture-proof device, which can effectively dehumidify the interior of the LED packaging structure;

[0014] The second objective of this invention is to provide a moisture-proof LED system assembly.

[0015] To achieve the above objectives, the present invention adopts the following technical solution:

[0016] A moisture-proof device for an LED packaging structure includes a heat-generating and moisture-removing layer, a room temperature sensor for sensing the room temperature of the surrounding space, a device temperature sensor for sensing the temperature of devices inside the LED packaging structure, and a temperature measurement and control circuit; the device temperature sensor and the heat-generating and moisture-removing layer are disposed inside the LED packaging structure, and the room temperature sensor is disposed outside the LED packaging structure; the heat-generating and moisture-removing layer, the room temperature sensor, and the device temperature sensor are respectively connected to the temperature measurement and control circuit.

[0017] Preferably, the device also includes a humidity sensing device for sensing the humidity of the space where the device is located, the humidity sensing device being connected to the temperature measurement and control circuit; the humidity of the space where the device is located is obtained through the humidity sensing device; if the humidity is higher than the preset humidity, the preset temperature difference value is increased; if the humidity is not higher than the preset humidity, the preset temperature difference value is decreased.

[0018] Preferably, the system also includes a time delay control circuit for controlling the delayed temperature rise of the heating and dehumidifying layer, the time delay control circuit being connected to the temperature measurement and control circuit.

[0019] Preferably, the heating and desiccant layer is a thin film printed with resistive paste; or the heating and desiccant layer is a generally concentric, uninterrupted linear heating film layer.

[0020] Preferably, the room temperature sensor or / and device temperature sensor is a thin-film resistive thermistor or a device made by printing resistive paste.

[0021] Preferably, the temperature sensor of the device is located near or at an equivalent position to the Tc temperature measurement point of the LED package structure.

[0022] A moisture-proof LED system assembly includes a packaged structure body, an LED driving circuit, and a light-emitting component, wherein the light-emitting component is disposed within the packaged structure body; the LED driving circuit is connected to the light-emitting component; and the moisture-proof device is also included.

[0023] Preferably, a power outage monitoring circuit is also included, which is connected to the temperature measurement and control circuit and the LED driving circuit. When the power outage monitoring circuit detects that a power outage has occurred, it automatically disconnects the LED driving circuit. After the power is restored, the heating and dehumidifying layer heats up to dehumidify, and the power outage monitoring circuit sends a signal again to start the LED driving circuit.

[0024] Preferably, the encapsulation structure body includes a substrate layer, an adhesive layer, a circuit carrier layer, and a protective layer stacked sequentially; the LED driving circuit is disposed between the circuit carrier layer and the protective layer, and the heat-generating and moisture-removing layer and the device temperature sensor are disposed between the circuit carrier layer and the adhesive layer;

[0025] The adhesive layer, the heat-generating and moisture-removing layer, the circuit carrier layer, and the LED driving circuit each have a concentric circular through hole in the middle, and the light-emitting component is disposed in the concentric circular through hole;

[0026] The light-emitting component includes a dam, a KSF fluorescent conversion material, leads, a conventional fluorescent conversion material, and an LED chip; the LED chip is disposed on a substrate layer, and the KSF fluorescent conversion material is disposed on the LED chip; the dam surrounds all the LED chips in a ring and is set within concentric circular through holes of the encapsulation structure body, and contains the conventional fluorescent conversion material; the LED chips are interconnected by leads, and one or more LED chips are connected to an LED driving circuit by leads.

[0027] Preferably, the heat-generating and moisture-removing layer is the metal part in the LED packaging structure; the heat-generating and moisture-removing layer is connected in series with a pulse output current and voltage circuit and then connected to a temperature measurement and control circuit.

[0028] The beneficial effects of this utility model are as follows:

[0029] Through the above structure, moisture protection and dehumidification are effectively achieved inside the LED packaging structure, thereby extending the service life of the KSF-containing packaged device. Compared with existing conventional technologies, the technical route adopted in this case can extend the expiration period of KSF phosphor, thereby extending the service life of the LED packaged device. Based on conventional experience data, it is roughly estimated that the service life can be extended by 5000~10000H.

[0030] In the initial stages of accidental moisture exposure (such as power outages or splashing rain), actively heating the components to re-dry them can prevent rapid failure of the light fixture, effectively extending its lifespan. Since the fixture is already damp, the effect of extending its lifespan is uncertain, roughly equivalent to an extension of 1000-5000 hours.

[0031] By eliminating the moisture hazard of KSF devices, the risk of using high-performance KSF phosphors in applications with high reliability requirements is reduced. Product brightness can be increased by 10-15%, and the NTSC color gamut value can be improved by 5-15 percentage points; reducing the risk of selecting KSF phosphors for automotive-grade high color gamut devices. Attached Figure Description

[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0033] Figure 1 This is an exploded view of the moisture-proof LED system assembly described in this utility model;

[0034] Figure 2 This is a schematic diagram of the heating and dehumidifying layer described in this utility model;

[0035] Figure 3 This is a cross-sectional view a of the moisture-proof LED system assembly described in this utility model;

[0036] Figure 4 This is a cross-sectional view (b) of the moisture-proof LED system assembly described in this utility model;

[0037] Figure 5 The circuit diagram of the temperature measurement and control circuit of this utility model adopts an analog circuit method;

[0038] Figure 6 The circuit diagram of the temperature measurement and control circuit of this utility model adopts a digital circuit method.

[0039] in:

[0040] 101-Substrate layer; 102-Adhesive layer; 103-Heat-generating and moisture-wicking layer; 103a-Exposed electrical terminals led out from the heat-generating and moisture-wicking layer; 105-Protective layer; 106-LED driver circuit; 107-Damage; 108-KSF fluorescent conversion material; 109-Lead wire; 110-Conventional fluorescent conversion material; 111-LED chip; 120-Device temperature sensor; 120a-Exposed wiring terminals led out from the temperature sensor; 130-Circuit carrier layer;

[0041] 21-Temperature measurement and control circuit; 22-Room temperature sensor;

[0042] 31-First operational amplifier; 32-Second operational amplifier; 33-First comparator; 34-Second comparator; 35-Bidirectional thyristor or solid-state relay;

[0043] 41-Microprocessor (MCU); 42-Thermistor; 43-Relay;

[0044] 5- Fuse;

[0045] 6-Radiator;

[0046] 7-MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor);

[0047] 8-Hot plate. Detailed Implementation

[0048] To make the technical problems solved by this utility model, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this utility model are further described in detail below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0049] See Figure 1 As shown, the moisture-proof device for an LED packaging structure according to this utility model includes a heat-generating and moisture-removing layer 103, a room temperature sensor 22 for sensing the room temperature of the surrounding space, a device temperature sensor 120 for sensing the temperature of the device inside the LED packaging structure, and a temperature measurement and control circuit 21; the device temperature sensor 120 and the heat-generating and moisture-removing layer 103 are disposed inside the LED packaging structure, and the room temperature sensor 22 is disposed outside the LED packaging structure; the heat-generating and moisture-removing layer 103, the room temperature sensor 22, and the device temperature sensor 120 are respectively connected to the temperature measurement and control circuit 21;

[0050] The room temperature sensor 22 and the device temperature sensor 120 acquire the room temperature and the device temperature, respectively. If the device temperature is lower than the room temperature, the temperature control circuit 21 controls the heating and desiccant layer 103 to start heating, causing the device temperature to rise to a level where the temperature difference between the device and the room temperature is above a preset temperature difference value. If the device temperature is higher than the room temperature, but the temperature difference is not greater than the preset temperature difference value, the heating and desiccant layer 103 heats up, causing the device temperature to rise to a level where the temperature difference between the device and the room temperature is above the preset temperature difference value. If the device temperature is higher than the room temperature and the temperature difference is greater than the preset temperature difference value, the heating and desiccant layer 103 does not operate. This ensures a suitable temperature inside the LED packaging structure, preventing moisture accumulation and effectively dehumidifying and preventing moisture buildup inside the LED packaging structure.

[0051] The temperature sensor is positioned near or at an equivalent location to the Tc temperature measurement point on the LED package structure. Positioning it closer to the KSF fluorescent material is preferable to positioning it further away.

[0052] It also includes a humidity sensing device for sensing the humidity of the space where the device is located. The humidity sensing device is connected to the temperature measurement and control circuit 21. The humidity of the space where the device is located is obtained through the humidity sensing device. If the humidity is higher than the preset humidity (when the air is humid), the preset temperature difference value is increased to ensure the moisture-proof effect. If the humidity is not higher than the preset humidity (when the air is dry), the preset temperature difference value is decreased to reduce energy consumption.

[0053] The preset humidity can be set according to the actual humidity requirements of the space where the device is located, or according to meteorological data, the air humidity parameters corresponding to the humid / dry classification can be set appropriately.

[0054] It also includes a time-delay control circuit for controlling the delayed temperature rise of the heating and dehumidifying layer 103, which is connected to the temperature measurement and control circuit 21. This allows the temperature difference between the device and room temperature to fluctuate within a certain range outside of a preset temperature difference value, so as to avoid the device falling into critical jitter in the heating-stop heating-cooling-reheating cycle (meaning that when the temperature cools down a little, it will immediately trigger reheating, and then quickly stop heating, and then cool down and heat up again. The cycle is too short, causing the device to respond frequently and affecting the stability of the system).

[0055] For example, if the room temperature is 20℃ and the temperature difference is set to 5℃, then the temperature at which heating is determined is 25℃. Without a delay, heating will start as soon as the detected temperature is below 25℃, and will immediately stop as soon as the temperature exceeds 25℃. It will then immediately start heating again as the temperature drops slightly… This is an excessively rapid cycle. With a delay control, when the detected temperature is below or above 25℃, heating will not start immediately, but will proceed after a delay. This will cause the temperature to fluctuate within a small range, for example, it could drop to 23℃, or heat up to 26℃, and so on.

[0056] The time-delay circuit allows the temperature to drop slightly further, but not below room temperature, before re-entering the heating cycle.

[0057] As one embodiment, the room temperature sensor 22 and / or the device temperature sensor 120 are thin-film resistive thermistors or devices made by printing resistive paste.

[0058] In one embodiment, the heating and desiccant layer 103 is a thin film printed with resistive paste, which is then led out to the upper surface of the product through a through-hole process; in another embodiment, see [reference needed]. Figure 2 As shown, the heating and dehumidifying layer 103 is a roughly concentric, uninterrupted linear heating film layer.

[0059] The aforementioned moisture-proof structure effectively dehumidifies and prevents moisture buildup within the LED packaging structure, thus protecting the lifespan of KSF phosphor.

[0060] See Figures 1 to 4 As shown, the present invention provides a moisture-proof LED system assembly, which includes a packaged structure body, an LED driving circuit 106, and a light-emitting component. The light-emitting component is disposed within the packaged structure body. The LED driving circuit 106 is connected to the light-emitting component. The assembly also includes the moisture-proof device described in this invention, wherein a device temperature sensor 120 and a heat-generating and moisture-removing layer 103 are disposed within the packaged structure body, and a room temperature sensor 22 is disposed outside the packaged structure body.

[0061] As one embodiment, the heat-generating and moisture-repelling layer 103 is connected to the temperature measurement and control circuit 21 through the metal part of the encapsulation structure body to reduce the complexity and cost of the system.

[0062] It also includes a power outage monitoring circuit, which is connected to the temperature measurement and control circuit 21 and the LED driver circuit 106. When the power outage monitoring circuit detects that a power outage has occurred, it automatically disconnects the LED driver circuit 106. After the power is restored, the heating and desiccant layer 103 heats up to remove the moisture absorbed during the power outage (because the temperature difference cannot be maintained). Only then does the power outage monitoring circuit send a signal again to close the LED driver circuit 106 to allow the LED to work.

[0063] As one embodiment, the heat-generating and moisture-removing layer 103 is the metal part in the LED packaging structure; when connected to the temperature measurement and control circuit 21, a pulse output current and voltage circuit is added in series at the output end of the control device to avoid the metal body resistance being too small and the current being too large and causing it to burn out in a runaway manner under constant current mode.

[0064] As one example, see Figures 1 to 4 As shown, the encapsulation structure body includes a substrate layer 101, an adhesive layer 102, a circuit carrier layer 130, and a protective layer 105 (i.e., a surface solder resist carrier layer) stacked sequentially; an LED driving circuit 106 is disposed between the circuit carrier layer 130 and the protective layer 105; a heat-generating and moisture-wicking layer 103 and a device temperature sensor 120 are disposed between the circuit carrier layer 130 and the adhesive layer 102; the substrate layer 101 is a metal substrate layer.

[0065] Each of the adhesive layer 102, the heat-generating and moisture-removing layer 103, the circuit carrier layer 130, and the protective layer 105 has a concentric circular through hole in the middle. The light-emitting component is placed in the concentric circular through hole and is disposed on the exposed space of the substrate layer 101.

[0066] The light-emitting component includes a dam 107, a KSF fluorescent conversion material 108 (containing silicone), a lead wire 109, a conventional fluorescent conversion material 110 (containing silicone), and an LED chip 111. The LED chip 111 is fixed on the substrate layer 101, and the KSF fluorescent conversion material 108 is disposed on the LED chip 111. The dam 107 surrounds all the LED chips 111 in a circle and is set in a concentric circular through hole of the encapsulation structure body, and contains the conventional fluorescent conversion material 110. The LED chips 111 are interconnected through the lead wire 109, and one or more LED chips 111 are connected to the LED driving circuit 106 through the lead wire 109.

[0067] The exposed electrical terminals 103a of the heating and dehumidifying layer 103 pass through the circuit carrier layer 130 and the protective layer 105; the exposed wiring terminals 120a of the device temperature sensor pass through the circuit carrier layer 130 and the protective layer 105, and are connected to the temperature measurement and control circuit 21 through their respective exposed terminals.

[0068] For a specific embodiment of the temperature measurement and control circuit 21 in the moisture-proof device of the LED packaging structure described in this utility model, which adopts an analog circuit method, please refer to [the relevant documentation]. Figure 5 As shown. Among them, the power supply, room temperature thermistor, and device thermistor represent two sensors that sense the temperature of the LED package device and the indoor temperature of the space where the device is located, namely the room temperature sensor 22 and the device temperature sensor 120.

[0069] Two temperature signals are input to two operational amplifiers: the room temperature signal, after amplification, is input to the first comparator 33. The positive input of the first comparator 33 is connected to the high-potential end of an adjustable resistor. By adjusting the adjustable resistor, a reference voltage V-ref is provided, indirectly adjusting the temperature difference. The output of the first comparator 33 is connected to the negative input of the second comparator 34, and compared with the amplified signal from the device temperature signal. When the device signal level is lower than the comparator output signal, the output of the second comparator 34 is at a high potential, driving the bidirectional thyristor or solid-state relay 35 to conduct, energizing the heat sink 8 (i.e., the heating layer 103) and causing it to heat up. As the device temperature gradually increases, the two inputs of the second comparator 34 gradually level off, the output level of the second comparator 34 drops, the bidirectional thyristor or solid-state relay 35 turns off, and the device stops heating up. This cycle repeats continuously.

[0070] The temperature control function implemented by this circuit is: room temperature + set temperature difference = device temperature.

[0071] Preferably, a delay control circuit can be connected in series at the output of the second comparator 34. Its function is to start a timer for a certain period of time when the output level of the second comparator 34 goes low (at this time, the previous heating device has just ended and the device has started to cool naturally). The timer duration is longer than the normal recovery time of the output level of the second comparator 34, so as to delay the timing of starting the next heating.

[0072] For a specific embodiment of the temperature measurement and control circuit 21 of the moisture-proof device for the LED packaging structure described in this utility model, which adopts a digital circuit method, please refer to [the relevant documentation]. Figure 6 As shown.

[0073] Temperature detection and regulation are achieved through a digital circuit control system. A microprocessor MCU41 reads the temperature signals from the room temperature sensor 22 and the device temperature sensor 120. Through digital-to-analog conversion, temperature comparison and relay 43 driving are implemented using C language or other programming languages ​​suitable for embedded control systems, thereby controlling the heating layer 103. Specific technical details are general technologies that can be used directly and will not be elaborated here.

[0074] It should be noted that in both of the above embodiments, whether analog or digital circuits, there are circuits or components that are not shown or mentioned but are necessary according to common general knowledge, including but not limited to: overheat protection components, overcurrent protection components, positive and negative feedback circuits of operational amplifiers, peripheral clock, reset, program burning and other servo circuits of MCU, power supply circuits, indicator lights, etc.

[0075] The two circuit diagrams only show the most basic components that implement the functions, and do not limit the parameters, packages, layouts, etc. of the components used. Those skilled in the art should be able to deduce more extended, detailed, and slightly adjusted schematic diagrams from the above schematic diagrams, and can also easily add or delete certain components while keeping the functions declared in this patent unchanged.

[0076] One method for manufacturing the moisture-proof LED system assembly when the temperature measurement and control circuit 21 adopts an analog circuit is as follows:

[0077] The first stage involves fabricating the LED packaging substrate or bracket, which includes the following steps:

[0078] 1. A double-sided copper-clad laminate (BT) is used as the circuit carrier layer 130, with a central cutout to accommodate the LED chip 111 and other components. The LED driver circuit 106 is fabricated on the front side using printed circuit board technology; resistive paste is printed on the back side and dried / sintered to serve as a heating layer (i.e., a heat-generating and moisture-removing layer 103). Holes are drilled and metallized to bring the back heating layer 103 to the pre-reserved electrodes on the front side.

[0079] 2. Print the thermistor paste (to make the device temperature sensor 120) at the reserved position on the back (e.g., the corner), and similarly, lead it out to the reserved electrode on the front through the metallized through hole.

[0080] 3. On the metal substrate, from bottom to top, the adhesive layer 102, the circuit carrier layer 130 (whose bottom surface is the heating layer 103 and the device temperature sensor 120, and its front surface is the LED driver circuit 106), and the printed surface solder resist layer 105 are sequentially bonded to complete the fabrication of the packaging substrate. (See reference) Figure 1 )

[0081] Phase Two: Manufacturing LED Packaging Devices

[0082] 1. An LED light-emitting diode chip is fixed on the exposed light-emitting surface in the center of the metal substrate on the packaging substrate;

[0083] 2. Bond the LED chips together to achieve the preset series-parallel connection, and connect them to the LED driver circuit 106;

[0084] 3. Create a dam 107 of a preset diameter around the edge of the luminous surface;

[0085] 4. Coat the upper surface of the LED light-emitting diode with a mixture of KSF phosphor and encapsulating adhesive and heat-cur it to form the first phosphor conversion layer;

[0086] 5. A mixture of conventional fluorescent material and encapsulating adhesive is coated inside the dam 107 and then heat-cured to form the second fluorescent conversion layer, completing the fabrication of the LED encapsulation device. (See also...) Figure 3 , Figure 4 )

[0087] Phase 3: System Integration

[0088] 1. Connect the manufactured LED packaged device to the control system, wherein the heating layer 103 is connected to the output terminal of the bidirectional thyristor or solid-state relay 35 and the negative terminal of the DC power supply;

[0089] 2. The device temperature sensor 120 is connected to the circuit position of the "device thermistor" resistor in the control device;

[0090] 3. Adjust the reference potentiometer and use a thermocouple to detect the device temperature and room temperature. Record the resistance and temperature values ​​when the system responds to obtain a series of corresponding reference potentiometer resistance values ​​and temperature difference values. Optionally, a scale sticker can be made and attached to the potentiometer accessory.

[0091] 4. Debugging and Operation: Adjust to a set of known resistance values ​​obtained in the previous step, monitor the operation of the system, and complete the final debugging.

[0092] The moisture-proof method for a moisture-proof LED system assembly according to this utility model specifically includes the following steps:

[0093] S1. The room temperature and the device temperature are obtained by the room temperature sensor 22 and the device temperature sensor 120, respectively.

[0094] S2. If the device temperature is lower than the room temperature, the heat-generating and moisture-removing layer 103 will start to heat up, causing the device temperature to rise to a level where the temperature difference with the room temperature is above the preset temperature difference value.

[0095] S3. If the device temperature is higher than the room temperature, but the temperature difference is not greater than the preset temperature difference value, the heating and dehumidifying layer 103 will generate heat, causing the device temperature to rise to a level where the temperature difference with the room temperature is above the preset temperature difference value.

[0096] S4. If the device temperature is higher than the room temperature and the temperature difference is greater than the preset temperature difference value, the heat-generating and moisture-removing layer 103 will not work.

[0097] S5. The above steps S2, S3, and S4 are continuously repeated to ensure that the devices inside the LED packaging structure are always above the ambient temperature, thus protecting the KSF phosphor inside the LED packaging structure from hydrolysis.

[0098] This invention extends the lifespan of KSF-containing packaged devices through the aforementioned structure: Compared to existing conventional technologies, the technical approach adopted in this invention can extend the failure period of KSF phosphor, thereby extending the lifespan of LED packaged devices. Based on conventional experience data, it is roughly estimated that the lifespan can be extended by 5000~10000H (estimated method: the lifespan of conventional KSF-containing packaged devices is about 40000~45000H, and the lifespan of KSF-free packaged devices is about 50000H. With the technical approach of this invention, KSF will not hydrolyze, so it is roughly equivalent to the lifespan of KSF-free packaged devices. This method is for reference only and does not constitute a guarantee or commitment).

[0099] In the initial stages of accidental moisture exposure (such as power outages or splashing rain), actively heating the components to re-dry them can prevent rapid failure of the light fixture, effectively extending its lifespan. Since the fixture is already damp, the effect of extending its lifespan is uncertain, roughly equivalent to an extension of 1000-5000 hours.

[0100] By eliminating the moisture hazard of KSF devices, the risk of using high-performance KSF phosphors in applications with high reliability requirements is reduced. Product brightness can be increased by 10-15%, and the NTSC color gamut value can be improved by 5-15 percentage points; reducing the risk of selecting KSF phosphors for automotive-grade high color gamut devices.

[0101] In this description, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0102] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0103] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A moisture-proof device for an LED package structure, characterized by, The moisture-proof device comprises a heat-generating moisture-removing layer, a room temperature sensor for sensing the room temperature of the space where the device is located, a device temperature sensor for sensing the temperature of the device in the LED packaging structure, and a temperature measurement and control circuit; the device temperature sensor and the heat-generating moisture-removing layer are arranged in the LED packaging structure, and the room temperature sensor is arranged outside the LED packaging structure; the heat-generating moisture-removing layer, the room temperature sensor, and the device temperature sensor are connected with the temperature measurement and control circuit.

2. The moisture-proof device for LED package structure according to claim 1, wherein, The moisture-proof device further comprises a humidity sensing device for sensing the humidity of the space where the device is located, which is connected with the temperature measurement and control circuit; the humidity of the space where the device is located is obtained through the humidity sensing device; if the humidity is higher than the preset humidity, the preset temperature difference value is increased; if the humidity is not higher than the preset humidity, the preset temperature difference value is decreased.

3. The moisture-proof device for LED package structure according to claim 1 or 2, characterized in that, The moisture-proof device further comprises a time delay control circuit for controlling the time delay of the heat-generating moisture-removing layer, which is connected with the temperature measurement and control circuit.

4. The moisture-proof device for LED package structure according to claim 1, wherein, The heat-generating moisture-removing layer is a thin film printed by resistive paste; or the heat-generating moisture-removing layer is an uninterrupted linear heat-generating thin film layer arranged in a concentric ring.

5. The moisture-proof device for LED package structure according to claim 1, wherein, The room temperature sensor and / or the device temperature sensor are thin film resistance type thermosensitive devices or devices made by printing resistive paste.

6. The moisture-proof device for LED package structure according to claim 1, wherein, The device temperature sensor is arranged near the Tc temperature measurement point of the LED packaging structure or an equivalent position.

7. A moisture-proof LED system device assembly, comprising a packaging structure body, an LED driving circuit and a light-emitting assembly, the light-emitting assembly is arranged in the packaging structure body; the LED driving circuit is connected with the light-emitting assembly; characterized in that, The moisture-proof device further comprises the moisture-proof device according to any one of claims 1 to 6.

8. The moisture resistant LED system fixture assembly of claim 7, wherein, The moisture-proof device further comprises a power failure monitoring circuit connected with the temperature measurement and control circuit and the LED driving circuit; when the power failure monitoring circuit monitors that power failure has occurred, the LED driving circuit is automatically disconnected; after power recovery, the heat-generating moisture-removing layer generates heat to remove moisture, and then the power failure monitoring circuit sends a signal to start the LED driving circuit again.

9. The moisture resistant LED system fixture assembly of claim 7, wherein, The packaging structure body comprises a substrate layer, an adhesive layer, a circuit carrying layer, and a protective layer arranged in sequence; the LED driving circuit is arranged between the circuit carrying layer and the protective layer, and the heat-generating moisture-removing layer and the device temperature sensor are arranged between the circuit carrying layer and the adhesive layer. The adhesive layer, the heat-generating moisture-removing layer, the circuit carrying layer, and the LED driving circuit each have a concentric circular through hole arranged in the middle, and the light emitting assembly is arranged in the concentric circular through hole. The light emitting assembly comprises a dam, a KSF fluorescent conversion substance, a lead wire, a fluorescent conversion substance, and an LED chip; the LED chip is arranged on the substrate layer, the KSF fluorescent conversion substance is arranged on the LED chip, the dam surrounds all the LED chips to form a ring and is arranged in the concentric circular through hole of the packaging structure body, and the fluorescent conversion substance is contained in the dam; the LED chips are connected with each other through the lead wire, and one or more LED chips are connected with the LED driving circuit through the lead wire.

10. The moisture resistant LED system fixture assembly of claim 7, wherein, The heat-generating moisture-removing layer is a metal part in the LED packaging structure; the heat-generating moisture-removing layer is connected with a pulse output current voltage circuit in series and connected with the temperature measurement and control circuit.

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