Injection molding structure in electro-magnetic levitation mold

Abstract

The utility model discloses an electro-magnetic levitation in-mold injection molding structure, which belongs to the technical field of in-mold injection molding process, and comprises an injection cavity structure, a molding framework structure, a magnet structure and an external power supply positive and negative pole structure, the molding skeleton structure is movably arranged in the injection cavity structure, an N pole of the magnet structure is arranged on one side of the injection cavity structure, and an S pole of the magnet structure is arranged on the other side of the injection cavity structure; the external power source positive and negative electrode structure is arranged on the adjacent side of the injection cavity structure and electrically connected with the forming framework structure. The injection molding structure in the electro-magnetic levitation mold solves the technical problem that a power line and a memory steel wire are easy to expose when a Bluetooth earphone neck hanging product is subjected to oil pressure molding.

Description

Technical Field

[0001] This utility model relates to the technical field of in-mold injection molding, and in particular to an electromagnetic levitation in-mold injection molding process and a structure using the electromagnetic levitation in-mold injection molding process. Background Technology

[0002] Existing Bluetooth headset neckband products mainly consist of the following components: memory steel wire, power cord, and silicone for the product's outer shape.

[0003] The traditional production method for the aforementioned Bluetooth headset neckband product is as follows: it mainly utilizes the in-mold molding process of hydraulic silicone / solid silicone. Specifically, the amount of silicone used in a single mold is first calculated; then the silicone, power cord, and memory steel wire are placed into the preset mold cavity according to the required direction and sequence; finally, the hydraulic machine is started to perform in-mold molding to complete the production.

[0004] For example, Chinese patent CN117382076A discloses a hydraulic molding device for silicone products and its usage method, which includes: a base, on which a molding component, a transfer component, and a feeding component are arranged. The transfer component is used to transfer the silicone product; the molding component is used to mold the silicone and prevent accidental activation from causing injury to personnel; the feeding component is used to pick up the molded product and remove burrs and waste. The technical solution disclosed in this patent can ensure that the mold is in place and filled with silicone before molding, while protecting personnel safety; it realizes the transfer of the product, so that the feeding pipe does not interfere with the feeding operation, improving the feeding speed; it can quickly feed the product and remove the burrs at the same time, and directly collect and package the finished product without manual operation, simplifying the operation process and improving efficiency.

[0005] However, the aforementioned in-mold hydraulic molding process for silicone products cannot avoid the technical problem of exposed power cords and memory wires in existing Bluetooth headset neckband products during hydraulic molding. Specifically, when using the hydraulic silicone molding process to produce existing Bluetooth headset neckband products, the state inside the mold cavity after the mold closes cannot be observed or perceived by the operator in real time; therefore, the operator cannot control or adjust the position of the power cord and memory wire in real time, resulting in a high defect rate in the produced products. This is mainly manifested in the following ways: the power cord and memory wire are not in the middle tolerance position of the product, and the power cord and memory wire swing in the up and down direction of the product, causing the power cord or memory wire in the finished product to be exposed outside the silicone shell.

[0006] Furthermore, in-mold injection molding is a plastic processing technology that involves melting solid plastic at a specific melting point and injecting it into a mold at a controlled speed under pressure from an injection machine. The mold then cools and solidifies the plastic through water channels, resulting in a product that matches the designed mold cavity. This plastic processing technology is primarily used for molding thermoplastics, but it can also be used for molding thermosetting plastics.

[0007] Based on this, in-mold injection molding can be combined with silicone hydraulic technology to solve the technical problem of exposed power cords and memory steel wires in current Bluetooth headset neckband products during hydraulic molding. Utility Model Content

[0008] Therefore, it is necessary to provide an electromagnetic floating mold in-mold injection molding process to address the technical problem of exposed power cords and memory steel wires during hydraulic molding of Bluetooth headset neckband products.

[0009] An electromagnetic floating mold in-mold injection molding process includes the following steps:

[0010] S1: First, the power cord and memory steel wire required for making the Bluetooth headset neckband product are connected through the first molding mold to obtain a shot product;

[0011] S2: An electromagnetic levitation structure is provided around the product cavity of the second molding mold so that a shot product placed in the product cavity of the second molding mold will always be suspended in a preset position in the product cavity structure after being energized.

[0012] S3: Start the injection machine to inject filler material into the product cavity of the second molding mold, so that the filler material covers and fills the periphery of the first injection product in suspension, so as to obtain the second injection product;

[0013] S4: Further processing of the two-shot product yields a Bluetooth headset neckband product.

[0014] Specifically, the method of providing an electromagnetic levitation structure around the product cavity of the second molding mold is as follows:

[0015] S21: Magnets are installed on both sides of the top of the product cavity of the second molding mold, with one side being N-class and the other side being S-class according to the direction of the magnetic field.

[0016] S22: At the junction of the power cord components of the Bluetooth headset neckband product, a power supply positive and negative terminal device is provided that is insulated from the second molding mold on all four sides, and the energized structure is led out of the second molding mold from the power supply positive and negative terminal device.

[0017] S23: Place the first shot product into the product cavity of the second molding mold, so that the first shot product is electrically connected to the positive and negative terminals of the power supply device.

[0018] S24: Connect the power supply positive and negative terminals to the power supply. By adjusting the output voltage of the power supply positive and negative terminals and the injection parameters of the injection machine, the product in the product cavity of the second molding mold is always suspended at the preset position.

[0019] Furthermore, a structure applying the aforementioned electromagnetic in-mold injection molding process includes: an injection cavity structure, a molding skeleton structure, a magnet structure, and an external power supply positive and negative pole structure; the molding skeleton structure is movably disposed within the injection cavity structure; the N pole of the magnet structure is disposed on one side of the injection cavity structure, and the S pole of the magnet structure is disposed on the other side of the injection cavity structure; the external power supply positive and negative pole structure is disposed adjacent to the injection cavity structure, and the external power supply positive and negative pole structure is electrically connected to the molding skeleton structure.

[0020] Furthermore, the external power supply positive and negative pole structure has an insulating support base, an insulating isolation cover, an electrode connection post structure, an electrode locking structure, an electrode top sealing structure, and an electrode bottom sealing structure.

[0021] Furthermore, an insulating cover is provided above the insulating support body, and two electrode connecting column structures are movably sleeved within the insulating support body.

[0022] Furthermore, each of the electrode connection post structures is electrically connected to one end of the molded skeleton structure, and the insulating cover is disposed over the connection between each of the electrode connection post structures and the molded skeleton structure.

[0023] Furthermore, each of the electrode locking structures is connected to one of the electrode connecting post structures, the electrode top sealing structure passes through the insulating cover and covers the two electrode connecting post structures, and the electrode bottom sealing structure covers the bottom of the two electrode connecting post structures.

[0024] Furthermore, the electrode locking structure includes an electrode locking part and an electrode connector.

[0025] Furthermore, the electrode locking part is movably disposed on the electrode connecting post structure, and the electrode connectors respectively connect the electrode locking part and the electrode connecting post structure.

[0026] Furthermore, the electrode tip sealing structure includes a tip sealing block, a clamping member, and a spring structure; the tip sealing block covers and is disposed on the two electrode connecting post structures, the clamping member passes through the insulating isolation cover and abuts against the top of the tip sealing block, and the spring structure is connected to the clamping member.

[0027] In summary, this invention provides an electromagnetic levitation in-mold injection molding process. First, a first molding die is used to connect the memory steel wire and power cord of a Bluetooth headset neckband product within the product cavity of the first molding die using silicone. This silicone material is injected by a silicone injection molding machine after the first molding die is closed. Subsequently, the product cavity in the second molding die is structurally optimized. A high-temperature resistant magnet and a power supply device are used to create an electromagnetic levitation structure around the product cavity. The magnetic field generated by the current in the power cord and memory steel wire, combined with the magnetic field of the high-temperature resistant magnet, allows the power cord and memory steel wire to levitate within the product cavity of the second molding die due to the magnetic field force generated after energization. Finally, silicone raw material is injected into the product cavity of the second molding mold after mold closing using a silicone injection molding machine. By adjusting the injection parameters such as injection pressure and injection speed of the silicone injection machine, and in conjunction with the aforementioned magnetic field force, it can be ensured that the skeleton material is always controlled within the preset intermediate tolerance value of the product. This eliminates the technical problem of the power cord or memory wire being exposed outside the silicone shell after the product is injection molded in the mold due to the inability to control their position. Therefore, this invention's electromagnetic floating in-mold injection molding process solves the technical problem of exposed power cords and memory wires in Bluetooth headset neckband products during hydraulic molding. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the electromagnetic floating mold in-mold injection molding process of this utility model;

[0029] Figure 2 This is a schematic diagram of the structure of an electromagnetic floating mold in-mold injection molding structure according to the present invention;

[0030] Figure 3 This is a schematic diagram of the exploded structure of an electromagnetic floating mold injection molding structure from another direction according to this utility model.

[0031] Figure 4 This is an exploded view of another direction of a partial structure of an electromagnetic floating mold injection molding structure according to this utility model.

[0032] Figure 5 This is a schematic diagram of another direction of the structure of an electromagnetic floating mold in-mold injection molding structure of the present invention;

[0033] Figure 6 This is an exploded view of another direction of a partial structure of an electromagnetic floating mold injection molding structure according to this utility model.

[0034] Figure 7 This is a schematic diagram of the electromagnetic floating mold in-mold injection molding structure from another direction according to this utility model. Detailed Implementation

[0035] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0036] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0039] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0040] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0041] Please see Figure 1 This utility model discloses an electromagnetic floating mold in-mold injection molding process, which includes the following steps:

[0042] Prepare in advance the first molding mold, the second molding mold, the silicone injection machine, the power transformer, the high-temperature magnet, the silicone material, the power cord material for the Bluetooth headset neckband product, the memory steel wire material for the Bluetooth headset neckband product, and other necessary materials;

[0043] S1: First, use the first molding mold to connect the power cord and memory steel wire required to make the Bluetooth headset neckband product to obtain a shot product;

[0044] S2: Magnets are installed on both sides of the top of the product cavity of the second molding mold, with one side being N-class and the other side being S-class, according to the direction of the magnetic field.

[0045] S3: At the junction of the power cord of the Bluetooth headset neckband product, a power supply positive and negative terminal device is provided that is insulated from the second molding mold on all four sides, and the power is led out of the second molding mold from the side of the power supply positive and negative terminal device.

[0046] S4: Place the first shot product obtained in step S1 into the product cavity of the second molding mold, so that the junction of the power lines of the first shot product is electrically connected to the positive and negative terminals of the power supply device.

[0047] S5: Connect the power supply positive and negative terminals to the power supply. By adjusting the output voltage of the power supply positive and negative terminals and the injection parameters of the silicone injection machine, the product in the product cavity of the second molding mold is always suspended at the preset position.

[0048] S6: Start the silicone injection machine to inject silicone material into the product cavity of the second molding mold to obtain a two-shot product. After the two-shot product is deburred and other fine processing, a Bluetooth headset neckband product can be obtained.

[0049] Specifically, in the electromagnetic levitation in-mold injection molding process of this utility model, firstly, the skeleton material of the Bluetooth headset neckband product, namely the memory steel wire and the power cord material, is connected to each other using a first molding mold. The connection between the two can be made with silicone in the product cavity of the first molding mold, and the silicone material can be injected by a silicone injection machine after the first molding mold is closed. Subsequently, the product cavity in the second molding mold is structurally optimized so that a high-temperature resistant magnet and a power supply device are used to set up an electromagnetic levitation structure around the product cavity. The magnetic field formed by the current in the power cord and the memory steel wire input by the power supply device, combined with the magnetic field of the high-temperature resistant magnet itself, makes the power cord and memory steel wire levitate in the product cavity of the second molding mold by the magnetic field force after being energized. Finally, silicone raw materials are injected into the product cavity of the second molding mold after the mold is closed using a silicone injection molding machine. By adjusting the injection parameters such as the injection pressure and injection speed of the silicone injection machine, and in conjunction with the aforementioned magnetic field force, it can be ensured that the skeleton material is always controlled within the range of the product's preset intermediate tolerance value. Thus, the technical problem of power cords or memory steel wires being exposed outside the silicone shell after the product is injected into the mold is eliminated.

[0050] For further information, please refer to [link / reference]. Figures 2 to 7 A structure applying the aforementioned electromagnetic floating mold in-mold injection molding process includes: an injection cavity structure 1, a molding skeleton structure 2, a magnet structure 3, and an external power supply positive and negative pole structure 4; the molding skeleton structure 2 is movably disposed within the injection cavity structure 1, the N pole of the magnet structure 3 is disposed on one side of the injection cavity structure 1, and the S pole of the magnet structure 3 is disposed on the other side of the injection cavity structure 1; the external power supply positive and negative pole structure 4 is disposed on the adjacent side of the injection cavity structure 1, and the external power supply positive and negative pole structure 4 is electrically connected to the molding skeleton structure 2.

[0051] Specifically, in the aforementioned electromagnetic floating mold injection molding structure, the injection cavity structure 1 is provided in the injection molding mold, and the molding skeleton structure 2 is movably placed within it. The two ends of the molding skeleton structure 2 are electrically connected to the positive and negative terminals of the external power supply positive and negative terminal structure 4, respectively. Therefore, when an external power supply is connected to the external power supply positive and negative terminal structure 4, the current from the external power supply can flow from the positive terminal of the external power supply positive and negative terminal structure 4 into the skeleton molding structure 2, and then flow back to the external power supply after passing through the negative terminal of the external power supply positive and negative terminal structure 4. Since the skeleton molding structure 2 is made of a conductive material, for example, it can be composed of the power cord and memory steel wire structure of a Bluetooth headset neckband product connected together. When current flows into the molding skeleton structure 2, a magnetic field is generated around the molding skeleton structure 2 due to the principle of electromagnetic induction. The injection cavity structure 1 has N and S poles of the magnet structure 3 respectively on both sides. Specifically, one magnet's N pole can be placed on one side of the injection cavity structure 1, and another magnet's S pole on the other side; these two magnets can form the magnet structure 3. Alternatively, the same magnet's N and S poles can be placed on both sides of the injection cavity structure 1, thus forming the magnet structure 3. Therefore, the magnet structure 3 can create a magnetic field force within the injection cavity structure 1; this magnetic field force can act on the magnetic field generated by the energized molding skeleton structure 2; thereby, the molding skeleton structure 2 can levitate within the injection cavity structure 1 after being energized. Subsequently, an external injection mechanism can fill the injection cavity structure 1 with materials such as silicone, which will uniformly coat the periphery of the molding skeleton structure 2 to form its shell structure; thus, the molding skeleton structure 2 can be formed into a uniform in-mold molded product.

[0052] Furthermore, the external power supply positive and negative pole structure 4 has an insulating support base 401, an insulating isolation cover 402, an electrode connecting post structure 403, an electrode locking structure 404, an electrode top sealing structure 405, and an electrode bottom sealing structure 406. The insulating isolation cover 402 is disposed above the insulating support base 401, and two electrode connecting post structures 403 are movably sleeved within the insulating support base 401. Each electrode connecting post structure 403 is electrically connected to one end of the molded skeleton structure 2, and the insulating isolation cover 402 covers the connection between each electrode connecting post structure 403 and the molded skeleton structure 2. Each electrode locking structure 404 is connected to one electrode connecting post structure 403. The electrode top sealing structure 405 passes through the insulating isolation cover 402 and covers the two electrode connecting post structures 403. The electrode bottom sealing structure 406 covers the bottom of the two electrode connecting post structures 403.

[0053] Specifically, the external power supply positive and negative terminal structure 4 mainly serves to connect the molding skeleton structure 2 to an external power source and to insulate the conductive connection portion from the rest of the injection molding mold. More specifically, the molding skeleton structure 2 typically has two ends, each electrically connected to an electrode connection post structure 403, with one electrode connection post structure 403 serving as the positive terminal of the external power source and the other as the negative terminal; thus, a conductive circuit can be formed between the molding skeleton structure 2 and the external power source. Furthermore, the insulating support 401 can pass through the plate structure of the mold and form an insulating barrier, allowing the electrode connection post structure 403 to pass through it; the insulating cover 402 can further insulate the connection point between the electrode connection post structure 403 and the molding skeleton structure 2. Further, after the two electrode connection post structures 403 are electrically connected to the molding skeleton structure 2, the electrode locking structure 404 can lock the conductive connection point; then, the electrode tip sealing structure 405 provides supplementary insulation at this point. Furthermore, the bottom of the two electrode connecting pillar structures 403 is the connection point to the external power source. This part can be insulated and sealed by the electrode bottom sealing structure 406, thereby achieving complete insulation isolation between the setting range of the insulating support body 401 and the insulating isolation cover body 402, so as to completely insulate the positive and negative pole structures 4 of the external power source from the external mold plate.

[0054] Furthermore, the electrode locking structure 404 includes an electrode locking part 404a and an electrode connector 404b. The electrode locking part 404a is movably disposed on the electrode connecting post structure 403, and the electrode connector 404b connects the electrode locking part 404a and the electrode connecting post structure 403 respectively. Specifically, one end of the cable connecting the electrode connecting post structure 403 and the molded skeleton structure 2 is connected to the molded skeleton structure 2, and the other end can be inserted between the electrode locking part 404a and the electrode connecting post structure 403, and then the electrode connector 404b is used to lock the two together.

[0055] Furthermore, the electrode tip sealing structure 405 includes a tip sealing block 405a, a clamping member 405b, and a spring structure 405c. The tip sealing block 405a covers the two electrode connecting post structures 403. The clamping member 405b passes through the insulating cover 402 and abuts against the top of the tip sealing block 405a. The spring structure 405c is connected to the clamping member 405b. Specifically, after the external mold plate structure clamps the spring structure 405c, the spring can be transferred to the tip sealing block 405a through the clamping member 405b, thereby allowing the tip sealing block 405a to cover the two electrode connecting post structures 403.

[0056] Furthermore, in one embodiment, an upper mold core structure 5 is provided above the external power supply positive and negative terminal structure 4, and a lower mold core structure 6 is provided below the external power supply positive and negative terminal structure 4; the upper mold core structure 5 and the lower mold core structure 6 are arranged to open and close relative to each other, and the injection cavity structure 1 is disposed between the upper mold core structure 5 and the lower mold core structure.

[0057] Furthermore, the molded skeleton structure 2 has a power cord portion 201 and a memory wire portion 202. The power cord portion 201 and the memory wire portion 202 are stacked and arranged. The power cord portion 201 and the memory wire portion 202 can be connected by silicone coating through mold core molding.

[0058] In summary, this invention provides an electromagnetic levitation in-mold injection molding process. First, a first molding die is used to connect the memory steel wire and power cord of a Bluetooth headset neckband product within the product cavity of the first molding die using silicone. This silicone material is injected by a silicone injection molding machine after the first molding die is closed. Subsequently, the product cavity in the second molding die is structurally optimized. A high-temperature resistant magnet and a power supply device are used to create an electromagnetic levitation structure around the product cavity. The magnetic field generated by the current in the power cord and memory steel wire, combined with the magnetic field of the high-temperature resistant magnet, allows the power cord and memory steel wire to levitate within the product cavity of the second molding die due to the magnetic field force generated after energization. Finally, silicone raw material is injected into the product cavity of the second molding mold after mold closing using a silicone injection molding machine. By adjusting the injection parameters such as injection pressure and injection speed of the silicone injection machine, and in conjunction with the aforementioned magnetic field force, it can be ensured that the skeleton material is always controlled within the preset intermediate tolerance value of the product. This eliminates the technical problem of the power cord or memory wire being exposed outside the silicone shell after the product is injection molded in the mold due to the inability to control their position. Therefore, this invention's electromagnetic floating in-mold injection molding process solves the technical problem of exposed power cords and memory wires in Bluetooth headset neckband products during hydraulic molding.

[0059] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An electromagnetic floating mold in-mold injection molding structure, characterized in that, It includes: an injection cavity structure (1), a molding skeleton structure (2), a magnet structure (3), and an external power supply positive and negative pole structure (4); the molding skeleton structure (2) is movably disposed in the injection cavity structure (1), the N pole of the magnet structure (3) is disposed on one side of the injection cavity structure (1), and the S pole of the magnet structure (3) is disposed on the other side of the injection cavity structure (1); the external power supply positive and negative pole structure (4) is disposed on the adjacent side of the injection cavity structure (1), and the external power supply positive and negative pole structure (4) is electrically connected to the molding skeleton structure (2).

2. The electromagnetic floating mold in-mold injection molding structure according to claim 1, characterized in that: The external power supply positive and negative pole structure (4) has an insulating support base (401), an insulating isolation cover (402), an electrode connection post structure (403), an electrode locking structure (404), an electrode top sealing structure (405), and an electrode bottom sealing structure (406).

3. The electromagnetic floating mold in-mold injection molding structure according to claim 2, characterized in that: The insulating cover (402) is provided above the insulating support base (401), and two electrode connecting column structures (403) are movably sleeved in the insulating support base (401).

4. The electromagnetic floating mold in-mold injection molding structure according to claim 3, characterized in that: Each of the electrode connection post structures (403) is electrically connected to one end of the molded skeleton structure (2), and the insulating cover (402) is disposed over the connection between each of the electrode connection post structures (403) and the molded skeleton structure (2).

5. The electromagnetic floating mold in-mold injection molding structure according to claim 4, characterized in that: Each of the electrode locking structures (404) is connected to one of the electrode connecting post structures (403). The electrode top sealing structure (405) passes through the insulating cover (402) and covers the two electrode connecting post structures (403). The electrode bottom sealing structure (406) covers the bottom of the two electrode connecting post structures (403).

6. The electromagnetic floating mold in-mold injection molding structure according to claim 5, characterized in that: The electrode locking structure (404) has an electrode locking part (404a) and an electrode connector (404b).

7. The electromagnetic floating mold in-mold injection molding structure according to claim 6, characterized in that: The electrode locking part (404a) is movably disposed on the electrode connecting post structure (403), and the electrode connector (404b) connects the electrode locking part (404a) and the electrode connecting post structure (403) respectively.

8. The electromagnetic floating mold in-mold injection molding structure according to claim 7, characterized in that: The electrode tip sealing structure (405) has a tip sealing block (405a), a clamping member (405b), and a spring structure (405c).

9. The electromagnetic floating mold in-mold injection molding structure according to claim 8, characterized in that: The top sealing block (405a) is disposed on the two electrode connecting post structures (403), and the clamping member (405b) passes through the insulating isolation cover (402) and abuts against the top of the top sealing block (405a).

10. The electromagnetic floating mold in-mold injection molding structure according to claim 9, characterized in that: The spring structure (405c) is connected to the clamping member (405b).

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