Radio frequency test circuit and electronic equipment

Abstract

The utility model discloses a radio frequency test circuit and electronic equipment, and belongs to the technical field of electronics. The radio frequency test circuit comprises a first radio frequency circuit which comprises a first output port; the first end of the first radio frequency matching network is connected with the first output port; a first port of the coupler is connected with a second end of the first radio frequency matching network, a second port of the coupler is connected with a test point, the test point is used for inserting a test probe, and a fourth port of the coupler is grounded; the first end of the first antenna matching network is connected with the third port of the coupler; and the first antenna is connected with the second end of the first antenna matching network.

Description

Technical Field

[0001] This application belongs to the field of electronic technology, specifically relating to a radio frequency test circuit and electronic device. Background Technology

[0002] With the rapid development of communication technology, electronic devices are increasingly equipped with more and more antennas. Generally, 4G (4th Generation Mobile Communication Technology) has 2 to 4 antennas, 5G (5th Generation Mobile Communication Technology) has 4 to 6 antennas, and GPS (Global Positioning System), WIFI (Wireless Fidelity), or BT (Bluetooth) has 3 to 4 antennas.

[0003] Among them, such as Figure 9 As shown, the dots represent RF test sockets, and ANT1 to ANT11 represent antenna numbers. Each antenna corresponds to at least one RF test socket.

[0004] As a result, with the increase in the number of antennas in electronic devices, the number of RF test sockets in electronic devices is also increasing, and the layout space occupied by RF test sockets is also increasing. With the number of cameras in electronic devices also gradually increasing, the layout space in electronic devices is decreasing sharply, which leads to a shortage of PCB (Printed Circuit Board) layout space in electronic devices. Furthermore, the increase in RF test sockets will also lead to an increase in costs. Utility Model Content

[0005] The purpose of this application is to provide an RF test circuit and electronic device that can reduce the number of RF test sockets in the electronic device, save PCB layout space in the electronic device, and reduce the manufacturing cost of the electronic device.

[0006] In a first aspect, embodiments of this application provide a radio frequency (RF) test circuit, comprising: a first RF circuit including a first output port; a first RF matching network, a first end of the first RF matching network being connected to the first output port; a coupler, a first port of the coupler being connected to a second end of the first RF matching network, the second port of the coupler being connected to a test point for inserting a test probe, and a fourth port of the coupler being grounded; a first antenna matching network, a first end of the first antenna matching network being connected to a third port of the coupler; and a first antenna being connected to the second end of the first antenna matching network.

[0007] Secondly, embodiments of this application provide a radio frequency (RF) test circuit, comprising: a second RF circuit including a second output port and a third output port; a first RF matching network, a first end of which is connected to the third output port; a second RF matching network, a first end of which is connected to the second output port; a coupler, a first port of which is connected to a second end of the first RF matching network, and a second port of which is connected to a second end of the second RF matching network; an RF test socket, a first end of which is connected to a fourth port of the coupler, the RF test socket being used to insert test probes; a first antenna matching network, a first end of which is connected to the third port of the coupler; a second antenna matching network, a first end of which is connected to the second end of the RF test socket; a first antenna connected to the second end of the first antenna matching network; and a second antenna connected to the second end of the second antenna matching network.

[0008] Thirdly, embodiments of this application provide an electronic device, including: a radio frequency test circuit as described in the first aspect, or a radio frequency test circuit as described in the second aspect.

[0009] The first aspect of this application provides an RF test circuit, including a first RF circuit, a first RF matching network, a coupler, a first antenna matching network, and a first antenna. The first RF circuit includes a first output port; a first end of the first RF matching network is connected to the first output port; a first port of the coupler is connected to a second end of the first RF matching network, and the second port of the coupler is connected to a test point for inserting a test probe; a fourth port of the coupler is grounded; a first end of the first antenna matching network is connected to a third port of the coupler; and the first antenna is connected to the second end of the first antenna matching network. Through this RF test circuit, the coupler and test point replace the RF test socket. During RF testing, the input signal is transmitted and coupled through the coupler, and a test probe is inserted at the test point for testing. Thus, when performing RF testing on a single-output RF circuit, the RF test socket can be eliminated, saving the layout space occupied by the RF test socket, saving PCB layout space in electronic devices, and reducing the manufacturing cost of electronic devices.

[0010] The radio frequency (RF) test circuit provided in the second aspect of this application includes a second RF circuit, a first RF matching network, a second RF matching network, a coupler, an RF test socket, a first antenna matching network, a second antenna matching network, a first antenna, and a second antenna. The second RF circuit includes a second output port and a third output port; a first end of the first RF matching network is connected to the third output port; a first end of the second RF matching network is connected to the second output port; a first port of the coupler is connected to the second end of the first RF matching network, and a second port of the coupler is connected to the second end of the second RF matching network; a first end of the RF test socket is connected to the fourth port of the coupler, and the RF test socket is used to insert test probes; a first end of the first antenna matching network is connected to the third port of the coupler; a first end of the second antenna matching network is connected to the second end of the RF test socket; the first antenna is connected to the second end of the first antenna matching network; and the second antenna is connected to the second end of the second antenna matching network. With the above RF test circuit, a coupler and a single RF test socket replace two RF test sockets. During RF testing, the coupler transmits and couples the input signal, and test probes are inserted into the remaining RF test sockets for testing. In this way, RF testing of dual-output RF circuits can be achieved with only one RF test socket, reducing the number of RF test sockets used, reducing the layout space occupied by the RF test sockets, saving PCB layout space in electronic devices, and reducing the manufacturing cost of electronic devices. Attached Figure Description

[0011] Figure 1 This is one of the structural schematic diagrams of the radio frequency test circuit provided in the embodiments of this application;

[0012] Figure 2 This is a second schematic diagram of the structure of the radio frequency test circuit provided in the embodiments of this application;

[0013] Figure 3 This is a schematic diagram of the structure of the test probe provided in the embodiments of this application;

[0014] Figure 4 This is a RF link diagram of test points in related technologies;

[0015] Figure 5 A top view of the radio frequency test socket provided in the embodiments of this application;

[0016] Figure 6 A left view of the RF test socket provided in an embodiment of this application;

[0017] Figure 7 A front view of the RF test socket provided in an embodiment of this application;

[0018] Figure 8 A right view of the RF test socket provided in an embodiment of this application;

[0019] Figure 9 This is a diagram showing the distribution of antennas and RF test sockets for electronic devices in related technologies.

[0020] Figure 10 This is a diagram of the radio frequency link of a radio frequency test socket in related technologies;

[0021] Figure 11 This is a schematic diagram showing the location of the radio frequency test socket for electronic devices in related technologies;

[0022] Figure 12 This is one of the signal flow diagrams for the RF test socket in related technologies;

[0023] Figure 13 This is the second diagram showing the working signal flow of an RF test socket in related technologies.

[0024] Figure 14 This is one of the simulation modeling diagrams of the coupler provided in the embodiments of this application;

[0025] Figure 15 This is the second schematic diagram of the simulation modeling of the coupler provided in the embodiments of this application;

[0026] Figure 16 One of the simulation result diagrams of the coupler provided in the embodiments of this application;

[0027] Figure 17 The second simulation result diagram of the coupler provided in the embodiments of this application;

[0028] Figure 18 Figure 3 shows the simulation results of the coupler provided in the embodiments of this application;

[0029] Figure 19 Figure 4 shows the simulation results of the coupler provided in the embodiments of this application;

[0030] Figure 20 This is one of the structural block diagrams of the electronic device provided in the embodiments of this application;

[0031] Figure 21 This is a second structural block diagram of the electronic device provided in the embodiments of this application.

[0032] Figure 1 Figure labels in the diagram:

[0033] 100 RF test circuit, 102 First RF circuit, 104 First output port, 106 First RF matching network, 108 Coupler, 110 First port, 112 Second port, 114 Test point, 116 First antenna matching network, 118 Third port, 120 First antenna, 122 First resistor, 124 Fourth port, 136 Second resistor, 138 Third resistor, 140 Fourth resistor, 142 Fifth resistor, 144 Sixth resistor, 146 Seventh resistor.

[0034] Figure 2 Figure labels in the diagram:

[0035] 106 First RF matching network, 108 Coupler, 110 First port, 112 Second port, 116 First antenna matching network, 118 Third port, 120 First antenna, 124 Fourth port, 128 Second RF matching network, 130 RF test socket, 132 Second antenna matching network, 134 Second antenna, 200 RF test circuit, 202 Second RF circuit, 204 Second output port, 206 Third output port. Detailed Implementation

[0036] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0037] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0038] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] The following is combined Figures 1-21 The radio frequency test circuit and electronic device according to embodiments of this application will be described in detail.

[0040] like Figure 1 As shown in the figure, this application embodiment provides a radio frequency (RF) test circuit 100. The RF test circuit 100 includes a first RF circuit 102, a first RF matching network 106, a coupler 108, a first antenna matching network 116, and a first antenna 120.

[0041] The first radio frequency circuit 102 includes a first output port 104.

[0042] Furthermore, the first end of the first radio frequency matching network 106 is connected to the first output port 104.

[0043] Furthermore, the first port 110 of the coupler 108 is connected to the second end of the first RF matching network 106, the second port 112 of the coupler 108 is connected to the test point 114, and the fourth port 124 of the coupler 108 is grounded.

[0044] Test point 114 is a solder pad on the PCB, which does not increase costs.

[0045] Furthermore, test point 114 is used to insert a test probe, the specific structure of which is as follows: Figure 3 As shown, it includes a signal conductor and a ground conductor, with the signal conductor being the portion inserted at test point 114. Test probes are generally used in conjunction with measuring instruments. By using test probes in conjunction with measuring instruments, radio frequency conduction parameters such as power and receiving sensitivity of the first radio frequency circuit 102 can be measured.

[0046] Furthermore, the first end of the first antenna matching network 116 is connected to the third port 118 of the coupler 108.

[0047] Furthermore, the first antenna 120 is connected to the second end of the first antenna matching network 116.

[0048] It is understandable that, such as Figure 10 and Figure 11 As shown, existing RF testing solutions utilize an RF test socket, which is positioned between the RF circuit and the antenna. Specifically, when no test probes are inserted into the RF test socket, such as... Figure 12 As shown, the signal flow is: RF circuit → RF test socket → antenna matching network → antenna; after inserting the test probe into the RF test socket, the signal flow changes, as shown... Figure 13 As shown, the signal flow is: RF circuit → RF test socket → test probe. At this point, the RF test socket is disconnected from the back-end circuit, and the back-end circuit does not affect the circuit performance or the accuracy of the test. In this scheme, as... Figure 5 , Figure 6 , Figure 7 as well as Figure 8As shown, the base side lengths of the RF test socket are 2.1mm and 2mm respectively, the socket diameter is 1.35mm, the socket height is 0.45mm, the overall height of the RF test socket is approximately 0.9±0.1mm, and the RF test socket occupies an area of ​​approximately 4mm². 2 When electronic devices adopt the above-mentioned RF testing scheme, the more RF test sockets there are, the more PCB area they occupy, which makes the PCB layout extremely tight, increases the design difficulty, and increases material costs.

[0049] Based on this, those skilled in the art have designed a test-point-based RF testing scheme, which replaces the RF test socket in the existing RF testing scheme with a test point to test RF conducted parameters. However, in this scheme, the antenna impedance at the back end of the test point can affect the accuracy of the RF conducted parameter test results.

[0050] Furthermore, existing RF testing solutions also include, for example... Figure 4 The illustrated solution uses an RF test socket during the debugging phase, but omits it during mass production, replacing it with a 0-ohm resistor jumper to allow RF signals to be transmitted to the antenna. The production line uses test points for conducted testing. However, while this solution eliminates the need for the RF test socket in mass production, its location is still retained, resulting in wasted PCB layout space.

[0051] Therefore, this application provides an RF test circuit 100 that can accurately test RF conduction parameters while saving the need for an RF test socket. Specifically, in the RF test circuit 100 provided in this application embodiment, a coupler 108 and test points 114 (pads on the PCB) replace the RF test socket. During the testing of RF conduction parameters, the input signal is transmitted and coupled through the coupler 108, and test probes are inserted into the test points 114 to obtain the measurement results.

[0052] Specifically, the aforementioned coupler 108 is a directional coupler 108. According to the working principle of the directional coupler 108, the RF signal output from the first output port 104 of the first RF circuit 102, after passing through the first RF matching network 106 to the first port 110 of the coupler 108, can be output to the third port 118 of the coupler 108 with approximately no loss. Then, it passes through the first antenna matching network 116 to reach the first antenna 120, where the first antenna 120 receives the normal RF signal. Simultaneously, the RF signal output from the first output port 104 of the first RF circuit 102, after reaching the first port 110 of the coupler 108, can also be coupled to the second port 112 of the coupler 108 with some loss, thus reaching the test point 114. At this point, the test point 114 receives the lost RF signal. The loss value of the RF signal transmitted to the test point 114 is the coupling value of the second port 112 of the coupler 108. This coupling value is a fixed value, related to the device parameters of the coupler 108. Based on this, the energy of the coupled radio frequency signal at test point 114 is measured by using a test probe and measuring instruments. By combining the compensation of the above loss value, i.e. the coupling value, the test results of the radio frequency conduction index can be obtained. These test results can be used to evaluate the radio frequency performance during project debugging.

[0053] In the process of compensating for the loss value, i.e. the coupling value, the loss value can be added to the measured value of the test instrument to obtain the test result of the radio frequency conduction index. Alternatively, the loss value, i.e. the coupling value, of the coupler 108 can be compensated directly inside the test instrument so that the measured value of the test instrument is the test result of the radio frequency conduction index.

[0054] Thus, compared to existing RF testing solutions, the RF testing circuit 100 provided in this application replaces the RF test socket with a coupler 108 and a test point 114. During the debugging and mass production stages, the RF test socket does not need to be attached, and there is no need to use a 0-ohm resistor for compatibility design. This reduces the number of RF test sockets, thereby saving PCB layout space and reducing the manufacturing cost of electronic devices.

[0055] The radio frequency (RF) test circuit 100 according to an embodiment of this application includes a first RF circuit 102, a first RF matching network 106, a coupler 108, a first antenna matching network 116, and a first antenna 120. The first RF circuit 102 includes a first output port 104; a first end of the first RF matching network 106 is connected to the first output port 104; a first port 110 of the coupler 108 is connected to a second end of the first RF matching network 106, a second port 112 of the coupler 108 is connected to a test point 114 for inserting a test probe, and a fourth port 124 of the coupler 108 is grounded; a first end of the first antenna matching network 116 is connected to a third port 118 of the coupler 108; and the first antenna 120 is connected to a second end of the first antenna matching network 116. Using the above-described RF test circuit 100, the coupler 108 and the test point 114 replace the RF test socket. During RF testing, the input signal is transmitted and coupled through the coupler 108, and a test probe is inserted at the test point 114 for testing. In this way, when performing RF testing on single-output RF circuits, the RF test socket can be eliminated, saving the layout space occupied by the RF test socket, saving PCB layout space in electronic devices, and reducing the manufacturing cost of electronic devices.

[0056] According to some embodiments of this application, optionally, such as Figure 1 As shown, the RF test circuit 100 also includes a first resistor 122.

[0057] The first end of the first resistor 122 is connected to the fourth port 124 of the coupler 108, and the second end of the first resistor 122 is grounded, so that the fourth port 124 of the coupler 108 is grounded through the first resistor 122.

[0058] Furthermore, the function of the first resistor 122 is to prevent signal reflection caused by insufficient isolation at the fourth port 124 of the coupler 108.

[0059] Furthermore, under ideal conditions, the fourth port 124 of the coupler 108 has no energy. In actual use, the fourth port 124 of the coupler 108 may have a very weak signal, and the energy of this part of the signal will be consumed by the first resistor 122.

[0060] The radio frequency test circuit 100 according to an embodiment of this application further includes a first resistor 122. The first end of the first resistor 122 is connected to the fourth port 124 of the coupler 108, and the second end of the first resistor 122 is grounded, so that the fourth port 124 is grounded through the first resistor 122. In this way, signal reflection can be prevented due to insufficient isolation of the fourth port 124 of the coupler 108.

[0061] According to some embodiments of this application, optionally, such as Figure 1 As shown, the first port 110 of the coupler 108 is the input port, the second port 112 of the coupler 108 is the coupling port, the third port 118 of the coupler 108 is the output port, and the fourth port 124 of the coupler 108 is the isolation port.

[0062] The loss value between the input port and the output port is 0, and the loss value between the input port and the coupling port is related to the device parameters of the coupler 108.

[0063] Specifically, based on the working principle of coupler 108, the radio frequency (RF) signal can be transmitted from the input port of coupler 108 to the output port of coupler 108 with approximately zero loss; that is, the loss between the input and output ports of coupler 108 is approximately zero. Further, the RF signal will be transmitted with some loss from the input port to the coupling port of coupler 108, where the loss between the input and coupling ports is related to the device parameters of coupler 108. Thus, based on the working principle of coupler 108, for the single-path first RF circuit 102, when testing RF conduction parameters, the test socket can be replaced, saving the layout space occupied by the RF test socket, saving PCB layout space in the electronic device, and reducing the manufacturing cost of the electronic device.

[0064] Specifically, the RF signal output from the first output port 104 passes through the first RF matching network 106 to the first port 110 of the coupler 108, and can then be output to the third port 118 of the coupler 108 with almost no loss. It then passes through the first antenna matching network 116 to reach the first antenna 120, where the first antenna 120 receives the normal RF signal. Simultaneously, the RF signal output from the first output port 104 of the first RF circuit 102, after reaching the first port 110 of the coupler 108, can also be coupled to the second port 112 of the coupler 108 with some loss, reaching the test point 114. Here, the test point 114 receives the lost RF signal. Based on this, by using a test probe and measuring instruments to measure the energy of the coupled RF signal at test point 114, and combining this with compensation for the loss value (coupling value) of the coupler 108, the test results of the RF conduction index can be obtained. These test results can be used for RF performance evaluation during project debugging. In this way, for the first RF circuit 102 with a single channel, the RF test socket is replaced by the coupler 108 and the test point 114, which saves the layout space occupied by the RF test socket, saves the PCB layout space in the electronic device, and reduces the manufacturing cost of the electronic device.

[0065] In practical applications, the device parameters of coupler 108 may specifically include the substrate parameters and coupling parameters of coupler 108. Among them, the substrate parameters are used to indicate the material properties of coupler 108, and the coupling parameters are used to indicate the coupling performance or coupling target of coupler 108.

[0066] According to the RF test circuit 100 of this application embodiment, the first port 110 of the coupler 108 is an input port, the second port 112 of the coupler 108 is a coupling port, the third port 118 of the coupler 108 is an output port, and the fourth port 124 of the coupler 108 is an isolation port. Thus, for the single-path first RF circuit 102, the coupler 108 and test point 114 replace the RF test socket, saving the layout space occupied by the RF test socket, saving PCB layout space in the electronic device, and reducing the manufacturing cost of the electronic device.

[0067] According to some embodiments of this application, optionally, such as Figure 1 As shown, the first radio frequency matching network 106 includes a second resistor 136, a third resistor 138, and a fourth resistor 140.

[0068] The first end of the second resistor 136 is connected to the first output port 104, and the second end of the second resistor 136 is grounded.

[0069] Furthermore, the first end of the third resistor 138 is connected to the first output port 104, and the second end of the third resistor 138 is connected to the first port 110 of the coupler 108.

[0070] Furthermore, the first end of the fourth resistor 140 is connected to the first port 110 of the coupler 108, and the second end of the fourth resistor 140 is grounded.

[0071] In the RF test circuit 100 provided in this embodiment, the first RF matching network 106 adopts a T-type matching network. In actual applications, the first RF matching network 106 may also adopt an L-type matching network or a π-type matching network, etc., without specific limitations.

[0072] According to the RF test circuit 100 of this application embodiment, the first RF matching network 106 includes a second resistor 136, a third resistor 138, and a fourth resistor 140. The first end of the second resistor 136 is connected to the first output port 104, and the second end of the second resistor 136 is grounded. The first end of the third resistor 138 is connected to the first output port 104, and the second end of the third resistor 138 is connected to the first port 110 of the coupler 108. The first end of the fourth resistor 140 is connected to the first port 110 of the coupler 108, and the second end of the fourth resistor 140 is grounded. Thus, the first RF matching network 106 adopts a T-type matching network, ensuring that the input impedance of the coupler 108 matches the output impedance of the first RF circuit 102, reducing signal reflection and energy loss, and improving signal transmission efficiency.

[0073] According to some embodiments of this application, optionally, such as Figure 1 As shown, the first antenna matching network 116 includes a fifth resistor 142, a sixth resistor 144, and a seventh resistor 146.

[0074] The first end of the fifth resistor 142 is connected to the first antenna 120, and the second end of the fifth resistor 142 is grounded.

[0075] Furthermore, the first end of the sixth resistor 144 is connected to the first antenna 120, and the second end of the sixth resistor 144 is connected to the third port 118 of the coupler 108.

[0076] Furthermore, the first end of the seventh resistor 146 is connected to the third port 118 of the coupler 108, and the second end of the seventh resistor 146 is grounded.

[0077] In the RF test circuit 100 provided in this embodiment, the first antenna matching network 116 adopts a T-type matching network. In practical applications, the first antenna matching network 116 may also adopt an L-type matching network or a π-type matching network, etc., without specific limitations.

[0078] According to the RF test circuit 100 of this application embodiment, the first antenna matching network 116 includes a fifth resistor 142, a sixth resistor 144, and a seventh resistor 146. The first end of the fifth resistor 142 is connected to the first antenna 120, and the second end of the fifth resistor 142 is grounded. The first end of the sixth resistor 144 is connected to the first antenna 120, and the second end of the sixth resistor 144 is connected to the third port 118 of the coupler 108. The first end of the seventh resistor 146 is connected to the third port 118 of the coupler 108, and the second end of the seventh resistor 146 is grounded. Thus, the first antenna matching network 116 adopts a T-type matching network, ensuring that the input impedance of the first antenna 120 matches the output impedance of the coupler 108, reducing signal reflection and energy loss, and improving signal transmission efficiency.

[0079] According to some embodiments of this application, the coupler 108 may optionally be a microstrip line coupler.

[0080] The design of the microstrip line coupler can be achieved through simulation.

[0081] Specifically, in the process of simulating the design of microstrip line couplers, such as Figure 14 and Figure 15 As shown, a simulation model of a microstrip line coupler is established, with four ports (port 1, port 2, port 3, and port 4). Appropriate board material parameters and coupling parameters are selected, and the passive circuit design wizard is used for design, yielding calculated results for the microstrip line width W, the gap S between microstrip lines, and the microstrip line length L. Based on this, as... Figure 16 , Figure 17 , Figure 18 and Figure 19 As shown, by combining the above calculation results and the simulation results of the S-parameters of the designed microstrip line coupler, the above plate parameters and coupling parameters can be adjusted to design a microstrip line coupler that meets the performance requirements.

[0082] The aforementioned substrate parameters include, but are not limited to: the thickness H of the microstrip dielectric substrate, the relative permittivity Er of the microstrip dielectric substrate, the relative permeability Mur of the microstrip dielectric substrate, the conductivity Cond of the microstrip metal sheet, the package height Hu of the microstrip circuit, the thickness T of the microstrip metal sheet, the loss tangent TanD of the microstrip line, and the surface roughness Rough of the microstrip line, etc., which are not specifically limited here.

[0083] Furthermore, the aforementioned board parameters include, but are not limited to: center frequency F, characteristic impedance Zo of microstrip lines at each port, coupling value C, fine-tuning coefficient Delta, cutoff frequency, and frequency increment, etc., without specific limitations.

[0084] Furthermore, the S-parameters are a set of complex coefficients describing the frequency response of a microstrip line coupler. The S-parameters are a key tool for understanding and optimizing the performance of coupler 108, providing important information about its transmission and reflection losses. After obtaining the S-parameters through simulation, the performance of coupler 108 at different frequencies, including its gain stability, can be analyzed, thereby enabling optimization of coupler 108.

[0085] Among them, such as Figure 16 As shown, the S-parameters include S(1, 1), which represents the input reflection coefficient of coupler 108, i.e., the proportion of power of the input signal of coupler 108 reflected back to the input terminal. Figure 17As shown, the S-parameters also include S(1, 2), which represents the reverse transmission coefficient of coupler 108, that is, the transmission coefficient from the output to the input of coupler 108. Figure 18 As shown, the S-parameters also include S(3,1), which represents the forward transmission coefficient of coupler 108, that is, the transmission coefficient from the input end to the output end of coupler 108, i.e., the power ratio of the input signal transmitted to the output end of coupler 108. Figure 19 As shown, the S-parameters also include S(4,1), which represents the output reflection coefficient of coupler 108, that is, the proportion of power of the output signal of coupler 108 reflected back to the output terminal.

[0086] In addition, during the simulation design of microstrip line couplers, those skilled in the art can set and adjust the specific values ​​of the above-mentioned plate parameters and coupling parameters according to the actual situation, and no specific restrictions are imposed here.

[0087] For example, when simulating the design of a microstrip line coupler with a coupling value C of 15 dB as the design target, the initial value of the thickness H of the microstrip line dielectric substrate can be 0.8 mm, the initial value of the relative permittivity Er of the microstrip line dielectric substrate can be 4.4, the initial value of the relative permeability Mur of the microstrip line dielectric substrate can be 1, the initial value of the conductivity Cond of the microstrip line metal sheet can be 1.0E+50, and the initial value of the package height Hu of the microstrip circuit can be 1.0E+0.33 m. The initial values ​​for the microstrip line thickness T can be taken as 35 μm, the initial value for the microstrip line loss tangent TanD can be taken as 0.02, the initial value for the microstrip line surface roughness Rough can be taken as 0, the initial value for the center frequency F can be taken as 2 GHz, the initial value for the characteristic impedance Zo of each port microstrip line can be taken as 50 Ω, the initial value for the fine-tuning coefficient Delta can be taken as 0, the initial values ​​for the cutoff frequency can be taken as 1 GHz and 3 GHz, and the initial value for the frequency increment can be taken as 1 MHz. Based on this, the microstrip line width W can be calculated as 1.451 mm, the gap S between microstrip lines as 0.495 mm, and the microstrip line length L as 20.78 mm. Based on this, and combined with the simulation results of the S-parameters of the designed microstrip line coupler, the set plate parameters and coupling parameters can be adjusted to design a microstrip line coupler that meets the performance requirements.

[0088] According to the RF test circuit 100 of this application embodiment, the coupler 108 is a microstrip line coupler. This saves PCB layout space in electronic devices.

[0089] According to some embodiments of this application, optionally, such as Figure 2As shown, an RF test circuit 200 is also provided. The RF test circuit 200 includes a second RF circuit 202, a first RF matching network 106, a second RF matching network 128, a coupler 108, an RF test socket 130, a first antenna matching network 116, a second antenna matching network 132, a first antenna 120, and a second antenna 134.

[0090] The second radio frequency circuit 202 includes a second output port 204 and a third output port 206.

[0091] Furthermore, the first end of the first RF matching network 106 is connected to the third output port 206, and the second end of the first RF matching network 106 is connected to the first port 110 of the coupler 108.

[0092] Furthermore, the first end of the second RF matching network 128 is connected to the second output port 204, and the second end of the second RF matching network 128 is connected to the second port 112 of the coupler 108.

[0093] Furthermore, the first end of the RF test socket 130 is connected to the fourth port 124 of the coupler 108, and the RF test socket 130 is used to insert test probes.

[0094] Furthermore, the first end of the first antenna matching network 116 is connected to the third port 118 of the coupler 108.

[0095] Furthermore, the first end of the second antenna matching network 132 is connected to the second end of the RF test socket 130.

[0096] Furthermore, the first antenna 120 is connected to the second end of the first antenna matching network 116.

[0097] Furthermore, the second line 134 is connected to the second end of the second line matching network 132.

[0098] Furthermore, the aforementioned coupler 108 can specifically be a 90° hybrid network directional coupler 108. The RF signal output from the third output port 206 of the second RF circuit 202 can be output from the first port 110 of the coupler 108 to the third port 118 with approximately no loss, or it can be coupled from the first port 110 of the coupler 108 to the fourth port 124 of the coupler 108 with some loss, thereby reaching the RF test socket 130. At this point, by combining the measurement value of the test probe at the RF test socket 130 and the loss value (coupling value) of the coupler 108, the test result of the RF conduction index corresponding to the third output port 206 can be obtained, thereby evaluating the RF performance corresponding to the third output port 206.

[0099] Furthermore, the RF signal output from the second output port 204 of the second RF circuit 202 can be output almost losslessly from the second port 112 of the coupler 108 to the fourth port 124, and then to the RF test socket 130. At this time, the measurement value of the test probe at the RF test socket 130 is the test result of the RF conduction index corresponding to the second output port 204, thereby evaluating the RF performance corresponding to the second output port 204.

[0100] Thus, for the second RF circuit 202 with a third output port 206 and a second output port 204, there is no need for two RF test sockets. The RF performance corresponding to the third output port 206 and the second output port 204 can be evaluated with only one RF test socket. This reduces the number of RF test sockets used, reduces the layout space occupied by the RF test sockets, saves PCB layout space in electronic devices, and reduces the manufacturing cost of electronic devices.

[0101] In practical applications, the second radio frequency matching network 128 can be a T-type matching network, an L-type matching network, or a π-type matching network, etc., without any specific restrictions.

[0102] Furthermore, for the second antenna matching network 132, a T-type matching network, an L-type matching network, or a π-type matching network can be used, and no specific restrictions are made here.

[0103] The radio frequency test circuit 200 according to an embodiment of this application includes a second radio frequency circuit 202, a first radio frequency matching network 106, a second radio frequency matching network 128, a coupler 108, a radio frequency test socket 130, a first antenna matching network 116, a second antenna matching network 132, a first antenna 120, and a second antenna 134. The second RF circuit 202 includes a second output port 204 and a third output port 206; the first end of the first RF matching network 106 is connected to the third output port 206, and the second end of the first RF matching network 106 is connected to the first port 110 of the coupler 108; the first end of the second RF matching network 128 is connected to the second output port 204, and the second end of the second RF matching network 128 is connected to the second port 112 of the coupler 108; the first end of the RF test socket 130 is connected to the fourth port 124 of the coupler 108, and the RF test socket 130 is used to insert test probes; the first end of the first antenna matching network 116 is connected to the third port 118 of the coupler 108; the first end of the second antenna matching network 132 is connected to the second end of the RF test socket 130; the first antenna 120 is connected to the second end of the first antenna matching network 116; and the second antenna 134 is connected to the second end of the second antenna matching network 132. The RF test circuit 200 described above uses a coupler 108 and one RF test socket 130 instead of two RF test sockets. During RF testing, the input signal is transmitted and coupled through the coupler 108, and test probes are inserted into the remaining RF test socket 130 for testing. In this way, RF testing of a dual-output RF circuit can be achieved using only one RF test socket 130, reducing the number of RF test sockets used, reducing the layout space occupied by the RF test sockets, saving PCB layout space in electronic devices, and reducing the manufacturing cost of electronic devices.

[0104] According to some embodiments of this application, optionally, such as Figure 2 As shown, the first radio frequency matching network 106, coupler 108, first antenna matching network 116 and first antenna 120 form the first radio frequency path.

[0105] In the first radio frequency path, the first port 110 of the coupler 108 is the input port, the second port 112 of the coupler 108 is the isolation port, the third port 118 of the coupler 108 is the output port, and the fourth port 124 of the coupler 108 is the coupling port.

[0106] Specifically, in the first RF path, the RF signal output from the third output port 206 can be output from the first port 110 of the coupler 108 to the third port 118 with approximately no loss. Alternatively, it can be coupled from the first port 110 of the coupler 108 to the fourth port 124 of the coupler 108, with some loss, and then reach the RF test socket 130. At this point, by combining the measurement value of the test probe at the RF test socket 130 and the loss value (coupling value) of the coupler 108, the test result of the RF conduction index corresponding to the third output port 206 can be obtained, thereby evaluating the RF performance corresponding to the third output port 206.

[0107] According to the RF test circuit 200 of this application embodiment, a first RF matching network 106, a coupler 108, a first antenna matching network 116, and a first antenna 120 form a first RF path. In the first RF path, the first port 110 of the coupler 108 is an input port, the second port 112 of the coupler 108 is an isolation port, the third port 118 of the coupler 108 is an output port, and the fourth port 124 of the coupler 108 is a coupling port. Thus, by combining the measurement value of the test probe at the RF test socket 130 and the loss value, i.e., the coupling value, of the coupler 108, the test result of the RF conduction index corresponding to the third output port 206 can be obtained.

[0108] According to some embodiments of this application, optionally, such as Figure 2 As shown, the second RF matching network 128, coupler 108, RF test socket 130, second RF matching network 132, and second antenna 134 form the second RF path.

[0109] In the second RF path, the first port 110 of coupler 108 is an isolation port, the second port 112 of coupler 108 is an input port, the third port 118 of coupler 108 is a coupling port, and the fourth port 124 of coupler 108 is an output port.

[0110] Specifically, in the second RF path, the RF signal output from the second output port 204 can be output from the second port 112 of the coupler 108 to the fourth port 124 with approximately no loss, and then reach the RF test socket 130. At this time, the measurement value of the test probe at the RF test socket 130 is the test result of the RF conduction index corresponding to the second output port 204, thereby evaluating the RF performance corresponding to the second output port 204.

[0111] Thus, compared to existing RF testing solutions, for both RF paths of the second RF circuit 202, the test results of RF conduction parameters are obtained at the RF test socket 130. There is no need for two RF test sockets. The RF performance of the dual paths can be evaluated with only one RF test socket, which reduces the number of RF test sockets used, reduces the layout space occupied by the RF test sockets, saves PCB layout space in electronic devices, and reduces the manufacturing cost of electronic devices.

[0112] According to the RF test circuit 200 of this application embodiment, a second RF matching network 128, a coupler 108, an RF test socket 130, a second RF matching network 132, and a second antenna 134 form a second RF path. In the second RF path, the first port 110 of the coupler 108 is an isolation port, the second port 112 of the coupler 108 is an input port, the third port 118 of the coupler 108 is a coupling port, and the fourth port 124 of the coupler 108 is an output port. Thus, the measurement value of the test probe at the RF test socket 130 is the test result of the RF conduction index corresponding to the second output port 204. The two RF paths of the second RF circuit 202 share one RF test socket 130 for RF testing. The RF performance of the dual paths can be evaluated using only one RF test socket, reducing the number of RF test sockets used, reducing the layout space occupied by the RF test sockets, saving PCB layout space in electronic devices, and reducing the manufacturing cost of electronic devices.

[0113] According to some embodiments of this application, optionally, the loss value between the input port and the coupling port of the coupler 108 is related to the device parameters of the coupler 108.

[0114] Furthermore, the loss between the input port and the output port of the coupler 108 is 0.

[0115] Specifically, based on the operating principle of coupler 108, the radio frequency signal can be transmitted from the input port of coupler 108 to the output port of coupler 108 with approximately zero loss; that is, the loss between the input port and the output port of coupler 108 is approximately zero. Further, the radio frequency signal will be transmitted from the input port of coupler 108 to the coupling port of coupler 108 with some loss, wherein the loss between the input port and the coupling port of coupler 108 is related to the device parameters of coupler 108.

[0116] Thus, based on the working principle of coupler 108, for the dual-path second RF circuit 202, when testing RF conduction parameters, the two RF paths of the second RF circuit 202 can share one RF test socket 130 for RF testing, which can save one test socket, reduce the layout space occupied by the RF test socket, save PCB layout space in electronic devices, and reduce the manufacturing cost of electronic devices.

[0117] According to the RF test circuit 200 of this application embodiment, the loss value between the input port and the coupling port of the coupler 108 is related to the device parameters of the coupler 108. Thus, based on the working principle of the coupler 108, for the dual-path second RF circuit 202, when testing RF conduction parameters, one test socket can be saved, reducing the layout space occupied by the RF test socket, saving PCB layout space in electronic devices, and reducing the manufacturing cost of electronic devices.

[0118] According to some embodiments of this application, optionally, such as Figure 20 As shown, this application embodiment also provides an electronic device 300. The electronic device 300 includes the radio frequency test circuit 100 in any of the above embodiments. The electronic device 300 provided in this application embodiment includes the radio frequency test circuit 100 in any of the above embodiments and can achieve the same technical effect; therefore, to avoid repetition, it will not be described again here.

[0119] According to some embodiments of this application, optionally, such as Figure 21 As shown, this application embodiment also provides an electronic device 400. The electronic device 400 includes the radio frequency test circuit 200 from any of the above embodiments. The electronic device 400 provided in this application embodiment includes the radio frequency test circuit 200 from any of the above embodiments and achieves the same technical effect; therefore, to avoid repetition, it will not be described again here.

[0120] It should be noted that the electronic devices 300 and 400 in the embodiments of this application include mobile electronic devices and non-mobile electronic devices.

[0121] In practical applications, electronic devices 300 and 400 can be terminals or other devices besides terminals. For example, electronic devices 300 and 400 can be mobile phones, tablets, laptops, handheld computers, in-vehicle electronic devices, mobile internet devices (MIDs), augmented reality (AR) / virtual reality (VR) devices, robots, wearable devices, ultra-mobile personal computers (UMPCs), netbooks, or personal digital assistants (PDAs), etc. They can also be servers, network attached storage (NAS), personal computers (PCs), televisions (TVs), ATMs, or self-service machines, etc. This application does not specifically limit the types of devices described.

[0122] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0123] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A radio frequency test circuit, characterized in that, include: A first radio frequency circuit, including a first output port; A first radio frequency matching network, wherein a first end of the first radio frequency matching network is connected to the first output port; A coupler, wherein a first port of the coupler is connected to a second end of the first RF matching network, a second port of the coupler is connected to a test point for inserting a test probe, and a fourth port of the coupler is grounded; A first antenna matching network, wherein a first end of the first antenna matching network is connected to a third port of the coupler; The first antenna is connected to the second end of the matching network of the first antenna.

2. The radio frequency test circuit according to claim 1, characterized in that, Also includes: A first resistor, the first end of which is connected to the fourth port of the coupler, and the second end of which is grounded, so that the fourth port is grounded through the first resistor.

3. The radio frequency test circuit according to claim 1, characterized in that, The first port of the coupler is the input port, the second port of the coupler is the coupling port, the third port of the coupler is the output port, and the fourth port of the coupler is the isolation port.

4. The radio frequency test circuit according to claim 1, characterized in that, The first radio frequency matching network includes: The second resistor has its first end connected to the first output port and its second end grounded. A third resistor, wherein the first end of the third resistor is connected to the first output port, and the second end of the third resistor is connected to the first port of the coupler; A fourth resistor, the first end of which is connected to the first port of the coupler, and the second end of which is grounded.

5. The radio frequency test circuit according to claim 1, characterized in that, The first antenna matching network includes: The fifth resistor has its first end connected to the first antenna and its second end grounded. The sixth resistor has a first end connected to the first antenna and a second end connected to the third port of the coupler. The seventh resistor has its first end connected to the third port of the coupler and its second end grounded.

6. The radio frequency test circuit according to any one of claims 1 to 5, characterized in that, The coupler is a microstrip line coupler.

7. A radio frequency test circuit, characterized in that, include: The second radio frequency circuit includes a second output port and a third output port; A first radio frequency matching network, wherein a first end of the first radio frequency matching network is connected to the third output port; A second radio frequency matching network, wherein a first end of the second radio frequency matching network is connected to the second output port; A coupler, wherein a first port of the coupler is connected to a second end of the first radio frequency matching network, and a second port of the coupler is connected to a second end of the second radio frequency matching network; An RF test socket, wherein the first end of the RF test socket is connected to the fourth port of the coupler, and the RF test socket is used to insert test probes; A first antenna matching network, wherein a first end of the first antenna matching network is connected to a third port of the coupler; A second antenna matching network, wherein a first end of the second antenna matching network is connected to a second end of the RF test socket; The first antenna is connected to the second end of the matching network of the first antenna. The second antenna is connected to the second end of the matching network of the second antenna.

8. The radio frequency test circuit according to claim 7, characterized in that, The first radio frequency matching network, the coupler, the first antenna matching network, and the first antenna form a first radio frequency path. In the first radio frequency path, the first port of the coupler is an input port, the second port of the coupler is an isolation port, the third port of the coupler is an output port, and the fourth port of the coupler is a coupling port.

9. The radio frequency test circuit according to claim 7, characterized in that, The second RF matching network, the coupler, the RF test socket, the second antenna matching network, and the second antenna form a second RF path. In the second RF path, the first port of the coupler is an isolation port, the second port of the coupler is an input port, the third port of the coupler is a coupling port, and the fourth port of the coupler is an output port.

10. An electronic device, characterized in that, include: The RF test circuit as described in any one of claims 1 to 6, or the RF test circuit as described in any one of claims 7 to 9.

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