Intelligent driving domain PCB, central controller of vehicle and vehicle

Abstract

The utility model provides an intelligent driving domain PCB, a central controller of a vehicle and the vehicle. The intelligent driving domain PCB comprises a circuit board body; the micro-control unit is arranged on the circuit board body, and the micro-control unit comprises a first serial peripheral interface; the chip system is arranged on the circuit board body, the chip system comprises a second serial peripheral interface, and the second serial peripheral interface is connected with the first serial peripheral interface; the data exchange device is arranged on the circuit board body and is electrically connected with the chip system and the micro-control unit; the inertial measurement unit is arranged on the circuit board body, the inertial measurement unit comprises a third serial peripheral interface and a fourth serial peripheral interface, and the third serial peripheral interface and the fourth serial peripheral interface are both connected with the first serial peripheral interface; and the third serial peripheral interface and the fourth serial peripheral interface are configured for time-sharing transmission. And data transmission can be realized through in-board communication, so that the data exchange efficiency between the inertial measurement unit and the control system in the central controller is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of vehicle technology, and in particular to an intelligent driving domain PCB board, a central controller for vehicles, and a vehicle. Background Technology

[0002] With the continuous development of technology, vehicle central controllers have achieved multi-functional integration, such as intelligent driving, cockpit control, and vehicle control. Vehicles are equipped with inertial measurement units (IMUs) to measure parameters such as acceleration and angular velocity, typically composed of accelerometers and gyroscopes. Currently, common IMUs exchange data with the central controller via external CAN signal lines, resulting in low communication speeds and data exchange efficiency that needs improvement. Utility Model Content

[0003] This application provides a smart driving domain PCB board, a central controller for a vehicle, and a vehicle, to improve the data exchange efficiency between the inertial measurement unit and the control system.

[0004] This application provides a smart driving domain PCB board, comprising: a circuit board body; a microcontroller unit disposed on the circuit board body, and the microcontroller unit including a first serial peripheral interface; a chip system disposed on the circuit board body, and the chip system including a second serial peripheral interface connected to the first serial peripheral interface; a data exchange device disposed on the circuit board body and electrically connected to the chip system and the microcontroller unit; and an inertial measurement unit disposed on the circuit board body, the inertial measurement unit including a third serial peripheral interface and a fourth serial peripheral interface, both of which are connected to the first serial peripheral interface; and the third serial peripheral interface and the fourth serial peripheral interface are configured for time-division multiplexing.

[0005] Optionally, the circuit board body is provided with a power supply interface for connecting the power supply end, which is connected to the chip system, microcontroller unit, inertial measurement unit and data exchange device respectively.

[0006] This application provides a central controller for a vehicle, including the aforementioned intelligent driving domain PCB board.

[0007] Optionally, the vehicle's central controller further includes: a gateway domain PCB board and a cockpit domain PCB board stacked on top of the intelligent driving domain PCB board, with the gateway domain PCB board and the cockpit domain PCB board respectively disposed on both sides of the intelligent driving domain PCB board; a first connecting part connecting the gateway domain PCB board and the intelligent driving domain PCB board; a second connecting part connecting the intelligent driving domain PCB board and the cockpit domain PCB board; and a third connecting part connecting the gateway domain PCB board and the cockpit domain PCB board; the first connecting part, the second connecting part, and the third connecting part all include B2B connection components.

[0008] Optionally, the first connection portion includes a first B2B connection component, which includes a first sub-connector connected to the gateway domain PCB board and a second sub-connector connected to the intelligent driving domain PCB board, and the first sub-connector and the second sub-connector are plugged into each other; and / or, the second connection portion includes a second B2B connection component and a first FPC connection line, which includes a third sub-connector connected to the intelligent driving domain PCB board and a fourth sub-connector connected to the cockpit domain PCB board, and the first FPC connection line is connected between the third sub-connector and the fourth sub-connector.

[0009] Optionally, the first connection part includes at least one of the following signal transmission lines: a high-speed Ethernet transmission line for realizing a high-speed Ethernet connection; and a first CAN transmission line for transmitting CAN signals.

[0010] Optionally, the second connection includes at least one of the following signal transmission lines: a PCIe transmission line for transmitting PCIe data; and a MIPI transmission line for transmitting MIPI data.

[0011] Optionally, the third connection part includes a third B2B connection component and a second FPC connection line. The third B2B connection component includes a fifth sub-connector connected to the gateway domain PCB board and a sixth sub-connector connected to the cockpit domain PCB board; the second FPC connection line is connected between the fifth sub-connector and the sixth sub-connector.

[0012] Optionally, the third connection includes at least one of the following signal transmission lines: a second CAN transmission line for transmitting CAN signals; and an SCMII transmission line for transmitting SCMII data.

[0013] This application provides a vehicle, including the aforementioned intelligent driving domain PCB board or the aforementioned central controller.

[0014] The intelligent driving domain PCB board, vehicle central controller, and vehicle provided in this application integrate the inertial measurement unit (IMU), chip system, microcontroller unit, and data exchange device onto the same PCB board. An electrical connection is established between the IMU and the microcontroller unit via a serial peripheral interface to achieve data transmission between them. Data transmission can be achieved through on-board communication, significantly improving the data exchange efficiency between the IMU and the control system within the central controller (i.e., the microcontroller unit and chip system on the intelligent driving domain PCB board), thus enhancing response speed. Simultaneously, the time-division multiplexing method reduces hardware interface requirements while avoiding disruption to data exchange, thereby conserving hardware interface resources. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the intelligent driving domain PCB board provided in one embodiment of this application;

[0016] Figure 2 This is a schematic diagram of a central controller provided in one embodiment of this application;

[0017] Figure 3 This is a schematic diagram of a central controller provided in another embodiment of this application.

[0018] Figure label:

[0019] 1: Central Controller; 10: Intelligent Driving Domain PCB Board; 100: Circuit Board Body; 101: Chip System; 102: Microcontroller Unit; 103: Data Exchange Device; 104: Inertial Measurement Unit; 20: Gateway Domain PCB Board; 30: Cockpit Domain PCB Board;

[0020] 21: First serial peripheral interface; 22: Second serial peripheral interface; 23: Third serial peripheral interface; 24: Fourth serial peripheral interface; 25: Fifth serial peripheral interface

[0021] 120: First connecting part; 121: First sub-connector; 122: Second sub-connector;

[0022] 230: Second connecting part; 231: Third sub-connector; 232: Fourth sub-connector; 233: First FPC connecting line;

[0023] 310: Third connecting part; 311: Fifth sub-connector; 312: Sixth sub-connector; 313: Second FPC connecting line;

[0024] 41: High-speed Ethernet transmission line; 42: First CAN transmission line; 43: PCIe transmission line; 44: MIPI transmission line; 45: Second CAN transmission line; 46: SCMII transmission line. Detailed Implementation

[0025] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings.

[0026] Combination Figure 1 As shown, this application provides a smart driving domain PCB (Printed Circuit Board) 10, including a circuit board body 100 and a chip system 101, a microcontroller unit 102, a data exchange device 103 and an inertial measurement unit 104 disposed on the circuit board body 100.

[0027] The microcontroller unit 102 includes a first serial peripheral interface 21. The chip system 101 includes a second serial peripheral interface 22, which is connected to the first serial peripheral interface 21. The inertial measurement unit 104 includes a third serial peripheral interface 23 and a fourth serial peripheral interface 24, both of which are connected to the first serial peripheral interface 21. The third serial peripheral interface 23 and the fourth serial peripheral interface 24 are configured for time-division multiplexing.

[0028] The third serial peripheral interface 23 and the fourth serial peripheral interface 24 are used to transmit different data. For example, the third serial peripheral interface 23 is used to transmit acceleration data, and the fourth serial peripheral interface 24 is used to transmit angular velocity data.

[0029] The first serial peripheral interface 21, the second serial peripheral interface 22, the third serial peripheral interface 23, and the fourth serial peripheral interface 24 are all SPI (Serial Peripheral Interface) interfaces, which can provide high data transmission speeds and can perform bidirectional data transmission simultaneously, which helps to ensure data exchange efficiency.

[0030] Using the intelligent driving domain PCB board 10 provided in this application embodiment, the inertial measurement unit 104, chip system 101, microcontroller 102, and data exchange device 103 are integrated onto the same PCB board. An electrical connection is established between the inertial measurement unit 104 and the microcontroller 102 via a serial peripheral interface to achieve data transmission between them. Data transmission can be achieved through on-board communication, greatly improving the data exchange efficiency between the inertial measurement unit 104 and the control system within the central controller, i.e., the microcontroller 102 and chip system 101 of the intelligent driving domain PCB board 10, which is beneficial for improving response speed. Since the inertial measurement unit 104 is part of the intelligent driving positioning box, establishing on-board communication between the inertial measurement unit 104 and the microcontroller 102 of the intelligent driving domain PCB board 10 is equivalent to improving the data transmission efficiency between the intelligent driving positioning box and the central controller, which is beneficial for improving positioning accuracy.

[0031] Simultaneously, a master-slave data transmission model was implemented, with the first serial peripheral interface 21 as the master and the second, third, and fourth serial peripheral interfaces 22, 23, and 24 as slaves. This time-sharing transmission method reduces hardware interface requirements while avoiding disruption to data exchange, thus conserving hardware interface resources. In the time-sharing mode using the third and fourth serial peripheral interfaces 23 and 24, the microcontroller unit 102 reuses its computing power to perform software processing tasks, including SPI driver development and data acquisition SDK (Software Development Kit) integration. This unifies the software development and upgrade process, avoiding the complexity of unified software upgrades caused by incomplete integration between the two microcontroller units, and improving software iteration efficiency. Furthermore, computing power reuse reduces the need for additional hardware resources, which helps lower the development difficulty of incremental PCB board designs and improves system integration and performance.

[0032] This section describes the process of configuring the information processing environment for the inertial measurement unit (IMU) 104. This configuration process includes SPI driver development, SPI control logic configuration, data acquisition and uploading, SDK integration, IMU power supply and fault diagnosis, and calibration host computer development. Specifically, SPI driver development involves developing a driver program suitable for one-master-multiple-slave SPI communication. SPI control logic configuration involves configuring the one-master-multiple-slave SPI control logic to ensure the correctness and efficiency of data transmission. Data acquisition and uploading involves acquiring and uploading SPI data, providing a foundation for subsequent data processing. SDK integration involves integrating the SDK to collect IMU data, providing support for data processing and analysis. IMU power supply and fault diagnosis involves providing a stable power supply to the IMU and implementing fault diagnosis functions to facilitate timely detection and resolution of problems. Calibration host computer development involves developing host computer software for calibration to standardize IMU data and improve positioning accuracy.

[0033] In some embodiments, the circuit board body 100 is provided with a power supply interface for connecting to the power supply terminal. The power supply interface is connected to the chip system 101, the microcontroller unit 102, the inertial measurement unit 104, and the data exchange device 103, respectively. In this way, the power supply to each device, including the chip system 101, the microcontroller unit 102, the inertial measurement unit 104, and the data exchange device 103, is ensured, so that the overall intelligent driving domain PCB board 10 can operate normally.

[0034] This application provides a central controller for a vehicle, including the aforementioned intelligent driving domain PCB board 10. Combined with... Figure 2As shown, within the vehicle's central controller 1, in addition to the aforementioned intelligent driving domain PCB board 10, there are also a gateway domain PCB board 20 and a cockpit domain PCB board 30 stacked on top of the intelligent driving domain PCB board 10, with the gateway domain PCB board 20 and cockpit domain PCB board 30 respectively located on both sides of the intelligent driving domain PCB board 10. The intelligent driving domain PCB board 10 is responsible for data processing and decision-making related to intelligent driving; the gateway domain PCB board 20, as the network data receiving and forwarding center, is responsible for processing data entering and leaving the vehicle network. The cockpit domain PCB board 30 is responsible for data and control of the cockpit electronic system, improving passenger comfort and entertainment experience. Currently, the intelligent driving domain PCB board 10, gateway domain PCB board 20, and cockpit domain PCB board 30 are mostly connected using external wiring harnesses, resulting in low data transmission bandwidth. Furthermore, the long distance of these external wiring harnesses significantly impacts high-speed signal transmission, potentially leading to signal integrity issues and electromagnetic interference.

[0035] To address the aforementioned issues, this application provides an improvement to the connection method between the intelligent driving domain PCB board 10, the gateway domain PCB board 20, and the cockpit domain PCB board 30. Combined with... Figure 2 and Figure 3 As shown, the central controller 1 also includes a first connection part 120, a second connection part 230, and a third connection part 310. The first connection part 120 connects the gateway domain PCB board 20 and the intelligent driving domain PCB board 10; the second connection part 230 connects the intelligent driving domain PCB board 10 and the cockpit domain PCB board 30; and the third connection part 310 connects the gateway domain PCB board 20 and the cockpit domain PCB board 30. Each of the first connection part 120, the second connection part 230, and the third connection part 310 includes a B2B (Board-to-Board) connection component. This allows signal transmission within the central controller 1 via the B2B connection component, eliminating the need for external wiring harnesses and improving transmission efficiency. It also helps to reduce the aforementioned problems of signal integrity and electromagnetic interference caused by excessively long external wiring harnesses.

[0036] In some embodiments, the first connection portion 120 includes a first B2B connection component, which includes a first sub-connector 121 connected to the gateway domain PCB board 20 and a second sub-connector 122 connected to the intelligent driving domain PCB board 10, wherein the first sub-connector 121 and the second sub-connector 122 are plugged into each other. Considering that the distance between the gateway domain PCB board 20 and the intelligent driving domain PCB board 10 is short during implementation, the connection between the gateway domain PCB board 20 and the intelligent driving domain PCB board 10 can be achieved by directly plugging in the first sub-connector 121 and the second sub-connector 122. In this way, the transmission link between the gateway domain PCB board 20 and the intelligent driving domain PCB board 10 is shorter, which is beneficial to improving data transmission efficiency. It is understood that, considering that in other embodiments, the distance between the gateway domain PCB board 20 and the intelligent driving domain PCB board 10 may be too long, making it impossible to achieve a connection by directly plugging in the first sub-connector 121 and the second sub-connector 122, the first sub-connector 121 and the second sub-connector 122 can be connected by a connecting cable. More specifically, FPC (Flexible Printed Circuit) connecting lines can be used as connecting lines between the first sub-connector 121 and the second sub-connector 122. As a flexible circuit board, the FPC connecting line can be bent, folded, or rolled up in confined spaces. Furthermore, it is suitable for high-speed signal transmission, ensuring the stability and reliability of signal transmission and guaranteeing the data exchange process.

[0037] In some embodiments, the first connection unit 120 includes at least one of a high-speed Ethernet transmission line 41 and a first CAN (Controller Area Network) transmission line 42. The high-speed Ethernet transmission line 41 is used to implement a high-speed Ethernet connection. More specifically, the high-speed Ethernet transmission line 41 is used to transmit Ethernet signals greater than 1G, such as 2.5G Ethernet, 5G Ethernet, and 10G Ethernet. This enables higher bandwidth signal transmission and improves signal transmission reliability while reducing packet loss. The first CAN transmission line 42 is used to transmit CAN signals, thus enabling network wake-up functionality.

[0038] In some embodiments, the second connection portion 230 includes a second B2B connection component and a first FPC connection line 233. The second B2B connection component includes a third sub-connector 231 connected to the intelligent driving domain PCB board 10 and a fourth sub-connector 232 connected to the cockpit domain PCB board 30; the first FPC connection line 233 connects the third sub-connector 231 and the fourth sub-connector 232. Considering that the distance between the intelligent driving domain PCB board 10 and the cockpit domain PCB board 30 is relatively long in practice, the connection between the third sub-connector 231 and the fourth sub-connector 232 is achieved through the first FPC connection line 233 based on the second B2B connection component. In this way, while ensuring smooth signal transmission, the transmission distance is shortened compared to external wiring harness transmission, which is beneficial to improving data transmission efficiency.

[0039] In some embodiments, the second connection 230 includes at least one of a PCIe (Peripheral Component Interconnect Express) transmission line 43 and a MIPI (Mobile Industry Processor Interface) transmission line 44. The PCIe transmission line 43 is used to transmit PCIe data, and the MIPI transmission line 44 is used to transmit MIPI data. Transmitting PCIe data via the first FPC connection line 233 allows bidirectional access to memory, enabling a larger amount of information exchange, resource sharing, and improved functional reliability. Transmitting MIPI data via the first FPC connection line 233 helps ensure signal integrity and ensures the reliability of the video stream transmission process.

[0040] In some embodiments, the third connection portion 310 includes a third B2B connection component and a second FPC connection line 313. The third B2B connection component includes a fifth sub-connector 311 connected to the gateway domain PCB board 20 and a sixth sub-connector 312 connected to the cockpit domain PCB board 30; the third connection portion 310 is connected between the fifth sub-connector 311 and the sixth sub-connector 312. Considering that the intelligent driving board PCB is separated from the gateway domain PCB board 20 and the cockpit domain PCB board 30 by a relatively large distance, a second FPC connection line 313 needs to be added between the third B2B connection components to ensure normal data transmission. This shortens the transmission distance compared to external wiring harness transmission, which is beneficial to improving data transmission efficiency.

[0041] In some embodiments, the third connection 310 includes at least one of a second CAN signal line and a SCMII (System Control and Management Interface) transmission line. The second CAN signal line is used to transmit CAN signals. The SCMII transmission line 46 is used to transmit SCMII data. Using the second FPC connection line 313 to transmit CAN and SCMII signals helps ensure the reliability of data transmission and has strong anti-interference capabilities. It also supports high-bandwidth SCMII signal transmission, ensuring real-time data transmission.

[0042] It is understood that this section only provides a brief description of the signal transmission types of various signal transmission lines, including high-speed Ethernet transmission lines, first CAN transmission lines, PCIe transmission lines, MIPI transmission lines, second CAN transmission lines, and SCMII transmission lines. In the implementation process, it is necessary to make corresponding settings for the interface, control program, etc. in order to realize the corresponding signal transmission process. These will not be described one by one here, as long as the corresponding signal transmission can be realized.

[0043] This application also provides a vehicle, including the aforementioned intelligent driving domain PCB board 10 or central controller 1.

[0044] In the description of this disclosure, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

Claims

1. A PCB board for intelligent driving domain, characterized in that, include: Circuit board body; A microcontroller unit is disposed on the circuit board body, and the microcontroller unit includes a first serial peripheral interface; A chip system is disposed on the circuit board body, and the chip system includes a second serial peripheral interface, which is connected to the first serial peripheral interface. A data exchange device is disposed on the circuit board body and is electrically connected to the chip system and the microcontroller unit; An inertial measurement unit is disposed on the circuit board body. The inertial measurement unit includes a third serial peripheral interface and a fourth serial peripheral interface, both of which are connected to the first serial peripheral interface. Furthermore, the third serial peripheral interface and the fourth serial peripheral interface are configured for time-division transmission.

2. The intelligent driving domain PCB board according to claim 1, characterized in that, The circuit board body is provided with a power supply interface for connecting to the power supply end. The power supply interface is connected to the chip system, the microcontroller unit, the inertial measurement unit and the data exchange device respectively.

3. A central controller for a vehicle, characterized in that, Includes the intelligent driving domain PCB board as described in claim 1 or 2.

4. The central controller according to claim 3, characterized in that, The central controller also includes: A gateway domain PCB board and a cockpit domain PCB board are stacked on top of the intelligent driving domain PCB board, and the gateway domain PCB board and the cockpit domain PCB board are respectively disposed on both sides of the intelligent driving domain PCB board; The first connection part connects the gateway domain PCB board and the intelligent driving domain PCB board; The second connection part connects the intelligent driving domain PCB board and the cockpit domain PCB board; The third connection part connects the gateway domain PCB board and the cockpit domain PCB board; The first connecting part, the second connecting part and the third connecting part all include B2B connecting components.

5. The central controller according to claim 4, characterized in that, The first connection part includes a first B2B connection component, which includes a first sub-connector connected to the gateway domain PCB board and a second sub-connector connected to the intelligent driving domain PCB board, wherein the first sub-connector and the second sub-connector are plugged into each other; and / or The second connection part includes a second B2B connection component and a first FPC connection line. The second B2B connection component includes a third sub-connector connected to the intelligent driving domain PCB board and a fourth sub-connector connected to the cockpit domain PCB board. The first FPC connection line is connected between the third sub-connector and the fourth sub-connector.

6. The central controller according to claim 5, characterized in that, The first connection portion includes at least one of the following signal transmission lines: High-speed Ethernet transmission cable, used to achieve high-speed Ethernet connection; The first CAN transmission line is used to transmit CAN signals.

7. The central controller according to claim 5, characterized in that, The second connection includes at least one of the following signal transmission lines: PCIe cable, used to transmit PCIe data; MIPI transmission line, used for transmitting MIPI data.

8. The central controller according to claim 4, characterized in that, The third connection part includes a third B2B connection component and a second FPC connection line. The third B2B connection component includes a fifth sub-connector connected to the gateway domain PCB board and a sixth sub-connector connected to the cockpit domain PCB board. The second FPC connection line is connected between the fifth sub-connector and the sixth sub-connector.

9. The central controller according to claim 8, characterized in that, The third connection portion includes at least one of the following signal transmission lines: The second CAN transmission line is used to transmit CAN signals; The SCMII transmission line is used to transmit SCMII data.

10. A vehicle, characterized in that, Includes the intelligent driving domain PCB board as described in claim 1 or 2, or the central controller as described in any one of claims 3 to 9.

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