Circuit board tin immersion processing device

Abstract

The utility model belongs to the technical field of circuit board processing, and discloses a circuit board tin immersion processing device which comprises a tin immersion tank, a lifting assembly and a hanging assembly, the lifting assembly is fixedly connected to the top of the tin immersion tank and used for achieving movement in the vertical direction, and the hanging assembly is fixedly connected with the output end of the lifting assembly. The carrier is used for carrying a circuit board for immersion tin treatment; wherein the hanging assembly comprises a cross rod, the outer surface of the cross rod is sleeved with a fixing sleeve, the bottom of the fixing sleeve is fixedly connected with a supporting rod, the bottom of the supporting rod is fixedly connected with a plurality of clamping pieces in the length direction, and the circuit board is fixed in the clamping pieces. According to the utility model, the lifting assembly can drive the suspension assembly to move up and down, a plurality of circuit boards can be fixed through the suspension assembly, batch processing of the circuit boards can be realized, and meanwhile, the processing effect and the safety are ensured, so that the requirements of the electronic manufacturing industry on the tin immersion processing technology of the circuit boards are met.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board processing technology, specifically relating to a circuit board immersion tin treatment device. Background Technology

[0002] In the electronics manufacturing industry, the circuit board manufacturing process is crucial. Immersion tin plating is a common surface treatment process for circuit boards. Immersion tin plating improves the conductivity and corrosion resistance of the circuit board by forming a uniform tin layer on the surface of the circuit board, and also helps with the subsequent soldering of components.

[0003] For example, patent CN220235087U discloses a circuit board immersion tin treatment device. In this patent, a second motor drives the circuit board to rotate, so that the circuit board can quickly and fully perform immersion tin, cleaning and drying operations, effectively preventing the immersion tin layer from turning black and improving the immersion tin effect of the circuit board. However, the existing technology can only process one circuit board at a time, which obviously cannot meet the needs of large-scale and high-efficiency production in actual production. In view of this, a circuit board immersion tin treatment device was designed. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides a circuit board tin plating treatment device, which aims to solve to some extent the technical problem that in the prior art, only one circuit board can be processed at a time, which obviously cannot meet the needs of large-scale and high-efficiency production in actual production.

[0005] The technical solution of this utility model is: a circuit board immersion tin treatment device, including an immersion tin tank, a lifting component and a suspension component, wherein the lifting component is fixedly connected to the top of the immersion tin tank and is used to realize vertical movement;

[0006] The output end of the suspension assembly is fixedly connected to the lifting assembly and is used to support the circuit board for immersion soldering.

[0007] The suspension assembly includes a crossbar, a fixing sleeve is fitted on the outer surface of the crossbar, a support rod is fixedly connected to the bottom of the fixing sleeve, and multiple clamping components are fixedly connected to the bottom of the support rod along its length. The circuit board is fixed inside the clamping components.

[0008] Preferably, the outer surface of the fixing sleeve is threaded with a locking bolt, and the end of the locking bolt abuts against the outer surface of the crossbar.

[0009] Preferably, the clamping member includes a U-shaped block, one side of which is threaded with an adjusting bolt, and the end of the adjusting bolt is rotatably connected to a pressure plate.

[0010] Preferably, one side of the U-shaped block is provided with a threaded hole, and the adjusting bolt is threaded into the threaded hole.

[0011] Preferably, the opening of the U-shaped block is oriented downwards.

[0012] Preferably, a pressure pad is embedded inside the U-shaped block on the side away from the pressure plate.

[0013] Preferably, the lifting assembly includes two uprights, which are symmetrically fixedly connected to both sides of the immersion tin bath. A servo motor is fixedly mounted on the top of one of the uprights, and a rotating shaft is fixedly connected to the output end of the servo motor. A first bevel gear is fixedly sleeved on both sides of the outer surface of the rotating shaft.

[0014] Both of the two uprights are rotatably connected to ball screws on their outer sides. A second bevel gear is fixedly sleeved on the top of the ball screw. The teeth of the second bevel gear mesh with the teeth of the first bevel gear. A lifting block is sleeved on the outer surface of the ball screw. The crossbar is fixedly connected between the two lifting blocks.

[0015] Preferably, the bottom of the servo motor is fixedly connected to a mounting base, which is fixedly connected to the top of one of the sides of the support frame.

[0016] Preferably, a ball nut is embedded in the middle of the lifting block, and the ball nut is threaded onto the outer surface of the ball screw.

[0017] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages: the lifting component can drive the suspension component to move up and down, and the suspension component can fix multiple circuit boards, enabling batch processing of circuit boards while ensuring processing effect and safety, so as to meet the requirements of the electronics manufacturing industry for the immersion tin treatment process of circuit boards. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the lifting assembly, suspension assembly, and circuit board structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the lifting component structure of this utility model;

[0022] Figure 4This is a schematic diagram of the suspension assembly structure of this utility model;

[0023] Figure 5 This is a schematic diagram of the suspension assembly structure of this utility model.

[0024] In the attached image:

[0025] 1. Tin bath; 2. Lifting assembly; 201. Stand; 202. Fixing base; 203. Servo motor; 204. Rotating shaft; 205. First bevel gear; 206. Ball screw; 207. Second bevel gear; 208. Lifting block; 209. Ball nut; 3. Suspension assembly; 301. Crossbar; 302. Fixing sleeve; 303. Locking bolt; 304. Support rod; 305. Clamping component; 3051. U-shaped block; 3052. Adjusting bolt; 3053. Pressure plate; 3054. Pressure pad; 4. Circuit board; 5. Drain pipe. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. Example 1:

[0027] In the existing technology, only one circuit board 4 can be processed at a time. This obviously cannot meet the needs of large-scale and high-efficiency production in actual production. Especially in today's rapidly developing electronics manufacturing industry, the requirements for the production efficiency and quality of circuit board 4 are getting higher and higher. The traditional single-board processing method can no longer meet the market demand.

[0028] like Figure 1 and Figure 2 As shown, a circuit board immersion tin treatment device includes an immersion tin tank 1, a lifting assembly 2, and a suspension assembly 3. The lifting assembly 2 is fixedly connected to the top of the immersion tin tank 1 to achieve vertical movement; the suspension assembly 3 is fixedly connected to the output end of the lifting assembly 2 to support the circuit board 4 for immersion tin treatment.

[0029] like Figure 4 As shown, the suspension assembly 3 includes a crossbar 301, a fixing sleeve 302 is fitted on the outer surface of the crossbar 301, a support rod 304 is fixedly connected to the bottom of the fixing sleeve 302, and multiple clamping parts 305 are fixedly connected to the bottom of the support rod 304 along the length direction. The circuit board 4 is fixed in the clamping parts 305, which can clamp multiple circuit boards 4 at one time, thereby improving processing efficiency.

[0030] like Figure 4As shown, the outer surface of the fixing sleeve 302 is threaded with a locking bolt 303. The end of the locking bolt 303 abuts against the outer surface of the crossbar 301, which can adjust the position of the support rod 304 and thus adapt to circuit boards 4 of different sizes.

[0031] like Figure 5 As shown, the clamping member 305 includes a U-shaped block 3051 with its opening facing downwards. An adjusting bolt 3052 is threadedly connected to one side of the U-shaped block 3051. A threaded hole is provided on one side of the U-shaped block 3051, and the adjusting bolt 3052 is threadedly connected to the threaded hole. A pressure plate 3053 is rotatably connected to the end of the adjusting bolt 3052. A pressure pad 3054 is embedded in the side of the U-shaped block 3051 away from the pressure plate 3053. When the top of the circuit board 4 is placed in the U-shaped block 3051, the pressure plate 3053 can be moved by rotating the adjusting bolt 3052, thereby achieving clamping and releasing of the circuit board 4.

[0032] like Figure 1 As shown, a drain pipe 5 is fixedly connected to the bottom of the side of the tin immersion tank 1. The drain pipe 5 is equipped with a shut-off valve to facilitate the discharge of waste liquid in the tin immersion tank 1.

[0033] In this embodiment, multiple circuit boards 4 can be suspended in the immersion solder bath 1, which improves the space utilization of the entire device and reduces production costs. The suspended design allows the circuit board 4 to be seen directly in the immersion solder solution during the processing, and the height of the circuit board 4 can be adjusted as needed to ensure the best immersion soldering effect. Example 2:

[0034] Traditional immersion soldering equipment typically uses a fixed immersion method, which involves directly immersing the circuit board into the immersion solder bath for processing. Since the circuit boards 4 vary in size and shape, the fixed immersion method makes it difficult to ensure that all circuit boards 4 can be evenly contacted by the immersion solder solution, resulting in poor processing results.

[0035] like Figure 3 As shown, this embodiment is based on embodiment one, but differs from embodiment one in that: the lifting assembly 2 includes two uprights 201, which are symmetrically fixedly connected to both sides of the immersion tin bath 1. A servo motor 203 is fixedly fixed to the top of one of the uprights 201, and a fixed base 202 is fixedly connected to the bottom of the servo motor 203. The fixed base 202 is fixedly connected to the top of the side of one of the uprights 201. A rotating shaft 204 is fixedly connected to the output end of the servo motor 203. A first bevel gear 205 is fixedly sleeved on both sides of the outer surface of the rotating shaft 204.

[0036] Both uprights 201 are rotatably connected to ball screws 206 on their outer sides. A second bevel gear 207 is fixedly sleeved on the top of the ball screw 206. The teeth of the second bevel gear 207 mesh with the teeth of the first bevel gear 205. A lifting block 208 is sleeved on the outer surface of the ball screw 206. A crossbar 301 is fixedly connected between the two lifting blocks 208.

[0037] A ball nut 209 is embedded in the middle of the lifting block 208, and the ball nut 209 is threaded onto the outer surface of the ball screw 206.

[0038] The servo motor 203 drives the rotating shaft 204 and the first bevel gear 205, which in turn drives the second bevel gear 207 and the ball screw 206 to rotate, thereby realizing the lifting movement of the lifting block 208 and the crossbar 301. This allows the circuit board 4 to enter and leave the immersion solder bath 1 more flexibly, and the circuit board 4 to contact the immersion solder solution more evenly. This avoids the problem of uneven processing that occurs in the fixed immersion method, and improves the immersion solder quality and consistency of the circuit board 4.

[0039] Working principle: First, place the circuit board 4 to be processed on the U-shaped block 3051 in sequence. By rotating the adjusting bolt 3052, the pressure plate 3053 can be moved to achieve clamping and fixing of the circuit board 4.

[0040] After the circuit board 4 is fixed, the servo motor 203 is started. The servo motor 203 drives the rotating shaft 204 and the first bevel gear 205 to rotate. The first bevel gear 205 and the second bevel gear 207 mesh and transmit power, causing the ball screw 206 to rotate. Due to the threaded engagement between the ball nut 209 and the ball screw 206, the lifting block 208 will move along the axial direction of the ball screw 206, thereby driving the suspension assembly 3 and the circuit board 4 to rise and fall.

[0041] When circuit board 4 is lowered to the appropriate position, it will be immersed in the immersion solder bath 1. The immersion solder bath contains solder powder and additives to form a uniform solder layer on the copper surface of the circuit board. During the immersion process, the immersion time and temperature of circuit board 4 can be adjusted to obtain the best immersion effect. The suspended design allows circuit board 4 to contact the immersion solder bath more evenly during the process, avoiding the uneven processing problems that occur in the fixed immersion method.

[0042] After the immersion tin treatment is completed, the lifting assembly 2 is activated again to lift the circuit board 4 from the immersion tin solution. Then, the clamping force on the circuit board 4 is released by rotating the adjusting bolt 3052, and the circuit board 4 is removed from the suspension assembly 3. As needed, the treated circuit board 4 can be cleaned, dried and other subsequent treatments.

[0043] As the immersion tin treatment proceeds, the immersion tin solution in the immersion tin tank 1 will be gradually consumed and waste liquid will be generated. At this time, the shut-off valve on the drain pipe 5 on the side of the immersion tin tank 1 can be opened to drain the waste liquid. At the same time, new immersion tin solution can be added to the immersion tin tank 1 as needed to maintain its working performance.

[0044] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circuit board immersion tin treatment apparatus, characterized in that, include: Immersion tin bath (1); Lifting assembly (2), which is fixedly connected to the top of the immersion tin bath (1) and is used to realize vertical movement; The suspension assembly (3) is fixedly connected to the output end of the lifting assembly (2) and is used to support the circuit board (4) for tin plating. The suspension assembly (3) includes a crossbar (301), a fixing sleeve (302) is fitted on the outer surface of the crossbar (301), a support rod (304) is fixedly connected to the bottom of the fixing sleeve (302), and a plurality of clamping parts (305) are fixedly connected to the bottom of the support rod (304) along the length direction. The circuit board (4) is fixed inside the clamping parts (305).

2. The circuit board tin plating treatment apparatus as described in claim 1, characterized in that, The outer surface of the fixed sleeve (302) is threaded with a locking bolt (303), and the end of the locking bolt (303) abuts against the outer surface of the crossbar (301).

3. The circuit board tin plating treatment apparatus as described in claim 1, characterized in that, The clamping member (305) includes a U-shaped block (3051), one side of which is threaded with an adjusting bolt (3052), and the end of the adjusting bolt (3052) is rotatably connected with a pressure plate (3053).

4. The circuit board tin plating treatment apparatus as described in claim 3, characterized in that, The U-shaped block (3051) has a threaded hole on one side, and the adjusting bolt (3052) is threaded into the threaded hole.

5. The circuit board tin plating treatment apparatus as described in claim 3, characterized in that, The opening of the U-shaped block (3051) is set downwards.

6. The circuit board tin plating treatment apparatus as described in claim 3, characterized in that, A pressure pad (3054) is embedded on the side of the U-shaped block (3051) away from the pressure plate (3053).

7. The circuit board tin plating treatment apparatus as described in claim 1, characterized in that, The lifting assembly (2) includes two uprights (201), which are symmetrically fixedly connected to both sides of the immersion tank (1). A servo motor (203) is fixedly mounted on the top of one of the uprights (201), and a rotating shaft (204) is fixedly connected to the output end of the servo motor (203). A first bevel gear (205) is fixedly mounted on both sides of the outer surface of the rotating shaft (204). Both of the two uprights (201) are rotatably connected to ball screws (206) on their outer sides. A second bevel gear (207) is fixedly sleeved on the top of the ball screw (206). The teeth of the second bevel gear (207) mesh with the teeth of the first bevel gear (205). A lifting block (208) is sleeved on the outer surface of the ball screw (206). The crossbar (301) is fixedly connected between the two lifting blocks (208).

8. The circuit board tin plating treatment apparatus as described in claim 7, characterized in that, The bottom of the servo motor (203) is fixedly connected to a mounting base (202), which is fixedly connected to the top of the side of one of the uprights (201).

9. The circuit board tin plating treatment apparatus as described in claim 7, characterized in that, The lifting block (208) is fitted with a ball nut (209) in the middle, and the ball nut (209) is threaded onto the outer surface of the ball screw (206).

10. The circuit board tin plating treatment apparatus as described in claim 1, characterized in that, A drain pipe (5) is fixedly connected to the bottom of the side of the tin bath (1), and a shut-off valve is provided on the drain pipe (5).

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