Semiconductor light emitting device
By designing an array of light-emitting chips on the substrate, the chips are distributed at equal angles along the radial direction, which solves the problems of LED packaging products being unable to achieve multiple high voltage specifications and uneven light output, thus achieving a highly efficient and uniform light emission effect.
Patent Information
- Application Number
- CN202422724199.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-11-08
AI Technical Summary
Existing LED packaging products cannot achieve designs with different high voltage specifications, and the light output is uneven, affecting the luminous effect.
By setting an array of light-emitting chips on a substrate, with each light-emitting chip arranged radially along the perpendicular axis of symmetry of the target circular area and distributed at equal angles, a multi-ring peripheral chip array is formed, including a first ring and a second ring of peripheral chips. This enables various high-voltage LED packaging types and ensures light emission performance through uniform excitation of phosphors.
It achieves uniform light output for LED packages with different high voltage specifications, improves luminous efficiency, avoids the yellow ring phenomenon, and ensures uniform light emission and heat dissipation.
Smart Images
Figure CN223503344U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor light-emitting technology, and in particular to a semiconductor light-emitting device. Background Technology
[0002] With the development of LED (light-emitting diode) light source products, there are also more and more types of LED packaging products. Among them, high-voltage LEDs are widely used due to their higher luminous efficiency. However, at present, LED chips themselves cannot achieve high-voltage driving design. How to achieve different high-voltage LED packaging types while ensuring light uniformity and good light output effect remains a hot research topic for LED packaging products. Utility Model Content
[0003] Therefore, in order to overcome at least some of the defects in the prior art, this utility model provides a semiconductor light-emitting device that can realize LED packaging types with different high voltage specifications and more uniform light output.
[0004] Specifically, in one embodiment of the present invention, a semiconductor light-emitting device is provided, comprising: a substrate having a first surface; an array of light-emitting chips disposed on the first surface; one side of each light-emitting chip in the array is arranged radially along a target circular region perpendicular to its axis of symmetry; the target circular region is centered on the center of the first surface; the array of light-emitting chips includes a first ring of peripheral chips, in which multiple light-emitting chips are distributed at equal angles around the center of the first surface.
[0005] As can be seen from the above, the above embodiments of this utility model can achieve one or more of the following beneficial effects: by arranging the edges of multiple light-emitting chips along the radial direction of the target circular area with the vertical axis of symmetry, and the design of the first ring of peripheral chips being distributed at equal angles around the center line of the first surface, multiple chips can be arranged more evenly on the substrate, enabling LED packaging types with different high voltage specifications and ensuring that the phosphor is uniformly excited to guarantee the light-emitting effect.
[0006] Other aspects and features of the present invention will become apparent from the following detailed description with reference to the accompanying drawings. However, it should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of the invention. It should also be understood that, unless otherwise indicated, the drawings are not necessarily drawn to scale; they are merely intended to conceptually illustrate the structures and processes described herein. Attached Figure Description
[0007] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.
[0008] Figure 1This is a schematic diagram of the elevation structure of a semiconductor light-emitting device provided in an embodiment of the present invention.
[0009] Figure 2 for Figure 1 The diagram shows a top view of the semiconductor light-emitting device.
[0010] Figure 3 A top view of a semiconductor light-emitting device provided for another embodiment.
[0011] Figure 4 A top view of a semiconductor light-emitting device provided in another embodiment.
[0012] Figure 5 A top view of the structure of a semiconductor light-emitting device provided in yet another embodiment.
[0013] Figure 6 To and Figure 2 A top view of the substrate structure in the corresponding semiconductor light-emitting device.
[0014] Figure 7 To and Figure 3 A top view of the substrate structure in the corresponding semiconductor light-emitting device.
[0015] Figure 8 To and Figure 4 A top view of the substrate structure in the corresponding semiconductor light-emitting device.
[0016] [Explanation of Labels in the Attached Image]
[0017] 10. Substrate; 11. First surface; 12. Pad pair; 121. First pad; 122. Second pad; 20. Light-emitting chip array; 201. Light-emitting chip; 21. First ring of peripheral chips; 22. Central chip; 23. Second ring of peripheral chips; 30. Package. Detailed Implementation
[0018] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0019] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.
[0020] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0021] It should also be noted that the division of multiple embodiments in this utility model is only for the convenience of description and should not constitute a special limitation. Features in various embodiments can be combined and referenced in each other without contradiction.
[0022] like Figure 1 As shown, this utility model provides a semiconductor light-emitting device, including a substrate 10 and a light-emitting chip array 20. The substrate 10 has a first surface 11. The light-emitting chip array 20 is disposed on the first surface 11, and the light-emitting chip array 20 includes a plurality of light-emitting chips 201. (Refer to...) Figure 2 Each light-emitting chip 201 has one side perpendicular to its axis of symmetry and arranged radially along the target circular region, with the center of the first surface 11 as its center. The light-emitting chip array 20 includes one or more concentric rings of peripheral chips distributed around the center of the first surface 11. For example, the light-emitting chip array 20 includes a first ring of peripheral chips 21, in which multiple light-emitting chips 201 are distributed at equal angles around the center of the first surface 11.
[0023] The substrate 10 is, for example, a ceramic substrate, and the multiple light-emitting chips 201 are, for example, flip-chip LEDs. The substrate 10 also has multiple pad pairs 12 corresponding one-to-one with each of the multiple light-emitting chips 201. The electrode of each light-emitting chip 201 is electrically connected to a corresponding pad pair 12. The substrate 10 also has conductive connectors, specifically conductive metal, which enable electrical connections between the multiple pad pairs, thereby achieving electrical connections between the multiple light-emitting chips 201. The multiple light-emitting chips 201 are, for example, connected in series to achieve a high-voltage driving design.
[0024] In some embodiments, such as Figure 1The semiconductor light-emitting device shown also includes a package 30, which is disposed on the first surface 11 and covers the light-emitting chip array 20. The package 30 includes, for example, a hemispherical lens, and may also include a fluorescent film, a fluorescent adhesive layer, or other light conversion layer containing wavelength conversion materials such as phosphors, disposed on the surfaces of the plurality of light-emitting chips 201.
[0025] The orthographic projection of the hemispherical lens in the package 30 onto the first surface 11 can be considered a specific embodiment of the target circular region. Of course, the target circular region can be any circular region centered at the center of the first surface 11. The vertical axis of symmetry of the light-emitting chip 201 specifically refers to the vertical axis of symmetry of the orthographic projection of the light-emitting chip 201 onto the first surface 11. A "vertical axis of symmetry" refers to an axis of symmetry perpendicular to one side or two opposite sides of the shape. For example, if the orthographic projection of the light-emitting chip 201 onto the first surface 11 is a rectangle (including squares and rectangles), then there are two vertical axes of symmetry, each perpendicular to one or both opposite sides of the rectangle, and the two vertical axes of symmetry are mutually perpendicular. Figure 2 The dashed line L1 indicates that the three light-emitting chips 201 are arranged radially along the target circular region, perpendicular to the axis of symmetry. This results in the outer edge (referred to as the outer side) of each light-emitting chip 201 in the first ring of peripheral chips 21, away from the center of the first surface 11, being perpendicular to the radial direction of the target circular region. In other words, the outer edge of each light-emitting chip 201 in the first ring of peripheral chips 21 is tangent to or parallel to the tangent direction of the target circular region.
[0026] The included angle between adjacent light-emitting chips 201 in the first ring of peripheral chips 21 can be referenced by the line connecting the center of the first surface 11 and the center of each light-emitting chip 201, or by the perpendicular axis of symmetry of the edge of each light-emitting chip 201. Figure 2 Three light-emitting chips 201 constitute the first ring of peripheral chips 21, and the three light-emitting chips 201 are distributed at an angle of 120° around the center of the first surface 11. Of course, this embodiment does not limit the number of light-emitting chips 201 constituting the first ring of peripheral chips 21, and it can be more than three, such as four, five, six or even more.
[0027] In this design, the centers of the multiple light-emitting chips 201 in the first peripheral chip 21 (as projected onto the first surface 11) lie on the same circle centered at the center of the first surface 11. The intersecting lines of the outer edges of the multiple light-emitting chips 201 in the first peripheral chip 21 form a regular polygonal region. The number of sides of this regular polygon is the same as the number of light-emitting chips 201 constituting the first peripheral chip 21, and the radius of the inscribed circle of this regular polygonal region is the distance from the center point of the first surface 11 to the outer edge of any light-emitting chip 201 in the first peripheral chip 21.
[0028] In the above embodiments of this utility model, by designing the arrangement of the light-emitting chip array 20 on the substrate 10, the multiple light-emitting chips 201 in the first ring of peripheral chips 21 are not only arranged at equal angles, but also set with the outer edges rather than the top corners facing the periphery of the first surface 11 (package 30). This makes the multiple light-emitting chips 201 evenly distributed and easy to dissipate heat. At the same time, when emitting light, it can also more evenly excite the phosphor in the light conversion layer. For white light devices, it can avoid the generation of yellow rings and achieve a more uniform light emission effect.
[0029] In some embodiments, refer to Figure 3 and Figure 4 The light-emitting chip array 20 also includes a central chip 22, which is disposed at the center of the first surface 11. Specifically, when the number of light-emitting chips 201 in the light-emitting chip array 20 is greater than or equal to four, one light-emitting chip 201 is used as the central chip 22, and the remaining light-emitting chips 201 are arranged around the central chip 22. This ensures the light emission effect and the rational utilization of space on the substrate 10.
[0030] In some embodiments, the light-emitting chip array 20 further includes a second ring of peripheral chips 23, in which a plurality of light-emitting chips 201 are distributed at equal angles around the center of the first surface 11 and surround the first ring of peripheral chips 21. Here, the first ring of peripheral chips 21 is not limited to the first ring measured outwards from the center of the first surface 11; the terms "first ring" and "second ring" are used to indicate that the first ring of peripheral chips 21 and the second ring of peripheral chips 23 belong to different rings, with the second ring located further outwards. Generally, the number of light-emitting chips 201 in the second ring of peripheral chips 23 is greater than the number of light-emitting chips 201 in the first ring of peripheral chips 21. The number and spacing angle of the light-emitting chips 201 in each ring of peripheral chips can be designed according to the circumference of the ring and the allowable tolerances of the manufacturing process.
[0031] In one embodiment, the vertical axis of symmetry of any one of the light-emitting chips 201 in the second ring of peripheral chips 23 is offset from the vertical axis of symmetry of the side of each light-emitting chip 201 in the first ring of peripheral chips 21. This allows the semiconductor light-emitting devices to be offset as much as possible, resulting in a more uniform distribution of the light-emitting area.
[0032] In some embodiments, the plurality of light-emitting chips 201 of the light-emitting chip array 20 are symmetrically arranged about the edge perpendicular axis of symmetry of the first surface 11. For example... Figures 2 to 5 As shown, the positive and negative electrodes of the semiconductor light-emitting device are located on the left and right sides of the substrate 10, respectively, and multiple light-emitting chips 201 are symmetrically arranged about the vertical axis of the first surface 11. In some embodiments, multiple pad pairs 12 are also symmetrically arranged about the vertical axis of the first surface 11 to better match the arrangement of the light-emitting chip array 20.
[0033] In some embodiments, refer to Figures 6 to 8 On the substrate 10, each pad pair 12 includes a first pad 121 and a second pad 122, which are respectively used to connect to the positive and negative electrodes of the corresponding light-emitting chip 201. For example Figure 6 In the three pad pairs, the pad pair 12 located in the lower left corner is used to connect the first pad 121 to the negative terminal of the corresponding light-emitting chip 201, and the second pad 122 to the positive terminal of the corresponding light-emitting chip 201.
[0034] In some embodiments, the first pad 121 and the second pad 122 in each pad pair 12 are arranged opposite each other in a first direction, which is perpendicular to the radial direction of the target circular region. That is, the first pad 121 and the second pad 122 are located on opposite sides of a certain radial line of the target circular region, that is, the length direction of the first pad 121 and the second pad 122 is parallel to the radial direction of the target circular region, which is beneficial for the arrangement of the connecting metal between the multiple pad pairs 12.
[0035] The above-described embodiments of this utility model enable the achievement of 9V (corresponding to...). Figure 2 (structure), 12V (corresponding) Figure 3 (structure), 15V, 18V (corresponding) Figure 4 (structure), 21V, 72V (corresponding) Figure 5 It offers various high-voltage LED packaging types (such as structure) to ensure more uniform light emission and better luminous efficiency.
[0036] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.
Claims
1. A semiconductor light-emitting device, characterized in that, include: A substrate (10) having a first surface (11); A light-emitting chip array (20) is disposed on the first surface (11); one side of each light-emitting chip (201) in the light-emitting chip array (20) is arranged radially along the vertical axis of symmetry of the target circular region; the target circular region is centered on the center of the first surface (11); the light-emitting chip array (20) includes a first ring of peripheral chips (21), in which multiple light-emitting chips (201) are distributed at equal angles around the center of the first surface (11).
2. The semiconductor light-emitting device as described in claim 1, characterized in that, The light-emitting chip array (20) also includes a central chip (22), which is disposed at the center of the first surface (11).
3. The semiconductor light-emitting device as described in claim 1, characterized in that, The light-emitting chip array (20) also includes a second ring of peripheral chips (23), in which multiple light-emitting chips (201) are distributed at equal angles around the center of the first surface (11) and surround the first ring of peripheral chips (21).
4. The semiconductor light-emitting device as described in claim 3, characterized in that, The vertical axis of symmetry of any light-emitting chip (201) in the second ring of peripheral chips (23) is offset from the vertical axis of symmetry of each light-emitting chip (201) in the first ring of peripheral chips (21).
5. The semiconductor light-emitting device as described in claim 1, characterized in that, The light-emitting chip array (20) is symmetrically arranged about the vertical axis of the first surface (11).
6. The semiconductor light-emitting device as described in claim 1, characterized in that, The light-emitting chip array (20) consists of multiple light-emitting chips (201) connected in series.
7. The semiconductor light-emitting device as described in claim 1, characterized in that, The light-emitting chip (201) in the light-emitting chip array (20) is a flip-chip LED.
8. The semiconductor light-emitting device as described in claim 7, characterized in that, The substrate (10) is provided with multiple pad pairs (12) corresponding one-to-one with multiple light-emitting chips (201) in the light-emitting chip array (20), and the electrode of each light-emitting chip (201) is electrically connected to a corresponding pad pair (12).
9. The semiconductor light-emitting device as described in claim 8, characterized in that, Each pad pair (12) includes a first pad (121) and a second pad (122), wherein the first pad (121) and the second pad (122) in each pad pair (12) are arranged opposite to each other in a first direction, the first direction being perpendicular to the radial direction of the target circular region.
10. The semiconductor light-emitting device as described in claim 8, characterized in that, The plurality of pads (12) are arranged symmetrically about the edge perpendicular to the axis of symmetry of the first surface (11).