Piezoelectric ceramic stacking and bonding device

Abstract

The utility model provides a piezoelectric ceramic stack bonding device which comprises two pressing pieces, a fixing frame and a base, one face of each pressing piece is provided with a plurality of containing grooves, the fixing frame is provided with a containing portion, one pressing piece is installed in the containing portion firstly, piezoelectric ceramic stacks are placed in the containing grooves, then the other pressing piece is installed in the containing portion, and the piezoelectric ceramic stacks are placed in the containing grooves. And taking down the pressing piece which is installed firstly, wiping the surface of the piezoelectric ceramic stack, then installing the piezoelectric ceramic stack to the original position again, and finally vertically placing the fixing frame containing the pressing piece in the base. When the device provided by the utility model is used for bonding the piezoelectric ceramic stack, the surface of the piezoelectric ceramic stack can be wiped by disassembling the pressing piece, so that the problem of serious glue overflow in the bonding process is solved, and the production efficiency is improved by only wiping once in the whole process; in addition, the piezoelectric ceramic stack is vertically placed in the base, so that the problem of serious glue overflow in the curing process after the piezoelectric ceramic stack is bonded is solved.

Description

Technical Field

[0001] This utility model belongs to the field of piezoelectric ceramic technology, specifically, it relates to a piezoelectric ceramic stacking and bonding device. Background Technology

[0002] Currently, in the manufacturing process of piezoelectric ceramic stacks, it is necessary to bond the piezoelectric ceramic stacks. However, using existing bonding devices for bonding has the following drawbacks:

[0003] 1. During the bonding process, the piezoelectric ceramic stack involves multiple disassembly, compression, and re-disassembly and compression. This results in a small amount of adhesive overflowing after repeated wiping, and this overflowing adhesive is present on the contact surface between the piezoelectric ceramic stack and the tooling, which cannot be wiped away. In addition, after wiping, the stack is placed in an oven for curing. During the curing process, the piezoelectric ceramic stack and the tooling are placed flat. When the adhesive is heated, its fluidity first increases and then decreases. Therefore, when the piezoelectric ceramic stack is placed flat, adhesive overflows on the downward-facing side due to gravity. Both of these situations will lead to poor product appearance.

[0004] 2. When using the existing equipment for bonding, it is necessary to repeatedly disassemble and press. In order to ensure that as little glue as possible is discharged when pressing for the last time, it is necessary to wipe and discharge the glue after each disassembly and pressing to remove excess glue. This process is repeated many times, resulting in a long overall processing time and reduced production efficiency.

[0005] 3. After the stacked adhesive base is assembled, the two sides are not completely flat, which makes it impossible to place it stably vertically. After being placed vertically, the stacked base has no support, and as the adhesive becomes more fluid, it is prone to problems such as incomplete curing, stacking, and breakage. Utility Model Content

[0006] In view of the shortcomings of the prior art described above, this utility model provides a piezoelectric ceramic stack bonding device, including two clamping parts, a fixing frame, and a base. One side of the clamping parts has multiple placement grooves, and the fixing frame has a receiving part. First, one clamping part is installed in the receiving part, and the piezoelectric ceramic stack is placed in the placement groove. Then, the other clamping part is installed in the receiving part. The first clamping part is removed, the surface of the piezoelectric ceramic stack is wiped, and then it is reinstalled in its original position. Finally, the fixing frame containing the clamping parts is placed in the base, so that the entire structure is placed vertically. Using the device provided by this utility model for piezoelectric ceramic stack bonding, when wiping the excess adhesive on the surface of the piezoelectric ceramic stack, the clamping parts can be removed for wiping, which completely solves the problem of severe adhesive overflow during the bonding process. Moreover, only one wiping is required in the entire process, avoiding multiple pressure tightening and loosening of the piezoelectric ceramic stack, thus improving production efficiency. In addition, the vertical placement of the piezoelectric ceramic stack in the base solves the problem of severe adhesive overflow during the curing process after the piezoelectric ceramic stack is bonded.

[0007] To achieve the above and other related objectives, this utility model provides a piezoelectric ceramic stack bonding device, comprising:

[0008] Two clamping members, one side of which has a plurality of parallel placement grooves extending along a first direction for placing piezoelectric ceramics;

[0009] A fixed frame has a receiving portion, in which two clamping members are placed, with the sides of the two clamping members having the placement groove facing each other; the two opposite sides of the fixed frame in the first direction are mounting surfaces, and the mounting surfaces have a plurality of mounting holes, the mounting holes corresponding one-to-one with the positions of the placement grooves;

[0010] The base has a receiving groove for placing the fixing frame containing the clamping member, and one mounting surface of the fixing frame is located in the receiving groove.

[0011] Optionally, each of the placement slots contains two top blocks, which are located at opposite ends of the piezoelectric ceramic along the first direction.

[0012] Optionally, it also includes a fastener that passes through the mounting hole to press the top block.

[0013] Optionally, each of the mounting surfaces has four first positioning holes, which are symmetrically distributed in pairs on both sides of the plurality of mounting holes.

[0014] Optionally, the clamping member has two second positioning holes on one side near the mounting surface, the second positioning holes corresponding to the positions of the first positioning holes.

[0015] Optionally, the connector passes through the first positioning hole and the second positioning hole to fix the fixing frame to the clamping member.

[0016] Optionally, the receiving groove includes a first receiving groove and a second receiving groove. The length of the first receiving groove is equal to the width of the fixing frame, and it is used to place the fixing frame. The length of the second receiving groove is less than the length of the first receiving groove, and it is used to accommodate the fixing member and the connecting member.

[0017] Optionally, the two sides of the fixing frame are connected to the two mounting surfaces, each side having a first groove and two second grooves, the first groove being located in the middle of the side, and the second grooves being symmetrically arranged about the first groove.

[0018] Optionally, the openings of the first groove and the second groove are opposite.

[0019] Optionally, the four corners of the fixing frame are provided with rounded corners, and the rounded corners are connected to the receiving part.

[0020] The piezoelectric ceramic stack bonding device provided by this utility model has at least the following beneficial effects:

[0021] 1) When wiping the excess adhesive on the surface of the piezoelectric ceramic stack, the clamping parts can be removed for wiping, which completely solves the problem of severe adhesive overflow during the bonding process;

[0022] 2) Wiping is only done once throughout the entire process, avoiding multiple pressurization and loosening of the piezoelectric ceramic stack, thus improving production efficiency;

[0023] 3) The piezoelectric ceramic stack is placed vertically in the base, which solves the problem of severe glue overflow during the curing process after the piezoelectric ceramic stack is bonded. Attached Figure Description

[0024] Figure 1 The diagram shown is a structural schematic of the piezoelectric ceramic stack bonding device provided in the embodiment.

[0025] Figure 2 The diagram shown is a cross-sectional view of the piezoelectric ceramic stack bonding device provided in the embodiment.

[0026] Figure 3 The diagram shown is a structural schematic of the clamping component provided in the embodiment.

[0027] Figure 4 The diagram shown is a structural schematic of the fixed frame provided in the embodiment.

[0028] Component designation explanation

[0029] 1. Clamping component

[0030] 11 Placement slot

[0031] 12 Second positioning hole

[0032] 2. Fixed frame

[0033] 21. Reception Department

[0034] 22 mounting holes

[0035] 23 First positioning hole

[0036] 24 First Groove

[0037] 25 Second Groove

[0038] 26 Rounded corners

[0039] 3 bases

[0040] 31 First Receiving Tank

[0041] 32 Second Receiving Tank

[0042] 4 top blocks

[0043] 5. Piezoelectric ceramics

[0044] 6. Fasteners

[0045] 7 Connectors Detailed Implementation

[0046] To make the technical objectives, technical solutions, and technical effects of this application clearer, the technical solutions in this application will be clearly and completely described below in conjunction with embodiments. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0047] Therefore, the following detailed description of embodiments of this application is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0048] In the description of this application, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0049] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly, for example, referring to both fixed connections and detachable connections. Furthermore, the use of terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" indicates that a specific feature, structure, material, or characteristic described in connection with an implementation or example is included in at least one implementation or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same implementation or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more implementations or examples.

[0050] Example

[0051] This embodiment provides a piezoelectric ceramic stack bonding device, such as Figure 1 As shown, it includes two clamping parts 1, a fixing frame 2 and a base 3. The two clamping parts 1 are first fixed in the fixing frame 2 and then placed in the base 3.

[0052] like Figure 3 As shown, one side of the clamping member 1 has a plurality of parallel placement grooves 11, the placement grooves 11 being along a first direction ( Figure 3 Extending along the Z-axis (as shown), combined with Figure 2 As shown, the placement groove 11 is used to place the piezoelectric ceramic 5 and the top block 4. The two top blocks 4 are respectively located along the first direction of the piezoelectric ceramic 5. Figure 2 The two ends of the Z-axis direction (as shown). As an example, the number of placement slots 11 can be set according to actual needs. In this embodiment, the number of placement slots 11 is five.

[0053] like Figure 3 As shown, the clamping member 1 is in the first direction ( Figure 3 Two second positioning holes 12 are provided on two opposite faces in the Z-axis direction (as shown).

[0054] like Figure 4As shown, the fixing frame 2 has a receiving portion 21 for holding two clamping members 1. As an example, in the receiving portion 21, the two clamping members 1 are placed opposite each other with the sides having the placement grooves 11.

[0055] like Figure 4 As shown, the fixed frame 2 is in the first direction ( Figure 4 The two opposite surfaces in the Z-axis direction shown are the mounting surfaces, which have four first positioning holes 23 and multiple mounting holes 22.

[0056] As an example, multiple mounting holes 22 along Figure 4 The mounting holes 22 are evenly spaced along the X-axis, and their positions correspond one-to-one with those of the placement slots 11. In this embodiment, there are five mounting holes 22. Figure 1 and Figure 2 As shown, it also includes a fixing member 6, which passes through the mounting hole 22 and presses against the top block 4 placed in the placement groove 11, thereby fixing the piezoelectric ceramic 5.

[0057] As an example, four first positioning holes 23 are symmetrically distributed in pairs on both sides of multiple mounting holes 22, and the positions of the first positioning holes 23 and the second positioning holes 12 correspond one-to-one. Figure 1 and Figure 2 As shown, the connector 7 passes through the first positioning hole 23 and the second positioning hole 12 to fix the fixed frame 2 to the clamping member 1.

[0058] like Figure 4 As shown, the two sides of the fixing frame 2 connect to two mounting surfaces. Each side has a first groove 24 and two second grooves 25. The first groove 24 is located in the middle of the side, and the second grooves 25 are symmetrically arranged about the first groove 24, with the openings of the first groove 24 and the second grooves 25 opposite to each other. The first groove 24 and the second groove 25 are used to remove and place the clamping member 1 in the fixing frame 2, ensuring that the clamping member 1 can be removed from one side during the piezoelectric ceramic stacking and bonding process, thereby improving the convenience and speed of piezoelectric ceramic bonding.

[0059] like Figure 4 As shown, rounded corners 26 are provided at the four corners of the fixed frame 2. The rounded corners 26 are connected to the receiving part 21 to avoid interference between the clamping part 1 and the fixed frame 2.

[0060] like Figure 2As shown, the base 3 has a receiving groove for placing the fixing frame 2 containing the clamping member 1, and one mounting surface of the fixing frame 2 is located in the receiving groove. As an example, the receiving groove includes a first receiving groove 31 and a second receiving groove 32. The length of the first receiving groove 31 is equal to the width of the fixing frame 2, and it is used to place the fixing frame 2; the length of the second receiving groove 32 is less than the length of the first receiving groove 31, and it is used to accommodate the fixing member 6 and the connecting member 7.

[0061] The method of using the piezoelectric ceramic stack bonding device provided in this embodiment is as follows:

[0062] First, place a clamping member 1 inside the fixed frame 2 with the side having the placement groove 11 facing inward. Use the connector 7 to pass through the first positioning hole 23 and the second positioning hole 12 to fix the fixed frame 2 and the clamping member 1 in place.

[0063] Next, a piezoelectric ceramic 5 and a top block 4 are placed in each placement slot 11, with the two top blocks 4 located respectively along the first direction of the piezoelectric ceramic 5. Figure 2 At both ends of the Z-axis direction shown, the fastener 6 passes through the mounting hole 22 and presses the top block 4 placed in the placement groove 11, thereby fixing the piezoelectric ceramic 5.

[0064] Next, another clamping member 1 is placed inside the fixed frame 2, with the side having the placement groove 11 facing inward. The connecting member 7 passes through the first positioning hole 23 and the second positioning hole 12 to fix the fixed frame 2 and the clamping member 1 in place.

[0065] Next, the clamping component 1, initially placed in the fixing frame 2, is removed. The surface of the piezoelectric ceramic stack is wiped to remove excess adhesive, and then it is reinstalled in its original position. Because the fixing frame 2 has a receiving part 21, the contact surface can be wiped by removing the clamping component 1 when wiping the surface of the piezoelectric ceramic stack. This avoids repeatedly pressing and releasing the piezoelectric ceramic stack, requiring only one wipe throughout the entire process. This reduces the number of times the piezoelectric ceramic stack surface needs to be wiped, increasing production efficiency by 50%, and there is no obvious excess adhesive on the surface of the piezoelectric ceramic stack.

[0066] Finally, the above structure is placed in the receiving groove of the base 3, so that the entire structure is placed vertically, which solves the problem of severe glue overflow during the curing process after the piezoelectric ceramic stacking and bonding is completed.

[0067] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A piezoelectric ceramic stack bonding device, characterized in that, include: Two clamping members (1), one side of which has a plurality of parallel placement grooves (11) extending along a first direction for placing piezoelectric ceramics (5); A fixed frame (2) has a receiving portion (21) in which two clamping members (1) are placed, and the two clamping members (1) are placed facing each other with the side of the placement groove (11); the two sides of the fixed frame (2) facing each other in the first direction are mounting surfaces, and the mounting surfaces have a plurality of mounting holes (22), and the positions of the mounting holes (22) correspond one-to-one with the positions of the placement grooves (11); The base (3) has a receiving groove for placing the fixing frame (2) containing the clamping member (1), and one mounting surface of the fixing frame (2) is located in the receiving groove.

2. The piezoelectric ceramic stack bonding device according to claim 1, characterized in that, Two top blocks (4) are placed in each of the placement slots (11), and the two top blocks (4) are located at the two ends of the piezoelectric ceramic (5) along the first direction.

3. The piezoelectric ceramic stack bonding device according to claim 2, characterized in that, It also includes a fastener (6) that passes through the mounting hole (22) to press the top block (4).

4. The piezoelectric ceramic stack bonding device according to claim 3, characterized in that, Each of the mounting surfaces has four first positioning holes (23), which are symmetrically distributed in pairs on both sides of the plurality of mounting holes (22).

5. The piezoelectric ceramic stack bonding device according to claim 4, characterized in that, The clamping member (1) has two second positioning holes (12) on one side near the mounting surface, and the second positioning holes (12) correspond to the positions of the first positioning holes (23).

6. The piezoelectric ceramic stack bonding device according to claim 5, characterized in that, The connector (7) passes through the first positioning hole (23) and the second positioning hole (12) to fix the fixing frame (2) to the clamping member (1).

7. The piezoelectric ceramic stack bonding device according to claim 6, characterized in that, The receiving groove includes a first receiving groove (31) and a second receiving groove (32). The length of the first receiving groove (31) is equal to the width of the fixing frame (2) and is used to place the fixing frame (2). The length of the second receiving groove (32) is less than the length of the first receiving groove (31) and is used to accommodate the fixing member (6) and the connecting member (7).

8. The piezoelectric ceramic stack bonding device according to claim 1, characterized in that, The two sides of the fixed frame (2) are connected to the two mounting surfaces. Each side has a first groove (24) and two second grooves (25). The first groove (24) is located in the middle of the side, and the second grooves (25) are symmetrically arranged about the first groove (24).

9. The piezoelectric ceramic stack bonding device according to claim 8, characterized in that, The openings of the first groove (24) are opposite to those of the second groove (25).

10. The piezoelectric ceramic stack bonding device according to claim 1, characterized in that, The four corners of the fixed frame (2) are provided with rounded corners (26), and the rounded corners (26) are connected to the receiving part (21).

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