Image fusion processor convenient to stack

By using vertically stacked connecting and sealing components, the problems of large space occupation and low heat dissipation efficiency of existing graphics fusion processors are solved, enabling rapid installation and disassembly as well as efficient heat dissipation.

CN223514940UActive Publication Date: 2025-11-04SHENZHEN ZHONGCHUANG SHIJI TECH CO LTD
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Patent Information

Application Number
CN202423080357.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-13
Publication Date
2025-11-04
Estimated Expiration
2034-12-13

AI Technical Summary

Technical Problem

Most existing graphics fusion processors are horizontally stacked, resulting in a large overall device footprint and poor heat dissipation efficiency.

Method used

The system employs vertically stacked connecting and sealing components. The connecting components enable quick installation and removal of the processor body, while the cooling fan and sealing components improve heat dissipation efficiency.

Benefits of technology

It enables rapid installation and removal of the processor and uniform heat dissipation, improving the device's heat dissipation efficiency and reducing the risk of dust ingress.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of image processing, and discloses an image fusion processor convenient to stack, which comprises processor main bodies, a connecting assembly used for vertically stacking the processor main bodies is arranged between the processor main bodies, a connecting groove is formed in the surface of each processor main body, air inlet holes are uniformly formed in each connecting groove, and the air inlet holes are communicated with the processor main bodies. The air inlet holes penetrate through the connecting grooves, sealing assemblies used for blocking the air inlet holes are evenly arranged in the processor body, the processors can be quickly and vertically stacked through the connecting assemblies, quick mounting and dismounting of the processor body are facilitated, and the sealing assemblies can block the air inlet holes in the surface of the processor body. And then airflow generated by a cooling fan in the connecting assembly can eject the sealing assembly open, so that the interior of the processor main body can be uniformly cooled, and the cooling efficiency of the device is improved.
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Description

Technical Field

[0001] This utility model relates to the field of image processing technology, and more specifically to an image fusion processor that is easy to stack. Background Technology

[0002] An image fusion processor, also known as an image fusion unit or splicing fusion unit, is mainly used for video splicing and fusion. It divides a complete image signal into N blocks and distributes them to N independent video display units, thereby forming a large-screen dynamic image display screen through these N independent video display units.

[0003] For example, utility model CN219068587U discloses an image fusion processor with passive heat dissipation, including a housing. A heat dissipation component extending to the outside of the housing is embedded in the inner wall of the top of the housing. The heat dissipation component includes a shell, the interior of which is filled with a medium. Heat sinks distributed at equal intervals are welded to the outer wall of the top of the shell, and the heat sinks are interconnected with the shell. The housing includes a base layer, and a shielding layer and an elastic layer are respectively bonded to the outer walls on both sides of the base layer. A paint layer is sprayed on one side of the outer wall of the shielding layer and the elastic layer. A central control screen is embedded in one side of the outer wall of the housing. In this utility model, the medium in the heat dissipation component vaporizes upon heating and rises into the heat sinks, then liquefies upon cooling at the top of the heat sinks. This process exchanges a large amount of heat with the air, improving the heat dissipation effect of the image fusion processor and achieving passive heat dissipation. Compared to using a fan, this reduces the processor's size and cost.

[0004] In the process of developing this application, the following problems were found in the technology: Most existing graphics fusion processors are horizontally stacked, and the stacking method is to add or remove the main body of the processor in the frame, which results in the overall size of the device not changing, resulting in the device occupying a large space, and the heat dissipation efficiency of the stacked graphics fusion processors is poor.

[0005] To address this, an image fusion processor that is easy to stack is proposed. Utility Model Content

[0006] The purpose of this invention is to address the problem that most existing graphics fusion processors are horizontally stacked, and the stacking method involves adding or removing processor bodies within a frame, resulting in no change in the overall size of the device, a large overall space occupation, and poor heat dissipation efficiency of stacked graphics fusion processors. This invention provides an image fusion processor that is easy to stack.

[0007] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0008] An image fusion processor that is easy to stack includes a processor body, a connecting component for vertical stacking of the processor bodies, a connecting groove on the surface of the processor body, air inlets uniformly formed in the connecting groove and extending through the connecting groove, and a sealing component uniformly formed inside the processor body for blocking the air inlets.

[0009] Furthermore, the connecting component includes a mounting plate, a connecting plate is fixed to the side of the mounting plate, and an array of air outlet holes are formed on the surface of the connecting plate, with the air outlet holes penetrating the surface of the connecting plate.

[0010] Furthermore, the surface of the mounting plate is provided with a mounting groove, in which a cooling fan is arrayed and a filter plate is provided.

[0011] Furthermore, the surface of the connecting plate is provided with an electrical groove, and an electrical strip is provided in the connecting groove, and the electrical strip is movably connected to the electrical groove.

[0012] Furthermore, the mounting plate has a locking block on its inner side, the connecting groove has a locking slot on its side, and the locking block and the locking slot are engaged and connected. The processor body has a heat dissipation hole on its side, and the heat dissipation hole penetrates through the side of the processor body.

[0013] Furthermore, the sealing assembly includes a sealing block made of thermoplastic rubber. A limiting groove is formed on the surface of the sealing block, and a return spring is provided in the limiting groove. The two ends of the return spring are fixedly connected to the sealing block and the processor body, respectively.

[0014] The beneficial effects of this utility model are as follows:

[0015] This invention features a connecting component between processor bodies, and a sealing component evenly distributed within the processor bodies. The connecting component allows for quick vertical stacking of processors, facilitating rapid installation and disassembly of the processor bodies. The sealing component blocks the air inlet holes on the surface of the processor bodies, and the airflow generated by the cooling fan in the connecting component pushes the sealing component open, facilitating uniform heat dissipation inside the processor bodies and improving the device's heat dissipation efficiency. Attached Figure Description

[0016] Figure 1 This is an isometric drawing of this utility model;

[0017] Figure 2 This is an overall sectional view of the present invention;

[0018] Figure 3 This is an exploded view of the overall structure of this utility model;

[0019] Figure 4This is a cross-sectional view of the main body of the processor of this utility model;

[0020] Figure 5 This is a structural diagram of the connecting component of this utility model;

[0021] Figure 6 This is a cross-sectional view of the connecting component of this utility model;

[0022] Figure 7 This is an exploded view of the connecting component of this utility model;

[0023] Figure 8 This is a structural diagram of the sealing assembly of this utility model.

[0024] Reference numerals: 1. Connecting assembly; 101. Filter plate; 102. Mounting plate; 103. Connecting plate; 104. Electrical groove; 105. Air outlet; 106. Locking block; 107. Cooling fan; 108. Mounting groove; 2. Sealing assembly; 201. Limiting groove; 202. Sealing block; 203. Return spring; 3. Air inlet; 4. Processor body; 5. Electrical strip; 6. Heat dissipation hole; 7. Connecting groove; 8. Locking slot. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0027] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0028] In the description of the embodiments of this utility model, it should be noted that the terms "inner", "outer", "upper", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0029] like Figures 1 to 8 As shown, the processor body 4 is provided with a connecting component 1 for vertical stacking of the processor bodies 4. A connecting groove 7 is provided on the surface of the processor body 4. Air inlets 3 are uniformly provided in the connecting groove 7 and the air inlets 3 penetrate the connecting groove 7. A sealing component 2 for blocking the air inlets 3 is uniformly provided in the processor body 4.

[0030] Specifically, the processors can be quickly stacked vertically through the connecting component 1, which facilitates the quick installation and removal of the processor body 4. The sealing component 2 can block the air inlet 3 on the surface of the processor body 4. Then, the airflow generated by the cooling fan 107 in the connecting component 1 will push the sealing component 2 open, which facilitates uniform heat dissipation inside the processor body 4 and improves the heat dissipation efficiency of the device.

[0031] The connecting component 1 includes a mounting plate 102, a connecting plate 103 fixed to the side of the mounting plate 102, an array of air outlet holes 105 on the surface of the connecting plate 103, and the air outlet holes 105 penetrating the surface of the connecting plate 103, a mounting groove 108 on the surface of the mounting plate 102, an array of cooling fans 107 in the mounting groove 108, a filter plate 101 in the mounting groove 108, an electrical groove 104 on the surface of the connecting plate 103, an electrical strip 5 in the connecting groove 7, and the electrical strip 5 is movably connected to the electrical groove 104, a locking block 106 on the inner side of the mounting plate 102, a locking slot 8 on the side of the connecting groove 7, and the locking block 106 engaging with the locking slot 8, and a heat dissipation hole 6 on the side of the processor body 4, and the heat dissipation hole 6 penetrating the side of the processor body 4.

[0032] Specifically, in the connection component 1, the cooling fan 107 filters the external air through the filter plate 101, and then the filtered airflow enters the processor body 4 through the air inlet 3 in the connection slot 7 through the air outlet 105, and exhausts the hot air in the processor body 4 through the heat dissipation hole 6.

[0033] The sealing assembly 2 includes a sealing block 202, which is made of rubber thermoplastic. A limiting groove 201 is formed on the surface of the sealing block 202. A reset spring 203 is provided in the limiting groove 201, and the two ends of the reset spring 203 are fixedly connected to the sealing block 202 and the processor body 4, respectively.

[0034] Specifically, in the sealing component 2, the sealing block 202 blocks the air inlet 3 to prevent dust from entering through the air inlet 3. When the processor needs to dissipate heat, the airflow will lift the sealing block 202. When the cooling fan 107 is not working, the sealing block 202 will block the air inlet 3 again under the action of the reset spring 203.

[0035] In summary: In the connecting assembly 1, the cooling fan 107 filters external air through the filter plate 101, and then the filtered airflow enters the processor body 4 through the air inlet 3 in the connecting slot 7 through the air outlet 105. The hot air in the processor body 4 is discharged through the heat dissipation hole 6. In the sealing assembly 2, the sealing block 202 blocks the air inlet 3 to prevent dust from entering through the air inlet 3. When the processor needs to dissipate heat, the airflow will push the sealing block 202 up. When the cooling fan 107 is not working, the sealing block 202 will block the air inlet 3 again under the action of the reset spring 203. The connecting assembly 1 allows the processors to be stacked vertically quickly, which is convenient for the quick installation and removal of the processor body 4. The sealing assembly 2 can block the air inlet 3 on the surface of the processor body 4. Then, the airflow generated by the cooling fan 107 in the connecting assembly 1 will push the sealing assembly 2 open, which facilitates uniform heat dissipation inside the processor body 4 and improves the heat dissipation efficiency of the device.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An image fusion processor that is easy to stack, comprising a processor body (4), characterized in that: The processor bodies (4) are provided with a connecting component (1) for vertical stacking of the processor bodies (4). A connecting groove (7) is provided on the surface of the processor body (4). An air inlet (3) is uniformly provided in the connecting groove (7) and the air inlet (3) passes through the connecting groove (7). A sealing component (2) for blocking the air inlet (3) is uniformly provided in the processor body (4).

2. The image fusion processor for easy stacking according to claim 1, characterized in that: The connecting component (1) includes a mounting plate (102), and a connecting plate (103) is fixed to the side of the mounting plate (102). The surface of the connecting plate (103) is arrayed with air outlet holes (105), and the air outlet holes (105) penetrate the surface of the connecting plate (103).

3. The image fusion processor for easy stacking according to claim 2, characterized in that: The mounting plate (102) has a mounting groove (108) on its surface, and a cooling fan (107) is arranged in an array in the mounting groove (108). A filter plate (101) is also arranged in the mounting groove (108).

4. The image fusion processor for easy stacking according to claim 3, characterized in that: The surface of the connecting plate (103) is provided with an electrical groove (104), and an electrical strip (5) is provided in the connecting groove (7), and the electrical strip (5) is movably connected to the electrical groove (104).

5. The image fusion processor for easy stacking according to claim 4, characterized in that: The mounting plate (102) has a locking block (106) on its inner side, and the connecting groove (7) has a locking slot (8) on its side. The locking block (106) and the locking slot (8) are engaged and connected. The processor body (4) has a heat dissipation hole (6) on its side, and the heat dissipation hole (6) penetrates the side of the processor body (4).

6. The image fusion processor for easy stacking according to claim 5, characterized in that: The sealing assembly (2) includes a sealing block (202), which is made of rubber thermoplastic. A limiting groove (201) is provided on the surface of the sealing block (202). A reset spring (203) is provided in the limiting groove (201), and the two ends of the reset spring (203) are fixedly connected to the sealing block (202) and the processor body (4) respectively.

Citation Information

Patent Citations

  • Image fusion processor with passive heat dissipation

    CN219068587U