Battery assembly and electronic device

Abstract

The utility model discloses a battery assembly and electronic equipment, and belongs to the technical field of electronic equipment. The battery assembly comprises a circuit board, a metal layer is arranged in the circuit board, and a mounting position is arranged on the peripheral side face of the circuit board; and the energy storage component comprises an electrode, and the electrode is connected with the metal layer through the mounting position.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronic equipment, and particularly relates to a battery assembly and electronic equipment. BACKGROUND

[0002] With the rapid development of mobile intelligent terminal technology, the power consumption of electronic equipment increases sharply, and the battery is not durable, which has become a pain point in the entire industry. In order to meet the needs of consumers, the volume of the battery cell can only be increased in the short term to improve the capacity of the battery.

[0003] In the related art, the battery cell in the battery is welded to the nickel sheet pad on the circuit board through the tab, and the nickel sheet pad is arranged on the front and back surfaces of the circuit board.

[0004] However, the nickel sheet pad occupies a large area on the front and back surfaces of the circuit board, so that the components and the nickel sheet pad cannot be arranged on the same surface, and the components need to be arranged on the front and back surfaces of the circuit board, which leads to the compression of the arrangement space of the battery cell, so that the electronic equipment has the technical problems of limited arrangement space of the battery cell, difficulty in increasing the size of the battery cell, and poor battery life of the equipment. CONTENT OF THE UTILITY MODEL

[0005] The present application aims to provide a battery assembly and electronic equipment, which at least solve the technical problems of limited arrangement space of the battery cell, difficulty in increasing the size of the battery cell, and poor battery life of the equipment.

[0006] In order to solve the above technical problems, the present application is implemented as follows:

[0007] In a first aspect, the present application provides a battery assembly, which comprises: a circuit board, the circuit board comprising a metal layer, and the circuit board being provided with a mounting position on the peripheral surface; and an energy storage component, the energy storage component comprising an electrode, and the electrode being connected to the metal layer through the mounting position.

[0008] In a second aspect, the present application provides an electronic equipment, which comprises: a housing; and the battery assembly as described in the first aspect, the battery assembly being arranged in the housing.

[0009] In the technical solution, the circuit board and the energy storage component share the arrangement space, the size of the circuit board and the size of the energy storage component affect each other, and the space occupied by the circuit board will invade the arrangement space of the energy storage component, leading to the forced reduction of the size of the energy storage component, and vice versa. Specifically, the size of the battery cell in the energy storage component directly affects the energy storage capacity of the battery assembly, and therefore increasing the size of the energy storage component is beneficial to enhancing the energy storage capacity of the battery assembly.

[0010] On this basis, the peripheral side of the circuit board is provided with a mounting position, the mounting position is in contact with the metal layer in the circuit board, and the mounting position is used to connect the electrode on the energy storage component. The battery cell is connected to the metal layer in the circuit board through the electrode and the mounting position, so as to realize the electrical connection between the energy storage component and the circuit board.

[0011] By arranging the mounting position on the peripheral side of the circuit board, the mounting position and the electrode in contact with the mounting position can avoid the first surface and the second surface on the upper and lower sides of the circuit board, so as to avoid the mounting position and the electrode occupying the space on the upper and lower sides of the circuit board. The area on the first surface and the second surface can be exposed for arranging components, so that the components on the circuit board can be arranged on the first side or the second side of the circuit board, thereby reducing the probability of forced arrangement of part of the components on the other side.

[0012] Among them, arranging the components on one side of the circuit board can reduce the space arrangement requirement of the circuit board and the components in the height direction, thereby leaving more arrangement space for the battery cell, so as to increase the size of the battery cell by optimizing the structure layout of the circuit board without changing the total size of the battery assembly. Further solve the technical problems of limited battery cell arrangement space, difficulty in increasing the size of the battery cell, and poor endurance of the electronic device in the related art. Corresponding technical effects of improving the compactness of the battery assembly, improving the energy storage capacity of the battery assembly, and improving the endurance of the electronic device are achieved.

[0013] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter in the description of embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0014] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of embodiments, taken in conjunction with the accompanying drawings in which:

[0015] Figure 1 is a structural schematic diagram of a battery assembly according to an embodiment of the present application;

[0016] Figure 2 is a structural schematic diagram of a battery assembly according to an embodiment of the present application;

[0017] Figure 3 is a structural schematic diagram of a first conductive component according to an embodiment of the present application;

[0018] Figure 4 is a structural schematic diagram of a first conductive component according to an embodiment of the present application;

[0019] Figure 5 is a structural schematic diagram of a circuit board according to an embodiment of the present application;

[0020] Figure 6is a structural schematic diagram of a battery assembly according to an embodiment of the present application;

[0021] Figure 7 is a structural schematic diagram of a battery assembly according to an embodiment of the present application;

[0022] Figure 8 is a structural schematic diagram of a battery assembly according to an embodiment of the present application;

[0023] Figure 9 is a structural schematic diagram of a battery assembly according to an embodiment of the present application;

[0024] Figure 10 is a structural schematic diagram of a second conductive component according to an embodiment of the present application;

[0025] Figure 11 is a structural schematic diagram of a battery assembly according to an embodiment of the present application;

[0026] Figure 12 is a structural schematic diagram of a battery assembly according to an embodiment of the present application;

[0027] Figure 13 is a structural schematic diagram of an energy storage component according to an embodiment of the present application;

[0028] Figure 14 is a structural schematic diagram of a battery assembly according to an embodiment of the present application.

[0029] Reference Signs:

[0030] 100 battery assembly, 110 circuit board, 1101 peripheral side, 1102 metal layer, 1103 mounting groove, 1104 mounting position, 1106 first surface, 1107 second surface, 112 first conductive component, 1122 first segment, 1124 second segment, 1126 adhesive layer, 114 second conductive component, 1142 through hole, 116 third conductive component, 120 energy storage component, 122 electrode, 124 battery cell, 126 aluminum plastic film, 1222 mounting hole. DETAILED DESCRIPTION

[0031] Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0032] The terms "first", "second" in the description and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified and limited, the meaning of "a plurality of" is two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the front and rear associated objects are in an "or" relationship.

[0033] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] The battery assembly and the electronic device according to the embodiments of the present application are described below. Figures 1 to 14 The battery assembly and the electronic device according to the embodiments of the present application are described below.

[0035] As shown in Figure 1 , Figure 6 , Figure 7 and Figure 11 , the battery assembly 100 according to some embodiments of the present application includes a circuit board 110, the circuit board 110 includes a metal layer 1102 inside, and the peripheral side 1101 of the circuit board 110 is provided with a mounting position 1104; the energy storage component 120 includes an electrode 122, and the electrode 122 is connected to the metal layer 1102 through the mounting position 1104.

[0036] In this embodiment, the battery assembly 100 includes the circuit board 110 and the energy storage component 120, and the circuit board 110 is provided with a control circuit. The circuit board 110 controls the energy storage component 120 to perform charging and discharging operation through the control circuit. Among them, the circuit board 110 is formed by stacking multiple levels, and the multiple levels include a metal layer 1102, and the energy storage component 120 is electrically connected to the metal layer 1102.

[0037] The energy storage component 120 is an energy storage structure in the battery assembly 100, and the energy storage component 120 comprises an electric core 124, a protective film and an electrode 122. The protective film is wrapped outside the electric core 124, and the protective film shields and protects the electric core 124. The electrode 122 penetrates the protective film, the first end of the electrode 122 is connected to the electric core 124 inside the protective film, and the second end of the electrode 122 is used to connect the circuit board 110 for controlling the working of the energy storage component 120. The circuit board 110 comprises a first surface 1106, a second surface 1107 and a peripheral surface 1101. The first surface 1106 and the second surface 1107 can be used to arrange components. The control circuit on the circuit board 110 cooperates with the components to realize the charging and discharging function.

[0038] Specifically, the protective film is an aluminum plastic film 126.

[0039] The circuit board 110 and the energy storage component 120 share the arrangement space, and the size of the circuit board 110 and the size of the energy storage component 120 affect each other. If the space occupied by the circuit board 110 is too large, it will encroach on the arrangement space of the energy storage component 120, resulting in the forced reduction of the size of the energy storage component 120, and vice versa. Specifically, the size of the electric core 124 in the energy storage component 120 directly affects the energy storage capacity of the battery assembly 100, so increasing the size of the energy storage component 120 is beneficial to enhancing the energy storage capacity of the battery assembly 100.

[0040] On this basis, the peripheral surface 1101 of the circuit board 110 is provided with a mounting position 1104, the mounting position 1104 is in contact with the metal layer 1102 in the circuit board 110, the mounting position 1104 is used to connect the electrode 122 on the energy storage component 120, and the electric core 124 is connected to the metal layer 1102 in the circuit board 110 through the electrode 122 and the mounting position 1104, so as to realize the electrical connection between the energy storage component 120 and the circuit board 110.

[0041] By arranging the mounting position 1104 on the peripheral surface 1101 of the circuit board 110, the mounting position 1104 and the electrode 122 in contact with the mounting position 1104 can avoid the first surface 1106 and the second surface 1107 on the upper and lower sides of the circuit board 110, so as to avoid the mounting position 1104 and the electrode 122 from encroaching on the space on the upper and lower sides of the circuit board 110. The area on the first surface 1106 and the second surface 1107 can be exposed for arranging components, so that the components on the circuit board 110 can be arranged concentratedly on the first side or the second side of the circuit board 110, reducing the probability of forced arrangement of part of the components on the other side.

[0042] In the circuit board 110, the components are arranged on one side of the circuit board 110, which can reduce the space arrangement requirement of the circuit board 110 and the components in the height direction, thereby leaving more arrangement space for the battery cell 124, so as to increase the size of the battery cell 124 by optimizing the structural layout of the circuit board 110 without changing the overall size of the battery assembly 100. In this way, the technical problems of limited battery cell arrangement space, difficulty in increasing the size of the battery cell, and poor endurance of the electronic device in the related art are solved. The technical effects of improving the structural compactness of the battery assembly 100, improving the energy storage capacity of the battery assembly 100, and improving the endurance of the electronic device are achieved.

[0043] Meanwhile, the mounting position 1104 and the electrode 122 are arranged on the peripheral side of the circuit board 110, so that the electrode 122 can avoid the components on the upper and lower sides of the circuit board 110, and the probability of mutual interference between the components and the electrode 122 can be reduced, thereby improving the contact stability of the electrode 122 and the mounting position 1104, reducing the probability of disconnection of the electrode 122, and further improving the working reliability of the battery assembly 100.

[0044] As shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 , in some embodiments of the present application, the circuit board 110 further includes a first conductive component 112, the first conductive component 112 is arranged on the peripheral side of the circuit board 110, and the first conductive component 112 is connected with the metal layer 1102 inside the circuit board 110, and the first conductive component 112 forms the mounting position 1104.

[0045] In this embodiment, the first conductive component 112 is arranged on the circuit board 110, and the first conductive component 112 forms the mounting position 1104 on the peripheral side of the circuit board 110.

[0046] Specifically, the first conductive component 112 penetrates into the inside of the circuit board 110 through the peripheral side 1101 of the circuit board 110, and the first conductive component 112 is connected with the metal layer 1102 inside the circuit board 110, and the part of the first conductive component 112 exposed outside the peripheral side 1101 of the circuit board 110 is used to connect the electrode 122, and the electrode 122 is electrically connected with the metal layer 1102 through the first conductive component 112.

[0047] By arranging the first conductive component 112 to be inserted into the inside of the circuit board 110, the first conductive component 112 can be connected to the metal layer 1102 inside the circuit board 110, so as to reasonably utilize the space inside the circuit board 110 to realize the electrical connection function, avoid the connection structure of the mounting position 1104 and the metal layer 1102 from occupying the space outside the circuit board 110, and thus provide more arrangement space for the electrode 122 and the battery cell 124, so as to improve the size of the battery cell 124, and thus realize the technical effects of improving the structural compactness of the battery assembly 100, improving the energy storage capacity of the battery assembly 100, and improving the endurance of the electronic equipment.

[0048] Specifically, the first conductive component 112 includes a nickel sheet, and the nickel sheet can clamp and position the electrode 122 through a bending action.

[0049] In the case where the nickel sheet is not inserted into the circuit board 110, the electrode 122 needs to be clamped and positioned by two sections of nickel sheets outside the circuit board 110. Taking the thickness of a single layer of nickel sheet as 0.5 mm for example, the two sections of folded nickel sheets need to occupy a size of 1 mm.

[0050] In the case where the nickel sheet is partially inserted into the circuit board 110, the electrode 122 can be press-fitted on the peripheral side 1101 of the circuit board 110 by only the part of the nickel sheet exposed outside the peripheral side 1101 through bending, that is, the electrode 122 is clamped and positioned by a single layer of nickel sheet and the peripheral side 1101 of the circuit board 110. Compared with the foregoing folding clamping scheme, a size benefit of 0.5 mm is increased.

[0051] Moreover, by inserting the nickel sheet into the circuit board 110 and connecting it inside the circuit board 110, the space outside the circuit board 110 can also be avoided from being occupied by the tin paste between the nickel sheet and the metal layer 1102.

[0052] As shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 , in some embodiments of the present application, the peripheral side 1101 of the circuit board 110 optionally includes a mounting groove 1103; the first conductive component 112 includes a first section 1122 and a second section 1124, the first section 1122 is embedded in the mounting groove 1103, and the second section 1124 is located outside the mounting groove 1103, and the electrode 122 is connected with the second section 1124; the first section 1122 and the second section 1124 are in a strip shape, and the extension directions of the first section 1122 and the second section 1124 are different.

[0053] In this embodiment, the peripheral side surface 1101 of the circuit board 110 is provided with a mounting groove 1103, and the shape of the mounting groove 1103 is matched with the shape of the first conductive component 112. In the process of preparing the circuit board 110, after the stacking process of the layer provided with the mounting groove 1103 is completed, the first conductive component 112 is first mounted in the mounting groove 1103, and then the stacking process of the remaining layers is completed, so that the first conductive component 112 can be embedded inside the mounting groove 1103.

[0054] On this basis, according to the location, the first conductive component 112 is divided into a first segment 1122 and a second segment 1124. Among them, the first segment 1122 is inserted into the circuit board 110, and the first segment 1122 is embedded in the mounting groove 1103, and the mounting groove 1103 can position the first segment 1122 to avoid the first segment 1122 from being pulled out of the mounting groove 1103.

[0055] The second segment 1124 is exposed outside the mounting groove 1103, and the second segment 1124 is connected with the electrode 122. In the assembly process, the second segment 1124 can be bent towards the peripheral side surface 1101 of the circuit board 110, so that the second segment 1124 and the peripheral side surface 1101 of the circuit board 110 can clamp and position the electrode 122.

[0056] By embedding the first segment 1122 inside the mounting groove 1103, the contact area between the first conductive component 112 and the circuit board 110 can be increased, thereby improving the positioning stability of the first conductive component 112 on the circuit board 110. For example, when the circuit board 110 is subjected to external impact, the circuit board 110 can reduce the stress in the first conductive component 112 through the contact relationship between the mounting groove 1103 and the first segment 1122, thereby reducing the probability of the first conductive component 112 falling off or the first conductive component 112 being irreversibly deformed, thereby improving the electrical connection stability of the circuit board 110 and the energy storage component 120.

[0057] Specifically, in the case of the first conductive component 112 being a nickel sheet, in order to prevent the nickel sheet from separating from the metal layer 1102 in a drop scenario, the metal layer 1102 is subjected to groove processing to process the mounting groove 1103, and the nickel sheet is designed as a T-shaped structure. The head of the T-shaped nickel sheet is embedded in the mounting groove 1103, and the end portion protrudes out of the mounting groove 1103, thereby reducing the drop tensile stress of the nickel sheet and avoiding separation of the nickel sheet from the metal layer 1102.

[0058] Specifically, the second segment 1124 of the nickel sheet exposed outside can be designed as a 7-shaped structure, which facilitates welding between the nickel sheet and the electrode 122.

[0059] As Figure 2 and Figure 4As shown, in some embodiments of this application, optionally, an adhesive layer 1126 is provided on the first segment 1122, the adhesive layer 1126 covers a portion of the first segment 1122, the adhesive layer 1126 is used to bond the first segment 1122 and the metal layer 1102, and the area of ​​the first segment 1122 not covered by the adhesive layer 1126 is in contact with the metal layer 1102.

[0060] In this embodiment, an adhesive layer 1126 is provided on the surface of the first end. The adhesive layer 1126 is used to bond the outer surface of the first segment 1122 and the inner surface of the mounting groove 1103 to fix the first segment 1122 inside the mounting groove 1103, reduce the probability of the first segment 1122 loosening or falling off, and thus achieve the technical effect of improving the positioning stability and electrical connection stability of the first conductive component 112.

[0061] The adhesive layer 1126 covers only a portion of the outer surface of the first segment 1122, leaving the remaining portion exposed, so that the first segment 1122 can be electrically connected to the metal layer 1102 through contact, thus preventing the adhesive layer 1126 from affecting the electrical connection between the first segment 1122 and the metal layer 1102.

[0062] Specifically, in the case where the first conductive component 112 is a nickel sheet, the metal layer 1102 is a copper layer, and the adhesive layer 1126 is polypropylene glue.

[0063] Direct lamination of the nickel sheet and copper layer results in weak interfacial adhesion and high-temperature delamination. Applying polypropylene adhesive to the nickel sheet beforehand enhances interfacial adhesion and resolves the high-temperature delamination issue on the circuit board. The polypropylene adhesive and nickel sheet do not completely overlap; the adhesive area is smaller than the outer surface area of ​​the nickel sheet. The exposed portion of the nickel sheet is laminated to the copper layer to achieve electrical connection. The polypropylene adhesive is very thin, and the height difference between the exposed nickel sheet and the adhesive-covered portion is minimal, ensuring minimal impact on the lamination effect between the nickel sheet and copper layer.

[0064] like Figure 6 As shown, in some embodiments of this application, optionally, the circuit board 110 includes a first surface 1106 and a second surface 1107, and the circuit board 110 is along a first direction ( Figure 6 (As shown by arrow a) Stacked in the first direction, the distance between the first conductive component 112 and the first surface 1106 is less than the distance between the first conductive component 112 and the second surface 1107.

[0065] In this embodiment, the stacking direction of the circuit board 110 is a first direction. In the first direction, the circuit board 110 includes a first surface 1106 and a second surface 1107. The first surface 1106 corresponds to the upper side of the circuit board 110, and the second surface 1107 corresponds to the lower side of the circuit board 110.

[0066] On this basis, the distance between the first conductive component 112 and the first surface 1106 is less than the distance between the first conductive component 112 and the second surface 1107, that is, the first conductive component 112 is close to the first surface 1106 above the circuit board 110 and away from the second surface 1107 below the circuit board 110.

[0067] By arranging the first conductive component 112 in the upper half area of the circuit board 110, it is beneficial to increase the length of the electrode 122 and provide more buffer space for the electrode 122 in a drop scenario, thereby reducing the risk of electrode 122 electrical connection failure.

[0068] In addition, by arranging the first conductive component 112 in the upper half area of the circuit board 110, the downward pressure of the circuit board 110 on the first conductive component 112 can be reduced, thereby reducing the probability of the electrode 122 dead folding problem, and further achieving the technical effect of improving the mechanical reliability of the battery assembly 100.

[0069] As shown in Figure 7 , Figure 8 , Figure 9 and Figure 10 In some embodiments of the present application, the circuit board 110 also includes a second conductive component 114, which is arranged on the peripheral side surface 1101 of the circuit board 110, and the second conductive component 114 includes a through hole 1142 opposite the metal layer 1102, and the second conductive component 114 forms a mounting site 1104; the electrode 122 is welded to the second conductive component 114, and the electrode 122 is connected to the metal layer 1102 through the through hole 1142.

[0070] In this embodiment, the second conductive component 114 is arranged on the circuit board 110, and the second conductive component 114 forms a mounting site 1104 on the peripheral side of the circuit board 110.

[0071] The second conductive component 114 is arranged on the peripheral side surface 1101 of the metal layer 1102, and the second conductive component 114 contacts the metal layer 1102 after assembly. When the second conductive component 114 has excellent conductive performance, the electrode 122 can indirectly connect the metal layer 1102 through the second conductive component 114 to meet the electrical connection requirements between the electrode 122 and the metal layer 1102.

[0072] On this basis, the second electrode 122 can also be provided with a through hole 1142 opposite the peripheral side surface 1101 of the metal layer 1102, so that the metal layer 1102 can be exposed through the through hole 1142. The electrode 122 directly connects the metal layer 1102 through the through hole 1142, thereby improving the electrical connection reliability between the electrode 122 and the metal layer 1102 and reducing the probability of disconnection between the electrode 122 and the metal layer 1102.

[0073] Therefore, by arranging the second conductive component 114 around the circuit board 110, the electrodes 122 can be arranged around the circuit board 110, avoiding the space on the upper and lower sides of the circuit board 110, so that the components can be arranged on one side of the circuit board 110, thereby improving the size of the battery cell 124, and achieving the technical effects of improving the compactness of the battery assembly 100, improving the energy storage capacity of the battery assembly 100, and improving the endurance of the electronic device.

[0074] As shown in Figure 10 , in some embodiments of the present application, the aperture of the through hole 1142 gradually decreases in the direction close to the metal layer 1102.

[0075] In this embodiment, the aperture of the through hole 1142 gradually decreases in the depth direction of the through hole 1142 to form a trumpet-shaped through hole 1142.

[0076] When the electrode 122 is welded around the metal layer 1102 by the solder filled into the through hole 1142, the solder filled into the through hole 1142 can be limited by the trumpet-shaped through hole 1142 to avoid the solder from coming out of the through hole 1142, thereby reducing the probability of disconnection between the electrode 122 and the metal layer 1102, and achieving the technical effect of improving the electrical connection reliability of the electrode 122.

[0077] Specifically, the through hole 1142 can be formed on the second conductive component 114 by a laser process. As viewed in the punching direction, the wide opening with a larger aperture corresponds to the outer side, and the narrow opening corresponds to the inner side. When the laser is punched, the laser energy of the outermost region is the largest, corresponding to a large aperture. As the laser energy decreases to the inner side, the aperture also decreases.

[0078] As shown in Figure 11 , Figure 12 , Figure 13 and Figure 14 , in some embodiments of the present application, the circuit board 110 further includes a third conductive component 116, the third conductive component 116 is arranged on the peripheral surface 1101 of the circuit board 110, and the third conductive component 116 forms a mounting position 1104; the electrode 122 includes a mounting hole 1222, and the electrode 122 is sleeved on the third conductive component 116 through the mounting hole 1222.

[0079] In this embodiment, the third conductive component 116 is arranged on the circuit board 110, and the third conductive component 116 forms the mounting position 1104 around the circuit board 110.

[0080] The electrode 122 is provided with a mounting hole 1222, the shape of the mounting hole 1222 is matched with the shape of the third conductive component 116, and the third conductive component 116 is inserted into the mounting hole 1222 during assembly to complete the positioning of the third conductive component 116 and the electrode 122. Then, the electrode 122 can be fixed on the third conductive component 116 through welding process or bonding process.

[0081] Therefore, by arranging the third conductive component 116 around the circuit board 110, the electrode 122 can be arranged around the circuit board 110, avoiding the space on the upper and lower sides of the circuit board 110, so that the components can be arranged on one side of the circuit board 110, thereby improving the size of the battery cell 124, and achieving the technical effects of improving the compactness of the battery assembly 100, improving the energy storage capacity of the battery assembly 100, and improving the endurance of the electronic device.

[0082] Specifically, by arranging the mounting hole 1222, the third conductive component 116 and the electrode 122 can be inserted and installed. Compared with the installation scheme of stacking the third conductive component 116 outside the electrode 122, the third conductive component 116 and the electrode 122 in plug-in cooperation can improve the compactness of the two, so as to reduce the space occupied by the two, thereby further increasing the arrangement space of the battery cell 124 and improving the endurance of the battery assembly 100.

[0083] As shown in Figure 12 , Figure 13 and Figure 14 , in some embodiments of the present application, the third conductive component 116 is in the form of a column, and the electrode 122 is bonded to the third conductive component 116 and / or the circuit board 110.

[0084] In this technical solution, the third conductive component 116 is in the form of a cylinder, and the through hole 1142 is a circular hole.

[0085] By arranging the third conductive component 116 in the form of a cylinder and the through hole 1142 in the form of a circular hole, the third conductive component 116 can be appropriately rotated in the through hole 1142, thereby reducing the probability of damage to the third conductive component 116 and the electrode 122 due to impact by appropriately rotating to unload part of the stress when subjected to external impact, thereby achieving the technical effect of improving the stability of the electrical connection of the battery assembly 100.

[0086] Specifically, the electrode 122 and the third conductive component 116 can be bonded together by glue, and the electrode 122 and the circuit board 110 can also be bonded together by glue.

[0087] According to some embodiments of the electronic device of the present application, the electronic device comprises: a shell; and the battery assembly 100 in any of the above embodiments is arranged in the shell.

[0088] In this embodiment, an electronic device provided with the battery assembly 100 in any of the above embodiments is proposed, so that the electronic device has the advantages of the battery assembly 100 in any of the above technical solutions, and can achieve the technical effects in any of the above embodiments. To avoid repetition, details are not described here.

[0089] The electronic device can be a terminal, or other devices other than the terminal. For example, the electronic device can be a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a mobile Internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. The electronic device can also be a personal computer (PC), a television (TV), a cashier machine, or a self-service machine, etc. The embodiments of the present application are not limited in this regard.

[0090] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0091] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A battery assembly, comprising: The battery assembly comprises: a circuit board, the circuit board comprising a metal layer, the circuit board being provided with a mounting position on a peripheral side thereof; an energy storage component, the energy storage component comprising an electrode, the electrode being connected to the metal layer through the mounting position; the circuit board further comprising a first conductive component, the first conductive component being arranged on the peripheral side of the circuit board, the first conductive component being connected to the metal layer on an inner side of the circuit board, the first conductive component forming the mounting position; the peripheral side of the circuit board comprising a mounting groove; the first conductive component comprising a first segment and a second segment, the first segment being arranged in the mounting groove, the second segment being arranged outside the mounting groove, the electrode being connected to the second segment.

2. The battery assembly according to claim 1, wherein an adhesive layer is arranged on the first segment, the adhesive layer covering a partial area on the first segment, the adhesive layer being used to adhere the first segment and the metal layer, an area on the first segment not covered by the adhesive layer being in contact with the metal layer.

3. The battery assembly according to claim 1, wherein the circuit board comprises a first surface and a second surface, the circuit board being stacked in a first direction; in the first direction, a distance between the first conductive component and the first surface is smaller than a distance between the first conductive component and the second surface.

4. The battery assembly according to claim 1, wherein the circuit board further comprises a second conductive component, the second conductive component being arranged on the peripheral side of the circuit board, the second conductive component comprising a through hole, the through hole being opposite to the metal layer, the second conductive component forming the mounting position; the electrode is welded to the second conductive component, the electrode being connected to the metal layer through the through hole.

5. The battery assembly according to claim 4, wherein in a direction close to the metal layer, a hole diameter of the through hole gradually decreases.

6. The battery assembly according to claim 1, wherein the circuit board further comprises a third conductive component, the third conductive component being arranged on the peripheral side of the circuit board, the third conductive component forming the mounting position; the electrode comprises a mounting hole, the electrode being sleeved on the third conductive component through the mounting hole.

7. The battery assembly according to claim 6, wherein the third conductive component is in a columnar shape, the electrode being adhered to the third conductive component and / or the circuit board.

8. An electronic device, comprising: The battery assembly comprises: a housing; the battery assembly according to any one of claims 1 to 7, the battery assembly being arranged in the housing.

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