Compact camera module

Abstract

The utility model relates to the field of mobile phone camera modules, and particularly discloses a compact camera module which comprises a substrate, a chip, a support and a lens which are sequentially distributed, the chip is arranged on the substrate, the support comprises a first mounting part and a second mounting part which are fixedly connected, the length of the first mounting part is smaller than that of the second mounting part, and the lens is arranged on the first mounting part. A glue filling space is formed on the outer side of the first mounting part and located between the second mounting part and the substrate, the first mounting part is arranged on the chip, and the lens is arranged on the side, away from the first mounting part, of the second mounting part. The compact camera module provided by the utility model can further reduce the size of the camera module.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of mobile phone camera module, concretely relates to a compact camera module. BACKGROUND

[0002] The camera module is an essential part in the current mobile phone, and the current mobile phone camera module is shown in the patent camera module and electronic equipment disclosed in application No. CN202010411953.2, which comprises a lens, a mounting frame, a base, a photosensitive chip, a circuit board and a bracket. The mounting frame is provided with a mounting hole, the lens is arranged in the mounting hole of the mounting frame, the base is arranged at the bottom of the mounting frame, the base is provided with a through hole communicated with the mounting hole, the circuit board is arranged at the bottom of the base, the photosensitive chip is electrically connected with the circuit board, the photosensitive chip corresponds to the lens, the bracket is matched with the mounting frame and surrounds the outer sidewall of the mounting frame, the outer periphery of the base is provided with a boss matched with the bracket, and the bracket is installed on the boss.

[0003] The electronic components such as gold wire and capacitor are located on the inner side of the bracket. When the bracket is installed, glue is needed to be applied at the bottom of the bracket to fix the bracket. However, the space in the current camera module is small. In order to avoid the contact between the glue needle of the glue application and the electronic components, which may cause damage to the electronic components, about 0.5cm space is usually reserved between the sidewall of the bracket and the closest electronic component in the current camera module. This results in that the length and width of the bracket are at least 1cm larger. The requirement for the thickness and other dimensions of the mobile phone is getting higher and higher, so the requirement for the size of each part in the mobile phone is also getting higher and higher, and it is necessary to further reduce the size of the camera module. UTILITY MODEL CONTENTS

[0004] The utility model intends to provide a compact camera module to further reduce the size of the camera module.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme: a compact camera module, comprising a substrate, a chip, a bracket and a lens distributed in sequence, the chip is arranged on the substrate, the bracket comprises a first mounting part and a second mounting part fixedly connected, the length of the first mounting part is less than the length of the second mounting part, a glue filling space is formed on the outer side of the first mounting part, and the glue filling space is located between the second mounting part and the substrate, the first mounting part is arranged on the chip, and the lens is arranged on the side of the second mounting part away from the first mounting part.

[0006] The beneficial effects of the present scheme are as follows:

[0007] After the camera module is assembled, the glue is injected into the glue filling space to fix the support and the substrate, seal the gap between the support and the substrate, and prevent dust from entering the support. At the same time, the glue solidifies into a solid state, which can support the second mounting portion and protect the first mounting portion, thereby improving the strength of the entire camera module.

[0008] Compared with the support in the traditional camera module which needs to be fixed by dispensing glue, the glue in the present solution is directly injected into the glue filling space without the need for dispensing glue. The sidewall of the first mounting portion can block the electronic components inside the first mounting portion, preventing the glue needle from contacting the electronic components inside the support and causing damage to the electronic components. Since there is no risk of the glue needle contacting the electronic components inside the support, a protection gap of about 0.5 cm does not need to be reserved between the first mounting portion and the electronic components inside, so the sidewall of the first mounting portion can be closer to the electronic components inside, and the size of the first mounting portion is smaller. A shorter substrate can be used to support the first mounting portion, making the structure of the entire camera module more compact and the overall size smaller.

[0009] Further, the width of the first mounting portion is smaller than the width of the second mounting portion.

[0010] The beneficial effects of the present solution are that the width of the first mounting portion is smaller, further reducing the space occupied by the first mounting portion, and a smaller width substrate can be used to support the first mounting portion, making the width of the entire camera module smaller.

[0011] Further, the substrate is provided with a capacitor, and the capacitor is located in the glue filling space.

[0012] The beneficial effects of the present solution are that the capacitor is set in the glue filling space, and the glue in the glue filling space can protect the capacitor after solidification. At this time, the number of electronic components to be installed in the support is reduced, and the installation space required is reduced, so the size of the first mounting portion and the second mounting portion can be further reduced, thereby further reducing the size of the camera module.

[0013] Compared with dispensing glue, the size of the glue filling space in the present solution is larger, and the glue needle will not contact the capacitor during glue filling, so the capacitor will not be damaged.

[0014] Further, the substrate is provided with a gold wire, and the gold wire is also located in the glue filling space.

[0015] The beneficial effects of the present solution are that the size of the camera module can be further reduced.

[0016] Further, the distance between the capacitor and the first mounting portion is greater than the distance between the gold wire and the first mounting portion.

[0017] The beneficial effects of the scheme are that the thickness of the capacitor is larger than that of the gold wire, the capacitor in the scheme is located outside the gold wire, and when the glue is poured, the capacitor can play a certain limiting role on the glue, avoiding the glue flowing too much outward, thereby improving the glue pouring effect.

[0018] Further, the cross section of the first mounting part is a square hole shape, and the wall thickness of the top corner position of the first mounting part is larger than that of the side wall position.

[0019] The beneficial effects of the scheme are that the thickness of the top corner position is larger, forming a leg with greater strength, so that the first mounting part can better support the second support part and the lens structure mounted above the second support part, thereby improving the strength of the entire camera module.

[0020] Further, the wall thickness of one side wall of the first mounting part is smaller than that of any other side wall of the first mounting part.

[0021] The beneficial effects of the scheme are that due to the greater strength of the top corner position, and the glue in the glue pouring space outside the first support part can protect the first support part and support the second support part after solidification, even if the thickness of one or two side walls of the first mounting part is reduced, the overall strength of the camera module can still meet the requirements. After the thickness of the side wall is reduced, the width or length of the outer wall of the first support part can be further reduced, thereby further reducing the size of the camera module. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a perspective view of the utility model embodiment;

[0023] Figure 2 is a front view of Figure 1 ;

[0024] Figure 3 is a front view of the bracket in Figure 2 ;

[0025] Figure 4 is a bottom view of Figure 3 . DETAILED DESCRIPTION

[0026] The following will be further described in detail through specific embodiments:

[0027] The reference signs in the drawings of the specification include: substrate 1, capacitor 11, chip 2, first mounting part 3, second mounting part 4, lens 5, glue pouring space 6.

[0028] EMBODIMENT

[0029] The embodiment is basically as follows: Figure 1 , Figure 2 and Figure 3As shown in the figure, a compact camera module includes a capacitor 11 and a gold wire, a substrate 1, a chip 2, a support and a lens 5 arranged from bottom to top, the chip 2 is mounted on the substrate 1, the support includes a first mounting part 3 and a second mounting part 4 which are integrally formed, the first mounting part 3 is located below the second mounting part 4, and the first mounting part 3 is combined with the second mounting part 4 through the gold wire. Figure 4 As shown in the figure, the cross section of the first mounting part 3 and the second mounting part 4 along the transverse direction is all mouth-shaped, the length of the first mounting part 3 is less than the length of the second mounting part 4, and the width of the first mounting part 3 is less than the width of the second mounting part 4, and a one-week glue filling space 6 is formed on the outer periphery of the first mounting part 3.

[0030] The wall thickness of the upper side wall and the lower side wall of the first mounting part 3 is less than the wall thickness of the left side wall, and the wall thickness of the right side wall is less than the wall thickness of the upper side wall and the lower side wall; the four corner positions of the first mounting part 3 are rounded, so that the wall thickness of the corner position is greater than the wall thickness of the left side wall, the corner position forms a support leg with greater thickness, and the strength of the first mounting part 3 is increased.

[0031] The first mounting part 3 is placed on the chip 2, and the lens 5 is mounted on the top of the second mounting part 4. The capacitor 11 and the gold wire are both located in the glue filling space 6, the gold wire is close to the first mounting part 3, the capacitor 11 is located on the side away from the first mounting part 3, and the capacitor 11 and the gold wire are both placed on the substrate 1.

[0032] The mounting mode of the chip 2, the capacitor 11, the gold wire and the lens 5 in the embodiment is the same as that of the prior art, and will not be described herein. Secondly, after the first mounting part 3 in the embodiment is placed on the chip 2, glue is injected into the glue filling space 6, the glue covers the capacitor 11 and the gold wire, the capacitor 11 and the gold wire are fixed, the first mounting part 3, the second mounting part 4 and the substrate 1 are fixed, the first mounting part 3 is protected, the second mounting part 4 is supported, and the strength of the camera module is improved.

[0033] The above is only an embodiment of the present application, and the specific technical solutions and / or common knowledge of the scheme are not described in detail. It should be noted that for those skilled in the art, without departing from the technical scheme of the present application, a number of modifications and improvements can be made, which should also be considered as the protection scope of the present application, which will not affect the effect and practicality of the present application. The protection scope of the present application should be subject to the content of its claims, and the specific implementation mode and the like recorded in the specification can be used to explain the content of the claims.

Claims

1. A compact camera module, comprising a substrate, a chip, a holder and a lens arranged in sequence, the chip is arranged on the substrate, characterized in that: The support includes fixedly connected first and second mounting portions, the length of the first mounting portion is less than the length of the second mounting portion, a glue-filling space is formed outside the first mounting portion, the glue-filling space is located between the second mounting portion and the substrate, the first mounting portion is arranged on the chip, and the lens is arranged on the side of the second mounting portion away from the first mounting portion.

2. The compact camera module of claim 1, wherein: The width of the first mounting portion is less than the width of the second mounting portion.

3. The compact camera module of claim 2, wherein: A capacitor is arranged on the substrate, and the capacitor is located in the glue-filling space.

4. The compact camera module of claim 3, wherein: A gold wire is arranged on the substrate, and the gold wire is also located in the glue-filling space.

5. The compact camera module of claim 4, wherein: The distance between the capacitor and the first mounting portion is greater than the distance between the gold wire and the first mounting portion.

6. The compact camera module of any of claims 1-5, wherein: The cross section of the first mounting portion is a mouth-shaped cross section, the wall thickness of the first mounting portion at the position of the top corner is greater than the wall thickness of the first mounting portion at the position of the side wall.

7. The compact camera module of claim 6, wherein: The wall thickness of one side wall of the first mounting portion is less than the wall thickness of any other side wall of the first mounting portion.

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