Power conversion device

Abstract

The utility model discloses power conversion equipment, and relates to the technical field of heat dissipation of the power conversion equipment, and the power conversion equipment provided by the utility model is characterized in that a power device is installed on a circuit board in a power cavity, a heat dissipation device is cooled through a heat dissipation cavity, and the heat dissipation device is used for cooling the power device; a fan and a flow dividing piece are further arranged in the heat dissipation cavity, the flow dividing piece is arranged between the fan and the heat dissipation device, the flow dividing piece is provided with a flow guide face, and when the fan works, part of air driven by the fan directly flows to the heat dissipation device, and part of air driven by the fan flows to the heat dissipation device after flowing through the flow guide face. The air speed and the air volume of the air blown to the whole heat dissipation device are uniformly distributed, no air-free area appears, the maximum utilization of the air volume of the fan is realized, and the overall heat dissipation efficiency of the heat dissipation device is improved.

Description

[0001] This application claims priority to the Chinese Patent Application No. 202421754973.X, filed on July 23, 2024, and entitled “Power Conversion Device”, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of heat dissipation of power conversion devices, and in particular to a power conversion device. BACKGROUND

[0003] With the development of the new energy industry, the power of power conversion devices and the like is continuously increasing, and the power consumption of internal devices is also continuously increasing. For example, as an important component for realizing energy conversion and transmission in a power conversion module, an insulated gate bipolar transistor (IGBT) accounts for more than two-thirds of the total heat generated by internal devices in the power conversion device, and is a bottleneck device that restricts the power increase of the module. With the increasing power and power density of inverters, the heat generation and heat dissipation density of the internal devices, single board through-flow and cables in the inverter cabinet are also increasing, and devices such as electrolytic capacitors that are easily affected by heat are all inside the cabinet. The internal temperature rise of the cabinet directly determines the service life of these devices, thereby affecting the service life and failure rate of the inverter.

[0004] The power conversion device usually adopts a fan, a heat sink and a fan cover for forced convection heat exchange. The heat generated by the power device is transferred to the heat sink by heat conduction, the fan cover is used to constrain the direction of the air flow, and the heat sink is cooled by the air driven by the fan to transfer heat to the air. However, the power conversion device has a certain volume, the air outlet area of the fan is limited, the air volume is concentrated, and the air outlet of the fan cannot fully cover the whole heat sink. The air volume on both sides of the heat sink is small, and the heat dissipation efficiency of the heat sink of the power conversion device is low. UTILITY MODEL CONTENT

[0005] The present application provides a power conversion device, which sets a flow dividing member between the fan and the heat dissipation device. The flow dividing member has a flow guiding surface, the flow guiding surface is inclined to the air outlet direction, the flow guiding surface is partially overlapped with the fan along the air outlet direction. When the fan is working, part of the air driven by the fan contacts the flow guiding surface and flows along the flow guiding surface to the non-overlapping area of the heat dissipation device and the fan along the air outlet direction. Part of the air driven by the fan flows to the overlapping area of the heat dissipation device and the fan along the air outlet direction, so that the air driven by the fan can cover the heat dissipation device in a larger area, the air speed and volume distribution of the heat dissipation device receiving the air are more uniform, and there is no windless area, realizing the maximum utilization of the air volume of the fan.

[0006] In a first aspect, the application provides a power conversion device, comprising: a housing, the housing enclosing a power cavity; a circuit board arranged in the power cavity, the circuit board being provided with a power device; a fan cover, the fan cover and an outer wall surface of the housing enclosing a heat dissipation cavity; a heat dissipation device arranged in the heat dissipation cavity, at least part of the heat dissipation device being in thermal connection with the power device; a fan, the fan and a projection of the heat dissipation device along an air outlet direction of the fan coinciding; a flow divider between the fan and the heat dissipation device, the flow divider coinciding with the projection of the fan along the air outlet direction, the flow divider having a flow guide surface, when the fan is working, part of air driven by the fan directly flows to the heat dissipation device, and part of air driven by the fan flows to the heat dissipation device after flowing through the flow guide surface.

[0007] The power conversion device provided in the embodiments of the application has the following advantages: the flow divider is arranged between the fan and the heat dissipation device, the flow guide surface of the flow divider coincides with the projection of the fan along the air outlet direction, part of air driven by the fan can flow to the heat dissipation device and the non-coinciding area of the fan along the air outlet direction along the flow guide surface; at the same time, the projection of the fan partially coincides with the flow guide surface, that is, part of the projection of the fan does not coincide with the flow guide surface, part of air driven by the fan can directly flow to the heat dissipation device and the coinciding area of the fan along the air outlet direction, so that part of air driven by the fan can flow into the heat dissipation device and the coinciding area and the non-coinciding area of the fan along the air outlet direction, a large amount of air can flow through the coinciding area and the non-coinciding area of the fan along the air outlet direction, all heat dissipation channels in the heat dissipation device flow into air, which is beneficial to ensuring that the air speed and the air volume distribution flowing into the entire heat dissipation device are uniform and no airless area exists, the air outlet volume of the fan is maximally utilized, the fan can dissipate heat to the entire area of the heat dissipation device, and the heat dissipation effect of the heat dissipation device is improved.

[0008] In a possible implementation manner, the fan cover has a back plate arranged opposite to the housing, one side edge of the flow guide surface is in sealing connection with the back plate, and the flow guide surface and the outer wall surface of the housing have a first spacing space therebetween, and when the fan is working, part of air driven by the fan directly flows to the heat dissipation device through the first spacing space. The one side edge of the flow guide surface is in sealing connection with the back plate, so that part of air driven by the fan when the fan is working can be prevented from flowing out from the side of the flow guide surface away from the housing, and it is ensured that part of air driven by the fan can only flow through the first spacing space into the coinciding area of the fan along the air outlet direction and the heat dissipation device, so that the heat dissipation efficiency of the heat dissipation device is improved.

[0009] In a possible implementation manner, the flow distributor has a wind collecting surface, the wind collecting surface and the shell are arranged in parallel, one side edge of the wind collecting surface is connected to an edge of the shell on one side, and the height of the heat dissipation device in the direction from the back plate to the shell is the same as the height of the wind collecting surface from the shell. The wind collecting surface and the shell are arranged in parallel, and a second spacing space is arranged between the wind collecting surface and the shell, air flowing out of the first spacing space enters the second spacing space and flows along the wind collecting surface; wherein the height of the heat dissipation device in the direction from the back plate to the shell is the same as the height of the wind collecting surface from the shell, air flowing out of the second spacing space can enter the overlapping area of the heat dissipation device and the fan in the air outlet direction, and air flowing out of the second spacing space cannot flow into the space above the overlapping area of the heat dissipation device and the fan in the air outlet direction, thereby improving the overall heat dissipation effect of the heat dissipation device.

[0010] In a possible implementation manner, the number of the flow guide surfaces is at least two, the at least two flow guide surfaces are arranged in an inclined manner, the number of the areas outside the overlapping area of the heat dissipation device and the fan is at least two and is located on both sides of the flow distributor, and when the fan is working, the fan drives part of the air to flow to the two areas outside the overlapping area of the heat dissipation device and the fan through the at least two flow guide surfaces. The overlapping area of the heat dissipation device and the fan in the air outlet direction can be located in the middle area of the heat dissipation device, part of the air driven by the fan when the fan is working can directly blow to the overlapping area, part of the air driven by the fan when the fan is working can flow through the two flow guide surfaces and flow to the two non-overlapping areas on both sides, and the air driven by the fan when the fan is working can be evenly dispersed in the length direction of the heat dissipation device, so that the heat dissipation device with a relatively long length can be cooled by one fan.

[0011] In a possible implementation manner, the power conversion device comprises a first partition plate, the fan cover has a first side plate, the air inlet is arranged on the first side plate, the first partition plate is located between the heat dissipation device and the first side plate, two sides of the first partition plate are respectively a first air duct and a second air duct, and a third spacing space is arranged between the first partition plate and the back plate of the fan cover; when the fan is working, part of the air driven by the fan directly flows to the heat dissipation device through the first air duct, and part of the air driven by the fan flows to the second air duct and the heat dissipation device through the third spacing space after flowing through the flow guide surface.

[0012] The first partition plate prevents the air flowing through the first spacing space from entering the second air duct, thereby increasing the air volume in the first air duct and preventing too much air driven by the fan from flowing into the non-overlapping area of the heat dissipation device and the fan in the air outlet direction, which is beneficial to the distribution of the air volume for cooling and ventilating the overlapping area and the non-overlapping area of the heat dissipation device and the fan in the air outlet direction.

[0013] In a possible implementation manner, the projection overlapping area of the heat dissipation device and the fan and the projection of the first air duct along the air outlet direction at least partially overlap, and the area outside the projection overlapping area of the heat dissipation device and the fan and the projection of the second air duct along the air outlet direction at least partially overlap. The air flowing out of the first air duct all enters the heat dissipation channel of the heat dissipation device through the projection overlapping area of the heat dissipation device and the fan, and the air flowing out of the second air duct all enters the heat dissipation channel of the heat dissipation device through the area outside the projection overlapping area of the heat dissipation device and the fan.

[0014] In a possible implementation manner, the partition plate includes a second partition plate, the first partition plate and the second partition plate are located on two sides of the flow divider, the first air duct is arranged between the first partition plate and the second partition plate, the second air duct is arranged on a side of the first partition plate opposite to the first air duct, the third air duct is arranged on a side of the second partition plate opposite to the first air duct, and the second partition plate and the back plate of the fan cover have a fourth spacing space; when the fan works, the fan drives part of the air to flow to the third air duct and the heat dissipation device through the fourth spacing space after the air flows through the guide surface.

[0015] When the fan works, the fan drives part of the air to flow to the third air duct and the heat dissipation device through the fourth spacing space after the air flows through the guide surface. The two sides of the second partition plate are respectively the first air duct and the third air duct, the first air duct is located between the first partition plate and the second partition plate, and part of the air driven by the fan can flow to the second air duct and the third air duct along the guide surface, thereby preventing the air flowing through the first air duct from directly entering the third air duct, and ensuring that the air driven by the fan dissipates heat in the projection overlapping area of the heat dissipation device and the fan.

[0016] In a possible implementation manner, the area outside the projection overlapping area of the heat dissipation device and the fan and the projection of the second air duct along the air outlet direction partially overlap, and the area outside the projection overlapping area of the heat dissipation device and the fan and the projection of the third air duct along the air outlet direction partially overlap.

[0017] In a possible implementation, the heat dissipation device includes a heat sink and an inductor box, and the power conversion device includes an inductor, which is accommodated in a space enclosed by the inductor box; the power conversion device includes a barrier, which is arranged in the heat dissipation cavity, and two sides of the barrier are respectively a first heat dissipation channel and a second heat dissipation channel, the heat sink is accommodated in the first heat dissipation channel, the inductor box is accommodated in the second heat dissipation channel, and the first heat dissipation channel and the second heat dissipation channel are communicated at a side close to the fan; when the fan works, the fan drives part of the air to flow through the first air duct and the first heat dissipation channel in sequence, and the air flows through the guide surface and then flows to the second air duct and the second heat dissipation channel through the third spacing space. The power conversion device provided in the embodiment of the present application can guide the air driven by the fan to flow through the guide member, increase the flow area of the air driven by the fan, simultaneously dissipate heat for the heat sink and the inductor box, improve the utilization rate of the air driven by the fan, and improve the heat dissipation efficiency of the heat sink and the inductor box.

[0018] In a possible implementation, the fan cover has a back plate arranged opposite to the shell, the back plate includes a first back plate, a second back plate and a third back plate, a space between the first back plate and the shell accommodates the fan and the guide member, and spaces between the second back plate and the third back plate and the shell accommodate the heat dissipation device; the second back plate is obliquely connected between the first back plate and the third back plate, and the height of the first back plate from the shell is greater than the height of the third back plate from the shell. The height of the fan is higher than the height of the heat dissipation device, so that the air driven by the fan at a lower part can flow to the heat dissipation device through the guide member at the lower part, and the air driven by the fan at an upper part can flow through the guide member and be guided to two sides of the guide member; the heights of the first back plate and the third back plate can match the heights of the fan and the heat dissipation device, the height of the third back plate is consistent with the height of the heat dissipation device, the heat dissipation device can be connected to the third back plate in a pasting manner, all the air passing through the heat dissipation cavity passes through the heat dissipation device, and the heat dissipation efficiency of the heat dissipation device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is an external schematic view of a power conversion device;

[0020] Figure 2 is a structural schematic view in a heat dissipation cavity of a power conversion device;

[0021] Figure 3 is a structural schematic view in a power cavity of a power conversion device;

[0022] Figure 4 is a schematic view of matching air directions of a fan and a heat dissipation device in a power conversion device;

[0023] Figure 5 is a schematic diagram of an external structure of a power conversion device provided by an embodiment of the present application Figure 1 ;

[0024] Figure 6 is a schematic diagram of an A-A cross section of the power conversion device in Figure 5 ;

[0025] Figure 7 is a schematic diagram of an internal structure of a heat dissipation cavity of a power conversion device provided by an embodiment of the present application

[0026] Figure 8 is a schematic diagram of a fan, a flow dividing member, and a heat dissipation device of a power conversion device provided by an embodiment of the present application

[0027] Figure 9 is a schematic diagram of an external structure of a power conversion device provided by an embodiment of the present application Figure 2 ;

[0028] Figure 10 is a schematic diagram of an internal structure of a heat dissipation cavity of a power conversion device provided by an embodiment of the present application

[0029] Figure 11 is a schematic diagram of a flow dividing member and a fan of a power conversion device provided by an embodiment of the present application Figure 1 ;

[0030] Figure 12 is a schematic diagram of a flow dividing member and a fan of a power conversion device provided by an embodiment of the present application Figure 2 ;

[0031] Figure 13 is a schematic diagram of a flow collecting plate of a power conversion device provided by an embodiment of the present application

[0032] Figure 14 is a schematic diagram of a flow collecting surface of a power conversion device provided by an embodiment of the present application

[0033] Figure 15 is a schematic diagram of a flow dividing member of a power conversion device provided by an embodiment of the present application Figure 1 ;

[0034] Figure 16 is a schematic diagram of a flow dividing member of a power conversion device provided by an embodiment of the present application Figure 2 ;

[0035] Figure 17 is a schematic diagram of a partition plate of a power conversion device provided by an embodiment of the present application Figure 1 ;

[0036] Figure 18 is a structure diagram of a partition plate in a power conversion device provided by the embodiment of the present application Figure 2 ;

[0037] Figure 19 is a structure diagram of a partition plate in a power conversion device provided by the embodiment of the present application Figure 3 ;

[0038] Figure 20 is a structure diagram of a radiator and an inductor box in a power conversion device provided by the embodiment of the present application Figure 1 ;

[0039] Figure 21 is a structure diagram of a power conversion device provided by the embodiment of the present application Figure 3 ;

[0040] Figure 22 is a structure diagram of a radiator and an inductor box in a power conversion device provided by the embodiment of the present application Figure 2 ;

[0041] Figure 23 is a matching diagram of two fans and two shunts in a power conversion device provided by the embodiment of the present application

[0042] Figure 24 is a structure diagram of a fan located at one side of a first side plate in a power conversion device provided by the embodiment of the present application Figure 1 ;

[0043] Figure 25 is a structure diagram of a fan located at one side of a first side plate in a power conversion device provided by the embodiment of the present application Figure 2 ;

[0044] Figure 26 is a structure diagram of a radiator provided by the embodiment of the present application

[0045] Figure 27 is a B-B section view diagram in Figure 26 ;

[0046] Figure 28 is a structure diagram of an inductor box provided by the embodiment of the present application

[0047] Figure 29 is a connection diagram of an inductor box and a power device provided by the embodiment of the present application

[0048] Figure 30 is a side section view of an inverter provided by the embodiment of the present application

[0049] Figure 31Another side sectional view of the inverter provided for the embodiment of the present application;

[0050] Figure 32 A top view structural schematic diagram of the inverter provided for the embodiment of the present application;

[0051] Figure 33 to Figure 35 Several structural schematic diagrams of the flow divider in the embodiment of the present application;

[0052] Figure 36 A top view structural schematic diagram of the flow divider in the embodiment of the present application;

[0053] Figure 37 A top view structural schematic diagram of the flow divider in the embodiment of the present application;

[0054] Figure 38 A top view structural schematic diagram of the flow divider in the embodiment of the present application;

[0055] Figure 39 A side sectional view of the inverter provided for the embodiment of the present application;

[0056] Figure 40 A top view structural schematic diagram of the inverter provided for the embodiment of the present application;

[0057] Figure 41 A top view structural schematic diagram of the inverter provided for the embodiment of the present application.

[0058] Reference numerals:

[0059] Power conversion device 10, housing 100, power cavity 110, circuit board 120, power device 121, heat generating electronic device 122;

[0060] Fan cover 200, heat dissipation cavity 210, first air duct 2121, second air duct 2122, third air duct 2123, first heat dissipation passage 210a, second heat dissipation passage 210b, first side plate 220, air inlet 221, second side plate 230, back plate 250, first back plate 251, second back plate 252, third back plate 253, fourth back plate 254, baffle 260;

[0061] Heat dissipation device 300, windward surface 310, first region 311, second region 312, heat sink 320, heat exchange plate 321, first fin 322, first heat dissipation air duct 323, inductance box 330, inductance box body 331, second fin 332, second heat dissipation air duct 333, electric connection wire 334;

[0062] Fan 400;

[0063] Splitter 500, first splitter 500a, second splitter 500b, guide surface 510, first guide surface 511, second guide surface 512, wind collecting surface 520, wind collecting plate 530;

[0064] First partition plate 610, second partition plate 620;

[0065] Barrier 700;

[0066] First interval space 810, second interval space 820, third interval space 830, fourth interval space 840. DETAILED DESCRIPTION

[0067] The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0068] For the convenience of understanding, the English abbreviations and related technical terms involved in the embodiments of the present application will be explained and described below.

[0069] It should be clear that the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0070] The terms used in the embodiments of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application. The singular forms "a", "an" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0071] It should be understood that the term "and / or" used herein is only to describe the same field of associated objects, which means that there can be three relationships, for example, A and / or B can represent: A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are a "or" relationship.

[0072] It should be understood that "first", "second", etc. used in the present application are only used for the purpose of distinguishing the description, and cannot be understood as indicating or implying relative importance, nor can it be understood as indicating or implying order.

[0073] In the description of the present application, the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0074] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or abutting connection or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0075] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0076] The power conversion device provided by the present application can include at least one of an inverter, a direct current converter (DC-DC), a charging module and a charging pile. The inverter is an electronic device that converts direct current (DC) power into alternating current (AC) power, and is widely used in renewable energy fields such as solar power generation and wind power generation. The inverter can be a photovoltaic inverter, which is used in series connection with a photovoltaic panel group. The photovoltaic inverter can convert the variable direct current voltage of the photovoltaic panel into a mains frequency alternating current.

[0077] Referring to Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the power conversion device 10 described in this application takes an inverter as an example. The inverter can adopt a compartmentalized design, divided into a power compartment and a heat dissipation compartment. In one embodiment, the power compartment is a sealed cavity, meaning it is not connected to the external space of the power compartment to prevent dust and moisture from the external space from entering the power compartment and to protect the components inside the power compartment; the heat dissipation compartment can be an open cavity. Electronic components are installed in the power compartment, and a heat dissipation device is installed in the heat dissipation compartment. A fan 400 can be installed in the heat dissipation compartment to dissipate heat by blowing or drawing air from the components inside the heat dissipation compartment. In this embodiment, the heat dissipation of the power compartment inside the inverter chassis mainly relies on the heat exchange between the heat dissipation device and the electronic components inside the heat dissipation compartment, as well as heat exchange between the casing wall and the external air. For example, by installing a fan 400 and a heat dissipation device 300 in the heat dissipation compartment, the air flowing out or drawn by the fan 400 can dissipate heat from the heat dissipation device 300, thereby enabling the heat dissipation device 300 to continuously exchange heat with the electronic components and improving the heat exchange efficiency.

[0078] See Figure 4 As shown, the length direction of the heat dissipation device 300 is parallel to... Figure 1 In the X direction, due to the large length of the heat dissipation device 300 and the limited air outlet area of ​​the fan 400, the airflow is relatively concentrated. This results in a large airflow in some areas of the heat dissipation device 300 projected along the air outlet direction, while the airflow in other areas is small, leading to poor heat dissipation and even the creation of airless zones on the heat dissipation device 300. Furthermore, when there are multiple fans 400, and the spacing between adjacent fans 400 along the X and opposite X directions is large, the problem of large airflow in some areas and small airflow in others on the heat dissipation device 300 also occurs. Multiple fans 400 can be installed in the heat dissipation cavity, spaced apart along the length of the heat dissipation device 300, so that the fans 400 can dissipate heat from the entire area of ​​the heat dissipation device. However, in some devices, the airflow and velocity of a single fan are sufficient to meet the heat dissipation requirements of the heat dissipation device. Increasing the number of fans 400 to increase the air outlet area may cause the total airflow and velocity to exceed the heat dissipation capacity requirements of the heat dissipation device, resulting in wasted fan capacity and increased cost of the power conversion equipment 10.

[0079] To solve the above problems, maximize the utilization of the air volume of the fan 400, and reduce the cost of the power conversion device 10, this application provides a power conversion device 10. This application uses the example of setting a single fan 400 in the heat dissipation cavity for heat dissipation. It can be understood that the power conversion device 10 provided by this application is also applicable to the case of setting multiple fans 400 in the heat dissipation cavity for heat dissipation.

[0080] See Figure 5 , Figure 6, Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, the power conversion device 10 described in this embodiment includes a housing 100, a fan shroud 200, a circuit board 120, a heat dissipation device 300, a fan 400, and a shunt component 500. The housing 100 encloses a power cavity 110, which is a sealed cavity. The circuit board 120 can be installed in the power cavity 110, wherein the circuit board 120 can be parallel to the back plate of the housing 100 (the plate located on the Z-opposite side of the housing 100), and at least one side of the circuit board 120 in the Z direction and the Z-opposite direction can be used to mount devices. In one embodiment, components can be mounted on both sides of the circuit board 120 in the Z direction and the Z-opposite direction, including power devices 121 and heat-generating electronic devices 122. Figure 5 An overall diagram of a power conversion device is shown. Figure 7 Compared to Figure 5 The backplate 250 of the fan cover 200 on the opposite side of the Z direction is not shown to better show the structure inside the heat dissipation cavity 210.

[0081] In one embodiment, see [reference] Figure 3 and Figure 5 As shown, circuit board 120 can be installed within power cavity 110, and components can be installed on both sides of circuit board 120. Power devices 121 can be installed on one side of circuit board 120, and heat-generating electronic devices 122 can be installed on the other side. (It should be noted that heat-generating electronic devices 122 refer to heat-generating devices that cannot be directly attached to a heat sink substrate or other heat dissipation devices, and have certain heat dissipation requirements. Compared to some low-protection devices, heat-generating electronic devices 122 have relatively low operating heat resistance and need to be cooled to a relatively low temperature to operate and maintain a certain service life.) Power devices 121 and heat-generating electronic devices 122 are respectively installed on opposite sides of circuit board 120. In one embodiment, power devices 121 may include IGBTs, power MOSFETs, gallium nitride enhancement-mode HEMTs, power discrete components, protection switches, silicon drivers, gallium nitride drivers, IGBT modules, and intelligent power modules (IPMs), etc. Heat-generating electronic devices 122 may include film capacitors, relays, electrolytic capacitors, optocouplers, resistors, common-mode inductors, L2 inductors, Hall effect sensors, surge protectors, and PCBs, etc. The heat generated by the electronic device 122 is directly discharged into the power cavity, which leads to high temperature inside the power cavity. Electrolysis and other components in these devices need to operate at lower temperatures (e.g., below 75 degrees Celsius) to ensure long-term reliability and lifespan.

[0082] The outer walls of the shroud 200 and the housing 100 together form a heat dissipation cavity 210. (See also...)Figure 7 As shown, the back plate of the housing 100 (the plate located on the Z-direction side of the housing 100) forms a heat dissipation cavity 210 by enclosing the outer wall surface on the side opposite to the power cavity 110 and the fan shroud 200. The back plate of the housing 100 can be a flat plate, or a curved plate or other regular or irregular plate-like structure.

[0083] In one embodiment, the housing 100 can be a hollow structure, and the housing 100 encloses a sealed power cavity 110. The fan shroud 200 and the housing 100 can be two independent parts. For example, when it is a metal plate, it can be sealed by welding, and when it is a non-metallic plate such as plastic, it can be sealed by adhesive, so as to form a relatively sealed power cavity 110 and heat dissipation cavity 210. The power cavity 110 and the heat dissipation cavity 210 are sealed and isolated, and air in the heat dissipation cavity 210 will not flow into the power cavity 110.

[0084] The power conversion device 10 also includes a heat dissipation device 300, see reference. Figure 6 and Figure 7 As shown, the heat dissipation device 300 is located within the heat dissipation cavity 210. Airflow within the heat dissipation cavity 210 can pass through the heat dissipation device 300, allowing for contact heat exchange and cooling. The heat dissipation device 300 can be a radiator 320 (in this embodiment, the heat dissipation device 300 only includes the radiator 320). The radiator 320 can be thermally connected to the power device 121. This thermal connection refers to the connection method by which the power device 121 transfers heat to the radiator 320; it can be a contact connection or an intermittent connection. Specifically, when the temperatures of both the power device 121 and the radiator 320 are stable, an increase in the temperature of the power device 121 will cause the temperature of the radiator 320 to rise, and the outward heat radiation from the radiator 320 will also increase accordingly.

[0085] Among them, see Figure 26 and Figure 27 As shown, the heat sink 320 may include a heat exchange plate 321 and first fins 322. The heat exchange plate 321 may be made of a metal plate with high thermal conductivity, such as an aluminum plate. The heat exchange plate 321 may be a flat plate, or its shape may be designed to match the shape of the attached power device 121; this application does not impose a specific limitation. The first fins 322 stand upright on one side of the heat exchange plate 321, and the number of first fins 322 may be at least two, for example, 30. The 30 first fins 322 are spaced apart along the length direction of the heat exchange plate 321 (the spacing direction is not limited; this embodiment only uses the length direction as an example) to form a first heat dissipation channel 323 between two adjacent first fins 322. The first fins 322 are parallel to each other, so that all the first heat dissipation channels 323 in the heat sink 320 extend in the same direction. See reference. Figure 26 and Figure 27As shown, the first heat dissipation air duct 323 can extend along the Y direction, and the fan drives air to flow through the first heat dissipation air duct 323 when working, and the air in the first heat dissipation air duct 323 can flow along the Y direction to take away the heat of the first fin 322, so as to reduce the temperature of the heat sink 320, thereby reducing the heat of the power device installed on the circuit board, and achieving the effect of heat dissipation. The first fin 322 can be in an integrated structure with the heat exchange plate 321. The integrated structure can refer to an integrated plastic molding, or a structure that an entire aluminum block is turned to form the heat sink 320. The first fin 322 can also be in a connected structure with the heat exchange plate 321, for example, fixed and connected by screws or the like.

[0086] In an embodiment, referring to Figure 6 and Figure 25 As shown, the back plate of the shell 100 can be provided with a through hole, and part of the heat sink 320 can pass through the through hole and contact the power device 121 in the power cavity 110. The inner wall of the through hole is in close contact with the heat sink 320, for example, the side wall of the heat exchange plate 321 is in sealing contact with the inner wall of the through hole, so as to ensure that the power cavity 110 is a sealed cavity. The first fin 322 of the heat sink 320 is arranged in the heat dissipation cavity 210, and the power device 121 on the circuit board 120 in the power cavity 110 can conduct heat to the heat sink 320, and the heat sink 320 conducts heat to the heat dissipation cavity 210, and the fan 400 arranged in the heat dissipation cavity 210 performs heat dissipation.

[0087] In an embodiment, the heat sink 320 can be located entirely in the heat dissipation cavity 210, and the power device 121 installed on the circuit board 120 in the power cavity 110 can pass through the through hole and contact the heat sink 320 in the heat dissipation cavity 210, so as to realize the heat conduction contact between the heat sink 320 and the power device 121, and the power device 121 can transfer heat to the heat sink 320. In this embodiment, the size of the through hole can be the same as that of the power device 121, and the inner wall of the through hole is sealingly connected with the power device 121, so as to realize the sealing connection between the power cavity 110 and the heat dissipation cavity 210.

[0088] In an embodiment, the power device 121 is located between the circuit board 120 and the heat sink 320, and the power device 121 is installed on the side of the circuit board 120 in the opposite direction of the Z direction and is in contact with the heat sink 320 passing through the through hole. The heat generated by the power device 121 can be directly transferred to the heat sink 320, and the heat is conducted out by the heat sink 320 for heat dissipation. The heat generating electronic device 122 is installed on the side of the circuit board 120 in the Z direction, and the heat generating electronic device 122 exchanges heat with the air medium in the power cavity 110 on one hand, and is cooled by the heat exchanger; on the other hand, the heat generating electronic device 122 can exchange heat with the circuit board 120, and the heat is transferred to the heat sink 320 by the power device 121 for heat dissipation.

[0089] The fan 400, the flow divider 500 and the heat sink 320 are arranged in the heat dissipation cavity 210, and the fan 400, the flow divider 500 and the heat sink 320 are arranged in sequence along the Y direction, and the heat sink 320 is in heat conduction connection with the power device 121. Referring to Figure 7 、 Figure 8 、 Figure 10 and Figure 11 , the flow divider 500 coincides with the projection part of the fan 400 along the air outlet direction (consistent with the Y direction in Figure 10 ), the flow divider 500 has a flow guide surface 510, and when the fan 400 works, the fan 400 drives part of the air to directly flow to the heat sink 320, and the fan 400 drives part of the air to flow to the heat sink 320 after flowing through the flow guide surface 510.

[0090] Referring to Figure 7 、 Figure 8 、 Figure 10 and Figure 11 , the flow divider 500 is arranged between the fan 400 and the heat sink 320, the flow divider 500 has a flow guide surface 510, and the flow guide surface 510 is inclined to the air outlet direction of the fan 400. When the fan 400 works, the fan 400 drives part of the air to directly flow to the heat dissipation device 300, and the fan 400 drives part of the air to flow to the heat dissipation device 300 after flowing through the flow guide surface 510.

[0091] Referring to Figure 7 、 Figure 8 、 Figure 10 and Figure 11 , the heat sink 320 has a windward surface 310 facing the fan 400, the windward surface 310 is the side surface of the heat sink 320 on the side of the Y direction (it should be noted that the side surface of the heat sink 320 on the side of the Y direction includes the side surface of the fin on the side of the Y direction and the interval space between the adjacent two fins), and the projection area of the fan 400 on the windward surface 310 along the air outlet direction of the fan 400 is a first area 311, and the area outside the first area 311 on the windward surface 310 is a second area 312. That is, the windward surface 310 has the first area 311 and the second area 312 adjacent to each other, wherein the projection of the fan 400 on the windward surface 310 along the air outlet direction covers the first area 311, and the area outside the projection of the fan 400 on the windward surface 310 along the air outlet direction is the second area 312.

[0092] Part of the air driven by the fan 400 directly flows to the first area 311, and part of the air driven by the fan 400 flows to the second area 312 along the flow guide surface 510. Referring to Figure 7 and Figure 10As shown in the figure, the air outlet direction of the fan 400 is the Y direction, the projection of the fan 400 along the Y direction partially overlaps the guide surface 510, the guide surface 510 is inclined to the Y direction, so that a part of the air flowing out of the fan 400 can contact the guide surface 510, and the air contacting the guide surface 510 flows along the guide surface 510 to the second area 312.

[0093] The power conversion device 10 described in the embodiments of the present application sets a flow dividing piece 500 between the fan 400 and the radiator 320, the flow dividing piece 500 has a guide surface 510, the guide surface 510 partially overlaps the projection of the fan 400 along the air outlet direction, as shown in the figure, Figure 7 and Figure 10 As shown in the figure, the projection of the fan 400 on the XZ plane partially overlaps the guide surface 510, a part of the air driven by the fan 400 when working can flow along the guide surface 510 to the second area 312; at the same time, the projection of the fan 400 on the XZ plane partially overlaps the guide surface 510, that is, the part of the projection of the fan 400 on the XZ plane does not overlap the guide surface 510, a part of the air driven by the fan 400 when working can directly flow along the air outlet direction to the first area 311, so that a part of the air driven by the fan 400 when working can be dispersed to flow into the first area 311 and the second area 312, the first area 311 and the second area 312 can both flow a large amount of air, all the heat dissipation channels in the radiator 320 flow in air, which is conducive to ensuring that the air speed and air volume distribution flowing into the entire windward surface 310 are uniform, and no windless area appears, the air outlet amount of the single fan 400 is maximized, the fan 400 can dissipate heat to the entire area of the radiator 320, and the heat dissipation effect of the radiator 320 is improved.

[0094] In an embodiment, as shown in the figure, Figure 10 The flow dividing piece 500 can be a flow dividing plate, and the outer wall surface of the flow dividing plate on the side facing the fan 400 is the guide surface 510. The greater the area of the guide surface 510 overlapping the projection of the fan 400 along the air outlet direction, the greater the air volume driven by the fan 400 when working and flowing along the guide surface 510 to the two sides of the flow dividing piece 500, the air volume flowing into the first area 311 and the second area 312 of the radiator 320 can be adjusted by adjusting the area of the guide surface 510 overlapping the projection of the fan 400 along the air outlet direction, and the shape of the flow dividing piece 500 can be designed according to the heat size and heat distribution of the radiator 320 when the power conversion device 10 is prepared.

[0095] In an embodiment, the flow dividing plate can be connected with the inner wall surface of the back plate 250 of the fan cover 200 to fix the flow dividing plate between the fan 400 and the radiator 320.

[0096] In an embodiment, as shown in the figure, Figure 7 ,Figure 8 and Figure 10 As shown in FIG. 4, the number of areas outside the projection of the heat sink 320 and the fan 400 is at least two and located on both sides of the flow divider 500. When the fan 400 is working, the fan 400 drives part of the air to flow to the two areas outside the projection of the heat sink 320 and the fan 400 through the at least two flow guide surfaces 510, and the fan 400 drives part of the air to flow to the two second areas 312 on both sides of the first area 311 through the at least two flow guide surfaces 510. The flow divider 500 includes a first flow divider 500a and a second flow divider 500b, both of which are flat plates. The first flow divider 500a has a first flow guide surface 511, and the second flow divider 500b has a second flow guide surface 512. Both the first flow guide surface 511 and the second flow guide surface 512 are flat surfaces, and part of the air driven by the fan 400 flows along the first flow guide surface 511 and the second flow guide surface 512, respectively.

[0097] The first flow guide surface 511 and the second flow guide surface 512 have an included angle, and the opening direction of the included angle is away from the fan 400. The range of the included angle is less than 180°. The first flow guide surface 511 and the second flow guide surface 512 are not parallel, and both the first flow guide surface 511 and the second flow guide surface 512 are inclined to the Y direction, so that the inclination direction of the first flow guide surface 511 and the second flow guide surface 512 is consistent with the air outlet direction of the fan 400, which is beneficial to achieving uniform distribution of the air flowing out of the fan 400 in the X direction and the X reverse direction while improving the wind speed flowing into the first area 311 and the second area 312, thereby improving the heat dissipation effect of the heat sink 320. The included angle between the first flow guide surface 511 and the second flow guide surface 512 and the YZ plane can be the same or different.

[0098] The greater the included angle between the first flow divider 500a and the second flow divider 500b, the longer the length of the first flow divider 500a and the second flow divider 500b extending in the X direction and the X reverse direction, so that the air driven by the fan 400 is dispersed more widely in the X direction and the X reverse direction. When the length of the first flow divider 500a and the second flow divider 500b extending in the X direction and the X reverse direction is constant, the longer the extension length of the first flow divider 500a and the second flow divider 500b in the Z direction, the more air driven by the fan 400 flows into the second area 312. In the preparation of the power conversion device 10, the shape, size and inclination angle of the first flow divider 500a and the second flow divider 500b can be designed according to the heat size and heat distribution of the heat sink 320, so as to distribute the air flow into the first area 311 and the second area 312 driven by the fan 400.

[0099] In an embodiment, the first and second flow distributors 500a and 500b can be one plate or two plates. The first and second flow distributors 500a and 500b can be connected or spaced apart.

[0100] In an embodiment, referring to Figure 12 Fig. 6, the flow distributor 500 can be a curved plate, and the flow guide surface 510 can be curved. The curvature of the flow distributor 500 bending in the Y direction and the length extending in the Z direction and the Z reverse direction can determine the air speed and air volume of the air driven by the fan 400 into the first region 311 and the second region 312. The shape, size and bending curvature of the flow distributor 500 can be designed according to the heat size and heat distribution of the heat sink 320, so as to adjust the air speed and air volume of the air driven by the fan 400 into the first region 311 and the second region 312. The flow guide surface 510 is curved, and the air driven by the fan 400 into both sides of the flow distributor 500 can gradually transition to flow in the Y direction, reducing the non-uniformity of the air flowing into the second region 312 in the X direction due to the excessive flow rate of the air flowing out of the flow guide surface 510, thereby improving the overall heat dissipation effect of the heat sink 320.

[0101] In some possible embodiments, referring to Figure 5 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 , the fan 400 can be located at the middle of the side plate on the Y reverse direction side of the fan cover 200, and the second region 312 of the heat sink 320 can be two and located on both sides of the first region 311. Referring to Figure 10 , when the fan 400 works, part of the air driven by the fan 400 flows in the X direction along part of the flow guide surface 510 to enter the second region 312 on one side; and the other part of the air flows in the X reverse direction along part of the flow guide surface 510 to enter the second region 312 on the other side.

[0102] In some possible embodiments, referring to Figure 8 , Figure 9 , Figure 10 and Figure 11 , the fan cover 200 includes a back plate 250, which is a plate body on the Z reverse direction side of the fan cover 200. The heat dissipation cavity 210 is located between the back plate 250 and the shell 100, and the flow guide surface 510 and the shell 100 have a first spacing space 810 therebetween.

[0103] The back plate 250 and the shell 100 are spaced apart along the Z direction, and the flow guide surface 510 can guide part of the air driven by the fan 400 to the second area 312. Part of the air driven by the fan 400 directly flows to the first area 311 of the radiator 320 after flowing through the first spacing space 810. Part of the air driven by the fan 400 flows to the second area 312 of the radiator 320 after flowing through the flow guide surface 510.

[0104] The edge of the flow guide surface 510 on the side opposite to the Z direction is sealingly connected to the back plate 250, so that part of the air driven by the fan 400 cannot flow out from the side of the flow guide surface 510 away from the shell 100, and part of the air driven by the fan 400 can only flow through the first spacing space 810 into the first area 311 of the radiator 320, thereby enhancing the heat dissipation efficiency of the heat dissipation channels of the radiator 320 into which air is introduced from the first area 311.

[0105] In some possible embodiments, in one embodiment, as shown in Figure 8 、 Figure 13 and Figure 14 , the flow distribution member 500 has a wind collecting surface 520, the wind collecting surface 520 is arranged parallel to the shell 100, one side edge of the wind collecting surface 520 is connected to the edge of the flow guide surface 510 on the side facing the shell 100, and the height of the radiator 320 along the direction from the back plate 250 to the shell 100 is the same as the height of the wind collecting surface 520 from the shell 100.

[0106] The wind collecting surface 520 is arranged parallel to the shell 100, and the wind collecting surface 520 and the shell 100 have the second spacing space 820 therebetween. The air flowing out of the first spacing space 810 enters the second spacing space 820 and flows along the wind collecting surface 520. The height of the radiator 320 along the direction from the back plate 250 to the shell 100 is the same as the height of the wind collecting surface 520 from the shell 100, the top surface of the radiator 320 on the side opposite to the Z direction coincides with the XY plane on which the wind collecting surface 520 is located, and the air flowing out of the second spacing space 820 can all enter the heat dissipation channels corresponding to the first area 311 of the radiator 320, so that the air flowing out of the second spacing space 820 cannot flow into the space above the first area 311 (since the height of the radiator needs to be smaller than the height of the fan due to the air volume distribution by the flow distribution member 500, and the flow distribution member 500 is located above the radiator 320), thereby improving the overall heat dissipation effect of the radiator 320.

[0107] In one embodiment, as shown in Figure 13 and Figure 14 , the flow distribution member 500 includes a wind collecting plate 530, the wind collecting plate 530 is fixedly connected to the first flow distribution member 500a and the second flow distribution member 500b, and the wind collecting surface 520 is a plate surface of the wind collecting plate 530 on the side facing the Z direction.

[0108] In one embodiment, referring to Figure 15 illustrated, the flow splitter 500 can be a flow splitter block, and the air collecting surface 520 and the flow guiding surface 510 are surfaces of the flow splitter block. The flow splitter block can be a tetrahedron, and in this case, the air collecting surface 520, the first flow guiding surface 511 and the second flow guiding surface 512 are all planar surfaces. Referring to Figure 16 illustrated, the flow splitter block can be a cylinder or a part of a cylinder, and in this case, the air collecting surface 520 can be a planar surface on the Z direction side of the flow splitter block, and the flow guiding surface 510 can be a curved side wall of the flow splitter block.

[0109] In some possible embodiments, referring to Figure 8 , Figure 17 and Figure 18 illustrated, the power conversion device includes a first partition plate 610, the shroud has a first side plate 220, the air inlet 221 of the shroud 200 is arranged on the first side plate 220, and a straight line where the shaft of the fan blade of the fan 400 rotates passes through the air inlet 221. When the fan 400 is working, the fan 400 drives air to flow in sequence along the air inlet 221, the fan 400, the heat dissipation cavity 210 and the air outlet (not labeled in the figure). The first partition plate 610 is located between the heat sink 320 and the first side plate 220, and the two sides of the first partition plate 610 are respectively a first air duct 2121 and a second air duct 2122. The first partition plate 610 and the back plate 250 of the shroud 200 (see Figure 8 ) have a third spacing space 830 therebetween.

[0110] When the fan 400 is working, the fan 400 drives part of the air to flow directly to the heat sink 320 after flowing through the first air duct 2121, and drives part of the air to flow to the second air duct 2122 and the heat sink through the third spacing space 830 after flowing through the flow guiding surface 510.

[0111] The first partition plate 610 is arranged in the heat dissipation cavity 210, wherein the first partition plate 610 is located on the X direction opposite side of the flow splitter 500 and on the Z direction side of the flow splitter 500. The Y direction opposite side of the first partition plate 610 can be attached to the inner wall of the first side plate 220, the Z direction side of the first partition plate 610 can be attached to the outer wall surface of the shell 100, the Y direction side of the first partition plate 610 can be attached to the windward surface of the heat sink 320, and the Z direction opposite side of the first partition plate 610 and the back plate 250 of the shroud 200 have the third spacing space 830 therebetween.

[0112] The first partition plate 610 has a first air duct 2121 and a second air duct 2122 on its two sides. The projection of the splitter 500 and the first air duct 2121 along the air outlet direction of the fan 400 overlaps. When the fan 400 is working, part of the air driven by it flows through the first air duct 2121 and then directly to the first region 311 of the radiator 320. Part of the air driven by the fan 400 flows through the flow guide surface 510 and then through the third partition space 830 to the second air duct 2122, and then through the second air duct 2122 to the second region 312 of the radiator 320. The first partition plate 610 prevents the air flowing through the first partition space 810 from entering the second air duct 2122, thereby increasing the airflow in the first air duct 2121 and preventing too much air driven by the fan 400 from flowing into the second region 312 of the radiator 320 through the flow guide surface 510. This is beneficial for the distribution of heat dissipation and ventilation between the first region 311 and the second region 312 of the radiator 320.

[0113] In one embodiment, the Y-direction side of the first partition plate 610 may have a certain gap with the inner wall of the first side plate 220, and / or the Z-direction side of the first partition plate 610 may have a certain gap with the outer wall of the housing 100, and / or the Y-direction side of the first partition plate 610 may have a certain gap with the windward side of the heat sink 320. The size of the first partition plate 610 can be used to adjust the distribution ratio of the air driven by the fan 400 into the first air duct 2121 and the second air duct 2122, and the size of the first partition plate 610 can be designed according to the airflow requirements of the air ducts.

[0114] In one embodiment, the overlapping area of ​​the projected images of the heat sink 320 and the fan 400 at least partially overlaps with the projection of the first air duct 2121 along the air outlet direction, and the area outside the overlapping area of ​​the projected images of the heat sink 320 and the fan 400 at least partially overlaps with the projection of the second air duct 2122 along the air outlet direction. In this embodiment, see [reference needed]. Figure 17 and Figure 18 As shown, the projection of the first air duct 2121 along the air outlet direction coincides with the first region 311, and the projection of the second air duct 2122 along the air outlet direction coincides with the second region 312. All the air flowing out of the first air duct 2121 enters the heat dissipation channel of the radiator 320 through the first region 311, and all the air flowing out of the second air duct 2122 enters the heat dissipation channel of the radiator 320 through the second region 312.

[0115] In one embodiment, see [reference] Figure 18As shown, the first partition plate 610 can be fixed integrally with the flow divider 500. The flow divider 500 is connected with the back plate 250 of the shroud 200, and the first partition plate 610 is connected with the inner wall surface of the first side plate 220 and the outer wall surface of the shell 100, so that the flow divider 500 and the first partition plate 610 are stably fixed in the heat dissipation cavity. Under the blowing of the air driven by the fan 400, the shaking degree of the first partition plate 610 and the flow divider 500 is reduced, the air guiding stability of the first partition plate 610 and the flow divider 500 is improved, and the noise generated by the shaking of the first partition plate 610 and the flow divider 500 is reduced.

[0116] In an embodiment, referring to Figure 18 As shown, the first partition plate 610 is connected with the outer wall surface of the shell 100 and the inner wall surface of the first side plate 220, and the first partition plate 610 and the flow divider 500 can be in a separated state, and there is no direct connection between the first partition plate 610 and the flow divider 500. When the first partition plate 610 or the flow divider 500 is replaced, it is not necessary to replace both at the same time.

[0117] In some possible implementations, referring to Figure 17 and Figure 18 As shown, the power conversion device further includes a second partition plate 620. The first partition plate 610 and the second partition plate 620 are located on two sides of the flow divider 500. The first partition plate 610 and the second partition plate 620 have a first air duct 2121 therebetween. The side of the first partition plate 610 opposite to the first air duct 2121 has a second air duct 2122. The side of the second partition plate 620 opposite to the first air duct 2121 has a third air duct 2123. The second partition plate 620 and the back plate 250 of the shroud 200 (see Figure 8 ) have a fourth spacing space 840 therebetween. When the fan 400 is working, part of the air driven by the fan 400 flows through the fourth spacing space 840 to the third air duct 2123 and the heat sink 320 after flowing through the flow guide surface 510. The two sides of the second partition plate 620 are respectively the first air duct 2121 and the third air duct 2123. The first air duct 2121 is located between the first partition plate 610 and the second partition plate 620. Part of the air driven by the fan 400 can flow along the flow guide surface 510 to the second air duct 2122 and the third air duct 2123 respectively.

[0118] The flow guide surface 510 includes a first flow guide surface 511 and a second flow guide surface 512. Part of the air driven by the fan 400 flows to the second air duct 2122 after flowing through the first flow guide surface 511. Part of the air driven by the fan 400 flows to the third air duct 2123 after flowing through the second flow guide surface 512. The air flowing out of the second air duct 2122 and the third air duct 2123 both flows to the second region 312 of the heat sink 320.

[0119] The second air duct 2122, the first air duct 2121 and the third air duct 2123 are sequentially adjacent, and the first partition plate 610 and the second partition plate 620 are both connected between the flow divider 500 and the shell 100, so that the air flowing out of the first interval space 810 cannot enter the second air duct 2122 and the third air duct 2123, thereby increasing the air volume in the first air duct 2121, preventing the air driven by the fan 400 from flowing into the second area 312 of the heat sink 320 through the flow guide surface 510, and facilitating the improvement of the heat dissipation efficiency of the first area 311 of the heat sink 320.

[0120] In an embodiment, as shown in Figure 17 and Figure 18 , the first partition plate 610 and the second partition plate 620 are both connected with the inner wall surface of the first side plate 220, and the first partition plate 610 and the second partition plate 620 are both connected with the side edge of the flow divider 500 close to the shell 100 in the Z direction. By adjusting the length of the first partition plate 610, the second partition plate 620 and the flow divider 500 in the Z direction, the air volume in the first air duct 2121, the second air duct 2122 and the third air duct 2123 can be adjusted.

[0121] In an embodiment, the length of the first partition plate 610 and the second partition plate 620 in the Z direction can be the same or different.

[0122] In an embodiment, the projection overlapping area of the heat sink 320 and the fan 400 and the projection of the first air duct 2121 in the air outlet direction at least partially overlap, and the area outside the projection overlapping area of the heat sink 320 and the fan 400 can have two, and respectively at least partially overlaps with the projection of the second air duct 2122 and the third air duct 2123 in the air outlet direction. In this embodiment, as shown in Figure 17 and Figure 18 , the projection of the first air duct 2121 in the air outlet direction overlaps the first area 311, the projection of the second air duct 2122 in the air outlet direction overlaps one of the second areas 312, and the projection of the third air duct 2123 in the air outlet direction overlaps the other second area 312. The air flowing out of the first air duct 2121 all enters the corresponding heat dissipation channel of the heat sink 320 through the first area 311, the air flowing out of the second air duct 2122 all enters the corresponding heat dissipation channel of the heat sink 320 through one of the second areas 312, and the air flowing out of the third air duct 2123 all enters the corresponding heat dissipation channel of the heat sink 320 through the other second area 312.

[0123] In an embodiment, as shown in Figure 17 and Figure 18As shown, the second partition plate 620 can be fixed integrally with the flow distributor 500. The flow distributor 500 is connected with the back plate 250 of the shroud 200, the second partition plate 620 is connected with the inner wall surface of the first side plate 220 and the outer wall surface of the housing 100, and the second partition plate 620 is fixedly connected with the flow distributor 500 or in an integral structure, so that the flow distributor 500 and the second partition plate 620 are stably fixed in the heat dissipation cavity. Under the driving of the fan 400, the shaking degree of the second partition plate 620 and the flow distributor 500 is reduced, the air guiding stability of the second partition plate 620 and the flow distributor 500 is improved, and the noise generated by the shaking of the second partition plate 620 and the flow distributor 500 is reduced.

[0124] In an embodiment, the Y direction side of the second partition plate 620 can have a certain gap with the inner wall of the first side plate 220, and / or the Z direction side of the second partition plate 620 can have a certain gap with the outer wall surface of the housing 100, and / or the Y direction side of the second partition plate 620 can have a certain gap with the windward surface of the heat sink 320. The size of the second partition plate 620 can be used to adjust the distribution ratio of the air driven by the fan 400 into the first air duct 2121 and the third air duct 2123, and the size of the second partition plate 620 can be designed according to the air volume demand of the air duct.

[0125] In an embodiment, referring to Figure 19 As shown, the first partition plate 610 and the second partition plate 620 are connected with the inner wall surface of the housing 100 and the inner wall surface of the first side plate 220, and at least one of the first partition plate 610 and the second partition plate 620 can be in a separated state with the flow distributor 500 (in this embodiment, the first partition plate 610 and the second partition plate 620 are in a separated state with the flow distributor 500), and the first partition plate 610 and the second partition plate 620 are not directly connected with the flow distributor 500, so that the first partition plate 610, the second partition plate 620 or the flow distributor 500 does not need to be replaced at the same time.

[0126] In some possible embodiments, referring to Figure 20 As shown, the heat dissipation device 300 includes a heat sink 320 and an inductor box 330, and the heat sink 320 and the inductor box 330 are accommodated in the heat dissipation cavity 210.

[0127] Referring to Figure 28 and Figure 26As shown, the inductor box 330 is an internal hollow structure, and the inductor is arranged inside. The inductor box 330 can be arranged in the heat dissipation cavity 210, and the cavity in the inductor box 330 and the heat dissipation cavity 210 are in a sealed and isolated structure. The inductor box 330 includes an inductor box body 331 and a second fin 332 arranged on the inductor box body 331. The second fin 332 is arranged on the upper wall surface of the inductor box body 331, and the second fin 332 can increase the contact area between the outer wall surface of the inductor box 330 and the heat dissipation cavity 210, and improve the heat dissipation efficiency of the inductor box 330. The number of the second fin 332 can be at least two, and the second fin 332 has a second heat dissipation air duct 333 between adjacent two second fins 332. The second fin 332 can be a parallel structure, so that the second heat dissipation air duct 333 on the inductor box 330 can extend in the Y direction. The extension direction of the second heat dissipation air duct 333 is the same as the extension direction of the first heat dissipation air duct 323, and the gas flowing in the Y direction in the heat dissipation cavity 210 can simultaneously cool the heat sink 320 and the inductor box 330. Wherein, the inductor box 330 and the heat sink 320 can be arranged in the X direction, and the low-temperature medium in the heat dissipation cavity 210 can cool the heat sink 320 and the inductor box 330 respectively. The inductor in the inductor box 330 can be electrically connected with the power device 121 in the power cavity 110 through an electric connection line. The electric connection line can pass through one side plate of the shell 100, one end of which extends into the power cavity 110 and is electrically connected with the power device 121, and the other end extends into the inductor box 330 and is electrically connected with the inductor.

[0128] In one embodiment, referring to Figure 29 As shown, the inductor box 330 is an internal hollow structure, and the inductor is arranged inside. The inductor box 330 can be arranged in the heat dissipation cavity 210, and the cavity in the inductor box 330 and the heat dissipation cavity 210 are in a sealed and isolated structure. The inductor box 330 includes an inductor box body 331 and a second fin 332 arranged on the inductor box body 331. The second fin 332 is arranged on the upper wall surface of the inductor box body 331, and the second fin 332 can increase the contact area between the outer wall surface of the inductor box 330 and the heat dissipation cavity 210, and improve the heat dissipation efficiency of the inductor box 330. The number of the second fin 332 can be at least two, and the second fin 332 has a second heat dissipation air duct 333 between adjacent two second fins 332. The second fin 332 can be a parallel structure, so that the second heat dissipation air duct 333 on the inductor box 330 can extend in the Y direction. The extension direction of the second heat dissipation air duct 333 is the same as the extension direction of the first heat dissipation air duct 323, and the gas flowing in the Y direction in the heat dissipation cavity 210 can simultaneously cool the heat sink 320 and the inductor box 330. Wherein, the inductor box 330 and the heat sink 320 can be arranged in the X direction, and the low-temperature medium in the heat dissipation cavity 210 can cool the heat sink 320 and the inductor box 330 respectively. The inductor in the inductor box 330 can be electrically connected with the power device 121 in the power cavity 110 through an electric connection line. The electric connection line can pass through one side plate of the shell 100, one end of which extends into the power cavity 110 and is electrically connected with the power device 121, and the other end extends into the inductor box 330 and is electrically connected with the inductor.

[0129] Referring to Figure 20As shown, the embodiment takes two inductance boxes 330 as an example, and the two inductance boxes 330 are located on both sides of the heat sink 320. The width of the heat sink 320 in the X direction and the width of the flow divider 500 can be the same or different. Part of the air driven by the fan 400 can directly enter the heat dissipation channel of the heat sink 320 through the first spacing space 810 below (on the Z direction side) the flow divider 500. Part of the air driven by the fan 400 can be diverted to both sides through the flow divider 500 and flow into the spaces on both sides, respectively, and then flow into the spaces on both sides of the inductance boxes 330 to cool the inductance boxes 330 on both sides. The embodiment can make part of the air driven by the fan 400 directly cool the heat sink 320, and another part of the air can be diverted to both sides to cool the inductance boxes 330, thereby achieving effective cooling of the heat sink 320 and the inductance boxes 330 at the same time.

[0130] In an embodiment, the flow divider 500 can be provided with a first partition plate 610 and a second partition plate 620 on both sides, respectively, and the first partition plate 610 and the second partition plate 620 are provided with a first air duct 2121 therebetween, the first partition plate 610 is provided with a second air duct 2122 on the side opposite to the first air duct 2121, and the second partition plate 620 is provided with a third air duct 2123 on the side opposite to the first air duct 2121. By providing the first partition plate 610 and the second partition plate 620, the air flowing out of the first spacing space 810 cannot enter the second air duct 2122 and the third air duct 2123, thereby increasing the air volume in the first air duct 2121 and preventing most or all of the air driven by the fan 400 from flowing into the inductance boxes 330 through the flow guide surface 510, which is conducive to improving the heat dissipation efficiency of the heat sink 320.

[0131] In an embodiment, the size of the flow divider 500 can be adjusted to adjust the overlapping area between the flow divider 500 and the fan 400, so as to distribute the air volume of the air driven by the fan 400 into the heat sink 320 and the inductance boxes 330. The shape of the flow divider 500 can be designed according to the heat size and heat distribution of the heat sink 320 and the inductance boxes 330 to ensure that the heat sink 320 and the inductance boxes 330 have good heat dissipation effect.

[0132] In an embodiment, referring to Figure 22As shown, the power conversion device comprises a blocking piece 700 arranged in the heat dissipation cavity 210. The number of the blocking piece 700 is two, and the two blocking pieces 700 can be located on both sides of the heat sink 320 and between the heat sink 320 and the inductor box 330. The first heat dissipation passage 210a is between the two blocking pieces 700, the second heat dissipation passage 210b is on the side of the blocking piece 700 away from the first heat dissipation passage 210a, and the blocking piece 700 blocks the air flow between the first heat dissipation passage 210a and the second heat dissipation passage 210b, avoiding the direct flow of air between the first heat dissipation passage 210a and the second heat dissipation passage 210b. The heat sink 320 is accommodated in the first heat dissipation passage 210a, and the inductor box 330 is accommodated in the second heat dissipation passage 210b, so that the inductor box 330 and the heat sink 320 are in parallel heat dissipation, avoiding the heat transfer between the inductor box 330 and the heat sink 320 to affect the heat dissipation.

[0133] In an embodiment, the first heat dissipation passage 210a and the second heat dissipation passage 210b are communicated at the side close to the fan 400, so that the air flowing out of the fan 400 can enter the first heat dissipation passage 210a and the second heat dissipation passage 210b respectively.

[0134] In an embodiment, the blocking piece 700 is made of heat insulation material, or the surface of the blocking piece 700 has a heat insulation layer, reducing the heat exchange between the first heat dissipation passage 210a and the second heat dissipation passage 210b, avoiding the heat transfer of the heat sink 320 to the inductor box 330, affecting the heat dissipation of the inductor box 330.

[0135] When the fan 400 works, the fan 400 drives part of the air to flow through the first air duct 2121 and the first heat dissipation passage 210a in sequence to dissipate heat for the heat sink 320; the fan 400 drives part of the air to flow through the third interval space to the second air duct 2122 and one of the second heat dissipation passages 210b after flowing through the flow guide surface 510; the fan 400 drives part of the air to flow through the fourth interval space to the third air duct 2123 and the other second heat dissipation passage 210b after flowing through the flow guide surface 510.

[0136] In an embodiment, referring to Figure 18 and Figure 22As shown, the power conversion device is provided with a first partition plate 610 and a second partition plate 620, and the first partition plate 610 is located between the first air duct 2121 and the second air duct 2122, and the second partition plate 620 is located between the first air duct 2121 and the third air duct 2123. Two blocking pieces 700 can be fixedly connected with the first partition plate 610 and the second partition plate 620 respectively, so that the air flowing out of the fan 400 enters the second heat dissipation channel 210b on one side, the first heat dissipation channel 210a, and the second heat dissipation channel 210b on the other side of the third air duct 2123 after entering the second air duct 2122, the first air duct 2121 and the third air duct 2123, and cannot diffuse with each other, so as to avoid the heat transfer between the inductor box 330 and the heat sink 320 and affect heat dissipation.

[0137] In some possible embodiments, referring to Figure 9 and Figure 10 As shown, the shroud 200 includes a back plate 250, and the back plate 250 and the shell 100 are oppositely arranged, and the back plate 250 and the shell 100 are spaced apart to form a heat dissipation cavity 210. The back plate 250 includes a first back plate 251, a second back plate 252 and a third back plate 253. The space between the first back plate 251 and the shell 100 accommodates the fan 400 and the flow divider 500. The space between the second back plate 252 and the third back plate 253 and the shell 100 accommodates the heat sink 320.

[0138] The second back plate 252 is obliquely connected between the first back plate 251 and the third back plate 253, and the height of the first back plate 251 from the shell 100 is greater than the height of the third back plate 253 from the shell 100. That is, the second back plate 252 is connected between the first back plate 251 and the third back plate 253, and the average distance between the first back plate 251 and the shell 100 is greater than the average distance between the third back plate 253 and the shell 100, and the height of the fan 400 in the Z direction is greater than the average length of the heat sink 320 in the Z direction, so that the air flowing out of the fan 400 can be divided by the flow divider 500 in the Z direction of the heat sink 320.

[0139] In one embodiment, the first back plate 251 and the third back plate 253 are parallel to the XY plane, the second back plate 252 is connected between the first back plate 251 and the third back plate 253, and the second back plate 252 is inclined to the Z direction relative to the XY plane. In one embodiment, at least two of the first back plate 251, the second back plate 252 and the third back plate 253 have an included angle with the XY plane, the second back plate 252 is connected between the first back plate 251 and the third back plate 253, and the second back plate 252 is inclined to the Z direction relative to the XY plane.

[0140] In one embodiment, referring to Figure 21As shown, the height of the inductor box 330 can be greater than the height of the heat sink 320, so that the blocking piece 700 can be a partition plate with a height greater than the height of the heat sink 320. The back plate 250 further includes a fourth back plate 254, the number of the fourth back plate 254 can be two and located on both sides of the third back plate 253, and the second back plate 252 and the third back plate 253 are connected between the two fourth back plates 254. The fourth back plate 254 is connected with or the same as the first back plate 251, and the average distance between the fourth back plate 254 and the shell 100 can be equal to the average distance between the first back plate 251 and the shell 100.

[0141] In an embodiment, the average distance between the fourth back plate 254 and the shell 100 can also be greater or less than the average distance between the first back plate 251 and the shell 100, which can be determined according to the height of the inductor box 330, which is not limited in the present application. It should be emphasized that the height of the first back plate 251 can be designed according to the height of the shunt piece 500, the height of the third back plate 253 can be designed according to the height of the heat sink 320, and the height of the fourth back plate 254 can be designed according to the height of the inductor box 330. The second back plate 252 is inclinedly connected with the first back plate 251, the third back plate 253 and the fourth back plate 254.

[0142] In some possible implementations, referring to Figure 23 As shown, when the length of the heat sink in the X direction is relatively long, the number of the fans 400 is at least two, the number of the shunt pieces 500 is at least two, and the fan 400 and the shunt piece 500 are one-to-one arranged. The at least two fans 400 are arranged at intervals in the X direction, and a single shunt piece 500 uniformly distributes the air flowing out of a single fan 400 in the X direction and the X reverse direction, so that in the X direction, the single fan 400 can radiate heat to a larger area of the heat sink, thereby reducing the number of the fans 400 required in the power conversion device 10, which is conducive to reducing the cost of the power conversion device 10.

[0143] In an embodiment, referring to Figure 23 As shown, the shroud 200 can be provided with a baffle 260, and the number of the baffle 260 is at least one, and at least one baffle 260 is arranged between any two adjacent fans 400.

[0144] In some possible implementations, referring to Figure 24 As shown, the fan 400 can be arranged on one side of the first side plate 220, for example, on the X reverse side of the first side plate 220, the shunt piece 500 can be connected with the second side plate 230, the first partition plate 610 is arranged on the X reverse side of the shunt piece 500, the X direction side of the first partition plate 610 is the first air duct 2121, and the X reverse side of the first partition plate 610 is the second air duct 2122.

[0145] The first spacing space 810 is formed between the shunt 500 and the outer wall surface of the shell 100, and can be in communication with the first air duct 2121. When the fan 400 is working, part of the air driven by the fan 400 can flow through the first spacing space 810 and then directly flow through the first air duct 2121 into the heat dissipation device (not shown in the figure), and part of the air driven by the fan 400 can flow through the shunt 500, then pass through the second spacing space 820 between the first partition plate 610 (not shown in the figure, and refer to Figure 9 ) and the back plate 250 (not shown in the figure, and refer to ), and then flow through the second air duct 2122 into the heat dissipation device (not shown in the figure).

[0146] In an embodiment, as shown in Figure 25 , the power conversion device can include a blocking piece 700 arranged in the heat dissipation cavity 210. The blocking piece 700 can be spaced, connected or integrated with the first partition plate 610 (not shown in the figure, and refer to Figure 24 ). The blocking piece 700 has a first heat dissipation channel 210a and a second heat dissipation channel 210b on two sides respectively, so as to avoid the hot air flowing between the first heat dissipation channel 210a and the second heat dissipation channel 210b. The heat sink 320 is accommodated in the first heat dissipation channel 210a, and the inductor box 330 is accommodated in the second heat dissipation channel 210b, so that the inductor box 330 and the heat sink 320 are in parallel for heat dissipation, and the heat dissipation is not affected by the heat air transmission between the inductor box 330 and the heat sink 320. The first heat dissipation channel 210a and the second heat dissipation channel 210b are in communication at the side close to the fan 400, so that the air driven by the fan 400 can enter the first heat dissipation channel 210a and the second heat dissipation channel 210b respectively.

[0147] When the fan 400 is working, as shown in Figure 24 and Figure 25 , part of the air driven by the fan 400 flows through the first air duct 2121 and the first heat dissipation channel 210a in sequence to dissipate heat for the heat sink 320; and part of the air driven by the fan 400 flows through the flow guide surface and then flows to the second air duct 2122 and the second heat dissipation channel 210b through the second spacing space 820.

[0148] In an embodiment, the blocking piece 700 is made of a heat insulation material, or the surface of the blocking piece 700 has a heat insulation layer, so that the first heat dissipation channel 210a and the second heat dissipation channel 210b do not exchange heat, and the heat of the heat sink 320 is prevented from being transmitted to the inductor box 330, thereby affecting the heat dissipation of the inductor box 330.

[0149] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

[0150] To further illustrate the technical solutions adopted in the embodiments of this application, the following description is provided in conjunction with the appendix. Figure 30 To be continued Figure 41 Let's take a closer look.

[0151] Appendix Figure 30 To be continued Figure 41 New annotations added to the attached figures in the middle section:

[0152] 01-Wall surface; 02-Hanging bracket; 222-Air outlet; 24-Guide plate; 25-Net cover; 26-Wind deflector;

[0153] 31 - Central axis; 514 - Middle area; 515 - Side area; 55 - Hole.

[0154] Figure 30 This is a side sectional view of an inverter provided in an embodiment of this application. Figure 31 Another side sectional view of the inverter provided in an embodiment of this application. (See reference...) Figure 30 and Figure 31 In this embodiment, the power converter 10 can be mounted on a wall surface 01. Specifically, the power converter 10 can be mounted on the wall surface 01 via a bracket 02. The wall surface 01 can be the equipment housing, a wall, or an auxiliary mounting surface. Figure 30 In the illustrated embodiment, the power converter 10 can be mounted independently on a wall, or as shown in the example. Figure 31 In the embodiment shown, two power converters 10 can be installed back to back, with an auxiliary mounting surface serving as a wall 01 between the two power converters 10.

[0155] Please continue to refer to this. Figure 30 and Figure 31 The power converter 10 includes a housing 100 and a shroud 200. The shroud 200 is stacked and fixed to the housing 100, and the shroud 200 is located on the outer side of the outer wall of the housing 100. Specifically, the shroud 200 is located on the side of the housing 100 facing the wall 01, or in other words, the side of the power converter 10 with the shroud 200 faces the aforementioned wall 01.

[0156] Figure 32 A top view of an inverter provided in an embodiment of this application is shown below.Figure 30 and Figure 32 As shown in FIG. 1 and FIG. 2, the fan shroud 200 and the outer wall of the shell 100 form a heat dissipation air duct. The fan shroud 200 includes an air inlet 221 and an air outlet 222. Cold air enters the heat dissipation air duct from the air inlet 221 and flows out of the heat dissipation air duct from the air outlet 222. The inverter includes a fan 400, a heat dissipation device 300, and a flow divider 500. The fan 400, the flow divider 500, and the heat dissipation device 300 are arranged in the heat dissipation air duct in a first direction in sequence, or in other words, the fan 400, the flow divider 500, and the heat dissipation device 300 are arranged between the fan shroud 200 and the outer wall of the shell 100 and in the direction from the air inlet 221 to the air outlet 222 in sequence. Specifically, the heat dissipation device 300 is in thermal contact with the shell 100 and is used to dissipate heat for the heat generating devices in the shell 100. The fan 400 is arranged at a position close to the air inlet 221 and is used to drive air flow into the heat dissipation air duct from the air inlet 221, improve the flow speed of the air flow in the heat dissipation air duct, improve the heat dissipation efficiency of the heat dissipation device 300, and further improve the heat dissipation effect for the heat generating devices in the shell 100 of the inverter.

[0157] In an embodiment, the fan 400 has a central axis 31 in a second direction, and the flow divider 500 includes a first flow guide surface 511. The farther the first flow guide surface 511 of the flow divider 500 is from the central axis 31 in the second direction, the farther the first flow guide surface 511 is from the air outlet surface of the fan 400 in the first direction. The first direction is perpendicular to the second direction. Please refer to FIG. 3 and FIG. 4. Figure 32 The distance L1 between the first flow guide surface 511 and the central axis 31 of the fan 400 in the second direction and the distance L2 between the first flow guide surface 511 and the air outlet surface of the fan 400 in the first direction satisfy: L2 increases with the increase of L1. The first flow guide surface 511 of the flow divider 500 is used to guide the air flow driven by the fan 400 to the direction away from the fan 400 in the second direction, that is, to guide the air flow driven by the fan 400, so that the areas on both sides of the heat dissipation device 300 which are far away from the fan 400 in the second direction can also have sufficient air flow, or in other words, the wind speed and wind volume at each position of the heat dissipation device 300 are relatively uniform, so that the heat dissipation capacity of the heat dissipation device 300 is relatively uniform. In addition, in this scheme, the number of fans 400 is small, which can also make the air flow in the heat dissipation air duct more uniform, and the cost of the inverter is low. Therefore, this scheme is conducive to improving the uniformity of the heat dissipation of the inverter and reducing the cost of the inverter.

[0158] Please continue to refer to Figure 30 and Figure 31In the embodiment, the minimum distance L between the flow splitter 500 and the fan 400 satisfies 2mm≤L≤20mm. The minimum distance between the flow splitter 500 and the fan 400 is less than or equal to 20mm, which is beneficial to improve the flow uniformity of the flow splitter 500. In a further embodiment, the minimum distance between the flow splitter 500 and the fan 400 can be less than or equal to 10mm. The smaller the distance between the flow splitter 500 and the fan 400, the better the flow uniformity. However, the flow splitter 500 and the fan 400 are too close, which can also generate a large noise. In the embodiment, the distance between the flow splitter 500 and the fan 400 is greater than or equal to 2mm, which is beneficial to make the noise of the inverter not too large. In an optional embodiment, the minimum distance L between the flow splitter 500 and the fan 400 can be 3mm, 5mm, 6.5mm, 7mm, 8mm, 8.5mm, 9mm, 11mm, 13mm, 15mm or 17mm, etc.

[0159] In the embodiment, the minimum distance between the flow splitter 500 and the fan 400 refers to the minimum distance among the distances between the flow splitter 500 and the fan 400 along the first direction.

[0160] Please continue to refer to Figure 32 In order to improve the flow uniformity of the flow splitter 500, the width W1 of the flow splitter 500 along the second direction and the width W2 of the heat dissipation device 300 along the second direction satisfy 1 / 5*W2≤W1≤1 / 2*W2 in the embodiment. In this embodiment, the flow splitter 500 can more evenly split the airflow driven by the fan 400 to both ends of the heat dissipation device 300 along the second direction, and each area of the heat dissipation device 300 along the second direction can exchange heat with more airflow, thereby improving the heat dissipation uniformity of the heat dissipation device 300. Specifically, if the width of the flow splitter 500 along the second direction is too small, for example, W1<1 / 5*W2, the airflow flowing through the area at the edge of the heat dissipation device 300 along the second direction can still be small, resulting in poor heat dissipation uniformity of the heat dissipation device 300. If the width of the flow splitter 500 along the second direction is too large, for example, W1>1 / 2*W2, the airflow flowing through the area of the heat dissipation device 300 along the second direction blocked by the flow splitter 500 can still be small, resulting in poor heat dissipation uniformity of the heat dissipation device 300.

[0161] Please refer to Figure 30In the embodiment of the present application, the maximum distance h1 between the edge of the flow distribution member 500 away from the outer wall of the shell 100 and the outer wall of the shell 100, and the maximum distance h2 between the rotating shaft of the fan 400 and the outer wall of the shell 100 satisfy: h1≤h2. Then the flow distribution member 500 does not exceed the rotating shaft of the fan 400 along the third direction, and at least half of the area of the fan 400 along the third direction is not blocked by the flow distribution member 500, thereby directly opposite to the heat dissipation device 300, so that the airflow can directly flow through the middle area of the heat dissipation device 300, so that the middle area of the heat dissipation device 300 also has a certain airflow, thereby the heat dissipation capacity of each area of the heat dissipation device 300 along the second direction is relatively uniform. The third direction is the thickness direction of the shroud 200, or the arrangement direction of the shroud 200 and the shell 100. In an embodiment, the third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.

[0162] Figure 33 to Figure 35 For several structural schematic diagrams of the flow distribution member 500 in the embodiment of the present application, as shown in Figure 32 to Figure 35 , the shape of the flow distribution member 500 in the embodiment of the present application has multiple choices. For example, the flow distribution member 500 includes two first flow guide surfaces 511, as shown in Figure 32 and Figure 33 , in an embodiment, the flow distribution member 500 can include two first flow guide surfaces 511 which are inclined surfaces; or, as shown in Figure 34 , the flow distribution member 500 can also include two first flow guide surfaces 511 which are convex arc surfaces; or, as shown in Figure 35 , the flow distribution member 500 can also include two first flow guide surfaces 511 which are concave arc surfaces. In addition, the two first flow guide surfaces 511 can be directly connected, or a third flow guide surface 513 is arranged between the two first flow guide surfaces 511, and the third flow guide surface 513 is parallel to the air inlet 221.

[0163] As shown in Figure 32 to Figure 35 , in the embodiment of the present application, the flow distribution member 500 is a symmetric structure along the second direction, and the projection of the symmetric axis of the flow distribution member 500 along the first direction coincides with the projection of the central axis 31 of the fan 400 along the first direction. In this scheme, it is beneficial to use the flow distribution member 500 to more uniformly guide the airflow of the fan 400 to the areas on both sides, thereby improving the heat dissipation uniformity of the heat dissipation device 300.

[0164] Figure 36 is a top view structural schematic diagram of the flow distribution member 500 in the embodiment of the present application, Figure 37 is a top view structural schematic diagram of the flow distribution member 500 in the embodiment of the present application, Figure 38 is a top view structural schematic diagram of the flow distribution member 500 in the embodiment of the present application. As shown in Figure 36 to Figure 38As shown, in the embodiment of the present application, the flow distributor 500 is provided with a plurality of holes 55, and the flow distributor 500 comprises a middle region 514 and two side regions 515, the two side regions 515 are respectively arranged on two sides of the middle region 514, and the opening rate of the middle region 514 is lower than that of the side regions 515. The airflow driven by the fan 400 diffuses to the side regions 515 on both sides of the flow distributor 500. Specifically, the middle region 514 of the flow distributor 500 is opposite to the fan 400, but the opening rate is low, so that the airflow flowing through the middle region 514 of the flow distributor 500 can be reduced; and the side regions 515 of the flow distributor 500 are staggered with the fan 400, but the opening rate is high, so that the airflow flowing through the two side regions 515 of the flow distributor 500 can be improved, thereby making the airflow flowing through the flow distributor 500 more uniform.

[0165] In the embodiment of the present application, the flow distributor 500 can comprise the first flow guide surface 511 and be provided with a plurality of holes 55 with different opening rates. That is, the first flow guide surface 511 can be arranged on the flow distributor 500, and the flow distributor 500 is provided with a plurality of holes 55 with different opening rates. Alternatively, only the first flow guide surface 511 can be arranged on the flow distributor 500. Alternatively, only the flow distributor 500 can be provided with a plurality of holes 55, and the opening rate of the middle region 514 is lower than that of the side regions 515.

[0166] When the flow distributor 500 is provided with a plurality of holes 55, the maximum distance h1 between the edge of the flow distributor 500 away from the outer wall of the shell 100 and the outer wall of the shell 100, and the maximum distance h2 between the rotation shaft of the fan 400 and the outer wall of the shell 100 satisfy: h1≥h2. Even, the maximum distance h1 between the edge of the flow distributor 500 away from the outer wall of the shell 100 and the outer wall of the shell 100 is greater than the maximum distance between the edge of the fan 400 away from the outer wall of the shell 100 and the outer wall of the shell 100.

[0167] In the optional embodiment, the way to realize that the opening rate of the middle region 514 is lower than that of the side regions 515 has multiple choices, for example, as shown in Figure 36 As shown, the hole diameters of the holes 55 provided on the flow distributor 500 can be the same, but the density of the holes 55 in the middle region 514 is lower than that of the holes 55 in the side regions 515. Alternatively, as shown in Figure 37 As shown, the hole diameters of the holes 55 provided on the flow distributor 500 can be different, and the hole diameters of the holes 55 in the middle region 514 are smaller than those of the holes 55 in the side regions 515. Alternatively, as shown in Figure 38 As shown, the hole diameters of the holes 55 in the middle region 514 of the flow distributor 500 can be greater than those of the holes 55 in the side regions 515, but the density of the holes 55 in the middle region 514 is lower than that of the holes 55 in the side regions 515.

[0168] In a specific embodiment, the flow distribution member 500 has a higher opening rate in the area farther away from the central axis 31 of the fan 400 in the second direction. The farther away from the central axis 31 of the fan 400, the less air flow driven by the fan 400, and the higher the opening rate of the flow distribution member 500, the greater the amount of air flow passing through. Therefore, the application facilitates improving the uniformity of air flow through each part of the heat dissipation device 300 by providing the above-mentioned flow distribution member 500.

[0169] In the prior art, the hot air generated in the air-cooled heat dissipation process of the inverter is discharged towards the wall surface, and under the flow guiding effect of the wall surface, the hot air is prone to backflow to the air inlet 221 of the air flow, so that the heat dissipation efficiency of the inverter is reduced. And with the miniaturization development of the inverter, the problem of hot air backflow is more and more obvious, which causes the internal part of the shell 100 of the inverter to be unable to achieve effective cooling, so the service life and reliability of various components in the internal part of the shell 100 cannot be guaranteed, which further affects the service life of the inverter as a whole.

[0170] Please refer to Figure 30 In an embodiment, the shroud 200 includes a back plate 250 facing away from the outer wall of the shell 100. Specifically, the above-mentioned back plate 250 can be parallel to the outer wall of the shell 100. The above-mentioned back plate 250 includes the air outlet 222, i.e. the air outlet 222 of the heat dissipation air duct is arranged on the back plate of the shroud 200, and the air outlet 222 faces the wall surface on which the inverter is installed. The air outlet 222 of the above-mentioned shroud 200 is provided with a guide plate 24 and a mesh cover 25, and the distance between the guide plate 24 and the back plate 250 gradually decreases along the first direction. In a possible embodiment, the distance between the guide plate 24 and the outer wall of the shell 100 gradually increases along the first direction. In the embodiment of the application, the guide plate 24 is located on the side of the mesh cover 25 facing the outer wall of the shell 100, i.e. the guide plate 24 is located inside the heat dissipation air duct of the shroud 200 and is protected by the mesh cover 25, so that it is not easy to accumulate sundries at the guide plate 24. It can be understood that in an embodiment, the above-mentioned guide plate 24 is arranged obliquely on the back plate 250, and the included angle between the guide plate 24 and the side of the back plate 250 facing the air inlet 221 is an acute angle. In an embodiment, the guide plate 24 is inclined towards the back plate 250 along the first direction. Therefore, the air flow enters the heat dissipation air duct from the air inlet 221 of the heat dissipation air duct, and under the guiding effect of the guide plate 24, the air flow flows out of the heat dissipation air duct in an obliquely upward direction, so that the hot air after heat exchange flows upwards and is not easy to flow downwards under the action of the wall surface to cause hot backflow. This scheme is helpful to reduce the hot backflow problem of the inverter and improve the heat exchange efficiency and effect.

[0171] Specifically, the shroud 200 in this application may include a plurality of guide plates 24 arranged at intervals along a first direction to improve the guiding effect of the guide plates 24. For example, the inventors found through simulation experiments that the shroud 200 may include at least three guide plates 24, thereby improving the guiding effect of the guide plates 24 and reducing the likelihood of heat backflow. In some embodiments, the more guide plates 24 there are, the better the guiding effect.

[0172] Figure 39 A side sectional view of the inverter provided in the embodiments of this application, such as... Figure 39 As shown, in one embodiment, the fan shroud 200 includes a back plate 250 and a baffle plate 26. The back plate 250 is located on the side of the heat dissipation device 300 away from the outer wall of the housing 100. Specifically, the back plate 250 may be parallel to the outer wall of the housing 100. The back plate 250 includes an air outlet 222, that is, the air outlet 222 of the heat dissipation duct is disposed on the back plate of the fan shroud 200, and the air outlet 222 faces the wall where the inverter is installed. The baffle plate 26 is disposed on the side of the air outlet 222 away from the outer wall of the housing 100. It can be understood that the baffle plate 26 is disposed outside the heat dissipation duct. The distance between the surface of the baffle plate 26 facing the air outlet 222 and the outer wall of the housing 100 gradually increases along a first direction. In other words, the baffle plate is located on the side of the air outlet away from the housing, and the plane of the baffle plate facing the air outlet forms an acute angle θ with the plane of the air outlet. The opening direction of this acute angle θ is consistent with the air blowing direction of the fan, that is, the fan blows upwards, and the acute angle θ also opens upwards. The surface of the baffle plate 26 facing the air outlet 222 is an inclined surface, and this inclined surface is inclined towards the wall along the first direction. Under the action of the baffle plate 26, the hot air after heat exchange flows upwards and is less likely to flow downwards under the action of the wall, thus preventing heat backflow. This solution helps to reduce the heat backflow problem of the inverter and improves heat exchange efficiency and effect.

[0173] In a specific embodiment, the minimum distance between the wind deflector 26 and the air outlet 222 is greater than or equal to 10mm. For example, the minimum distance between the wind deflector 26 and the air outlet 222 can be 11mm, 12mm, 14mm, 15mm, 16mm, 18mm, 20mm, or 21mm, etc. In this embodiment, the minimum distance between the wind deflector 26 and the air outlet 222 is relatively large, making it less likely for problems such as rainwater accumulation or foreign object accumulation to occur.

[0174] In this embodiment of the application, there are one or more fans 400. Figure 32 In the embodiment shown, there is one fan 400. Figure 40 This is a top view schematic diagram of an inverter provided in an embodiment of this application. Figure 41 This is a top view schematic diagram of an inverter provided in an embodiment of this application.Figure 40 and Figure 41 As shown in FIG. 4, the inverter 100 includes a plurality of fans 400. In the embodiment shown in FIG. 4, the inverter 100 includes one flow divider 500. As shown in FIG. 5, the inverter 100 includes a plurality of fans 400. In the embodiment shown in FIG. 5, the inverter 100 includes one flow divider 500. As shown in FIG. 6, the inverter 100 includes a plurality of fans 400. In the embodiment shown in FIG. 6, the inverter 100 includes one flow divider 500. As shown in FIG. 7, the inverter 100 includes a plurality of fans 400. In the embodiment shown in FIG. 7, the inverter 100 includes one flow divider 500. Figure 40 As shown in FIG. 8, the inverter 100 includes a plurality of fans 400. In the embodiment shown in FIG. 8, the inverter 100 includes one flow divider 500. As shown in FIG. 9, the inverter 100 includes a plurality of fans 400. In the embodiment shown in FIG. 9, the inverter 100 includes one flow divider 500. Figure 41 As shown in FIG. 10, the inverter 100 includes a plurality of fans 400. In the embodiment shown in FIG. 10, the inverter 100 includes a plurality of flow dividers 500. Each flow divider 500 corresponds to one fan 400.

[0175] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A power conversion device, characterized by, The application relates to a power supply device, which comprises: a housing, which encloses a power cavity; a circuit board arranged in the power cavity, and a power device arranged on the circuit board; a fan cover, which, together with the outer wall of the housing, encloses a heat dissipation cavity; a heat dissipation device arranged in the heat dissipation cavity, and at least part of the heat dissipation device is in heat conduction connection with the power device; a fan, which is in projection coincidence with the heat dissipation device along the air outlet direction of the fan; a flow divider between the fan and the heat dissipation device, which is in projection coincidence with the fan along the air outlet direction, and the flow divider has a flow guide surface, and when the fan works, the fan drives part of the air to directly flow to the heat dissipation device, and the air flows through the flow guide surface and then flows to the heat dissipation device.

2. The power conversion device of claim 1, wherein, The fan cover has a back plate arranged opposite to the housing, one side edge of the flow guide surface is in sealing connection with the back plate, and a first spacing space is formed between the flow guide surface and the outer wall of the housing, and when the fan works, the fan drives part of the air to directly flow to the heat dissipation device through the first spacing space.

3. The power conversion device of claim 2, wherein, The back plate is provided with an air outlet, the air outlet is provided with a guide plate and a mesh cover, the guide plate is located on the side of the mesh cover facing the housing, and the distance between the guide plate and the back plate gradually increases along a first direction.

4. The power conversion device of claim 3, wherein, The back plate comprises a first back plate, a second back plate and a third back plate, and the air outlet is located on the third back plate; the space between the first back plate and the housing contains the fan and the flow divider, the space between the second back plate and the third back plate and the housing contains the heat dissipation device, the second back plate is in inclined connection between the first back plate and the third back plate, and the height of the first back plate from the housing is greater than the height of the third back plate from the housing.

5. The power conversion device of claim 3, wherein, The fan cover comprises a baffle, the baffle is arranged on the side of the air outlet away from the housing, the plane where the surface of the baffle facing the air outlet is located forms an acute angle with the plane where the air outlet is located, the opening direction of the acute angle is consistent with the blowing direction of the fan.

6. The power conversion device of claim 2, wherein, The flow divider has a wind collecting surface, the wind collecting surface and the housing are arranged in parallel, one side edge of the wind collecting surface is connected with the edge of the flow guide surface facing the housing, and the height of the heat dissipation device along the direction from the back plate to the housing is the same as the height of the wind collecting surface from the housing.

7. A power conversion device according to any one of claims 1-6, characterized in that, The number of the flow guide surfaces is at least two, the at least two flow guide surfaces are arranged in an inclined mode, the number of the regions outside the projection coincidence area of the heat dissipation device and the fan is at least two and is located on both sides of the flow divider, and when the fan works, the fan drives part of the air to flow to the two regions outside the projection coincidence area of the heat dissipation device and the fan through the at least two flow guide surfaces.

8. A power conversion device according to any one of claims 1-7, characterized in that The power conversion device comprises a first partition plate, the fan cover has a first side plate, an air inlet is arranged on the first side plate, the first partition plate is located between the heat dissipation device and the first side plate, two sides of the first partition plate are respectively a first air duct and a second air duct, and a third interval space is formed between the first partition plate and a back plate of the fan cover. When the fan works, the fan driving part air flows through the first air duct and directly flows to the heat dissipation device, and the fan driving part air flows through the guide surface and flows to the second air duct and the heat dissipation device through the third interval space.

9. The power conversion device of claim 8, wherein, The projection overlapping area of the heat dissipation device and the fan and the projection of the first air duct along the air outlet direction at least partially overlap, and the area outside the projection overlapping area of the heat dissipation device and the fan and the projection of the second air duct along the air outlet direction at least partially overlap.

10. A power conversion device according to claim 8 or 9, characterized in that, The partition plate comprises a second partition plate, the first partition plate and the second partition plate are located on two sides of the flow divider, the first air duct is arranged between the first partition plate and the second partition plate, the second air duct is arranged on a side of the first partition plate opposite to the first air duct, the third air duct is arranged on a side of the second partition plate opposite to the first air duct, and a fourth interval space is formed between the second partition plate and the back plate of the fan cover. When the fan works, the fan driving part air flows through the guide surface and flows to the third air duct and the heat dissipation device through the fourth interval space.

11. The power conversion device of claim 10, wherein, The area outside the projection overlapping area of the heat dissipation device and the fan and the projection of the second air duct along the air outlet direction partially overlap, and the area outside the projection overlapping area of the heat dissipation device and the fan and the projection of the third air duct along the air outlet direction partially overlap.

12. A power conversion device according to any of claims 8-11, characterized in that The heat dissipation device comprises a heat sink and an inductor box, and the power conversion device comprises an inductor, which is accommodated in a space enclosed by the inductor box. The power conversion device comprises a blocking piece arranged in the heat dissipation cavity, two sides of the blocking piece are respectively a first heat dissipation channel and a second heat dissipation channel, the heat sink is accommodated in the first heat dissipation channel, the inductor box is accommodated in the second heat dissipation channel, and the first heat dissipation channel and the second heat dissipation channel are communicated at a side close to the fan. When the fan works, the fan driving part air flows through the first air duct and the first heat dissipation channel in sequence, and the fan driving part air flows through the guide surface and flows to the second air duct and the second heat dissipation channel through the third interval space.

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