Residual tin removing equipment

Abstract

The utility model discloses a residual tin removing device, which relates to the technical field of display devices, and comprises a moving part, a heating part, a suction part, an air extractor and a driving device, the heating part is used for heating residual tin on a circuit board, the suction part is arranged on the moving part and is provided with a suction channel for sucking the heated and melted residual tin, and the air extractor is arranged on the suction channel. The air extractor is communicated with the suction channel, and the driving device is in driving connection with the moving part to drive the moving part to move relative to the circuit board. In the technical scheme of the utility model, when the residual tin on the circuit board is cleaned, the driving device and the moving part drive the suction part to move to a corresponding position, the heating part heats the residual tin, and the air exhaust device exhausts air, so that the suction part sucks the residual tin aggregated into small spherical particles from the circuit board; and the residual tin on the plurality of bonding pads on the circuit board can be cleaned up by repeating the steps, manual removal is not needed, and time and labor are saved.

Description

Technical Field

[0001] This utility model relates to the field of display device technology, and in particular to a residual tin removal device. Background Technology

[0002] Solder paste is a gray paste. It is a new type of welding material that emerged with the development of SMT (Surface Mount Technology). It is a paste-like mixture formed by mixing solder powder, flux, and other surfactants. It is mainly used for welding electronic components such as resistors, capacitors, and ICs on the surface of PCBs in the SMT industry.

[0003] After the LED beads soldered on the PCB board surface fall off for some reason, they need to be reworked. A certain amount of solder will remain on the solder pads used for soldering the LED beads. The conventional way to remove the residual solder is to scrape away the molten solder with a baffle. This method is not clean, and it is easy to scrape the molten solder into the gap between the solder pads, which may cause a short circuit. Often, it is necessary to manually pick out the residual solder with a needle, which is time-consuming and laborious. Utility Model Content

[0004] The main purpose of this invention is to provide a residual solder removal device, which aims to solve the technical problem in related technologies that it is difficult to completely remove residual solder from solder pads, and that it is necessary to manually remove the residual solder, which is time-consuming and labor-intensive.

[0005] To achieve the above objectives, this utility model proposes a residual tin removal device, comprising:

[0006] Moving parts;

[0007] Heating element, used to heat residual solder on circuit boards;

[0008] A suction member, disposed on the moving member, has a suction channel for suctioning residual tin that has been heated and melted;

[0009] An air extraction device is connected to the suction channel; and,

[0010] A driving device is connected to the moving part to drive the moving part to move relative to the circuit board.

[0011] In one embodiment, the heating element includes a laser emitter.

[0012] In one embodiment, the laser emitted by the laser emitter exits from the entrance end of the absorption channel.

[0013] In one embodiment, the suction member includes:

[0014] A suction nozzle is disposed on the movable member. The suction nozzle has a cavity, and one end of the cavity in the first direction is open. The opening of the cavity constitutes the inlet end of the suction channel.

[0015] A connecting pipe, one end of which is connected to the side of the cavity in the second direction, and the other end of which is connected to the air extraction device; and,

[0016] The connecting pipe and part of the cavity constitute the absorption channel, and the connecting pipe is located between the laser emitter and the opening of the cavity.

[0017] In one embodiment, the residual tin removal device further includes a filter disposed in the suction channel.

[0018] In one embodiment, the heating element includes a laser emitter;

[0019] The laser emitted by the laser emitter exits from the entrance end of the absorption channel;

[0020] The filter is located to the side of the optical path of the laser emitted by the laser emitter.

[0021] In one embodiment, the suction member is detachably connected to the movable member.

[0022] In one embodiment, the residual solder removal device further includes an air blowing device for blowing air onto the circuit board.

[0023] In one embodiment, the residual tin removal device further includes:

[0024] A position recognition device for identifying the position information of pads on a circuit board; and,

[0025] A control device is electrically connected to the position identification device, the heating element, the air extraction device, and the drive device, and is used to control the operation of the heating element, the air extraction device, and the drive device according to the position information.

[0026] In one embodiment, the location recognition device includes a camera.

[0027] In the technical solution of this utility model, the residual solder removal device includes a moving part, a heating part, a suction part, an air extraction device, and a driving device. When cleaning residual solder on the circuit board, the driving device and the moving part drive the suction part to the corresponding position. The heating part heats the residual solder, causing it to aggregate into small spherical particles under the action of surface tension. The air extraction device extracts air, causing the suction part to pick up the aggregated spherical residual solder particles from the circuit board. This process is repeated to clean the residual solder on multiple pads on the circuit board without manual removal, saving time and effort. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0029] Figure 1 A schematic diagram of an embodiment of the residual tin removal device provided by this utility model;

[0030] Figure 2 for Figure 1 A schematic diagram illustrating the use of the residual tin removal equipment;

[0031] Figure 3 A schematic diagram of another embodiment of the residual tin removal device provided by this utility model.

[0032] Explanation of icon numbers:

[0033] 100. Residual tin removal equipment; 1. Moving part; 2. Heating part; 21. Laser emitter; 3. Suction part; 301. Suction channel; 302. Inlet end; 31. Suction nozzle; 32. Connecting pipe; 4. Filter; 5. Air blowing device; 200. Circuit board.

[0034] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0036] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0037] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0038] After the LED beads soldered on the PCB board surface fall off for some reason, they need to be reworked. A certain amount of solder will remain on the solder pads used for soldering the LED beads. The conventional way to remove the residual solder is to scrape away the molten solder with a baffle. This method is not clean, and it is easy to scrape the molten solder into the gap between the solder pads, which may cause a short circuit. Often, it is necessary to manually pick out the residual solder with a needle, which is time-consuming and laborious.

[0039] The main purpose of this invention is to provide a residual solder removal device, which aims to solve the technical problem in related technologies that it is difficult to completely remove residual solder from solder pads and that requires manual removal, which is time-consuming and labor-intensive.

[0040] Please see Figure 1 and Figure 2 In one embodiment of this utility model, the residual solder removal device 100 includes a moving part 1, a heating part 2, a suction part 3, a vacuum device, and a driving device. The heating part 2 is used to heat the residual solder on the circuit board 200. The suction part 3 is disposed on the moving part 1 and has a suction channel 301 for suctioning the heated and melted residual solder. The vacuum device is connected to the suction channel 301. The driving device is drivenly connected to the moving part 1 to drive the moving part 1 to move relative to the circuit board 200.

[0041] In the technical solution of this utility model, the residual solder removal device 100 includes a moving part 1, a heating part 2, a suction part 3, an air extraction device, and a driving device. When cleaning residual solder on the circuit board 200, the driving device and the moving part 1 drive the suction part 3 to move to the corresponding position. The heating part 2 heats the residual solder, causing it to aggregate into small spherical particles under the action of surface tension. The air extraction device extracts air, causing the suction part 3 to pick up the aggregated spherical residual solder from the circuit board 200. This process is repeated to clean the residual solder on multiple pads on the circuit board 200 without manual removal, saving time and effort.

[0042] The air extraction device (not shown in the attached drawings) can take many forms. It can be an air pump or a fan, as long as it can extract air to create a negative pressure in the suction channel 301, thereby drawing the molten residual solder on the circuit board 200 into the suction channel 301.

[0043] The installation position of the suction device depends on its connection method with the suction channel 301. For example, if the suction device is connected to the suction channel 301 via a rigid tube, it is installed on the movable component 1 and moves with it. If the suction device is connected to the suction channel 301 via a flexible tube, it can be installed in a fixed position, with only the suction component 3 moving with the movable component 1.

[0044] This design does not limit the specific form of the driving device (not shown in the accompanying drawings). The driving device is used to drive the moving part 1 to move relative to the circuit board 200, thereby driving the suction part 3 to move relative to the circuit board 200, so as to suction multiple residual solder points on the circuit board 200 and achieve automation. The driving device can be a combination of multiple driving structures such as linear motors, threaded structures, cylinders, and robotic arms.

[0045] The heating element 2 is used to melt the residual solder on the pads. The heating element 2 can take various forms, such as heating with hot air or directly heating the entire circuit board 200 via a heating plate. It is understood that not all LEDs on the circuit board 200 need rework. If hot air or a heating plate is used for overall heating, it can easily cause normal LEDs to detach from the pads on the circuit board 200, requiring subsequent resoldering and adding unnecessary procedures and costs. Therefore, in this embodiment of the invention, the heating element 2 includes a laser emitter 21. The laser beam emitted by the laser emitter 21 can be focused on a specific location, namely the residual solder on the area where the LED has detached from the circuit board 200, achieving targeted heating without affecting normal LEDs.

[0046] Please refer to Figure 2 To ensure the effective absorption of residual solder by the absorption channel 301, in actual use, the inlet end 302 of the absorption channel 301 is usually attached to the circuit board 200. If the laser path emitted by the laser emitter 21 is located to the side of the absorption member 3, the moving member 1 needs to be moved by the driving device first, so that the laser emitter 21 is aligned with the residual solder on the pad and heated. After heating, the absorption member 3 needs to be moved again by the driving device so that the inlet end 302 of the absorption channel 301 is aligned with the residual solder on the pad. This operation is relatively cumbersome. When there are many chips that have fallen off the circuit board 200, this method will obviously increase the processing time of residual solder and reduce the rework efficiency.

[0047] In this embodiment of the present invention, the laser emitted by the laser emitter 21 exits from the inlet end 302 of the suction channel 301. With this configuration, when cleaning residual solder on the pads, the drive device can directly align the inlet end 302 of the suction channel 301 on the suction member 3 with the corresponding pad. Then, the laser emitter 21 is directly activated, and the laser emitted by the laser emitter 21 can directly irradiate the residual solder, heating it to melt. Afterward, the vacuum device can be directly activated to suck away the residual solder on the circuit board 200 through the suction channel 301. During this process, it is not necessary to use the drive device twice to separately align the laser emitter 21 and the suction member 3 with the pads.

[0048] It is understood that when the laser emitted by the laser emitter 21 exits from the inlet end 302 of the absorption channel 301, it indicates that the laser's optical path at least partially overlaps with the flow path of the residual solder. To reduce the possibility of residual solder splashing onto the laser emitter 21 in the absorption channel 301, please refer to the embodiments of this utility model. Figure 1The suction component 3 includes a suction nozzle 31 and a connecting tube 32. The suction nozzle 31 is disposed on the moving component 1 and has a cavity. One end of the cavity in a first direction is open, and the opening of the cavity forms the inlet end 302 of the suction channel 301. One end of the connecting tube 32 is connected to the side of the cavity in a second direction, and the other end is connected to the air extraction device. The connecting tube 32 and part of the cavity form the suction channel 301, and the connecting tube 32 is located between the laser emitter 21 and the opening of the cavity. With this configuration, when the vacuum device is activated, the cavity and the connecting pipe 32 are under negative pressure. The opening of the cavity generates suction, drawing the residual solder melted by the laser emitter 21 onto the solder pads into the cavity. Since the connecting pipe 32 is usually under negative pressure, the residual solder will flow directly into the connecting pipe 32 within the cavity as much as possible. In addition, since the laser emitter 21 is located on the side of the connecting pipe 32 in the first direction and away from the opening of the cavity, the residual solder will not splash onto the laser emitter 21, thus improving the service life of the laser emitter 21.

[0049] As can be seen from the above, the connecting pipe 32 can be a flexible pipe or a rigid pipe, depending on whether the air extraction device moves with the moving part 1.

[0050] To prevent residual solder from entering the vacuum device through the suction channel 301 and damaging it, in this embodiment of the invention, the residual solder removal device 100 further includes a filter element 4 disposed in the suction channel 301. The filter element 4 intercepts residual solder and other impurities on the circuit board 200, reducing the possibility of residual solder and impurities entering the vacuum device and thus protecting it.

[0051] With prolonged use of the suction element 3, the filter element 4 will inevitably accumulate a lot of impurities or residual tin. When the laser emitted by the laser emitter 21 does not exit from the inlet end 302 of the suction channel 301, the presence of the filter element 4 will not obstruct the laser. However, when the laser exits from the inlet end 302 of the suction channel 301, the position of the filter element 4 will affect the laser emission from the laser emitter 21. Therefore, in this embodiment, as... Figure 1 and Figure 2As shown, the heating element 2 includes a laser emitter 21; the laser emitted by the laser emitter 21 exits from the inlet end 302 of the absorption channel 301; the filter element 4 is located to the side of the optical path of the laser emitted by the laser emitter 21. This arrangement, by offsetting the laser emitter 21 from the filter element 4, allows the filter element 4 to properly filter molten solder and impurities without obstructing the laser beam from the laser emitter 21, thus ensuring the heating effect of the laser emitter 21.

[0052] Specifically, the filter element 4 is disposed inside the connecting pipe 32. It should be noted that, in the actual removal of residual solder from the circuit board 200, the circuit board 200 is laid flat on a horizontal surface, and the residual solder is then sucked up by the suction element 3 facing upwards. Figure 1 The first direction shown is vertical, and the second direction is horizontal. The inlet end 302 of the suction channel 301 is downward. The filter element 4 is placed inside the connecting pipe 32, which can store a certain amount of molten solder and impurities, thus reducing the possibility of molten solder falling back onto the circuit board 200. Of course, the filter element 4 does not necessarily have to be placed inside the connecting pipe 32; it can also be placed at the connection between the connecting pipe 32 and the suction device.

[0053] With continuous use of the suction member 3, some cooled solder and impurities will inevitably adhere to the sidewall of the suction channel 301, which may affect its ability to absorb residual solder on the circuit board 200. Therefore, the suction member 3 needs to be repaired or replaced periodically. Thus, in this embodiment of the invention, the suction member 3 is detachably connected to the moving member 1. In this way, the suction member 3 can be periodically removed from the moving member 1 for repair or replacement.

[0054] Specifically, in this embodiment, the suction nozzle 31 is detachably connected to the movable component 1.

[0055] It should be noted that when the heating element 2 takes the form of the laser emitter 21, the laser emitter 21 needs to move with the moving element 1. The laser emitter 21 can be set on the moving element 1 or on the suction nozzle 31. If the laser emitter 21 is set on the suction nozzle 31, and the suction nozzle 31 needs to be replaced, the laser emitter 21 needs to be removed separately or replaced together, which is unnecessary waste. Therefore, it is preferable to set the laser emitter 21 on the moving element 1, so that it does not need to be removed along with the suction element 3.

[0056] Of course, since the laser emitter 21 is mounted on the moving part 1, in order for the laser emitted by the laser emitter 21 to exit from the inlet end 302 of the absorption channel 301, the other end of the suction nozzle 31 in the first direction must be provided with a clearance hole communicating with the cavity. The clearance hole is used to avoid the laser emitted by the laser emitter 21 on the moving part 1, so that it can exit through the inlet end 302 of the absorption channel 301. However, the presence of the clearance hole will affect the airtightness of the cavity, thereby affecting the absorption effect of residual solder. Therefore, the connection method between the suction nozzle 31 and the moving part 1 needs to consider the sealing of the clearance hole. In one embodiment, please refer to Figures 1 to 3 As shown, an internal thread is provided on the side wall of the clearance hole, and a corresponding external thread is provided on the outer side of the moving part 1. The suction nozzle 31 and the moving part 1 are connected by a threaded connection, which facilitates disassembly and can seal the clearance hole to ensure the airtightness of the suction channel 301 without affecting the laser emitted from the laser emitter 21 from the inlet end 302 of the suction channel 301. In another embodiment, an external thread can also be provided on the outer side of the suction nozzle 31, and the moving part 1 can be configured as a sleeve with an internal thread on its inner side, which can also seal the clearance hole; of course, the clearance hole can also be sealed by using a snap-fit ​​method with a sealing gasket.

[0057] During the process of removing residual solder, the suction member 3 may not be able to guarantee that all residual solder and impurities on the circuit board 200 are completely removed. Furthermore, residual solder may fall back onto the circuit board 200 after entering the suction channel 301. To further improve the removal effect of residual solder on the circuit board 200, in one embodiment, please refer to... Figure 3 The residual tin removal device 100 also includes an air blowing device 5, which is used to blow air onto the circuit board 200. By blowing air, the residual tin and some impurities that have been heated and melted by the heating element 2 can be blown away from the circuit board 200, thereby improving the overall cleaning effect of the device.

[0058] The air blowing device 5 includes a blower pipe fixed relative to the moving member 1. During use, the blower pipe moves with the moving member 1. After the suction member 3 has finished suctioning residual solder on a solder pad, the blower pipe blows air onto that location to blow away impurities and a small amount of residual solder from the circuit board 200. Of course, the blower pipe of the air blowing device 5 does not necessarily move with the moving member 1; it can also be fixed in one place to blow air onto the circuit board 200 with a larger coverage area.

[0059] To improve the automation of the residual solder removal device 100, in this embodiment of the invention, the residual solder removal device 100 further includes a position identification device and a control device. The position identification device is used to identify the position information of the pads on the circuit board 200. The control device is electrically connected to the position identification device, the heating element 2, the vacuum device, and the drive device, and is used to control the operation of the heating element 2, the vacuum device, and the drive device according to the position information. Thus, in use, the circuit board 200 to be repaired is first identified by the position identification device, and the position information of the pads that need to be repaired is identified. Then, the control device controls the drive device to work according to the position information, so that the moving element 1 drives the suction element 3 to move to the corresponding position. Then, the heating element 2 is controlled to work to heat the residual solder on the pads. Then, the vacuum device is controlled to work so that the suction element 3 can suck up the melted residual solder. The overall structure has a higher degree of automation.

[0060] The location identification device can be a camera, which takes a picture of the circuit board 200 that needs to be repaired, extracts information from the picture, and then obtains the location information of the pads that need to be repaired. Of course, the location identification device is not limited to the camera; it can also be a barcode scanner. When there are many circuit boards 200 that need to be repaired, the location information of the pads on each circuit board 200 can be made into an information code and pasted on the corresponding circuit board 200 beforehand. During repair, the location information can be obtained by scanning the information code with a barcode scanner.

[0061] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A residual tin removal device, characterized in that, include: Moving parts; Heating element, used to heat residual solder on circuit boards; A suction member, disposed on the moving member, has a suction channel for suctioning residual tin that has been heated and melted; An air extraction device is connected to the suction channel; and, A driving device is connected to the moving part to drive the moving part to move relative to the circuit board; The residual solder removal equipment also includes an air blowing device for blowing air onto the circuit board.

2. The residual tin removal device as described in claim 1, characterized in that, The heating element includes a laser emitter.

3. The residual tin removal device as described in claim 2, characterized in that, The laser emitted by the laser emitter exits from the entrance end of the absorption channel.

4. The residual tin removal device as described in claim 3, characterized in that, The suction element includes: A suction nozzle is disposed on the movable member. The suction nozzle has a cavity, and one end of the cavity in the first direction is open. The opening of the cavity constitutes the inlet end of the suction channel. A connecting pipe, one end of which is connected to the side of the cavity in the second direction, and the other end of which is connected to the air extraction device; and, The connecting pipe and part of the cavity constitute the absorption channel, and the connecting pipe is located between the laser emitter and the opening of the cavity.

5. The residual tin removal device as described in claim 1, characterized in that, The residual tin removal device also includes a filter element disposed in the suction channel.

6. The residual tin removal device as described in claim 5, characterized in that, The heating element includes a laser emitter; The laser emitted by the laser emitter exits from the entrance end of the absorption channel; The filter is located to the side of the optical path of the laser emitted by the laser emitter.

7. The residual tin removal device as described in claim 1, characterized in that, The suction component is detachably connected to the movable component.

8. The residual tin removal device according to any one of claims 1 to 7, characterized in that, The residual tin removal device also includes: A position recognition device for identifying the position information of pads on a circuit board; and, A control device is electrically connected to the position identification device, the heating element, the air extraction device, and the drive device, and is used to control the operation of the heating element, the air extraction device, and the drive device according to the position information.

9. The residual tin removal device as described in claim 8, characterized in that, The location recognition device includes a camera.

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