Surface mounting device for LED lamp bead production

Abstract

The utility model discloses a surface mounting device for LED lamp bead production, which comprises a base, a lamp panel template arranged in the middle of the top end of the base, an electric telescopic rod arranged in the corner of the base, a bearing frame connected to the output end of the electric telescopic rod, a tin coating template structure sleeved on the inner side of the bearing frame, and a first fixing plate arranged on one side of the upper end of the bearing frame. The automatic tin coating machine has the following advantages that lamp panel templates and tin coating template structures of corresponding specifications can be replaced according to lamp panel main bodies of different specifications, the tin paste scraping mechanism is driven by the servo motor to move, and the tin paste scraping mechanism is driven by the servo motor to move. The solder paste scraping mechanism is arranged on the bottom plate, and the molten solder paste on the bottom plate can be uniformly scraped through a scraper in the solder paste scraping mechanism, so that the solder paste can be conveniently and quickly attached to the corresponding position, where the LED lamp beads need to be pasted, of the lamp panel main body, the LED lamp beads can be conveniently pasted on the lamp panel main body coated with the solder paste, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of LED chip mounting technology, specifically to a chip mounting device for LED chip production. Background Technology

[0002] To save energy, people use LED lights for illumination. There are various types of LEDs, among which LED chips are manufactured using a surface mount technology (SMT) process. Chinese patent CN216437630U discloses a surface mount device for LED light production, including a moving mechanism and a loading / unloading mechanism. The loading / unloading mechanism is located below the moving mechanism. The moving mechanism includes a base plate, connecting seats, columns, connecting beams, a first guide rail, a first servo motor, a first ball screw, a moving beam, a second servo motor, a second ball screw, a second guide rail, a moving seat, a cylinder, a silicone chuck, a first support frame, and a wick placement tray. Multiple connecting seats are located above the base plate, and the columns are located above the connecting seats. The first servo motor drives the first ball screw to rotate, thus moving the moving beam. The second servo motor drives the second ball screw to rotate, thus moving the moving seat. The cylinder drives the silicone chuck to move, causing the servo motor to drive the rotating shaft to rotate, thus rotating the rotating seat. This reduces manual operation, improves SMT accuracy, and enhances product quality.

[0003] The existing technology has the following shortcomings: When mounting LED chips, the existing technology uses silicone clamps to hold the LED chips and then attaches them to the LED board. However, it cannot apply solder to the corresponding positions on the LED board where the LED chips are to be mounted, which affects the normal mounting process. Therefore, a chip mounting device for LED chip production is provided to solve the above problems. Utility Model Content

[0004] To solve the problems mentioned above, the technical solution adopted by this utility model is: a chip mounting device for LED lamp bead production, comprising: a base, a lamp board template placed at the top center of the base, an electric telescopic rod installed inside the corner of the base, a support frame connected to the output end of the electric telescopic rod, a soldering template structure sleeved inside the support frame, a first fixing plate installed on one side of the upper end of the support frame, threaded rods connected to both ends of the first fixing plate via bearings, and a solder paste scraping mechanism connected to the threaded rods.

[0005] As a preferred technical solution of this utility model, the tin-coating template structure includes an outer frame, a base plate, and a heating plate. The bottom inner side of the outer frame is connected to the base plate, and the outer frame is connected to heating plates at both ends of the base plate. The heating plates are sealed to the base plate.

[0006] As a preferred embodiment of this utility model, the base plate has an adhesive opening, the heating plate has a heating wire inside, and the outer frame has symmetrical positioning holes at both ends.

[0007] As a preferred technical solution of this utility model, the solder paste scraping mechanism includes a movable plate, a pneumatic telescopic cylinder, and a scraper. The pneumatic telescopic cylinder is fixedly installed on the top of the movable plate, and the output end of the pneumatic telescopic cylinder passes through the movable plate and is fixedly connected to the scraper.

[0008] As a preferred embodiment of this utility model, there are two scrapers, four pneumatic telescopic cylinders, and a threaded rod is internally connected to the movable plate.

[0009] As a preferred embodiment of this utility model, a servo motor is fixedly installed at the middle of one end of the first fixing plate, and the output end of the servo motor is connected to a gear via a chain, with the gear fixedly connected to one end of a threaded rod.

[0010] As a preferred technical solution of this utility model, a second fixing plate is provided at the upper end of the support frame corresponding to one end of the first fixing plate. The second fixing plate is connected to one end of a threaded rod through a bearing, and there are two threaded rods.

[0011] As a preferred technical solution of this utility model, a lamp board placement groove is provided on the upper end of the lamp board template corresponding to the pasting opening, and the lamp board body is placed on the lamp board template through the lamp board placement groove.

[0012] As a preferred technical solution of this utility model, the two ends of the support frame are connected to the positioning holes by threaded rods, and one end of the threaded rod is threaded through the support frame and connected to the positioning hole.

[0013] The present invention has the following advantages: the main body of the lamp board to be attached to the LED lamp beads can be directly placed in the lamp board placement slot, and the corresponding lamp board template and tin-coating template structure can be replaced according to different specifications of the lamp board main body.

[0014] The servo motor drives the solder paste scraping mechanism to move, and the scraper in the solder paste scraping mechanism can evenly scrape the molten solder paste on the base plate, so that the solder paste can be quickly attached to the corresponding position of the LED beads on the main body of the lamp board. This makes it easier to attach the LED beads to the main body of the lamp board coated with solder paste, thereby improving production efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a preferred embodiment of the present invention;

[0016] Figure 2 This is a schematic diagram showing the disassembled tin-coating template structure and support frame of a preferred embodiment of this utility model;

[0017] Figure 3 This is a schematic diagram of the solder paste scraping mechanism according to a preferred embodiment of the present invention;

[0018] Figure 4 This is a schematic diagram of the lamp board template and the main structure of the lamp board according to a preferred embodiment of the present utility model;

[0019] Figure 5 This is a schematic diagram of the connection structure between the heating plate and the heating wire in a preferred embodiment of this utility model.

[0020] Explanation of reference numerals in the attached drawings: 1. Base; 2. Lamp panel template; 201. Lamp panel placement slot; 3. Lamp panel body; 4. Electric telescopic rod; 5. Support frame; 6. Outer frame; 601. Positioning hole; 7. Base plate; 701. Adhesive port; 8. Heating plate; 801. Heating wire; 9. First fixing plate; 10. Threaded rod; 11. Movable plate; 12. Pneumatic telescopic cylinder; 13. Scraper; 14. Servo motor; 15. Gear; 16. Second fixing plate; 17. Lead screw. Detailed Implementation

[0021] The technical solution of this utility model will now be clearly and completely described in conjunction with the accompanying drawings. In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] The present invention will be further described below with reference to the accompanying drawings.

[0024] Please refer to the following: Figures 1-5This utility model discloses a chip mounting device for LED lamp bead production, comprising: a base 1, a lamp board template 2 placed at the top center of the base 1, an electric telescopic rod 4 installed inside the corner of the base 1, a support frame 5 connected to the output end of the electric telescopic rod 4, a soldering template structure sleeved on the inner side of the support frame 5, a first fixing plate 9 installed on one side of the upper end of the support frame 5, and threaded rods 10 connected to both ends of the first fixing plate 9 through bearings, and a solder paste scraping mechanism connected to the threaded rods 10.

[0025] Combination Figure 2 As shown, the solder paste stencil structure includes an outer frame 6, a base plate 7, and a heating plate 8. The inner bottom of the outer frame 6 is connected to the base plate 7. Heating plates 8 are connected to both ends of the outer frame 6 at the base plate 7, and the heating plates 8 are sealed to the base plate 7. The heating plates 8 facilitate the melting of the solder paste, allowing the scraper 13 to evenly spread it. The base plate 7 has an adhesive opening 701. Heating wires 801 are installed inside the heating plates 8. Positioning holes 601 are symmetrically provided at both ends of the outer frame 6. These positioning holes 601, in conjunction with the lead screw 17, facilitate the disassembly and assembly of the outer frame 6 and the support frame 5. This allows for the replacement of different specifications of solder paste stencil structures according to different specifications of the lamp board body 3. Figure 3 As shown, the solder paste scraping mechanism includes a movable plate 11, a pneumatic telescopic cylinder 12, and a scraper 13. The pneumatic telescopic cylinder 12 is fixedly installed on the top of the movable plate 11. The output end of the pneumatic telescopic cylinder 12 passes through the movable plate 11 and is fixedly connected to the scraper 13. Thus, through the two scrapers 13, the solder paste scraping mechanism can move to one end of the base plate 7. Then, the scraper 13 located on the outermost side of the base plate 7 descends, while the other scraper 13 rises, thereby facilitating the back-and-forth scraping of solder paste.

[0026] The system includes two scraper blades 13, four pneumatic telescopic cylinders 12, and a threaded rod 10 internally connected to the movable plate 11. A servo motor 14 is fixedly mounted at the middle of one end of the first fixed plate 9. The output end of the servo motor 14 is connected to a gear 15 via a chain, and the servo motor 14 is a reversible motor. The gear 15 is fixedly connected to one end of the threaded rod 10. A second fixed plate 16 is located on the upper end of the support frame 5 corresponding to one end of the first fixed plate 9. The second fixed plate 16 is connected to one end of the threaded rod 10 via a bearing. There are two threaded rods 10. Figure 4 As shown, a lamp board placement groove 201 is provided on the upper end of the lamp board template 2 corresponding to the pasting opening 701. The lamp board body 3 is placed on the lamp board template 2 through the lamp board placement groove 201, so as to facilitate the replacement of lamp board templates 2 of different specifications according to different lamp board bodies 3. The two ends of the support frame 5 are directly opposite the positioning holes 601 and have threaded rods 17 passing through them. One end of the threaded rod 17 passes through the support frame 5 and is threaded into the positioning hole 601.

[0027] Specifically, in use, the main body 3 of the lamp board to be fitted with LED beads is placed in the lamp board placement groove 201. An appropriate amount of solder paste is poured into one end of the soldering template structure located on the heating plate 8, and the heating wire 801 in the heating plate 8 is energized to heat the solder paste. Then, the electric telescopic rod 4 drives the support frame 5 to descend onto the base 1. Next, the pneumatic telescopic cylinder 12 drives the scraper 13 on one side to descend, so that the bottom end of the scraper 13 contacts the base plate 7. Then, the servo motor 14 drives the threaded rod 10 to rotate through the belt. The threaded rod 10 then drives the movable plate 11 in the solder paste scraping mechanism to move. The movable plate 11 moves along with the scraper 13, and the scraper 13 scrapes the molten solder paste on the base plate 7. When the solder paste passes through the bonding opening 701, it adheres to the corresponding position on the lamp board main body 3 where the LED beads need to be fitted. Finally, the LED beads are fitted onto the lamp board main body 3 coated with solder paste.

[0028] The above are merely preferred embodiments of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

[0029] All other parts of this utility model that are not described in detail belong to the prior art, and therefore will not be described in detail here.

[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A surface mount device for LED chip manufacturing, comprising: The base (1) is characterized in that a lamp board template (2) is placed at the top center of the base (1), an electric telescopic rod (4) is provided inside the corner of the base (1), a support frame (5) is connected to the output end of the electric telescopic rod (4), a tin-coating template structure is sleeved on the inner side of the support frame (5), a first fixing plate (9) is provided on one side of the upper end of the support frame (5), and threaded rods (10) are connected to both ends of the first fixing plate (9) through bearings, and the threaded rods (10) are connected to a solder paste scraping mechanism.

2. The LED chip mounting device for LED chip production as described in claim 1, characterized in that, The tin-coating template structure includes an outer frame (6), a base plate (7), and a heating plate (8). The bottom inner side of the outer frame (6) is connected to the base plate (7). The outer frame (6) is connected to the heating plate (8) at both ends of the base plate (7). The heating plate (8) is sealed to the base plate (7).

3. The LED chip mounting device for LED chip production as described in claim 2, characterized in that, The base plate (7) has an adhesive opening (701), the heating plate (8) has a heating wire (801) inside, and the outer frame (6) has symmetrical positioning holes (601) at both ends.

4. The LED chip mounting device for LED chip production as described in claim 1, characterized in that, The solder paste scraping mechanism includes a movable plate (11), a pneumatic telescopic cylinder (12), and a scraper (13). The pneumatic telescopic cylinder (12) is fixedly installed on the top of the movable plate (11), and the output end of the pneumatic telescopic cylinder (12) passes through the movable plate (11) and is fixedly connected to the scraper (13).

5. The LED chip mounting device for LED chip production as described in claim 4, characterized in that, There are two scrapers (13), four pneumatic telescopic cylinders (12), and the movable plate (11) is internally connected to a threaded rod (10).

6. The LED chip mounting device for LED chip production as described in claim 1, characterized in that, A servo motor (14) is fixedly installed at the middle of one end of the first fixed plate (9). The output end of the servo motor (14) is connected to a gear (15) via a chain. The gear (15) is fixedly connected to one end of a threaded rod (10).

7. The LED chip mounting device for LED chip production as described in claim 1, characterized in that, The upper end of the support frame (5) is provided with a second fixing plate (16) corresponding to one end of the first fixing plate (9). The second fixing plate (16) is connected to one end of the threaded rod (10) through a bearing. There are two threaded rods (10).

8. The LED chip mounting device for LED chip production as described in claim 1, characterized in that, The upper end of the lamp board template (2) is provided with a lamp board placement groove (201) on one side corresponding to the pasting opening (701), and the lamp board template (2) holds the lamp board body (3) through the lamp board placement groove (201).

9. The LED chip mounting device for LED chip production as described in claim 1, characterized in that, The bearing frame (5) has lead screws (17) passing through the positioning holes (601) at both ends. One end of the lead screw (17) passes through the bearing frame (5) and is threaded into the positioning hole (601).

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