Wavelength conversion assembly and lighting equipment

Abstract

The utility model discloses a wavelength conversion assembly and lighting equipment. The wavelength conversion assembly comprises a supporting piece, a reflection unit and a fluorescent glass film. Wherein the reflection unit comprises a first reflection layer and a second reflection layer which are used for reflecting light; the first reflecting layer is connected between the second reflecting layer and the supporting piece, and the thermal conductivity of the first reflecting layer is larger than that of the second reflecting layer. The fluorescent glass film covers the side, away from the supporting piece, of the second reflecting layer and is suitable for being arranged on the light path where the exciting light is located. The fluorescent glass film provided by the utility model is a fluorescent film in which a glass matrix contains fluorescent particles. Therefore, the fluorescent film arranged on the wavelength conversion assembly adopts a glass matrix inorganic packaging mode, and compared with a mode of organic packaging by organic silica gel or resin and the like, the fluorescent glass film has better heat-conducting property, so that the phenomenon that the fluorescent glass film possibly becomes yellow under long-time irradiation of high-power laser is avoided, and the service life of the fluorescent glass film is prolonged. And the excitation efficiency of the excited light is ensured.

Description

Technical Field

[0001] This application relates to the field of laser lighting technology, and more specifically, to a wavelength conversion component and a lighting device. Background Technology

[0002] In the field of existing laser lighting technology, the common lighting method is to use laser to excite fluorescence. For example, using a blue laser to excite yellow fluorescence can mix them to form white light.

[0003] Because laser light sources generate strong heat during operation, fluorescent color wheels need to have excellent heat dissipation performance and high-temperature stability to ensure the luminous efficiency and operational stability of lighting equipment. However, the fluorescent films on existing fluorescent color wheels are usually organically encapsulated using solid materials such as silicone and resin, which causes them to yellow under prolonged, high-power laser irradiation, thus affecting the excitation efficiency of fluorescence. Utility Model Content

[0004] This application provides a wavelength conversion component and a lighting device.

[0005] According to a first aspect of this application, an embodiment of this application provides a wavelength conversion component, which includes a support member, a reflective unit, and a fluorescent glass film. The reflective unit includes a first reflective layer and a second reflective layer for reflecting light; the first reflective layer is connected between the second reflective layer and the support member, and the thermal conductivity of the first reflective layer is greater than that of the second reflective layer. The fluorescent glass film covers the side of the second reflective layer opposite to the support member; the fluorescent glass film is adapted to be disposed in the optical path of the excitation light, for converting the excitation light into laser light.

[0006] In some possible embodiments, the thermal conductivity of the first reflective layer is greater than or equal to 700 W / (m·K).

[0007] In some possible embodiments, both the first reflective layer and the second reflective layer are diffuse reflective layers, and the first reflective layer is doped with thermally conductive particles.

[0008] In some possible embodiments, the thermally conductive particles are hexagonal boron nitride particles.

[0009] In some possible embodiments, the thickness of the first reflective layer is greater than or equal to 20 μm and less than or equal to 50 μm; or / and the thickness of the second reflective layer is greater than or equal to 40 μm and less than or equal to 80 μm.

[0010] In some possible embodiments, the fluorescent glass film includes a glass matrix and fluorescent particles, wherein the fluorescent particles include at least two of red fluorescent particles, yellow fluorescent particles, and green fluorescent particles.

[0011] In some possible embodiments, the glass matrix includes SiO2-B2O3-RO and SiO2-TiO2-Nb2O5-R. ，2 At least one of O and ZnO-P2O5, wherein R is at least one of Mg, Ca, Sr, Ba, Na, and K, and R ， It is at least one of Li, Na, and K.

[0012] In some possible embodiments, the support is a ceramic substrate.

[0013] According to a second aspect of this application, embodiments of this application also provide a lighting device, which includes a light source and the aforementioned wavelength conversion component. The light source is used to generate excitation light. The wavelength conversion component is disposed in the optical path of the excitation light and is used to generate illumination light.

[0014] In some possible embodiments, the color rendering index of the illumination light is greater than or equal to 80; or / and the color temperature of the illumination light is greater than or equal to 5000K and less than or equal to 8000K.

[0015] This application provides a wavelength conversion component and an illumination device. The wavelength conversion component may include a support, a reflective unit, and a fluorescent glass film. The reflective unit includes a first reflective layer and a second reflective layer for reflecting light, with the first reflective layer connected between the second reflective layer and the support. The fluorescent glass film covers the side of the second reflective layer opposite to the support and is adapted to be positioned in the optical path of the excitation light.

[0016] On one hand, this application uses a fluorescent glass film to achieve wavelength conversion. Here, "fluorescent glass film" refers to a fluorescent film containing fluorescent particles in a glass matrix. That is to say, in this application, the fluorescent film disposed on the wavelength conversion component adopts an inorganic encapsulation method with a glass matrix. Compared with organic encapsulation methods such as silicone or resin, the fluorescent glass film has better thermal conductivity, which avoids the yellowing phenomenon that may occur when the fluorescent glass film is irradiated by a high-power laser for a long time, thereby ensuring the excitation efficiency of the laser.

[0017] On the other hand, since the thermal conductivity of the first reflective layer in this application is greater than that of the second reflective layer, when the heat generated by the excitation light on the fluorescent glass film is transmitted from the second reflective layer to the first reflective layer, the heat can be quickly conducted away under the action of the first reflective layer, thereby avoiding the situation where heat is concentrated on the fluorescent glass film, improving the overall heat dissipation performance of the wavelength conversion component, and ensuring the service life of the lighting equipment equipped with the wavelength conversion component. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the lighting device provided in the embodiments of this application.

[0020] Figure 2 yes Figure 1 The diagram shows the structure of the wavelength conversion component in the lighting device. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative effort are within the scope of protection of the present application.

[0022] Please see Figure 1 This application provides a wavelength conversion component 100 and a lighting device 200 configured with the wavelength conversion component 100. The lighting device 200 refers to a device used to generate illumination light. For example, the lighting device 200 can be a laser light, a stage light, a vehicle light, a searchlight, etc.

[0023] Specifically, the lighting device 200 may include a light source 210 and a wavelength conversion component 100, wherein the light source 210 is used to generate excitation light L. The excitation light L serves as the excitation light for the wavelength conversion component 100; for example, the excitation light L may be a blue laser, with a center wavelength of 450 nm, 455 nm, etc. Of course, in other possible embodiments, the excitation light L may also be a violet laser, a deep blue laser, etc. Specifically, the light source 210 may be a laser generator, such as a gas laser generator, a solid-state laser generator, a semiconductor laser generator, etc. Multiple laser generators may be used to achieve high-power illumination from the lighting device 200.

[0024] In some other possible embodiments, the light source 210 may also be an LED generator, such as a blue LED lamp. In this case, the excitation light L may be blue LED light.

[0025] The wavelength conversion component 100 is adapted to be disposed in the optical path of the excitation light L. It is used to convert the excitation light L into a received laser F. The unconverted excitation light L combines with the received laser F to generate illumination light in the lighting device 200. Specifically, in this embodiment, the wavelength conversion component 100 adopts a reflective structure, which can improve the excitation efficiency of the received laser F. In some possible embodiments, the wavelength conversion component 100 may be a fluorescent color wheel.

[0026] It's easy to understand that during the process of the excitation light L passing through the wavelength conversion component 100, some light rays in the excitation light L may not be converted into the received laser F. This unconverted light will combine with the received laser F to form the illumination light emitted to the outside. For example, when a blue laser excites yellow fluorescence, some blue laser light will not be converted into yellow fluorescence. This unconverted blue laser light will combine with the excited yellow fluorescence to form white light (i.e., the illumination light).

[0027] In this embodiment, researchers conducted spectral testing on the lighting device 100 and found that the color rendering index (CRI) of the illumination light is greater than or equal to 80. For example, the CRI of the illumination light can be 80, 82, 84, 86, 88, etc. The color temperature of the illumination light is greater than or equal to 5000K and less than or equal to 8000K. For example, the color temperature of the illumination light can be 5000K, 6000K, 7000K, 8000K, etc. Therefore, the lighting device 100 in this embodiment has the advantages of a high CRI and a high color temperature, which can improve the market competitiveness of the lighting device 100.

[0028] Please see Figure 2 The wavelength conversion assembly 100 may include a support 10, a reflective unit 30, and a fluorescent glass film 50. The reflective unit 30 may include a first reflective layer 320 and a second reflective layer 340 for reflecting light. The first reflective layer 320 is connected between the second reflective layer 340 and the support 10, and the thermal conductivity of the first reflective layer 320 is greater than that of the second reflective layer 340. The fluorescent glass film 50 covers the side of the second reflective layer 340 facing away from the support 10, and the fluorescent glass film 50 is adapted to be disposed in the optical path of the excitation light L, for converting the excitation light L into a received laser F.

[0029] In one aspect, this embodiment uses a fluorescent glass film 50 to achieve wavelength conversion. Here, "fluorescent glass film 50" refers to a fluorescent film containing fluorescent particles in a glass matrix. That is, in this application, the fluorescent film disposed on the wavelength conversion component 100 adopts an inorganic glass encapsulation method. Compared with organic encapsulation methods such as silicone or resin, the fluorescent glass film 50 has better thermal conductivity, which avoids the yellowing phenomenon that may occur under long-term irradiation by high-power laser, thereby ensuring the excitation efficiency of laser F.

[0030] On the other hand, since the thermal conductivity of the first reflective layer 320 in this embodiment is greater than that of the second reflective layer 340, when the heat generated on the fluorescent glass film 50 by the excitation light L propagates from the second reflective layer 340 to the first reflective layer 320, the heat can be quickly conducted away to the support member 10 due to the higher thermal conductivity of the first reflective layer 320. This avoids the situation where heat is concentrated on the fluorescent glass film 50, improves the overall heat dissipation performance of the wavelength conversion component 100, and ensures the service life of the lighting equipment equipped with the wavelength conversion component 100.

[0031] The specific implementation of the wavelength conversion component 100 is described below.

[0032] In this embodiment, the support member 10 is generally sheet-like or block-like, serving to fix and support the reflective unit 30 and the fluorescent glass film 50. In some possible embodiments, the support member 10 can be a ceramic substrate, which has high heat resistance and heat dissipation performance to improve the overall heat dissipation performance of the wavelength conversion component 100. Specifically, the support member 10 can be one of the following ceramic substrates: aluminum nitride substrate, alumina substrate, boron nitride substrate, silicon nitride substrate, etc., and this embodiment does not impose a specific limitation.

[0033] In this embodiment, the reflective unit 30 is connected between the support member 10 and the fluorescent glass film 50, and it is used to reflect light. That is, the wavelength conversion component 100 in this embodiment adopts a reflective structure.

[0034] On one hand, the reflecting unit 30 can reflect the excitation light L. Specifically, during the process of the excitation light L passing through the fluorescent glass film 50, some light may not be converted into laser F. At this time, this part of the light will be reflected back to the fluorescent glass film 50 by the reflecting unit 30 to achieve secondary excitation of the laser F.

[0035] Therefore, compared to the transmissive wavelength conversion component 100, the reflective wavelength conversion component 100 has a higher fluorescence excitation efficiency. Of course, it is easy to understand that during the process of the excitation light L passing through the fluorescent glass film 50 twice, some light may still not be converted into the received laser F. This part of the light will be emitted to the outside to combine with the received laser F to generate illumination light.

[0036] On the other hand, the reflecting unit 30 can reflect the received laser F. Specifically, since the received laser F (i.e., fluorescence) is Lambertian light, a portion of the light in the received laser F will be emitted toward one side of the reflecting unit 30. Therefore, the reflecting unit 30 in this embodiment is also used to reflect this portion of the received laser F to improve the energy utilization efficiency of the received laser F.

[0037] Specifically, the reflective unit 30 may include a first reflective layer 320 and a second reflective layer 340 for reflecting light. The first reflective layer 320 is connected between the second reflective layer 340 and the support member 10, and the thermal conductivity of the first reflective layer 320 is greater than that of the second reflective layer 340. Specifically, the thermal conductivity of the first reflective layer 320 may be greater than or equal to 700 W / (m·K), for example, 700 W / (m·K), 725 W / (m·K), 750 W / (m·K), etc. The thermal conductivity of the second reflective layer 320 may be greater than or equal to 40 W / (m·K) and less than or equal to 80 W / (m·K), for example, 40 W / (m·K), 60 W / (m·K), 80 W / (m·K), etc.

[0038] Therefore, when the heat generated by the excitation light L on the fluorescent glass film 50 is transmitted from the second reflective layer 340 to the first reflective layer 320, the heat can be quickly conducted away to the support member 10 due to the high thermal conductivity of the first reflective layer 320, thereby avoiding the situation where the heat is concentrated on the fluorescent glass film 50.

[0039] In some possible embodiments, the first reflective layer 320 may be doped with thermally conductive particles (not shown in the figure) to give the first reflective layer 320 a high thermal conductivity. Exemplarily, the thermally conductive particles may be hexagonal boron nitride particles, which have the characteristics of high melting point, high temperature resistance, oxidation resistance, and high thermal conductivity. Their doping into the first reflective layer 320 can effectively improve its thermal conductivity, thereby maintaining the thermal stability of the primer. Furthermore, hexagonal boron nitride particles are white crystals, and this color characteristic is beneficial for improving the reflective performance of the first reflective layer 320.

[0040] In one implementation, the first reflective layer 320 may also be doped with metal oxide particles to improve its reflectivity. For example, the metal oxide particles could be alumina particles, which increase reflectivity. Due to their high refractive index, alumina particles can effectively reflect incident light. Furthermore, alumina particles typically have a large particle size, which can scatter light and increase the surface roughness of the first reflective layer 320, thereby improving its reflectivity. Alternatively, the metal oxide particles could be titanium oxide particles, which increase diffuse reflection, allowing light to be scattered uniformly in multiple directions. Because titanium oxide particles have a small particle size, they can increase the uniformity of particle distribution within the first reflective layer 320.

[0041] In one implementation, the metal oxide particles in the first reflective layer 320 can be a mixture of aluminum oxide particles and titanium oxide particles. The titanium oxide particles can effectively fill the gaps between the aluminum oxide particles to increase the particle density inside the first reflective layer 320.

[0042] In some possible embodiments, the second reflective layer 340 is doped with metal oxide particles (not shown in the figure). Specifically, the metal oxide particles may include at least one of aluminum oxide particles and titanium oxide particles. It should be noted that the second reflective layer 340 is not doped with hexagonal boron nitride particles. Therefore, compared with the first reflective layer 320, the second reflective layer 340 has lower thermal conductivity but higher reflectivity.

[0043] It is easy to see that, since both the first reflective layer 320 and the second reflective layer 340 are doped with metal oxide particles, both are diffuse reflective layers to achieve light reflection. Furthermore, because thermally conductive particles are added to the first reflective layer 320, heat can be quickly dissipated to ensure the lifespan of the wavelength conversion component 100.

[0044] In some possible embodiments, the thickness of the first reflective layer 320 is less than or equal to the thickness of the second reflective layer 340. On one hand, since the second reflective layer 340 is closer to the fluorescent glass film 50 than the first reflective layer 320, a thicker second reflective layer 340 can improve light reflection efficiency. On the other hand, compared to the second reflective layer 340, the first reflective layer 320 is doped with hexagonal boron nitride particles; therefore, a thinner first reflective layer 320 can reduce the processing cost of the wavelength conversion component 100 while ensuring thermal conductivity efficiency. Simultaneously, a thinner first reflective layer shortens the heat conduction path, which refers to the distance between the fluorescent glass film 50 and the support member 10, thereby improving heat conduction efficiency.

[0045] Specifically, the thickness of the first reflective layer 320 is greater than or equal to 20 μm and less than or equal to 50 μm. For example, the thickness of the first reflective layer 320 can be 20 μm, 30 μm, 40 μm, 50 μm, etc. The thickness of the second reflective layer 340 is greater than or equal to 40 μm and less than or equal to 80 μm. For example, the thickness of the second reflective layer 340 can be 40 μm, 60 μm, 80 μm, etc.

[0046] In this embodiment, a fluorescent glass film 50 covers the side of the second reflective layer 340 away from the support member 10. The fluorescent glass film 50 is disposed in the optical path where the excitation light L is located, and it is used to convert the excitation light L into the received laser F.

[0047] Here, "fluorescent glass film 50" refers to a film containing fluorescent particles in a glass matrix. Specifically, the fluorescent glass film 50 may include a glass matrix (not shown in the figure) and fluorescent particles 520. The glass matrix may include SiO2-B2O3-RO, SiO2-TiO2-Nb2O5-R, etc. ，2 At least one of O and ZnO-P2O5, wherein R is at least one of Mg, Ca, Sr, Ba, Na, and K, and R ， It is at least one of Li, Na, and K. For example, the glass matrix may include SiO2-B2O3-Na2O, SiO2-TiO2-Nb2O5-Li2O, etc. That is to say, in this application, the fluorescent film disposed on the wavelength conversion component 100 adopts an inorganic encapsulation method with a glass matrix, which improves the thermal conductivity of the fluorescent glass film 50 compared with organic encapsulation methods such as silicone or resin. In addition, the glass matrix is ​​continuously distributed to ensure light transmittance, thermal conductivity and temperature resistance.

[0048] In this embodiment, the fluorescence F generated by the fluorescent glass film 50 can be a single color fluorescence or a mixture of multiple colors fluorescence. Specifically, the excitation light L can be a blue laser, and the fluorescent particles 520 can include at least two of red fluorescent particles, yellow fluorescent particles, and green fluorescent particles.

[0049] In some possible embodiments, the fluorescent particles 520 may include red fluorescent particles, yellow fluorescent particles, and green fluorescent particles. In this case, the laser F may be a mixture of red, yellow, and green fluorescence. Therefore, when the wavelength conversion component 100 is configured in the lighting device 200, the generated illumination light can simultaneously mix blue laser, red fluorescence, yellow fluorescence, and green fluorescence to achieve a high color rendering index, which can meet the high color rendering index requirements of some lighting or photographic devices. It should be noted that when the fluorescent particles 520 simultaneously include red, yellow, and green fluorescent particles, the color rendering index of the illumination light can be greater than or equal to 80 to achieve a high color rendering index lighting effect.

[0050] Specifically, the red fluorescent particles can be nitride particles, the yellow fluorescent particles can be cerium-doped yttrium aluminum garnet (Ce:YAG) scintillation crystal particles, and the green fluorescent particles can be aluminate (LuAG) particles.

[0051] In other possible embodiments, the fluorescent particles 520 may also include any two of red, yellow, and green fluorescent particles. Researchers can adjust this according to the actual application scenario of the lighting device 200, and this embodiment does not impose specific limitations. For example, the fluorescent particles 520 may include both red and yellow fluorescent particles. Alternatively, the fluorescent particles 520 may include both red and green fluorescent particles. It should be noted that when the fluorescent particles 520 include red fluorescent particles, the color rendering index of the illumination light can be significantly improved.

[0052] In some possible embodiments, the thickness of the fluorescent glass film 50 can be greater than or equal to 50 μm and less than or equal to 120 μm. For example, the thickness of the fluorescent glass film 50 can be 50 μm, 70 μm, 80 μm, 100 μm, 120 μm, etc. Therefore, the relatively small thickness of the fluorescent glass film 50 in this embodiment is beneficial for achieving a small-size design of the wavelength conversion component 100, thereby saving installation space for the lighting device 200.

[0053] The inventors of this application packaged the fabricated wavelength conversion component 100 using a reflective packaging method in conjunction with a 455nm blue laser (i.e., light source 210), and then performed a spectral test on the packaged lighting device 200. The test result showed a Color Rendering Index (CRI) of 86. Since the CRI of existing wavelength conversion components 100 is typically less than or equal to 63, this embodiment improves the CRI of the wavelength conversion component 100 by 36% compared to existing wavelength conversion components 100, thus achieving a high CRI lighting effect.

[0054] This embodiment provides a wavelength conversion component 100 and an illumination device 200 configured with the wavelength conversion component 100. The wavelength conversion component 100 may include a support member 10, a reflective unit 30, and a fluorescent glass film 50. The reflective unit 30 may include a first reflective layer 320 and a second reflective layer 340 for reflecting light. The first reflective layer 320 is connected between the second reflective layer 340 and the support member 10, and the thermal conductivity of the first reflective layer 320 is greater than that of the second reflective layer 340. The fluorescent glass film 50 covers the side of the second reflective layer 340 facing away from the support member 10, and the fluorescent glass film 50 is adapted to be disposed in the optical path of the excitation light L, for converting the excitation light L into a received laser F.

[0055] In one aspect, this embodiment uses a fluorescent glass film 50 to achieve wavelength conversion. Here, "fluorescent glass film 50" refers to a fluorescent film containing fluorescent particles in a glass matrix. That is, in this application, the fluorescent film disposed on the wavelength conversion component 100 adopts an inorganic encapsulation method with a glass matrix. Compared with organic encapsulation methods such as silicone or resin, the fluorescent glass film 50 has better thermal conductivity, which avoids the yellowing phenomenon that may occur under long-term irradiation by high-power laser, thereby ensuring the excitation efficiency of laser F.

[0056] On the other hand, since the thermal conductivity of the first reflective layer 320 in this embodiment is greater than that of the second reflective layer 340, when the heat generated on the fluorescent glass film 50 by the excitation light L propagates from the second reflective layer 340 to the first reflective layer 320, the heat can be quickly conducted away under the action of the first reflective layer 320, thereby avoiding the situation where heat is concentrated on the fluorescent glass film 50, improving the overall heat dissipation performance of the wavelength conversion component 100, so as to ensure the service life of the lighting equipment equipped with the wavelength conversion component 100.

[0057] In this application specification, certain terms are used to refer to specific components. Those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. The specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" throughout the specification and claims is an open-ended term and should be interpreted as "including but not limited to"; "generally" means that those skilled in the art can solve the technical problem within a certain margin of error and basically achieve the technical effect.

[0058] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "inside", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the purpose of simplifying the description of this application and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0059] In this application, unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or merely surface contact. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0060] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0061] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A wavelength conversion component, characterized in that, include: Support components; The reflective unit includes a first reflective layer and a second reflective layer for reflecting light; the first reflective layer is connected between the second reflective layer and the support member, and the thermal conductivity of the first reflective layer is greater than that of the second reflective layer; and A fluorescent glass film covers the side of the second reflective layer away from the support member; the fluorescent glass film is adapted to be disposed in the optical path where the excitation light is located, for converting the excitation light into laser light.

2. The wavelength conversion component according to claim 1, characterized in that, The thermal conductivity of the first reflective layer is greater than or equal to 700. .

3. The wavelength conversion component according to claim 1, characterized in that, Both the first reflective layer and the second reflective layer are diffuse reflective layers, and the first reflective layer is doped with thermally conductive particles.

4. The wavelength conversion component according to claim 3, characterized in that, The thermally conductive particles are hexagonal boron nitride particles.

5. The wavelength conversion component according to claim 1, characterized in that, The thickness of the first reflective layer is greater than or equal to 20. and less than or equal to 50 ; or / and The thickness of the second reflective layer is greater than or equal to 40. and less than or equal to 80 .

6. The wavelength conversion component according to any one of claims 1 to 5, characterized in that, The fluorescent glass film comprises a glass matrix and fluorescent particles, wherein the fluorescent particles include at least two of red fluorescent particles, yellow fluorescent particles, and green fluorescent particles.

7. The wavelength conversion component according to any one of claims 1 to 5, characterized in that, The support component is a ceramic substrate.

8. A lighting device, characterized in that, include: A light source used to generate excitation light; as well as The wavelength conversion component as described in any one of claims 1 to 7 is disposed in the optical path of the excitation light and is used to generate illumination light.

9. The lighting device according to claim 8, characterized in that, The color rendering index of the illumination light is greater than or equal to 80; or / and The color temperature of the illumination light is greater than or equal to 5000K and less than or equal to 8000K.

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