Multilayer circuit board with optimized structure

Abstract

A multilayer circuit board with an optimized structure comprises a plurality of flexible circuit daughter boards which are sequentially overlapped, a folding area is arranged between every two adjacent flexible circuit daughter boards, and the folding areas between every two adjacent flexible circuit daughter boards are arranged in a staggered mode. A folding hole is formed in the center line of the folding area, the two ends of the folding hole are in a sharp corner shape, notch parts are arranged at the two ends of the center line of the folding area, and the inner side ends of the notch parts are in a sharp corner shape. All sharp corner end points on the folding area are located on the center line. According to the utility model, the folding area is arranged, and the required multilayer flexible circuit board is formed in a folding and attaching mode, so that the labor-saving process is simplified, the production cycle is shortened, and the working efficiency is improved. In addition, due to the arrangement of the rhombic holes in the folding area, folding is facilitated, and the folding and bending performance of the multi-layer flexible circuit board is improved. The practicability is high, and the popularization significance is high.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a multilayer circuit board with an optimized structure. Background Technology

[0002] As printed circuit boards (PCBs) trend towards being "lighter, thinner, shorter, and smaller," the requirements for circuit design and manufacturing methods in electronic products are becoming increasingly stringent. Traditional PCBs with uniform thickness and fine lines can no longer fully meet the demands of the electronics industry. To adapt to the diversified and modular development trend of electronic products, flexible PCBs that can be bent at multiple angles have emerged. However, traditional multilayer flexible PCBs typically involve first preparing multiple independent PCBs, then stacking and pressing them together sequentially. This traditional multilayer PCB structure suffers from cumbersome processes. Utility Model Content

[0003] Therefore, it is necessary to provide a multilayer circuit board with an optimized structure to address the shortcomings of existing technologies.

[0004] A multilayer circuit board with an optimized structure includes several flexible circuit sub-boards stacked sequentially. Folding areas are provided between adjacent flexible circuit sub-boards, and the folding areas between adjacent flexible circuit sub-boards are staggered. A folding hole is provided on the center line of the folding area, and the two ends of the folding hole are pointed. Cutouts are provided at both ends of the center line of the folding area, and the inner ends of the cutouts are pointed. All the pointed ends on the folding area are located on the center line.

[0005] Furthermore, the folded area is provided with a number of rhomboid holes, which are arranged on the same straight line and form a notch at each end of the folded area.

[0006] Furthermore, the rhomboid holes in adjacent folded areas are arranged in a one-to-one correspondence, and the four opposite corners of the corresponding rhomboid holes are on the same straight line.

[0007] Furthermore, the diamond-shaped hole in the folded area is an elongated hole, and the two ends of the elongated hole are pointed ends.

[0008] Furthermore, the length of the elongated hole in the upper folding area is greater than that in the lower folding area. After folding, a layered structure is formed between the upper and lower folding areas, arranged from the outside to the inside.

[0009] Furthermore, the flexible circuit board sub-board includes a base layer and circuit layers disposed on both sides thereof, and the folding area only has the base layer.

[0010] Furthermore, a fiber mesh layer is also provided on the base layer, and only the fiber mesh layer is retained in the folded area of ​​the base layer.

[0011] In summary, the multilayer circuit board with optimized structure of this utility model, by setting a folding area and employing folding, and then bonding the two adjacent surfaces with an adhesive layer, forms the required multilayer flexible circuit board. This simplifies the process, shortens the production cycle, and improves work efficiency. Furthermore, the diamond-shaped holes in the folding area not only facilitate folding but also improve the foldability and bending performance of the multilayer flexible circuit board.

[0012] This utility model is highly practical and has significant potential for widespread application. Attached Figure Description

[0013] Figure 1 This is a side view of the first embodiment of a multilayer circuit board with an optimized structure according to the present invention.

[0014] Figure 2 for Figure 1 A schematic diagram of the unfolded structure of the circuit board;

[0015] Figure 3 This is a schematic diagram of the unfolded structure of a second embodiment of a multilayer circuit board with an optimized structure according to the present invention;

[0016] Figure 4 for Figure 3 Side view of the circuit board;

[0017] Figure 5 This is a schematic diagram of the unfolded structure of a third embodiment of a multilayer circuit board with an optimized structure according to the present invention;

[0018] Figure 6 and Figure 7 for Figure 5 Schematic diagrams of two cross-sectional structures of the circuit board. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0020] like Figure 1 and Figure 2 As shown, this invention provides a first embodiment of a multilayer circuit board with an optimized structure. The multilayer circuit board with the optimized structure includes several flexible circuit sub-boards 10 stacked sequentially. A folding area 11 is provided between adjacent flexible circuit sub-boards 10. The folding areas 11 between adjacent flexible circuit sub-boards 10 are staggered, that is, if the previous folding area 11 is on the left side of the multilayer circuit board, then the next folding area 11 is on the right side of the multilayer circuit board.

[0021] The folding area 11 is provided with a plurality of diamond-shaped holes 12, which are arranged on the same straight line and form a cut-out 111 at each end of the folding area 11. The opposite sharp ends of the diamond-shaped holes 12 are arranged on the center line of the folding area 11, and the diamond-shaped holes 12 of adjacent folding areas 11 are arranged in a one-to-one correspondence. In this embodiment, the arrangement of the diamond-shaped holes 12 can reduce the rigidity of the folding area 11, making the folding area 11 more flexible and easier to fold; the sharp angles of the diamond-shaped holes 12, which are arranged on the center line of the folding area 11, facilitate folding guidance, while the other two opposite corners provide a structural advantage for the laterally bent multilayer board after bonding. The multilayer flexible circuit board can form a bending line along the diagonal of the two opposite diamond-shaped holes 12 of two adjacent folding areas 11 in the lateral extension direction, thereby improving the bending flexibility of the multilayer flexible circuit board and making its bending directional and uniform.

[0022] like Figures 3 to 4 As shown, this is a second embodiment of a multilayer circuit board with an optimized structure according to this utility model. The structure of this embodiment is basically the same as that of the first embodiment, except that: In this embodiment, the diamond-shaped hole of the folding area 11 is an elongated hole 111a, and the length of the elongated hole 111a of the upper folding area 11 is greater than that of the elongated hole 111a of the lower folding area 11. Thus, after folding, a layered structure arranged from the outside to the inside will be formed between the upper and lower folding areas 11. Therefore, during lamination, the layered structure of the folding area 11 can be detected by high-precision CCD to determine whether the lamination meets the standard. If there are inaccuracies in the vertical alignment, it can be detected which structures have problems; thus, it is convenient to quickly discover abnormal problems in the lamination, handle abnormalities, and rework the product. In addition, additional diamond-shaped holes 112a are provided on both sides of the folding area 11 where the elongated hole 111a in the middle is relatively short.

[0023] like Figure 5 and Figure 6 As shown, this is a third embodiment of a multilayer circuit board with an optimized structure according to this utility model. The structure of this embodiment is basically the same as that of the first embodiment, except that in this embodiment, the flexible circuit board sub-board 10 includes a base layer 101 and circuit layers 102 disposed on both sides thereon, while the folding area 11 only has the base layer 101, and the circuit layers 102 on both sides of the base layer 101 are removed. This further improves the flexibility of folding.

[0024] Furthermore, such as Figure 7 As shown, a fiber mesh layer 103 is also provided on the base layer 101. The base layer retains only the fiber mesh layer 103 in the folding area 11, which can further improve the flexibility and convenience of folding. The fiber mesh layer 103 can improve the toughness of the flexible circuit board and reduce the probability of breakage during folding and bending in the horizontal, vertical and other directions.

[0025] In summary, the multilayer circuit board with optimized structure of this utility model, by setting a folding area 11 and employing folding, and bonding an adhesive layer between adjacent surfaces, forms the desired multilayer flexible circuit board. This simplifies the process, shortens the production cycle, and improves work efficiency. Furthermore, the diamond-shaped holes 12 in the folding area 11 not only facilitate folding but also improve the foldability and bending performance of the multilayer flexible circuit board. This utility model is highly practical and has significant potential for widespread application.

[0026] The above-described embodiments only illustrate three implementation methods of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A multilayer circuit board with an optimized structure, characterized in that: It includes several flexible circuit sub-boards stacked sequentially, with folding areas provided between adjacent flexible circuit sub-boards, and the folding areas between adjacent flexible circuit sub-boards are staggered; a folding hole is provided on the center line of the folding area, and the two ends of the folding hole are pointed; a cut is provided at both ends of the center line of the folding area, and the inner end of the cut is pointed; all the pointed ends on the folding area are located on the center line.

2. A multilayer circuit board with an optimized structure as described in claim 1, characterized in that: The folded area is provided with a number of rhomboid holes, which are arranged on the same straight line and form a notch at each end of the folded area.

3. A multilayer circuit board with an optimized structure as described in claim 2, characterized in that: The diamond-shaped holes in adjacent folded areas are set in a one-to-one correspondence, and the four opposite corners of the corresponding diamond-shaped holes are on the same straight line.

4. A multilayer circuit board with an optimized structure as described in claim 1, characterized in that: The diamond-shaped hole in the folded area is an elongated hole, and the two ends of the elongated hole are pointed ends.

5. A multilayer circuit board with an optimized structure as described in claim 4, characterized in that: The length of the long hole in the upper fold area is greater than that in the lower fold area. After folding, a layered structure is formed between the upper and lower fold areas, arranged from the outside to the inside.

6. A multilayer circuit board with an optimized structure as described in claim 1, characterized in that: The flexible circuit board includes a base layer and circuit layers disposed on both sides thereof, and the folded area has only the base layer.

7. A multilayer circuit board with an optimized structure as described in claim 6, characterized in that: A fiber mesh layer is also provided on the base layer, and only the fiber mesh layer is retained in the folded area of ​​the base layer.

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