Semiconductor equipment part cleaning table

Abstract

The semiconductor equipment part cleaning table comprises a base and a shell, the shell is installed at the top end of the base, water storage tanks are symmetrically installed at the position, on one side of the shell, of the top end of the base, power pumps are installed at the top ends of the water storage tanks, and a connecting pipe is installed between the two sets of power pumps. And a conveying pipe is installed at the bottom end of the connecting pipe and extends into the base, liquid outlet pipes are symmetrically arranged in the position, on one side of the conveying pipe, of the base, the liquid outlet pipes are connected with the conveying pipe, and multiple sets of nozzles are arranged on the outer walls of the liquid outlet pipes at equal intervals. The cleaning table can be conveniently opened and closed to feed semiconductor parts for cleaning, the semiconductor equipment parts can be conveniently placed in the cleaning table in a transverse moving mode, multi-position and multi-direction water spraying cleaning is convenient, circumferential rotating cleaning is convenient, and the cleaning efficiency is improved. And the cleaning efficiency of the cleaning table and the convenience of taking the semiconductor parts are improved.

Description

Technical Field

[0001] This utility model relates to the field of cleaning station technology, specifically a cleaning station for semiconductor equipment parts. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. From both a technological and economic development perspective, semiconductors are of great importance. The core components of most electronic products, such as computers, mobile phones, or digital recorders, are closely related to semiconductors. In semiconductor manufacturing processes, the parts of semiconductor manufacturing equipment must be cleaned and regenerated regularly or irregularly to maintain the performance of the semiconductor manufacturing equipment and extend its service life.

[0003] A semiconductor equipment parts cleaning station disclosed in patent announcement number CN213378155U includes a housing, a heating water tank, and pipes. The heating water tank is fixedly installed on the left side of the housing, and a heating rod is installed on the cover of the heating water tank. Pipes are fixedly installed on both sides of the housing. The upper ends of the pipes extend through through holes in the side walls of the housing to the middle of the housing and are fixedly connected to water pipes. Multiple nozzles are evenly distributed on the water pipes. A hot air blower is fixedly installed on the top of the housing, and hot air blowers are installed on the side walls of the housing. Cylinders are fixedly installed at the four corners of the housing, and filter plates are hinged to the cylinders. A wastewater tank is provided at the bottom of the housing, and a water outlet is provided below the wastewater tank. A door is provided on the outside of the housing, and the door is hinged to the housing via a pivot.

[0004] While it achieves good cleaning results and saves costs, it does not solve the problems of existing cleaning stations being inconvenient to open and close for easy insertion of semiconductor components, difficult to spray water from multiple locations and directions, and difficult to perform uniform spraying in a circular motion. This greatly affects the cleaning efficiency of the cleaning station and the ease of handling semiconductor components. Utility Model Content

[0005] The purpose of this utility model is to provide a semiconductor equipment component cleaning station to solve the problems mentioned in the background art, such as the inconvenience of opening and closing the cleaning station to conveniently feed in semiconductor components for cleaning, the inconvenience of multi-position and multi-directional water spraying, and the inconvenience of uniform spraying in a circular rotation, which affect the cleaning efficiency of the cleaning station and the convenience of picking up semiconductor components.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor equipment parts cleaning station, comprising a base and a housing. The housing is mounted on the top of the base, and water tanks are symmetrically mounted on the top of the base on one side of the housing. A power pump is mounted on the top of each water tank, and a connecting pipe is installed between two sets of power pumps. A delivery pipe is mounted on the bottom of the connecting pipe and extends into the interior of the base. A liquid outlet pipe is symmetrically arranged inside the base on one side of the delivery pipe and is connected to the delivery pipe. Multiple sets of nozzles with equal spacing are arranged on the outer wall of each liquid outlet pipe. A support pipe is mounted on the top of each liquid outlet pipe on one side of the nozzles, and a flat spray nozzle is mounted on the outer wall of each support pipe. A drain port is provided on the outer wall of the base on one side of the water tank. A support box is installed inside the base below the housing, and a first waterproof motor is installed inside the support box. A pulley assembly is installed at the output end of the first waterproof motor.

[0007] Preferably, a rotating shaft is movably mounted inside the support box on one side of the pulley assembly, and the pulley assembly extends to the surface of the rotating shaft, while the rotating shaft extends into the interior of the housing.

[0008] Preferably, a rotating disk is installed at the top of the rotating shaft, a cleaning cylinder is provided at the top of the rotating disk, and support arms are symmetrically installed on the rotating disk surface on one side of the cleaning cylinder.

[0009] Preferably, a support shaft is installed on the outer wall of the cleaning cylinder on one side of the support arm, and the cleaning cylinder is movably connected to the support arm through the support shaft. Multiple sets of mesh holes with equal spacing are provided on the outer wall of the cleaning cylinder on one side of the support shaft.

[0010] Preferably, a support frame is installed at the bottom of the support box, and a second waterproof motor is installed inside the base on one side of the support frame. A threaded rod is provided inside the base on one side of the second waterproof motor, and the output end of the second waterproof motor is connected to the threaded rod.

[0011] Preferably, the surface of the threaded rod is fitted with a threaded block, and the threaded rod and the threaded block are threadedly connected, and the threaded block is fixedly connected to the support frame.

[0012] Preferably, a protective door is slidably installed on the outer wall of the housing, and an electric push rod is installed on the outer wall of the housing on one side of the protective door. A telescopic rod is installed at the output end of the electric push rod, and the telescopic rod is connected to the protective door.

[0013] Preferably, a control panel is installed on the outer wall of the base, and the output end of the control panel is electrically connected to the input end of the power pump, the first waterproof motor, the second waterproof motor, and the electric push rod.

[0014] Compared with the prior art, the beneficial effects of this utility model are: the cleaning station not only realizes the convenient opening and closing of the cleaning station to send in semiconductor parts for cleaning, but also facilitates the horizontal movement of semiconductor equipment parts for placement, facilitates multi-position and multi-directional water spray cleaning, and facilitates circumferential rotation cleaning, thereby improving the cleaning efficiency of the cleaning station and the convenience of picking up semiconductor parts. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a three-dimensional structural diagram of the power pump of this utility model;

[0017] Figure 3 This is a three-dimensional structural diagram of the cleaning cylinder of this utility model;

[0018] Figure 4 This is a front view structural diagram of the present utility model;

[0019] Figure 5 This is a front view cross-sectional structural diagram of the threaded rod of this utility model;

[0020] Figure 6 This is a side view sectional structural diagram of the base of this utility model.

[0021] In the diagram: 1. Base; 2. Housing; 3. Water tank; 4. Power pump; 5. Connecting pipe; 6. Delivery pipe; 7. Discharge pipe; 8. Support pipe; 9. Flat spray nozzle; 10. Spray head; 11. Support box; 12. First waterproof motor; 13. Pulley assembly; 14. Rotating shaft; 15. Rotary disc; 16. Cleaning cylinder; 17. Support arm; 18. Second waterproof motor; 19. Threaded rod; 20. Support frame; 21. Electric push rod; 22. Telescopic rod; 23. Protective door; 24. Drain outlet; 25. Support shaft; 26. Mesh; 27. Threaded block; 28. Control panel. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0023] Please see Figure 1-6An embodiment of this utility model provides a semiconductor equipment parts cleaning table, including a base 1 and a housing 2. The housing 2 is installed on the top of the base 1. A water storage tank 3 is symmetrically installed on the top of the base 1 on one side of the housing 2. A power pump 4 is installed on the top of each water storage tank 3. The power pump 4 is used for power output. A connecting pipe 5 is provided between the two sets of power pumps 4. A conveying pipe 6 is installed at the bottom of the connecting pipe 5 and extends into the interior of the base 1. A liquid outlet pipe 7 is symmetrically arranged inside the base 1 on one side of the conveying pipe 6. The liquid outlet pipe 7 is connected to the conveying pipe 6. Multiple sets of nozzles 10 with equal spacing are provided on the outer wall of each liquid outlet pipe 7. A support pipe 8 is installed on the top of each liquid outlet pipe 7 on one side of the nozzle 10. A flat spray nozzle 9 is installed on the outer wall of each support pipe 8. A drain port 24 is provided on the outer wall of the base 1 on one side of the water storage tank 3. A support box 11 is installed inside the base 1 below the housing 2. A first waterproof motor 12 is installed inside the support box 11. The first waterproof motor 12 is used for power output.

[0024] A pulley assembly 13 is installed at the output end of the first waterproof motor 12. A rotating shaft 14 is movably installed inside the support box 11 on one side of the pulley assembly 13. The pulley assembly 13 extends to the surface of the rotating shaft 14, and the rotating shaft 14 extends into the interior of the housing 2. A rotating disk 15 is installed at the top of the rotating shaft 14. A cleaning cylinder 16 is provided at the top of the rotating disk 15. Support arms 17 are symmetrically installed on the surface of the rotating disk 15 on one side of the cleaning cylinder 16. Support shafts 25 are installed on the outer wall of the cleaning cylinder 16 on one side of the support arm 17. The cleaning cylinder 16 is movably connected to the support arm 17 through the support shaft 25. Multiple sets of mesh holes 26 with equal spacing are provided on the outer wall of the cleaning cylinder 16 on one side of the support shaft 25. The mesh holes 26 are arranged in a dense pattern, allowing the cleaning liquid to flow in and out freely.

[0025] In use, a set of power pumps 4 are turned on via the control panel 28. Power pumps 4 pump the cleaning fluid from a set of water tanks 3 through connecting pipes 5 to the inside of the delivery pipe 6, then to the inside of the outlet pipe 7, and finally to the inside of the support pipe 8. The cleaning fluid is then sprayed out through flat nozzles 9 and spray heads 10. The cleaning fluid enters the inside of the cleaning cylinder 16 through multiple sets of mesh holes 26 on its surface, facilitating multi-position and multi-directional cleaning of the semiconductor equipment components inside the cleaning cylinder 16. The first waterproof motor 12 is turned on via the control panel 28. Supported by the support box 11, the first waterproof motor 12 drives the pulley assembly 13 to move. The pulley assembly 13 drives the rotating shaft 14 to rotate, which in turn drives the rotating disk 15 to rotate. The rotating disk 15 drives the support arm 17 to rotate, and the support arm 17 drives the cleaning cylinder 16 to rotate via the support shaft 25. Under the action of gravity, the cleaning cylinder 16 always remains vertical, facilitating the rotation of the internal components. The semiconductor equipment parts are cleaned by rotating in a circular motion. After cleaning, another set of power pumps 4 is turned on by operating control panel 28. Power pumps 4 deliver clean water from another set of water tanks 3 to the inside of connecting pipe 5. The water is then delivered from connecting pipe 5 to the inside of liquid outlet pipe 7 and support pipe 8 through delivery pipe 6. The water is sprayed out by flat spray nozzles 9 and spray head 10 to facilitate rinsing of the cleaning fluid residue on the surface of the semiconductor equipment parts, so as to avoid corrosion damage to the parts by the cleaning fluid. The cleaning fluid and water are discharged through the drain port 24 on the surface of base 1. After cleaning, the second waterproof motor 18 and electric push rod 21 are turned on by operating control panel 28 again to facilitate the removal of cleaning cylinder 16. With the support of support shaft 25, it is convenient for the staff to rotate cleaning cylinder 16 to facilitate the emptying of semiconductor equipment parts inside cleaning cylinder 16. This realizes convenient multi-position and multi-directional water spray cleaning of the cleaning table, facilitates circular rotation cleaning, facilitates the rotational emptying of semiconductor equipment parts, and improves the cleaning efficiency of the cleaning table.

[0026] A support frame 20 is installed at the bottom of the support box 11. A second waterproof motor 18 is installed inside the base 1 on one side of the support frame 20. The second waterproof motor 18 provides power output. A threaded rod 19 is provided inside the base 1 on one side of the second waterproof motor 18. The output end of the second waterproof motor 18 is connected to the threaded rod 19. A threaded block 27 is fitted on the surface of the threaded rod 19. The threaded rod 19 and the threaded block 27 are threadedly connected. The threaded block 27 is fixedly connected to the support frame 20. A protective door 23 is slidably installed on the outer wall of the housing 2. An electric push rod 21 is installed on the outer wall of the housing 2 on one side of the protective door 23. The electric push rod 21 provides power output. A telescopic rod 22 is installed at the output end of the electric push rod 21. The telescopic rod 22 is connected to the protective door 23. A control panel 28 is installed on the outer wall of the base 1. The output end of the control panel 28 is electrically connected to the input end of the power pump 4, the first waterproof motor 12, the second waterproof motor 18, and the electric push rod 21.

[0027] In use, the electric push rod 21 is activated via the control panel 28, which drives the telescopic rod 22 to move. With the sliding support of the protective door 23 and the housing 2, the telescopic rod 22 adjusts the height of the protective door 23 to facilitate its removal from the surface of the housing 2. The second waterproof motor 18 is activated via the control panel 28, and with the support of the base 1, it drives the threaded rod 19 to rotate. Through the threaded engagement of the threaded rod 19 and the threaded block 27, the threaded block 27 moves on the surface of the threaded rod 19, causing the support frame 20 to move. The support frame 20 then moves the support box 11, which in turn moves the rotating disk 15 via the rotating shaft 14. The cleaning drum 16 is moved by the rotating disk 15 to the outside of the housing 2, making it easier for staff to place the semiconductor equipment parts to be cleaned into the cleaning drum 16. The second waterproof motor 18 is opened in reverse, driving the threaded rod 19 to rotate in the opposite direction, which facilitates the movement of the cleaning drum 16 into the housing 2. The protective door 23 is closed again by operating the electric push rod 21 to facilitate the subsequent cleaning of the semiconductor equipment parts. This system enables convenient opening and closing of the cleaning table and the insertion of semiconductor equipment parts for cleaning. It also facilitates the horizontal movement of semiconductor equipment parts and improves the convenience of control and adjustment of the cleaning table.

[0028] Working principle: In use, with an external power supply, the electric push rod 21 first drives the telescopic rod 22 to move, which in turn moves the protective door 23 to adjust its height, facilitating its removal from the surface of the housing 2. The second waterproof motor 18 then drives the threaded rod 19 to rotate, causing the threaded block 27 to move on the surface of the threaded rod 19. The threaded block 27 then moves the support frame 20, which in turn moves the support box 11. The support box 11, via the rotating shaft 14, moves the rotating disk 15, which in turn moves the cleaning cylinder 16 to the outside of the housing 2, allowing workers to easily place the semiconductor equipment parts to be cleaned into the cleaning cylinder. Inside the cleaning cylinder 16, the second waterproof motor 18 is opened in reverse, driving the threaded rod 19 to rotate in the opposite direction, facilitating the movement of the cleaning cylinder 16 into the housing 2. The protective door 23 is then closed again by operating the electric push rod 21 to facilitate subsequent cleaning of the semiconductor equipment components. The cleaning fluid from the water tank 3 is transported by the power pump 4 through the connecting pipe 5 to the delivery pipe 6, then to the outlet pipe 7, and finally to the support pipe 8. The cleaning fluid is sprayed out through the flat nozzle 9 and the spray head 10, entering the cleaning cylinder 16 through multiple sets of mesh holes 26 on its surface. The internal structure of the cleaning cylinder 16 is designed to facilitate multi-position and multi-directional cleaning of the semiconductor equipment components inside. A first waterproof motor 12 drives a pulley assembly 13 to move, which in turn drives a rotating shaft 14 to rotate. The rotating shaft 14 then drives a rotating disk 15 to rotate, which in turn drives a support arm 17 to rotate. The support arm 17, via a support shaft 25, drives the cleaning cylinder 16 to rotate. Under the influence of gravity, the cleaning cylinder 16 remains vertical, facilitating the circular rotation and cleaning of the internal semiconductor equipment components. After cleaning, another set of power pumps 4 is activated via the control panel 28, which then pumps water from another set of storage tanks 3. Clean water is delivered to the interior of the connecting pipe 5, and then from the connecting pipe 5 to the interior of the liquid outlet pipe 7 and the support pipe 8 via the delivery pipe 6. It is then sprayed out by the flat spray nozzle 9 and the nozzle 10 to facilitate rinsing of the cleaning fluid residue on the surface of the semiconductor equipment parts, thereby preventing the parts from being corroded or damaged by the cleaning fluid. The cleaning fluid and water are discharged through the drain port 24 on the surface of the base 1. After cleaning, the control panel 28 is operated again to open the second waterproof motor 18 and the electric push rod 21 to facilitate the removal of the cleaning cylinder 16. With the support of the support shaft 25, the cleaning cylinder 16 can be rotated by the operator to facilitate the emptying of the semiconductor equipment parts inside the cleaning cylinder 16, thus completing the use of the cleaning table.

Claims

1. A semiconductor equipment component cleaning station, comprising a base (1) and a housing (2), characterized in that: A housing (2) is installed at the top of the base (1). A water storage tank (3) is symmetrically installed at the top of the base (1) on one side of the housing (2). A power pump (4) is installed at the top of each water storage tank (3). A connecting pipe (5) is installed between the two power pumps (4). A delivery pipe (6) is installed at the bottom of the connecting pipe (5). The delivery pipe (6) extends into the interior of the base (1). A liquid outlet pipe (7) is symmetrically arranged inside the base (1) on one side of the delivery pipe (6). All liquid outlet pipes (7) are connected to the delivery pipe (6). Multiple sets of nozzles (10) with equal spacing are provided on the outer wall. A support pipe (8) is installed at the top of the liquid outlet pipe (7) on one side of the nozzle (10). A flat spray nozzle (9) is installed on the outer wall of the support pipe (8). A drain port (24) is provided on the outer wall of the base (1) on one side of the water storage tank (3). A support box (11) is installed inside the base (1) below the shell (2). A first waterproof motor (12) is installed inside the support box (11). A pulley assembly (13) is installed at the output end of the first waterproof motor (12).

2. The semiconductor equipment component cleaning station according to claim 1, characterized in that: A rotating shaft (14) is movably installed inside the support box (11) on one side of the pulley assembly (13), and the pulley assembly (13) extends to the surface of the rotating shaft (14), and the rotating shaft (14) extends into the interior of the housing (2).

3. A semiconductor equipment component cleaning station according to claim 2, characterized in that: A rotating disk (15) is installed at the top of the rotating shaft (14), and a cleaning cylinder (16) is provided at the top of the rotating disk (15). Support arms (17) are symmetrically installed on the surface of the rotating disk (15) on one side of the cleaning cylinder (16).

4. A semiconductor equipment component cleaning station according to claim 3, characterized in that: Support shafts (25) are installed on the outer wall of the cleaning cylinder (16) on one side of the support arm (17). The cleaning cylinder (16) is movably connected to the support arm (17) through the support shafts (25). Multiple sets of mesh holes (26) with equal spacing are provided on the outer wall of the cleaning cylinder (16) on one side of the support shafts (25).

5. A semiconductor equipment component cleaning station according to claim 1, characterized in that: A support frame (20) is installed at the bottom of the support box (11). A second waterproof motor (18) is installed inside the base (1) on one side of the support frame (20). A threaded rod (19) is provided inside the base (1) on one side of the second waterproof motor (18), and the output end of the second waterproof motor (18) is connected to the threaded rod (19).

6. A semiconductor equipment component cleaning station according to claim 5, characterized in that: The threaded rod (19) is fitted with a threaded block (27) on its surface, and the threaded rod (19) is threadedly connected to the threaded block (27), and the threaded block (27) is fixedly connected to the support frame (20).

7. A semiconductor equipment component cleaning station according to claim 1, characterized in that: A protective door (23) is slidably installed on the outer wall of the housing (2). An electric push rod (21) is installed on the outer wall of the housing (2) on one side of the protective door (23). A telescopic rod (22) is installed at the output end of the electric push rod (21), and the telescopic rod (22) is connected to the protective door (23).

8. A semiconductor equipment component cleaning station according to claim 7, characterized in that: A control panel (28) is installed on the outer wall of the base (1). The output end of the control panel (28) is electrically connected to the input end of the power pump (4), the first waterproof motor (12), the second waterproof motor (18), and the electric push rod (21).

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