High-integration active temperature control type radio frequency laser

Abstract

The utility model discloses a high-integration active temperature control type radio frequency laser, which comprises a shell, a top cavity and a bottom cavity are arranged in the shell, and the top cavity and the bottom cavity are mutually independent to form an integrated discrete cavity structure; a heat sink unit and a laser unit are arranged in the bottom cavity; a temperature control unit is further arranged in the top cavity and used for transferring heat into the heat sink unit and controlling the temperature of the picosecond laser, the requirement for constant temperature during operation of the laser is met, the output stability of the laser is improved, and the service life of the laser is prolonged; the top cavity and the bottom cavity arranged in the shell are mutually independent to form an integrated discrete cavity structure, the problem of disordered wiring of an existing product is solved, the integration level is high, and the integrated design facilitates use of a user and maintenance and overhaul of an engineer; the picosecond laser can meet the requirement of constant temperature when the picosecond laser operates, and solves the problems of large size and low integration level of the existing picosecond laser.

Description

Technical Field

[0001] This utility model relates to the field of laser equipment technology, and in particular to a highly integrated active temperature-controlled radio frequency laser. Background Technology

[0002] With the rapid development of laser technology and applications, ultrafast lasers, including picosecond lasers, are being used more and more widely. Picosecond lasers have been widely used in materials processing, optoelectronic materials, and basic science. Due to their advantages such as low cost, compact structure, relatively high power, and wide usable wavelength range, they have become the preferred light source for many optical measurement technologies.

[0003] With the continuous development of technology, the original picosecond lasers can no longer meet people's current needs. In order to improve the output power and stability of picosecond lasers, it was found during research that a large amount of electrical energy is converted into heat energy during laser use, and the accumulation of heat will cause the output of picosecond lasers to be unstable and the output wavelength to change. If the laser cannot maintain temperature stability, it will affect its service life and output stability. Furthermore, most existing picosecond lasers cannot actively control the temperature, or if they have active temperature control, the temperature control drive is large and the temperature control is unstable. In addition, not only does the DC part need to provide a constant current source, but the RF bias part also needs to add an additional bias circuit module, which makes the connection operation complex and unstable.

[0004] Chinese patent document CN221201756U discloses a heat dissipation shell for a picosecond laser, including a heat dissipation shell, a heat dissipation component, and aluminum grooved plates. The aluminum grooved plates are vertically arranged on the inner side of the heat dissipation shell, and a heat dissipation component is installed on one side of the outer wall of the heat dissipation shell. The heat dissipation component includes a heat pipe radiator, a connecting pipe, and a heat dissipation heat pipe. Heat dissipation heat pipes are installed on the inner side of multiple sets of aluminum grooved plates. A connecting pipe is provided at the connection between the top wall of the heat dissipation heat pipe and the outer side of the heat pipe radiator. Dustproof grids are arranged and installed at adjacent positions of multiple sets of aluminum grooved plates.

[0005] Multiple heat pipes and aluminum groove plates are used to directly connect to the laser for efficient heat dissipation. However, this heat dissipation structure can only passively reduce the laser temperature and cannot control the target laser temperature at a constant temperature. In addition, it needs to be connected to the laser power supply during use, and its size is relatively large, making it unsuitable for highly integrated testing applications.

[0006] Therefore, improving the stability of temperature control in picosecond lasers, optimizing the integration of radio frequency lasers, and simplifying product operation have become technical problems that need to be solved. Utility Model Content

[0007] The technical problem to be solved by this invention is to provide a highly integrated active temperature-controlled radio frequency laser that can meet the constant temperature requirement of picosecond lasers during operation, thus solving the problem of large size and low integration of existing picosecond lasers.

[0008] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: the highly integrated active temperature-controlled radio frequency laser includes a housing, in which a top cavity and a bottom cavity are provided, and the top cavity and the bottom cavity are independent of each other, forming an integrated discrete cavity structure; a heat sink unit and a laser unit are provided in the bottom cavity; a temperature control unit is also provided in the top cavity, and the temperature control unit is used to transfer heat to the heat sink unit.

[0009] A heat sink unit is incorporated to receive the heat generated during operation of the highly integrated, actively temperature-controlled RF laser, thereby controlling the temperature of the picosecond laser. The temperature control unit transfers heat to the heat sink unit, meeting the constant temperature requirement for laser operation, improving laser output stability, and extending its lifespan. The top and bottom cavities within the housing are independent of each other, forming an integrated discrete cavity structure. This solves the problem of messy wiring in existing products, resulting in high integration. The integrated design facilitates user operation and engineer maintenance and repair. The temperature control unit can transfer the heat generated during operation of the highly integrated, actively temperature-controlled RF laser to the heat sink unit and precisely control the temperature of the picosecond laser.

[0010] In addition, the outer casing provides mechanical and dust protection for the laser unit, improving the convenience of later debugging and facilitating inspection and maintenance by engineers.

[0011] Preferably, the temperature control unit is a semiconductor temperature control unit, which includes a semiconductor cooling chip and a heat spreader plate.

[0012] The aforementioned structure of the semiconductor cooling chip and heat spreader plate further enhances the temperature control capability of the temperature control unit.

[0013] Preferably, a printed circuit board is also provided in the top cavity; the laser unit, the temperature control unit and the heat sink unit are all connected to the printed circuit board.

[0014] It adopts a custom printed circuit board, and the laser unit, temperature control unit and heat sink unit are compatible with a variety of lasers and temperature control units; it can also integrate the power supply terminals of each component, simplifying the wiring method and achieving a higher degree of integration.

[0015] Preferably, a temperature acquisition sensor is installed on the heat exchanger plate, and both the thermoelectric cooler and the temperature acquisition sensor are connected to the printed circuit board via wires.

[0016] The above structural design enhances temperature control capabilities, optimizes wiring methods, and improves temperature uniformity, stability, and data acquisition sensitivity.

[0017] Preferably, the laser in the laser unit is mounted on the heat exchanger plate; the laser emitter head of the laser is detachably connected to the printed circuit board and connected to the output of the bias unit.

[0018] The laser is mounted on the heat exchanger plate, which facilitates the rapid and even heat transfer of the generated heat, improving temperature uniformity. The laser emitter head is detachably connected to the printed circuit board, making the laser emitter head replaceable.

[0019] Preferably, the heat exchanger plate is provided with laser mounting holes, positioning holes, and temperature acquisition sensor mounting holes; a thermally conductive silicone grease layer is coated between the semiconductor cooling chip and the inner cavity of the outer shell, as well as between the laser and the heat exchanger plate.

[0020] The laser mounting holes are used to install the laser, the positioning holes are used for mounting and positioning the heat spreader adapter, the temperature acquisition sensor mounting holes are used to install the temperature acquisition sensor, and the thermal grease layer is used to improve thermal conductivity and heat spread performance.

[0021] Preferably, the printed circuit board includes a constant current unit, a bias unit, a temperature control unit, and an input / output unit; wherein, the constant current unit provides a DC input to the bias unit, the bias unit superimposes the RF input signal onto the DC input of the bias unit and outputs it to the laser emitter, and the temperature acquisition sensor in the temperature control unit acquires the temperature reading of the laser emitter and outputs a calculated voltage value.

[0022] Preferably, the heat sink unit includes a pin-shaped heat sink and a cooling fan; the pin-shaped structure design of the pin-shaped heat sink can maximize the heat dissipation area within the same volume, increase the heat dissipation area and heat conduction rate, and provide greater heat dissipation capacity within the same volume. The simplified structural design improves long-term stability and reduces the failure rate; the cooling fan accelerates the airflow inside the casing, further improving the heat dissipation capacity.

[0023] Preferably, the housing is provided with a heat sink exhaust vent, an RF input terminal, a power input terminal, a status indicator light, and a laser head output port; the power input terminal is connected to the printed circuit board, and the RF input terminal is connected to the bias unit.

[0024] Preferably, the laser head output port adopts a standard cage rod interface.

[0025] The standard cage bar interface allows for flexible addition or modification of the laser output collimation module as needed, meeting different application requirements. Attached Figure Description

[0026] Figure 1 This invention relates to the internal structure of a highly integrated, actively temperature-controlled radio frequency laser. Figure 1 ;

[0027] Figure 2 This invention relates to the internal structure of a highly integrated, actively temperature-controlled radio frequency laser. Figure 2 ;

[0028] Figure 3 The housing structure of the highly integrated active temperature-controlled radio frequency laser of this utility model. Figure 1 ;

[0029] Figure 4 The housing structure of the highly integrated active temperature-controlled radio frequency laser of this utility model. Figure 2 ;

[0030] Figure 5 The housing structure of the highly integrated active temperature-controlled radio frequency laser of this utility model. Figure 3 ;

[0031] Figure 6 This is a circuit diagram of the highly integrated active temperature-controlled radio frequency laser of this utility model;

[0032] Figure 7 The structure of the highly integrated active temperature-controlled radio frequency laser of this utility model with part of its outer casing removed. Figure 1 ;

[0033] Figure 8 The structure of the highly integrated active temperature-controlled radio frequency laser of this utility model with part of its outer casing removed. Figure 2 ;

[0034] Figure 9 This invention relates to the internal structure of a highly integrated, actively temperature-controlled radio frequency laser. Figure 1 ;

[0035] Figure 10 This invention relates to the internal structure of a highly integrated, actively temperature-controlled radio frequency laser. Figure 2 ;

[0036] Figure 11 The structure of the highly integrated active temperature-controlled radio frequency laser of this utility model with part of its outer casing removed. Figure 3 ;

[0037] Wherein: 1-Outer shell, 101-Top cavity, 102-Bottom cavity, 103-Heat sink exhaust vent, 104-RF input terminal, 105-Power input terminal, 106-Status indicator light, 107-Laser head output port, 2-Heat sink unit, 201-Needle-shaped heat sink, 202-Cooling fan, 3-Laser unit, 301-Laser, 302-Laser emitter head, 4-Temperature control unit, 401-Semiconductor cooling chip, 402-Hot heat exchanger plate, 403-Temperature sensor, 404-Laser mounting hole, 405-Positioning hole, 406-Temperature sensor mounting hole, 5-Printed circuit board, 501-Constant current unit, 502-Input / output unit, 6-Bias unit. Detailed Implementation

[0038] To further illustrate the technical means and effects adopted by this utility model to achieve its intended purpose, the following detailed description, in conjunction with the accompanying drawings and embodiments, provides specific implementation methods, structures, features, and effects based on this utility model.

[0039] The highly integrated active temperature-controlled radio frequency laser of the embodiment, such as Figures 1-11 As shown, it includes an outer shell 1, specifically a metal shell. The outer shell 1 contains a top cavity 101 and a bottom cavity 102, which are independent of each other, forming an integrated discrete cavity structure. A heat sink unit 2 and a laser unit 3 are disposed in the bottom cavity 102, such as... Figure 1 , Figure 2 , Figure 11 As shown, an integrated discrete metal cavity design is adopted, which integrates the various functional modules of the highly integrated active temperature-controlled RF laser into the metal housing 1.

[0040] A temperature control unit 4 is also provided in the top cavity 101, which is used to transfer heat to the heat sink unit 2.

[0041] A printed circuit board 5 is also provided in the top cavity 101; the laser unit 3, the temperature control unit 4 and the heat sink unit 2 are all connected to the printed circuit board 5.

[0042] like Figures 7-11 As shown, the temperature control unit 4 is a semiconductor temperature control unit, including a semiconductor cooling chip 401 and a heat exchanger plate 402; a temperature acquisition sensor 403 is installed on the heat exchanger plate 402, and the semiconductor cooling chip 401 and the temperature acquisition sensor 403 ( Figure 8The schematic diagram shows the installation location. The specific structure of the temperature acquisition sensor 403 can utilize existing technology; this invention does not make any technical improvements. All components are connected to the printed circuit board 5 via wires. The heat exchanger plate 402 is provided with laser mounting holes 404 (e.g., ...). Figure 10 As shown, the positions are indicated (laser 301 is already installed), positioning hole 405, and temperature acquisition sensor mounting hole 406; thermally conductive silicone grease is coated between the semiconductor cooling chip 401 and the inner cavity of the outer shell 1, as well as between the laser 301 and the heat spreader plate 402; it provides temperature control, heat spreader, temperature acquisition, and installation positioning functions, enhances temperature control capability, optimizes wiring method, and improves temperature uniformity, stability, and acquisition sensitivity.

[0043] It should be noted that a high thermal conductivity, low volatility or non-volatile silicone grease is uniformly and tightly coated between the laser 301 and the heat sink 402 to form a thermally conductive silicone grease layer, which improves the thermal conductivity and heat dissipation performance. Similarly, in this embodiment, a thermally conductive silicone grease is also coated between the metal cavity (outer shell 1) and the heat sink unit 2, which also forms a thermally conductive silicone grease layer.

[0044] The laser 301 in the laser unit 3 is mounted on the heat exchanger plate 402; the laser emitter 302 of the laser 301 is detachably connected to the printed circuit board 5 and connected to the output of the bias unit 6.

[0045] The printed circuit board 5 includes a constant current unit 501, a bias unit 6, a temperature control unit 4, and an input / output unit 502 (including a cooling fan output 503 that supplies power to the cooling fan 202). The constant current unit 501 provides the DC input to the bias unit 6. The bias unit 6 superimposes the RF input signal onto the DC input of the bias unit 6 and outputs it to the laser emitter 302. The temperature acquisition sensor 403 in the temperature control unit 4 acquires the temperature reading of the laser emitter 302 and outputs a calculated voltage value.

[0046] In this embodiment, the printed circuit board 5 integrates the input / output unit 502, the temperature control unit 4, the bias unit 6, the status indicator light 106 (only this structure is visible on the housing 1), and the power supply terminal (cooling fan output 503) of the cooling fan 202, simplifying the wiring method and making it compatible with various laser and temperature control units.

[0047] The heat sink unit 2 includes a pin-shaped heat sink 201 and a cooling fan 202; the pin-shaped heat sink 201 is made of copper, which has extremely high thermal conductivity, and its pin-shaped design, such as... Figure 2As shown, the heat dissipation area can be maximized within the same volume, and a large contact surface integrated design is adopted, which is tightly connected to the metal cavity (outer shell 1) by screws; a high-volume cooling fan 202 is installed below the pin-shaped heat sink 201. Figure 11 The diagram illustrates the installation position of the cooling fan 202. The specific structure of the cooling fan 202 can be achieved using existing technology, and this utility model does not make any technical improvements.

[0048] It is worth noting that while multiple heat pipes and aluminum groove plates are directly connected to the laser for efficient heat dissipation, this existing heat dissipation structure can only passively reduce the laser temperature and cannot control the target laser temperature at a constant level. Furthermore, it requires connection to the laser power supply and is relatively bulky, making it unsuitable for highly integrated testing applications. In contrast, this embodiment uses a pin-shaped heat sink 201 and a cooling fan 202, combined with a temperature control unit 4, which can meet the requirement of a constant operating temperature and solve the problem of the large size and low integration of existing lasers.

[0049] The outer casing 1 is provided with a heat sink heat dissipation vent 103, an RF input terminal 104, a power input terminal 105, a status indicator light 106, and a laser head output port 107, such as Figure 3 , Figure 4 and Figure 5 As shown; the power input terminal 105 is connected to the printed circuit board 5, and the RF input terminal 104 is connected to the bias unit 6; the laser head output port 107 adopts a standard cage rod interface, with a reserved expandable cage rod interface, which can adjust the output optical path as needed.

[0050] like Figure 6 The diagram shown is a circuit schematic of the highly integrated active temperature-controlled RF laser of this embodiment. After the power input terminal 105 is connected to the power supply, it is connected to the printed circuit board 5. The printed circuit board 5 supplies power to the bias unit 6, the constant current unit 501, the thermoelectric cooler 401 (which supplies power to the temperature acquisition sensor 403), and the cooling fan 202 via the cooling fan output 503. It should be noted that the bias unit 6 superimposes the RF input signal received via the RF input terminal 104 onto the DC input and outputs it to the laser emitter 302. Furthermore, combined with… Figure 1 , Figure 2 It can be seen that by integrating the laser unit 3, constant current unit 501, temperature control unit 4 and heat sink unit 2 into a single metal housing 1, the power supply for the laser, the power supply for the temperature control unit, the power supply for the cooling fan, and the power supply for the bias module are integrated into a single metal housing (housing 1). Only one power cord (power input terminal 105) and one RF signal input (RF input terminal 104) are needed for connection, which solves the problem of messy wiring in existing products.

[0051] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A highly integrated active temperature-controlled radio frequency laser, comprising a housing, characterized in that, The outer shell has a top cavity and a bottom cavity, which are independent of each other and form an integrated discrete cavity structure. A heat sink unit and a laser unit are provided in the bottom cavity. A temperature control unit is also provided in the top cavity, which is used to transfer heat to the heat sink unit.

2. The highly integrated active temperature-controlled radio frequency laser according to claim 1, characterized in that, The temperature control unit is a semiconductor temperature control unit, which includes a semiconductor cooling chip and a heat spreader plate.

3. The highly integrated active temperature-controlled radio frequency laser according to claim 2, characterized in that, A printed circuit board is also provided in the top cavity; the laser unit, the temperature control unit and the heat sink unit are all connected to the printed circuit board.

4. The highly integrated active temperature-controlled radio frequency laser according to claim 3, characterized in that, A temperature acquisition sensor is installed on the heat exchanger plate, and both the thermoelectric cooler and the temperature acquisition sensor are connected to the printed circuit board via wires.

5. The highly integrated active temperature-controlled radio frequency laser according to claim 4, characterized in that, The laser in the laser unit is mounted on the heat exchanger plate; the laser emitter head of the laser is detachably connected to the printed circuit board and connected to the output of the bias unit.

6. The highly integrated active temperature-controlled radio frequency laser according to claim 4, characterized in that, The heat exchanger plate is provided with laser mounting holes, positioning holes, and temperature acquisition sensor mounting holes; thermally conductive silicone grease is coated between the semiconductor cooling chip and the inner cavity of the outer shell, as well as between the laser and the heat exchanger plate.

7. The highly integrated active temperature-controlled radio frequency laser according to claim 5, characterized in that, The The printed circuit board includes a constant current unit, a bias unit, a temperature control unit, and an input / output unit. The constant current unit provides a DC input to the bias unit, the bias unit superimposes the RF input signal onto the DC input of the bias unit and outputs it to the laser emitter, and the temperature acquisition sensor in the temperature control unit acquires the temperature reading of the laser emitter and outputs a calculated voltage value.

8. The highly integrated active temperature-controlled radio frequency laser according to claim 2, characterized in that, The heat sink unit includes a needle-shaped heat sink and a cooling fan.

9. The highly integrated active temperature-controlled radio frequency laser according to claim 5 or 7, characterized in that, The housing is provided with a heat sink exhaust vent, an RF input terminal, a power input terminal, a status indicator light, and a laser head output port; the power input terminal is connected to the printed circuit board, and the RF input terminal is connected to the bias unit.

10. The highly integrated active temperature-controlled radio frequency laser according to claim 9, characterized in that, The laser head output port adopts a standard cage rod interface.

Images