Heat dissipation structure and display equipment

Abstract

The utility model discloses a heat dissipation structure and a display device, belonging to the technical field of display, the heat dissipation structure comprises a circuit board, a support and a cover body, the front side of the cover body is provided with an installation groove for accommodating the support, the support is respectively connected with the circuit board and the cover body, and the support is arranged in the installation groove so as to reduce the installation height of the support on the cover body. The distance between the front face of the cover body and the circuit board is closer, the circuit board is attached to the front face of the cover body, heat generated by the circuit board can be conducted to the cover body, the cover body provides a larger heat dissipation area, then the heat dissipation efficiency of the circuit board is improved, meanwhile, the cover body can serve as a supporting structure of the display module together with the support, and the heat dissipation efficiency of the display module is improved. The rigidity and strength of the display module are improved, and the cover body can protect the support and the circuit board, so that the support or the circuit board is prevented from being impacted by foreign objects.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a heat dissipation structure and display device. Background Technology

[0002] In the field of LED display, as the display brightness and pixel density of display modules gradually increase, the heat generated by the control circuit board of the display module is also increasing. Therefore, it is necessary to dissipate heat from the control circuit board and its various electronic components in order to improve the service life of the control circuit board. The existing heat dissipation solution is to set up heat dissipation components such as fans or heat sinks on the control circuit board. However, adding heat dissipation components will undoubtedly increase the weight, thickness and material cost of the display module, which is not conducive to the miniaturization and lightweighting of the display module. Utility Model Content

[0003] In order to overcome the shortcomings of the existing technology, the purpose of this utility model is to provide a heat dissipation structure and display device to solve the problem of increased weight, thickness and material cost caused by the heat dissipation components of current LED display modules.

[0004] The objective of this utility model is achieved through the following technical solution:

[0005] A heat dissipation structure includes a circuit board, a bracket, and a cover;

[0006] The cover has a front and a back, and the front of the cover is provided with a mounting groove;

[0007] The bracket is located in the mounting groove, and the bracket is connected to the circuit board and the cover respectively;

[0008] The front of the cover is attached to the circuit board.

[0009] Preferably, the front side of the cover is provided with a receiving groove, and the opening of the receiving groove is disposed opposite to the circuit board.

[0010] Preferably, the circuit board is provided with a chip and a capacitor, the chip is attached to the front side of the cover, the capacitor is disposed opposite to the opening of the receiving groove, and the capacitor is at least partially located in the receiving groove.

[0011] Preferably, it further includes a limiting component, which includes a limiting block and a limiting hole that fit together, one of the limiting block and the limiting hole being disposed on the cover and the other being disposed on the bracket.

[0012] Preferably, the mounting groove is provided with a guide protrusion, the bracket is provided with a guide groove, and the guide protrusion or the guide groove is provided with a guide slope, the guide slope being inclined to each other with the front surface of the cover.

[0013] Preferably, a connecting adhesive is provided between the bracket and the circuit board.

[0014] Preferably, a heat-conducting medium is provided between the front side of the cover and the circuit board.

[0015] Preferably, it further includes a connector, wherein the cover has a first connecting hole, the bracket has a second connecting hole, and the connector passes through the first connecting hole and the second connecting hole.

[0016] Preferably, the cover is made of metal.

[0017] To achieve the same technical effect, this utility model also provides a display device, including the heat dissipation structure described above.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] The front of the cover has a mounting groove for accommodating the bracket. The bracket is connected to the circuit board and the cover. The bracket is placed in the mounting groove, which can reduce the mounting height of the bracket on the cover, so that the distance between the front of the cover and the circuit board is closer. The circuit board is attached to the front of the cover, and the heat generated by the circuit board can be conducted to the cover. The cover provides a larger heat dissipation area, thereby improving the heat dissipation efficiency of the circuit board. At the same time, the cover and the bracket can serve as a support structure for the display module, improving the rigidity and strength of the display module. The cover can also provide protection for the bracket and the circuit board to prevent foreign objects from impacting the bracket or the circuit board. Attached Figure Description

[0020] Figure 1 This is one of the overall structural diagrams of the heat dissipation structure of the utility model;

[0021] Figure 2 This is the second schematic diagram of the overall structure of the heat dissipation structure of the utility model;

[0022] Figure 3 This is one of the exploded schematic diagrams of a heat dissipation structure for a utility model.

[0023] Figure 4 This is the second exploded view of the heat dissipation structure of the utility model;

[0024] Figure 5 This is the third exploded view of the heat dissipation structure of the utility model.

[0025] Figure 6 for Figure 4 Enlarged view of point A in the middle;

[0026] Figure 7 for Figure 4 Enlarged view of point B in the middle;

[0027] Figure 8 for Figure 5 Enlarged view of point C in the middle;

[0028] Figure 9 for Figure 5 Enlarged view of point D in the middle;

[0029] In the figure: 10, circuit board; 20, bracket; 21, limiting block; 22, guide groove; 23, second connecting hole; 24, mounting through hole; 30, cover; 31, front; 311, mounting groove; 312, receiving groove; 313, guide protrusion; 313a, guide slope; 32, back; 33, limiting hole; 34, first connecting hole; 40, connector. Detailed Implementation

[0030] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0031] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] Example 1

[0034] Combination Figures 1 to 9 As shown, the heat dissipation structure of this utility model is schematically displayed, including a circuit board 10, a bracket 20 and a cover 30, and a number of electronic components are provided on the circuit board 10.

[0035] Combination Figure 2 and Figure 3, the cover body 30 has a front surface 31 and a back surface 32. An installation groove 311 is provided on the front surface 31 of the cover body 30. The circuit board 10 is disposed opposite to the front surface 31 of the cover body 30. The bracket 20 is located in the installation groove 311. The bracket 20 is respectively connected to the circuit board 10 and the cover body 30. The installation groove 311 is used to accommodate the bracket 20 and reduce the installation height of the bracket 20 on the cover body 30, so that the distance between the circuit board 10 and the front surface 31 of the cover body 30 can be set closer.

[0036] The front surface 31 of the cover body 30 is adhered to the circuit board 10. The heat generated by the circuit board 10 can be conducted to the cover body 30, and the cover body 30 provides a larger heat dissipation area, thereby improving the heat dissipation efficiency of the circuit board 10. The cover body 30 can be used as a supporting structure of the display module together with the bracket 20 to improve the stiffness and strength of the display module. The cover body 30 can also provide a protective effect on the bracket 20 and the circuit board 10 to prevent external objects from impacting the bracket 20 or the circuit board 10.

[0037] Preferably, a connecting glue is provided between the bracket 20 and the circuit board 10, that is, the bracket 20 and the circuit board 10 are connected in a glued form.

[0038] Such as Figure 3 and Figure 4 , in order to accommodate each part of the bracket 20 in the installation groove 311, the shape of the installation groove 311 matches the shape of the bracket 20. For example, when the bracket 20 is in a "square" shape, the shape of the installation groove 311 is also in a "square" shape; when the bracket 20 is in a "field" shape, the shape of the installation groove 311 is also in a "field" shape. The cover body 30 is preferably made of a metal material to achieve higher heat conduction efficiency at a lower cost, and the cover body 30 can be formed by stamping, which is beneficial to mass production and high efficiency. The cover body 30 can also be formed by processes such as die casting and bending. Of course, the cover body 30 can also be made of graphene material, which can also improve the heat dissipation efficiency of the circuit board 10.

[0039] Specifically, such as Figure 3 and Figure 4The front surface 31 of the cover 30 is provided with a receiving groove 312. The opening of the receiving groove 312 is opposite to the circuit board 10. The circuit board 10 is provided with chips and capacitors. The chips are attached to the front surface 31 of the cover 30, and the cover 30 can absorb the heat generated by the chips. The capacitors on the circuit board 10 have a certain height (the height in the normal direction of the circuit board 10). The taller capacitors will cause structural interference with the front surface 31 of the cover 30. In this embodiment, the capacitors are at least partially located in the receiving groove 312. The setting of the receiving groove 312 can avoid structural interference between the front surface 31 of the cover 30 and the capacitors. The bottom of the receiving groove 312 avoids the capacitors, and the distance between the circuit board 10 and the front surface 31 of the cover 30 can be set closer, so that more chips on the circuit board 10 can be attached to the front surface 31 of the cover 30, thereby improving the heat dissipation efficiency of the cover 30.

[0040] To limit the relative sliding or misalignment of the cover 30 and the bracket 20, the heat dissipation structure also includes a limiting component, combined with... Figure 4 , Figure 5 , Figure 7 and Figure 8 As shown, the limiting component includes a limiting block 21 and a limiting hole 33 that fit together. The limiting hole 33 is located on the cover 30, and the limiting block 21 is located on the bracket 20. The shape of the limiting block 21 matches the shape of the limiting hole 33. Multiple limiting components can also be provided to achieve multi-point limiting.

[0041] like Figure 7 and Figure 8 The mounting groove 311 is also provided with a guide protrusion 313, and the bracket 20 is provided with a guide groove 22. The guide protrusion 313 or the guide groove 22 is provided with a guide slope 313a. In this embodiment, the guide slope 313a is provided on the guide protrusion 313. The guide slope 313a is inclined to the front surface 31 of the cover 30. When assembling the bracket 20 and the cover 30, the guide slope 313a first contacts the side wall of the guide groove 22. The guide slope 313a can make the bracket 20 and the cover 30... As the bodies 30 move toward each other, they gradually align, and finally the limiting block 21 is successfully embedded in the limiting hole 33, completing the initial positioning of the bracket 20 and the cover 30. Furthermore, the heat dissipation structure also includes a connector 40, which is preferably a screw. The cover 30 has a first connecting hole 34, and the bracket 20 has a second connecting hole 23. The connector 40 passes through the first connecting hole 34 and the second connecting hole 23, thereby connecting the bracket 20 and the cover 30 to each other and completing the assembly of the bracket 20 and the cover 30.

[0042] The bracket 20 has multiple mounting holes 24, which can be connected to the display module housing by fasteners such as screws and bolts.

[0043] Example 2

[0044] The difference between this embodiment and embodiment 1 is that a thermally conductive medium is provided between the front surface 31 of the cover 30 and the circuit board 10. The thermally conductive medium is preferably thermal grease. Filling the space between the front surface 31 of the cover 30 and the circuit board 10 with a thermally conductive medium can prevent air from remaining on the contact surface between the cover 30 and the circuit board 10, so as not to affect the thermal conductivity.

[0045] Example 3

[0046] This embodiment provides a display device, including a housing, a display panel, and the aforementioned heat dissipation structure. The housing is bolted to the mounting through-hole 24 on the bracket 20. The display panel is parallel to the front surface 31 of the cover 30 and is connected to the circuit board 10. The bracket 20, the cover 30, and the circuit board 10 are all located inside the housing.

[0047] In summary, the front surface 31 of the cover 30 is provided with a mounting groove 311 for accommodating the bracket 20. The bracket 20 is connected to the circuit board 10 and the cover 30 respectively. The bracket 20 is placed in the mounting groove 311, which can reduce the mounting height of the bracket 20 on the cover 30, so that the distance between the front surface 31 of the cover 30 and the circuit board 10 is closer. The circuit board 10 is attached to the front surface 31 of the cover 30, and the heat generated by the circuit board 10 can be conducted to the cover 30. The cover 30 provides a larger heat dissipation area, thereby improving the heat dissipation efficiency of the circuit board 10. At the same time, the cover 30 and the bracket 20 can serve as a support structure for the display module, improving the rigidity and strength of the display module. The cover 30 can also provide protection for the bracket 20 and the circuit board 10 to prevent foreign objects from impacting the bracket 20 or the circuit board 10.

[0048] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A heat dissipation structure, characterized in that, Includes circuit boards, brackets, and covers; The cover has a front and a back, and the front of the cover is provided with a mounting groove; The bracket is located in the mounting groove, and the bracket is connected to the circuit board and the cover respectively; The front of the cover is attached to the circuit board.

2. The heat dissipation structure according to claim 1, characterized in that, The front side of the cover is provided with a receiving groove, and the opening of the receiving groove is positioned opposite to the circuit board.

3. The heat dissipation structure according to claim 2, characterized in that, The circuit board is provided with a chip and a capacitor. The chip is attached to the front of the cover, and the capacitor is disposed opposite to the opening of the receiving groove, and the capacitor is at least partially located in the receiving groove.

4. The heat dissipation structure according to claim 1, characterized in that, It also includes a limiting component, which includes a limiting block and a limiting hole that fit together, one of which is located on the cover and the other is located on the bracket.

5. The heat dissipation structure according to claim 1, characterized in that, The mounting groove is provided with a guide protrusion, the bracket is provided with a guide groove, and the guide protrusion or the guide groove is provided with a guide slope, which is inclined to each other with the front side of the cover.

6. The heat dissipation structure according to claim 1, characterized in that, A connecting adhesive is provided between the bracket and the circuit board.

7. The heat dissipation structure according to claim 1, characterized in that, A heat-conducting medium is provided between the front side of the cover and the circuit board.

8. The heat dissipation structure according to claim 1, characterized in that, It also includes a connector, wherein the cover has a first connecting hole, the bracket has a second connecting hole, and the connector passes through the first connecting hole and the second connecting hole.

9. The heat dissipation structure according to any one of claims 1 to 8, characterized in that, The cover is made of metal.

10. A display device, characterized in that, Includes the heat dissipation structure as described in any one of claims 1 to 9.

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