Band saw blade polishing device
By designing a band saw blade grinding device, which utilizes height adjustment components and clamping components to achieve efficient grinding of the sides and bottom edges of the saw blade, the problems of incomplete grinding and high labor costs in existing technologies are solved, thereby improving grinding efficiency and quality.
Patent Information
- Application Number
- CN202423229625.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-12-26
AI Technical Summary
Existing band saw blade grinding methods cannot effectively remove scratches after quenching, especially bottom scratches, and also have problems such as sandpaper falling off easily and high labor costs.
Design a band saw blade grinding device, including a base, a first height adjustment component and a second height adjustment component, a clamping component and a grinding disc respectively set in the Y direction for grinding the side, and a second grinding disc set in the X direction for grinding the bottom edge. The grinding disc is adjusted and fixed by an adjusting rod and a guide post to ensure that it is in close contact with the surface of the saw blade.
It enables efficient grinding of the sides and bottom edges of band saw blades, reduces the risk of the grinding disc falling off, lowers labor costs, and improves grinding efficiency and quality.
Smart Images

Figure CN223558081U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the band saw blade processing technical field especially, relates to a band saw blade polishing device. BACKGROUND
[0002] When the bimetallic band saw blade is quenched, the bottom surface and the side surface contact the magnetic guide frame in the quenching furnace, so that scratches appear on the surface of the band saw blade. After quenching, the band saw blade enters sand blasting treatment, but the scratches cannot be eliminated after sand blasting at present, which affects product quality. Therefore, after quenching, the surface of the band saw blade needs to be polished.
[0003] The existing polishing method is aimed at the scratches on the bottom of the band saw blade, and sandpaper is placed on the bottom of the band saw blade in the running direction. Since the sandpaper has no fixing device when working, the sandpaper is easy to fall to the ground, and needs to be replaced frequently. For scratches on the side surface of the band saw blade, the scratches are manually wiped with sandpaper. This polishing method has high labor cost and labor intensity. The current polishing method has poor grinding effect on the scratches on the surface of the band saw blade, and cannot improve the product quality to a certain extent.
[0004] The existing polishing device, such as the band saw blade surface treatment device disclosed in patent publication No. CN219380139U, can better solve the problem of manual polishing of the side surface of the band saw blade, but cannot solve the problem of polishing the bottom edge of the band saw blade. UTILITY MODEL CONTENT
[0005] The utility model aims at providing a band saw blade polishing device which can better polish the side surface and the bottom edge of the band saw blade.
[0006] The technical scheme of the utility model is: a band saw blade polishing device, comprising a base, a first height adjusting assembly and a second height adjusting assembly arranged on the base, the first height adjusting assembly is arranged at both ends of the Y direction of the base, the upper end of the first height adjusting assembly is provided with a clamping assembly which can stretch and contract along the Y direction, the clamping assemblies on the two first height adjusting assemblies are stretched out and adjusted to be close to each other to form a clamping cavity, and a first polishing disc is installed on the side surface of the clamping assembly close to the clamping cavity; the second height adjusting assembly is located beside the first height adjusting assembly in the X direction, the upper end of the second height adjusting assembly is provided with a second polishing disc, and the X direction and the Y direction are perpendicular to each other in the same top projection plane.
[0007] The two first grinding discs arranged in the Y direction are used to grind the two side surfaces of the band saw blade, and the second grinding disc located between the two first grinding discs is used to grind the bottom edge of the band saw blade, so that the grinding of the side surfaces and the bottom edge is simultaneously realized during the movement of the band saw blade along the X direction, and the grinding efficiency is improved.
[0008] Preferably, the first height adjusting assembly comprises a first adjusting rod, a first guide column and a first mounting plate, the first adjusting rod is threadedly connected with the base, the upper end of the first adjusting rod is connected with the first mounting plate, the first guide column is located beside the first adjusting rod, the upper end of the first guide column is connected with the first mounting plate, and the lower end of the first guide column penetrates through the base; and the clamping assembly is mounted on the first mounting plate.
[0009] Preferably, the clamping assembly comprises a second adjusting rod, a second guide column and a second mounting plate, the second mounting plate is located beside the first height adjusting assembly in the Y direction, the second adjusting rod is threadedly connected with the upper end of the first height adjusting assembly, the second adjusting rod is connected with the second mounting plate, the second guide column is located beside the second adjusting rod, one end of the second guide column is connected with the second mounting plate, and the other end of the second guide column penetrates through the first height adjusting assembly; and the first grinding disc is mounted on the side surface of the second mounting plate.
[0010] Preferably, the second height adjusting assembly comprises a third adjusting rod, a bottom plate, an elastic piece, a third mounting plate and a fourth guide column, the bottom plate is located above the base, the third mounting plate is located above the bottom plate, the third adjusting rod is threadedly connected with the base, the upper end of the third adjusting rod is connected with the bottom plate, the fourth guide column is located beside the third adjusting rod, the upper end of the fourth guide column is connected with the third mounting plate, and the lower end of the fourth guide column penetrates through the bottom plate and the base; the elastic piece is sleeved on the fourth guide column and abuts between the third mounting plate and the bottom plate, and the second grinding disc is mounted on the upper surface of the third mounting plate.
[0011] Preferably, the first grinding disc is vertically arranged, the second grinding disc is horizontally arranged, and the second grinding disc is located between the two first grinding discs.
[0012] Compared with the related art, the present application has the following beneficial effects:
[0013] The two first polishing discs arranged in the Y direction are used for polishing the two side surfaces of the band saw blade, and the second polishing disc arranged between the two first polishing discs is used for polishing the bottom edge of the band saw blade, so that the polishing of the side surfaces and the bottom edge is simultaneously realized during the movement of the band saw blade along the X direction, and the polishing efficiency is improved;
[0014] The first polishing disc is installed through the first height adjusting assembly and the clamping assembly, so that the adjustment and position limitation of the first polishing disc in the height direction Z and the width direction Y are realized respectively, the second polishing disc is installed through the second height adjusting assembly, the adjustment and position limitation of the second polishing disc in the height direction Z are realized, the polishing disc can be closely attached to the corresponding surface of the band saw blade, the scratches are effectively removed, and the risk of falling of the polishing disc is avoided;
[0015] The adjusting rod is arranged in each height adjusting assembly and clamping assembly, the polishing disc and the band saw blade can be fully contacted and the friction therebetween can be ensured by screwing the adjusting rod during use, and good polishing effect is maintained. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 A structure schematic view of the band saw blade polishing device is provided in the utility model.
[0017] Figure 2 A Figure 1 The installation schematic view of the first height adjusting assembly, the clamping assembly and the base in the utility model is provided.
[0018] Figure 3 A Figure 1 The installation schematic view of the second height adjusting assembly and the base in the utility model is provided.
[0019] In the drawings: 1, base; 2, first height adjusting assembly; 21, first adjusting rod; 22, first guide column; 23, first mounting plate; 3, clamping assembly; 31, second adjusting rod; 32, second guide column; 33, second mounting plate; 34, clamping cavity; 4, second height adjusting assembly; 41, third adjusting rod; 42, bottom plate; 43, elastic piece; 44, third mounting plate; 45, fourth guide column; 5, first polishing disc; 6, second polishing disc; 10, band saw blade. DETAILED DESCRIPTION
[0020] The utility model will be described in detail below with reference to the drawings and in combination with the embodiments. It should be noted that the embodiments in the utility model and the features in the embodiments can be combined with each other without conflict. For the sake of description, if the words "upper", "lower", "left" and "right" appear in the following text, they only mean the upper, lower, left and right directions consistent with the drawings themselves, and do not limit the structure.
[0021] For example, Figure 1As shown, the band saw blade polishing device provided by the embodiment includes a base 1, a first height adjusting assembly 2, a clamping assembly 3, a second height adjusting assembly 4, a first polishing disc 5, and a second polishing disc 6.
[0022] The base 1 extends along the X direction and is provided with a mounting hole, so that the entire polishing device can be mounted on a production line outside the outlet of a quenching furnace (not shown) to polish the band saw blade 10 during movement in the X direction. The width direction of the base 1 is the Y direction.
[0023] One end of the base 1 in the X direction is provided with the first height adjusting assembly 2, and the other end is provided with the second height adjusting assembly 4. As shown, Figure 1 Figure 2 The first height adjusting assembly 2 includes a first adjusting rod 21, a first guide column 22, and a first mounting plate 23. The first adjusting rod 21 is threadedly connected to the base 1, and the upper end of the first adjusting rod 21 is connected to the first mounting plate 23, and the lower end of the first adjusting rod 21 is provided with a knob. The first guide column 22 is located beside the first adjusting rod 21, and the upper end of the first guide column 22 is connected to the first mounting plate 23, and the lower end of the first guide column 22 penetrates the base 1. The connection between the first adjusting rod 21 and the first mounting plate 23 does not limit the rotation of the first adjusting rod 21, and the first mounting plate 23 can be retracted together with the first adjusting rod 21 (the mounting mode of other adjusting rods is the same).
[0024] By rotating the knob on the first adjusting rod 21, the first adjusting rod 21 is rotated upward or downward relative to the base 1, thereby pushing or pulling the first mounting plate 23 to rise or fall, to adjust the height of the clamping assembly 3 mounted on the first mounting plate 23, to adapt to the surface scratch position of different models of band saw blades.
[0025] As shown, Figure 1 Figure 2 The clamping assembly 3 includes a second adjusting rod 31, a second guide column 32, and a second mounting plate 33. The second mounting plate 33 is located on the inner side of the first mounting plate 23 of the first height adjusting assembly 2 in the Y direction. The second adjusting rod 31 is threadedly connected to the first mounting plate 23, and one end of the second adjusting rod 31 is connected to the second mounting plate 33, and the other end of the second adjusting rod 31 is provided with a knob. The second guide column 32 is located beside the second adjusting rod 31, and one end of the second guide column 32 is connected to the second mounting plate 33, and the other end of the second guide column 32 penetrates the first mounting plate 23.
[0026] The first height adjustment component 2 is provided at both ends of the base 1 in the Y direction. A first grinding disc 5 is mounted on the adjacent side surface of the first mounting plates 23 of the two clamping components 3, forming a clamping cavity 34 between the two first grinding discs 5. By rotating the second adjusting rod 31, the second mounting plate 33 is extended or retracted in the Y direction, so that the size of the clamping cavity 34 adapts to the thickness of the band saw blade 10, ensuring that the first grinding disc 5 is tightly attached to the band saw blade 10 and maintaining friction during this process.
[0027] like Figure 1 , Figure 3 As shown, the second height adjustment component 4 includes a third adjusting rod 41, a base plate 42, a spring element 43, a third mounting plate 44, and a fourth guide post 45. The base plate 42 is located above the base 1, and the third mounting plate 44 is located above the base plate 42. The third adjusting rod 41 is threaded to the base 1, and its upper end is connected to the base plate 42, while its lower end has a knob. The fourth guide post 45 is located beside the third adjusting rod 41, and its upper end is connected to the third mounting plate 44, while its lower end passes through the base plate 42 and the base 1. The spring element 43 is fitted onto the fourth guide post 45 and abuts against the third mounting plate 44 and the base plate 42. The spring element 43 is a compression spring. The second grinding disc 6 is mounted on the upper surface of the third mounting plate 44. The first grinding disc 5 is vertically positioned, and the second grinding disc 6 is horizontally positioned, with the second grinding disc 6 located between the two first grinding discs 5. The second grinding disc 6 is used to grind the bottom edge of the band saw blade 10, and the bottom edge position of different models of band saw blades 10 can be adapted by adjusting the third adjusting rod 41. The spring force of the elastic element 43 is then used to increase the friction between the second grinding disc 6 and the bottom edge of the band saw blade 10, smoothing out the scratches.
[0028] The band saw blade polishing device provided by this utility model can effectively remove scratches on the bottom edge and sides of the band saw blade 10, and no manual supervision is required during the polishing process.
[0029] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. A band saw blade grinding device, comprising a base (1), characterized in that, It also includes a first height adjustment component (2) and a second height adjustment component (4) disposed on the base (1). The first height adjustment component (2) is disposed at both ends of the base (1) in the Y direction. The upper end of the first height adjustment component (2) is provided with a clamping component (3) that extends and retracts in the Y direction. The clamping components (3) on the two first height adjustment components (2) extend and move closer to each other to form a clamping cavity (34). A first grinding disc (5) is installed on the side surface of the clamping component (3) near the clamping cavity (34). The second height adjustment component (4) is located on the side of the first height adjustment component (2) in the X direction. A second grinding disc (6) is provided at the upper end of the second height adjustment component (4). The X direction and the Y direction are perpendicular to each other on the same top projection plane.
2. The band saw blade grinding device according to claim 1, characterized in that, The first height adjustment component (2) includes a first adjusting rod (21), a first guide post (22) and a first mounting plate (23). The first adjusting rod (21) is threadedly connected to the base (1), and the upper end of the first adjusting rod (21) is connected to the first mounting plate (23). The first guide post (22) is located beside the first adjusting rod (21), and the upper end of the first guide post (22) is connected to the first mounting plate (23). The lower end of the first guide post (22) passes through the base (1). The clamping component (3) is mounted on the first mounting plate (23).
3. The band saw blade grinding device according to claim 1, characterized in that, The clamping assembly (3) includes a second adjusting rod (31), a second guide post (32), and a second mounting plate (33). The second mounting plate (33) is located on the side of the first height adjustment assembly (2) in the Y direction. The second adjusting rod (31) is threaded to the upper end of the first height adjustment assembly (2) and is connected to the second mounting plate (33). The second guide post (32) is located on the side of the second adjusting rod (31) and one end of the second guide post (32) is connected to the second mounting plate (33). The other end of the second guide post (32) passes through the first height adjustment assembly (2). The first grinding disc (5) is mounted on the side surface of the second mounting plate (33).
4. The band saw blade grinding device according to claim 1, characterized in that, The second height adjustment component (4) includes a third adjusting rod (41), a base plate (42), a spring element (43), a third mounting plate (44), and a fourth guide post (45). The base plate (42) is located above the base (1), and the third mounting plate (44) is located above the base plate (42). The third adjusting rod (41) is threadedly connected to the base (1), and the upper end of the third adjusting rod (41) is connected to the base plate (42). The fourth guide post... (45) is located beside the third adjusting rod (41), and the upper end of the fourth guide post (45) is connected to the third mounting plate (44). The lower end of the fourth guide post (45) passes through the bottom plate (42) and the base (1). The elastic element (43) is fitted on the fourth guide post (45), and the elastic element (43) abuts between the third mounting plate (44) and the bottom plate (42). The second grinding disc (6) is installed on the upper surface of the third mounting plate (44).
5. The band saw blade grinding device according to any one of claims 1-4, characterized in that, The first grinding disc (5) is set vertically, the second grinding disc (6) is set horizontally, and the second grinding disc (6) is located between the two first grinding discs (5).
Citation Information
Patent Citations
Band saw blade surface treatment device
CN219380139U