Chip processing jig

Abstract

The utility model discloses a chip processing jig, and relates to the technical field of semiconductor processing. The chip processing jig comprises a base, an adsorption plate, a first clamping plate and a second clamping plate, the base comprises a bearing side; the adsorption plate is mounted on the side, facing the bearing side, of the base, and a vacuum hole communicating with the bearing side is formed in the adsorption plate; the first clamping plate is arranged on the side, facing the bearing side, of the base. The second clamping plate is arranged on the side, facing the bearing side, of the base and is opposite to the first clamping plate in the direction parallel to the adsorption plate, the second clamping plate is arranged on the base in a sliding mode so as to be close to and away from the first clamping plate, a clamping position is arranged between the second clamping plate and the first clamping plate, and the clamping position is opposite to the vacuum hole in the direction perpendicular to the adsorption plate. According to the chip processing jig provided by the invention, the mounting stability of the workpiece can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, in particular to a chip processing jig. BACKGROUND

[0002] Micro-Light Emitting Diode (Micro-LED) display modules have superior performance, with characteristics such as high brightness, high reliability, and miniaturization. In the process of packaging a Micro-LED monolithic module, wire bonding technology is used to electrically connect the Micro-LED chip and the circuit substrate. Among them, the wire bonding process, also known as the wire bonding process, is a technology that connects the electrodes inside the Micro-LED chip with the wires on the external circuit substrate. The main purpose is to achieve reliable connection of the Micro-LED chip and the external circuit, ensuring the normal operation of electronic products and providing protection for the normal operation of the Micro-LED chip. This process needs to be performed by an ultrasonic wire welding device, and the wire welding process requires the Micro-LED chip module to be fixed before welding to ensure the quality of the welding.

[0003] However, the traditional jig cannot provide reliable fixation for the Micro-LED chip module. CONTENT OF THE INVENTION

[0004] The present application provides a chip processing jig to improve clamping stability.

[0005] The present application provides a chip processing jig, comprising:

[0006] A base comprising a bearing side;

[0007] An adsorption plate mounted on one side of the base facing the bearing side, the adsorption plate having a vacuum hole communicating with the bearing side;

[0008] A first clamping plate provided on one side of the base facing the bearing side;

[0009] A second clamping plate provided on one side of the base facing the bearing side and opposite the first clamping plate in a direction parallel to the adsorption plate, the second clamping plate being slidingly provided on the base to approach and move away from the first clamping plate, and a clamping position being provided between the second clamping plate and the first clamping plate, the clamping position being opposite the vacuum hole in a direction perpendicular to the adsorption plate.

[0010] In some possible embodiments, the first clamping plate is detachably connected to the base and the position thereof is adjustable in a direction parallel to the sliding direction of the second clamping plate.

[0011] In some possible embodiments, the chip processing jig further comprises a locking member, which is detachably connected with the base;

[0012] When the locking member is connected with the base, the first clamping plate can be locked with the base.

[0013] In some possible embodiments, the locking member comprises a connecting rod portion and a limiting portion connected to one end of the connecting rod portion;

[0014] The first clamping plate is provided with a waist-shaped hole, and the length direction of the waist-shaped hole is parallel to the sliding direction of the second clamping plate;

[0015] When the locking member locks the first clamping plate and the base, one end of the connecting rod is arranged in the waist-shaped hole and is detachably connected with the base, and the limiting portion abuts against one side of the first clamping plate away from the base.

[0016] In some possible embodiments, the connecting rod portion is provided with external threads on the circumferential side;

[0017] The base is provided with a plurality of first threaded holes, which are arranged in sequence along the sliding direction of the second clamping plate, and the first threaded holes are adaptively arranged with the external threads.

[0018] In some possible embodiments, the chip processing jig further comprises a driving assembly, which is in transmission connection with the second clamping plate, and the driving assembly is used to drive the second clamping plate to slide along the sliding direction.

[0019] In some possible embodiments, the driving assembly comprises a driving member and a transmission rod, one end of the transmission rod is in transmission connection with the second clamping plate, the driving member is connected to the end of the transmission rod away from the second clamping plate, and the driving member is used to drive the transmission rod to move, so as to drive the second clamping plate to approach and move away from the first clamping plate.

[0020] In some possible embodiments, the transmission rod comprises a lead screw, the transmission rod is rotatably installed on the base, and a lead screw nut is fixedly connected to one side of the second clamping plate facing the base, and the lead screw nut is screwed with the transmission rod;

[0021] The driving member comprises a handle, the driving member is fixedly connected to the end of the transmission rod away from the first clamping plate and is protrudingly arranged relative to the base.

[0022] In some possible embodiments, one side of the base facing the bearing side is provided with a sliding rail, and the sliding rail is parallel to the sliding direction of the second clamping plate;

[0023] A sliding block is connected to one side of the second clamping plate, and the sliding block is slidingly connected to the sliding rail.

[0024] In some possible embodiments, a vacuum cavity is formed in the base, and a communication hole is formed in a side of the base away from the bearing side and in communication with the vacuum cavity, and the communication hole is used for communicating with a vacuumizing device.

[0025] The vacuum hole is in communication with the vacuum cavity.

[0026] The chip processing jig provided by the application has the following beneficial effects: the base is provided with the adsorption plate on the side facing the bearing side, the workpiece can be adsorbed through the vacuum hole on the adsorption plate and fixed relative to the base, meanwhile, the workpiece can be clamped from both sides of the workpiece by the first clamping plate and the second clamping plate. That is, the workpiece can be provided with corresponding fastening force in the direction perpendicular to the workpiece and the side edge of the workpiece, the installation stability of the workpiece is improved, the possibility of movement of the workpiece relative to the base in the wire bonding process is reduced, and then the precision of the wire bonding operation is improved and the processing yield is improved. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some of the embodiments of the application, and therefore should not be regarded as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0028] Figure 1 A top view structural schematic diagram of the chip processing jig in some embodiments is shown;

[0029] Figure 2 A side view structural schematic diagram of the chip processing jig in some embodiments is shown;

[0030] Figure 3 A bottom view structural schematic diagram of the chip processing jig in some embodiments is shown;

[0031] Figure 4 A structural schematic diagram of the locking piece in some embodiments is shown.

[0032] Main element symbol explanation:

[0033] 1000-chip processing jig;

[0034] 100-base; 101-bearing side; 111-vacuum cavity; 112-communication hole; 113-first threaded hole; 114-second threaded hole; 115-sink groove; 116-first positioning hole; 117-second positioning hole;

[0035] 210 - first clamping plate; 211 - waist-shaped hole; 220 - second clamping plate; 230 - clamping position;

[0036] 300 - locking piece; 310 - connecting rod part; 311 - external thread; 320 - limiting part;

[0037] 410 - sliding rail; 420 - sliding block;

[0038] 500 - driving assembly; 510 - driving piece; 520 - transmission rod;

[0039] 600 - adsorption plate; 610 - vacuum hole;

[0040] M - sliding direction. DETAILED DESCRIPTION

[0041] Embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only, only for explaining the present application, and cannot be understood as a limitation of the present application.

[0042] In the description of the present application, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0043] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0044] In the present application, unless specifically defined and limited otherwise, the terms "mounting", "connected", "connecting", "fixed", and the like, should be interpreted broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0045] In the present application, unless specifically defined and limited otherwise, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact or indirectly contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0046] As shown in Figure 1 An embodiment provides a chip processing jig 1000 which can be applied in a semiconductor processing process. Specifically, during wire bonding of a Micro LED device (i.e. a workpiece), the workpiece can be placed on the chip processing jig 1000, and then the chip processing jig 1000 is placed on an ultrasonic wire bonding device, so that the workpiece is fixed relative to the ultrasonic wire bonding device, so as to perform precise wire bonding operation.

[0047] As shown in Figure 1 and Figure 2 The chip processing jig 1000 can include a base 100, a suction plate 600, a first clamping plate 210 and a second clamping plate 220.

[0048] The base 100 includes a bearing side 101, i.e. a side for placing the workpiece.

[0049] The suction plate 600 can be installed on the side of the base 100 facing the bearing side 101. In addition, the suction plate 600 is also provided with a vacuum hole 610 facing the bearing side 101, and the vacuum hole 610 can be in communication with the bearing side 101 of the base 100.

[0050] The first clamping plate 210 and the second clamping plate 220 are arranged on the side of the base 100 facing the bearing side 101. In the direction parallel to the adsorption plate 600, the first clamping plate 210 and the second clamping plate 220 are oppositely arranged, and the clamping position 230 is arranged between the first clamping plate 210 and the second clamping plate 220. In the embodiment, in the direction perpendicular to the adsorption plate 600, the clamping position 230 can be opposite to the vacuum hole 610. In addition, the second clamping plate 220 can be slidably arranged on the base 100 to approach and move away from the first clamping plate 210. Correspondingly, the second clamping plate 220 can be provided with a sliding direction M.

[0051] In use, the second clamping plate 220 can be arranged away from the first clamping plate 210 first, so that the distance between the second clamping plate 220 and the first clamping plate 210 is greater than the size of the workpiece, which can facilitate the placement of the workpiece in the clamping position 230 between the first clamping plate 210 and the second clamping plate 220. Then, the workpiece can be placed on the bearing side 101 of the base 100 and located in the clamping position 230 between the first clamping plate 210 and the second clamping plate 220. The second clamping plate 220 is slid relative to the base 100 to gradually approach the first clamping plate 210, so that the workpiece can be clamped by the cooperation of the second clamping plate 220 and the first clamping plate 210. In addition, the vacuum hole 610 can be connected to a vacuum device, and the vacuum hole 610 is vacuumed by the vacuum device to negative pressure, so that the workpiece is adsorbed on the adsorption plate 600 and fixed relative to the base 100. In this way, the workpiece can be fixed on the chip processing jig 1000, and then the chip processing jig 1000 together with the workpiece can be placed on the ultrasonic wire bonding equipment for wire bonding operation of the workpiece. The vacuum device can also be started to vacuum the vacuum hole 610 to negative pressure after the chip processing jig 1000 is placed on the ultrasonic wire bonding equipment.

[0052] In the embodiment, the workpiece can be adsorbed on the adsorption plate 600 through the vacuum hole 610, and the workpiece can be clamped from both sides of the workpiece by the cooperation of the first clamping plate 210 and the second clamping plate 220. That is, in the direction perpendicular to the workpiece and the side edge of the workpiece, the workpiece can be provided with corresponding fastening force, which can improve the installation stability of the workpiece, reduce the possibility of movement of the workpiece relative to the base 100 during wire bonding, and thus improve the precision of wire bonding operation and improve the processing yield.

[0053] As shown in Figures 1 to 3 In some embodiments, a vacuum cavity 111 can be formed in the base 100. The side of the base 100 away from the bearing side 101 is also provided with a communication hole 112 communicating with the vacuum cavity 111. The end of the communication hole 112 away from the vacuum cavity 111 can be used to connect the vacuum device.

[0054] The adsorption plate 600 can be embedded on one side of the base 100 facing the bearing side 101. The vacuum holes 610 can communicate with the vacuum cavity 111. In an embodiment, a plurality of vacuum holes 610 are formed on the adsorption plate 600, and the vacuum holes 610 can be arranged in an array on the adsorption plate 600.

[0055] During use, the vacuum device can communicate with each vacuum hole 610 through the vacuum cavity 111, and each vacuum hole 610 can be pumped to negative pressure through the vacuum 111. Thus, the pressure at each vacuum hole 610 can be ensured to be consistent, so that the adsorption force on each part of the workpiece is consistent, that is, each part of the workpiece is uniformly stressed, thereby reducing the probability of problems such as cracking of the workpiece due to uneven stress on each part, and improving the processing yield of the workpiece.

[0056] In some embodiments, a plurality of second threaded holes 114 are formed on the base 100. When the chip processing jig 1000 is placed on the ultrasonic wire bonding equipment, a bolt can be inserted into the second threaded hole 114 and screwed with the ultrasonic wire bonding equipment to fix the chip processing jig 1000 on the ultrasonic wire bonding equipment.

[0057] The number of second threaded holes 114 can be set as needed, for example, the number of second threaded holes 114 can be one, two, three or any other number, which is not specifically limited here.

[0058] As shown in Figures 1 to 3 In some embodiments, a first positioning hole 116 and a second positioning hole 117 are formed on the base 100. The first positioning hole 116 and the second positioning hole 117 can each be one. The first positioning hole 116 and the second positioning hole 117 are arranged at different positions of the base 100. The shape of the first positioning hole 116 can be different from the shape of the second positioning hole 117. In some embodiments, the first positioning hole 116 can be a circular hole structure, and the second positioning hole 117 can be a waist-shaped hole structure. Correspondingly, two positioning columns corresponding to the first positioning hole 116 and the second positioning hole 117 can be provided on the ultrasonic wire bonding equipment. Thus, the positioning and foolproof installation of the chip processing jig 1000 and the ultrasonic wire bonding equipment can be achieved, the accuracy of the wire bonding operation can be ensured, and the workpiece yield can be improved.

[0059] As shown in Figures 1 to 3 In some embodiments, the first clamping plate 210 is detachably connected to the base 100, and the first clamping plate 210 can be adjusted in position relative to the base 100 in a direction parallel to the sliding direction M. Thus, the size of the clamping position 230 between the first clamping plate 210 and the second clamping plate 220 can be adjusted as needed to adapt to workpieces of different sizes. The size of the clamping position 230 can refer to the size of the clamping position 230 in the sliding direction M.

[0060] In some embodiments, the first clamping plate 210 may have a waist-shaped hole 211, and the length direction of the waist-shaped hole 211 may be parallel to the sliding direction M of the second clamping plate 220. In some embodiments, the first clamping plate 210 may have two parallel waist-shaped holes 211, and the two waist-shaped holes 211 may be respectively located at both ends of the first clamping plate 210 and respectively located on both sides of the adsorption plate 600.

[0061] Correspondingly, the base 100 may have two sets of first threaded holes 113. The two sets of first threaded holes 113 may be respectively located on both sides of the adsorption plate 600 and are respectively set to correspond to the two waist-shaped holes 211.

[0062] like Figures 1 to 4 As shown, in some embodiments, the chip processing fixture 1000 further includes a locking member 300. The locking member 300 may include an integral connecting rod portion 310 and a limiting portion 320, the limiting portion 320 being located at one end of the connecting rod portion 310. In an embodiment, the peripheral side of the connecting rod portion 310 is further provided with an external thread 311, and the external thread 311 is adapted to the first threaded hole 113. The limiting portion 320 may protrude relative to the peripheral side of the connecting rod portion 310.

[0063] When it is necessary to lock the relative position between the first clamping plate 210 and the base 100, the connecting rod portion 310 can be inserted into the oblong hole 211 of the first clamping plate 210, and the connecting rod portion 310 can be screwed into the corresponding first threaded hole 113. The limiting portion 320 can abut against the side of the first clamping plate 210 away from the base 100. In this way, the first clamping plate 210 can be fixed relative to the base 100, preventing the first clamping plate 210 from moving freely relative to the base 100.

[0064] When it is necessary to adjust the size of the clamping position 230, i.e., to adjust the position of the first clamping plate 210, the locking member 300 can be rotated out relative to the base 100 to create a gap between the limiting part 320 and the first clamping plate 210, thereby unlocking the first clamping plate 210. Thus, the first clamping plate 210 can be moved as needed to adjust the size of the clamping position 230 between the first clamping plate 210 and the second clamping plate 220. During this process, the connecting rod part 310 of the locking member 300 can move relative to the oblong hole 211. After adjustment, the locking member 300 can be gradually tightened to the base 100, and the limiting part 320 can be firmly pressed against the side of the first clamping plate 210 opposite to the base 100.

[0065] In some embodiments, each group of the first threaded holes 113 includes a plurality of first threaded holes 113. The plurality of first threaded holes 113 of each group can be arranged in sequence and spaced apart along the sliding direction M. Thus, the adjustment range of the position of the first clamping plate 210 can be further expanded to adapt the chip processing jig 1000 to more size types of workpieces. When the position of the first clamping plate 210 needs to be adjusted, the position of the locking piece 300 can also be adjusted as needed to connect the locking piece 300 with different first threaded holes 113.

[0066] In other embodiments, each group of the first threaded holes 113 can also include one first threaded hole 113.

[0067] In other embodiments, the connecting rod portion 310 and the base 100 can also be fixedly connected by means of a tight fit or the like. Correspondingly, the base 100 can be provided with a connecting hole adapted to the connecting rod portion 310. When the position of the first clamping plate 210 needs to be adjusted, the locking piece 300 can be pulled to separate the limiting portion 320 from the first clamping plate 210 to unlock the first clamping plate 210.

[0068] In other embodiments, the locking piece 300 can also be a buckle structure, and the locking piece 300 can be hingedly connected to the side edge of the first clamping plate 210 by means of a hinge or the like. The side of the base 100 or the edge away from the bearing side 101 can be provided with a clamping groove or a clamping block structure adapted to the locking piece 300. When the position of the first clamping plate 210 needs to be locked, the buckle structure can be clamped with the clamping groove (or the clamping block structure) on the base 100 to fix the first clamping plate 210 relative to the base 100.

[0069] As shown in some embodiments, the side of the base 100 facing the bearing side 101 is also provided with a sink groove 115. Figures 1 to 3

[0070] In some embodiments, the bottom of the sink groove 115 can be fixedly connected with a sliding rail 410 by means of a screw connection or the like, and the extension direction of the sliding rail 410 can be parallel to the sliding direction M of the second clamping plate 220. The side of the second clamping plate 220 facing the base 100 can be fixedly connected with a sliding block 420 by means of a screw connection or the like. The sliding block 420 can be slidingly installed on the sliding rail 410. Thus, the second clamping plate 220 can be slidingly installed on the base 100. At the same time, in the sliding process of the second clamping plate 220, the sliding rail 410 and the sliding block 420 can cooperate to provide a guiding function for the sliding of the second clamping plate 220, thereby reducing the probability of tilting of the second clamping plate 220, so as to smoothly clamp the workpiece by the second clamping plate 220 and the first clamping plate 210, and also facilitate the second clamping plate 220 and the first clamping plate 210 to provide a stable and reliable clamping force for the workpiece, thereby reducing the possibility of the workpiece being accidentally separated from the chip processing jig 1000.​

[0071] In the embodiment, the second clamping plate 220 is slidingly installed in the sink 115, so that the second clamping plate 220 and the first clamping plate 210 are substantially in the same plane, so that the first clamping plate 210 and the second clamping plate 220 accurately clamp the workpiece and provide stable and reliable clamping force for the workpiece.

[0072] As shown in Figure 1 and Figure 2 The chip processing jig 1000 further includes a driving assembly 500. The driving assembly 500 is in driving connection with the second clamping plate 220. In use, the second clamping plate 220 is driven by the driving assembly 500 to move along the sliding direction M to approach and move away from the first clamping plate 210.

[0073] In some embodiments, the driving assembly 500 can include a driving member 510 and a transmission rod 520. The axial direction of the transmission rod 520 can be parallel to the sliding direction M of the second clamping plate 220. One end of the transmission rod 520 is in driving connection with the second clamping plate 220, and the other end of the transmission rod 520 is in driving connection with the driving member 510. When the driving member 510 operates, the transmission rod 520 is driven to move, so as to drive the second clamping plate 220 to move along the sliding direction M to approach and move away from the first clamping plate 210.

[0074] In some embodiments, the transmission rod 520 can be a screw rod. The transmission rod 520 is rotatably installed at the bottom of the sink 115. The side of the second clamping plate 220 facing the base 100 is fixedly connected with a screw rod nut (not shown in the figure) by means of a screw, etc. The screw rod nut can be sleeved on the transmission rod 520 and screwed with the transmission rod 520.

[0075] The driving member 510 can be a handle. The end of the transmission rod 520 away from the first clamping plate 210 can protrude relative to the base 100. The driving member 510 is fixedly connected to the end of the transmission rod 520 away from the first clamping plate 210.

[0076] When it is needed to drive the second clamping plate 220 to approach or move away from the first clamping plate 210, the handle can be rotated to drive the transmission rod 520 to rotate. In addition, under the cooperation of the sliding rail 410 and the sliding block 420, the screw rod nut and the second clamping plate 220 can be limited to rotate relative to the base 100, so that the screw rod nut and the second clamping plate 220 can be driven to move along the axial direction of the transmission rod 520, i.e. the second clamping plate 220 is driven to move along the sliding direction M to approach or move away from the first clamping plate 210.

[0077] In some other embodiments, the transmission rod 520 can be replaced by a screw rod. The driving member 510 can be replaced by a motor. In addition, the second clamping plate 220 can be provided with a pressure sensor on the side facing the first clamping plate 210, and the pressure sensor can be in communication connection with the motor. In the process of clamping the workpiece by the cooperation of the second clamping plate 220 and the first clamping plate 210, when the pressure sensor detects that the pressure acting on the workpiece reaches a preset value, the driving member 510 can be controlled to stop working.

[0078] In some other embodiments, the driving assembly 500 can also be replaced by a screw rod or an electric push rod.

[0079] In the embodiments, by providing the driving assembly 500, the adjustment of the position of the second clamping plate 220 can be conveniently realized, and the operator can be conveniently operated.

[0080] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, different embodiments or examples described in the specification and the features of different embodiments or examples can be combined and combined by those skilled in the art without contradiction.

[0081] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A chip processing fixture, characterized in that, include: The base, including the load-bearing side; An adsorption plate is installed on the side of the base facing the bearing side, and the adsorption plate has a vacuum hole communicating with the bearing side; The first clamping plate is disposed on the side of the base facing the bearing side; The second clamping plate is disposed on the side of the base facing the bearing side and is opposite to the first clamping plate in a direction parallel to the adsorption plate. The second clamping plate is slidably disposed on the base to move closer to and further away from the first clamping plate. A clamping position is provided between the second clamping plate and the first clamping plate in a direction perpendicular to the adsorption plate, and the clamping position is opposite to the vacuum hole.

2. The chip processing fixture according to claim 1, characterized in that, The first clamping plate is detachably connected to the base and its position is adjustable in a direction parallel to the sliding direction of the second clamping plate.

3. The chip processing fixture according to claim 2, characterized in that, The chip processing fixture also includes a locking component, which is detachably connected to the base. When the locking member is connected to the base, it can lock the first clamping plate to the base.

4. The chip processing fixture according to claim 3, characterized in that, The locking component includes a connecting rod portion and a limiting portion connected to one end of the connecting rod portion; The first clamping plate has a waist-shaped hole, and the length direction of the waist-shaped hole is parallel to the sliding direction of the second clamping plate; When the locking member locks the first clamping plate and the base, one end of the connecting rod passes through the waist-shaped hole and is detachably connected to the base, and the limiting part abuts against the side of the first clamping plate away from the base.

5. The chip processing fixture according to claim 4, characterized in that, The connecting rod portion is provided with external threads on its circumference; The base has multiple first threaded holes, which are arranged sequentially along the sliding direction of the second clamping plate, and the first threaded holes are adapted to the external thread.

6. The chip processing fixture according to claim 1, characterized in that, The chip processing fixture also includes a driving component, which is connected to the second clamping plate and is used to drive the second clamping plate to slide along the sliding direction.

7. The chip processing fixture according to claim 6, characterized in that, The driving assembly includes a driving member and a transmission rod. One end of the transmission rod is connected to the second clamping plate, and the driving member is connected to the end of the transmission rod away from the second clamping plate. The driving member is used to drive the transmission rod to move, so as to move the second clamping plate closer to and away from the first clamping plate.

8. The chip processing fixture according to claim 7, characterized in that, The transmission rod includes a lead screw, which is rotatably mounted on the base. A lead screw nut is fixedly connected to the side of the second clamping plate facing the base, and the lead screw nut is screwed to the transmission rod. The driving component includes a handle, which is fixedly connected to the end of the transmission rod away from the first clamping plate and protrudes relative to the base.

9. The chip processing fixture according to any one of claims 6 to 8, characterized in that, The base is provided with a slide rail on the side facing the bearing side, and the slide rail is parallel to the sliding direction of the second clamping plate; The second clamping plate is connected to a slider on the side facing the base, and the slider is slidably connected to the slide rail.

10. The chip processing fixture according to claim 1, characterized in that, The base has a vacuum chamber, and the side of the base away from the bearing side has a communication hole that communicates with the vacuum chamber. The communication hole is used to connect to a vacuum pumping device. The vacuum hole is connected to the vacuum cavity.

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