Film tearing operation table for silicon wafer thinning processing

Abstract

The utility model relates to the technical field of silicon wafer processing, and provides a film tearing operation table for silicon wafer thinning processing, which comprises an operation table body, a rotating rod is movably embedded in the left side of the interior of the operation table body, a crank is fixedly mounted on the left side of the rotating rod, and a limiting gear is fixedly sleeved on the outer surface of the rotating rod. The left side of the operation table body is fixedly provided with a connecting column, the outer surface of the connecting column is connected with a limiting block in a sliding mode, the limiting block is meshed with the limiting gear, the right side of the limiting block is fixedly provided with a reset spring, and the inner surface of the reset spring is movably arranged on the outer surface of the connecting column in a sleeved mode. Through the arrangement of a forward rotation lead screw and a limiting gear structure, an operator can drive the whole adjusting system to adjust the height of the platen only through rotation of a crank, and meanwhile the safety in the adjusting process can be guaranteed through the design of a limiting block.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, and in particular to a film-peeling operation table for silicon wafer thinning processing. Background Technology

[0002] The film removal operation is an important step in silicon wafer thinning. It usually involves removing the attached protective film or coating from the silicon wafer surface. Common film materials include photoresist, oxide film, and protective film. The main purpose of film removal is to remove these materials to ensure the cleanliness of the silicon wafer surface and meet the surface quality requirements of subsequent processes (such as etching, wafer bonding, etc.). The film removal operation station is mainly used by operators to manually remove the protective film from the silicon wafer surface.

[0003] However, existing silicon wafer thinning peeling worktables lack flexible height adjustment functionality in their design. This means that operators cannot adjust the height of the worktable according to their own height or comfort needs. Due to the lack of an effective adjustment mechanism, the worktable cannot be personalized according to height, and operators may have to adopt unnatural postures to work. For example, shorter operators may need to bend over, while taller operators may need to lower their heads or stretch their arms to complete the task. This inappropriate posture not only increases the physical burden during operation, but may also lead to long-term discomfort, fatigue, and musculoskeletal problems. Utility Model Content

[0004] The purpose of this invention is to solve the problem that the lack of flexible height adjustment function in the existing technology makes it impossible for operators to adjust the height of the operating table according to their own height or comfort needs during use.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a film-peeling operating table for silicon wafer thinning processing, comprising an operating table body, a rotating rod movably embedded in the left side of the operating table body, a crank fixedly installed on the left side of the rotating rod, a limiting gear fixedly sleeved on the outer surface of the rotating rod, a connecting column fixedly installed on the left side of the operating table body, a limiting block slidably connected to the outer surface of the connecting column, the limiting block meshing with the limiting gear, a return spring fixedly installed on the right side of the limiting block, the inner surface of the return spring movably sleeved on the outer surface of the connecting column, the other end of the return spring fixedly installed on the left side of the operating table body, a forward rotation screw fixedly installed on the right side of the rotating rod, a reverse rotation screw fixedly installed on the right side of the forward rotation screw, and the right outer surface of the reverse rotation screw movably embedded in the right side of the inner wall of the operating table body.

[0006] In a preferred embodiment, a crossbeam is fixedly installed inside the operating table body, and sliders are threadedly connected to the outer surfaces of both the forward and reverse lead screws.

[0007] The technical effect of adopting the above-mentioned further solution is that the slider can be driven to move by the forward and reverse lead screws.

[0008] In a preferred embodiment, the crossbeam has a groove inside, and the bottom outer surfaces of the two sliders are slidably connected to the inner surface of the groove.

[0009] The technical effect of adopting the above-mentioned further solution is that it allows the slider to slide through the groove.

[0010] In a preferred embodiment, both sides of the two sliders are movably connected to support rods, and the other ends of the four support rods are movably connected to hinges.

[0011] The technical effect of adopting the above-mentioned further solution is that the support rod can be moved by the slider.

[0012] In a preferred embodiment, a platform is fixedly mounted on the top of each of the four hinges, and support columns are fixedly mounted on the bottom perimeter of each platform.

[0013] The technical effect of adopting the above-mentioned further solution is that the support rod can be flipped through the hinge.

[0014] In a preferred embodiment, the outer surfaces of the four support columns are movably embedded inside the operating table body, the table is provided with a vacuum adsorption platform, and a gantry frame is fixedly installed on the top of the table.

[0015] The technical effect of adopting the above-mentioned further solution is that the support column can be moved by pulling the platform.

[0016] In a preferred embodiment, electric push rods are fixedly installed on both sides of the top of the gantry frame, connecting plates are fixedly installed at the bottom of the two electric push rods, and a hot air blower is fixedly installed on the top of the gantry frame.

[0017] The technical effect of adopting the above-mentioned further solution is that the nozzle can be lowered by driving the connecting plate.

[0018] In a preferred embodiment, an air outlet pipe is fixedly installed on the left side of the hot air blower, the outer surface of the air outlet pipe is movably embedded in the top side of the inner wall of the gantry, and a nozzle is fixedly installed at the other end of the air outlet pipe, the nozzle being fixedly embedded inside the connecting plate.

[0019] The technical effect of adopting the above-mentioned further solution is that hot air can be transported to the inside of the nozzle through the air outlet pipe.

[0020] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0021] 1. In use, this utility model, through the setting of the forward rotating lead screw and the limit gear structure, not only allows the operator to drive the entire adjustment system to complete the adjustment of the platform height simply by rotating the handle, but also ensures the safety of the adjustment process by the design of the limit block. This solves the problem of the lack of flexible height adjustment function in the prior art, which makes it impossible for the operator to adjust the height of the operating platform according to their own height or comfort needs.

[0022] 2. In use, the electric push rod and nozzle structure of this utility model can not only adsorb and fix the silicon wafer through the vacuum adsorption platform, ensuring that the silicon wafer maintains a stable position during heating and avoiding the impact of silicon wafer movement or vibration on the heating effect, but also provide an appropriate temperature during the film peeling operation, reducing the adhesion between the film and the silicon wafer, making the film layer easier to peel off. Attached Figure Description

[0023] Figure 1 A rear-view three-dimensional structural diagram of a film-peeling operation table for silicon wafer thinning processing provided by this utility model;

[0024] Figure 2 A partial three-dimensional structural diagram of a film-peeling operating table for silicon wafer thinning processing provided by this utility model. Figure 1 ;

[0025] Figure 3 A partial three-dimensional structural diagram of a film-peeling operating table for silicon wafer thinning processing provided by this utility model. Figure 2 ;

[0026] Figure 4 A partial three-dimensional structural diagram of a film-peeling operating table for silicon wafer thinning processing provided by this utility model. Figure 3 .

[0027] Legend:

[0028] 1. Control panel body; 101. Crossbeam; 102. Rotating rod; 103. Handle; 104. Limit gear; 105. Connecting column; 106. Limit block; 107. Return spring; 108. Forward rotation screw; 109. Reverse rotation screw; 110. Slide groove; 111. Slider; 112. Support rod; 113. Hinge; 114. Platform; 115. Support column; 116. Vacuum adsorption platform; 2. Gantry frame; 201. Electric push rod; 202. Connecting plate; 203. Hot air blower; 204. Air outlet pipe; 205. Nozzle. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Example 1, please refer to Figures 1 to 4 This utility model provides a technical solution: a film-peeling operating table for silicon wafer thinning processing, including an operating table body 1. A rotating rod 102 is movably embedded in the left side of the operating table body 1. A crank 103 is fixedly installed on the left side of the rotating rod 102. A limiting gear 104 is fixedly sleeved on the outer surface of the rotating rod 102. A connecting column 105 is fixedly installed on the left side of the operating table body 1. A limiting block 106 is slidably connected to the outer surface of the connecting column 105, and the limiting block 106 meshes with the limiting gear 104. A return spring 107 is fixedly installed on the right side of the limiting block 106. The inner surface of the return spring 107 is movably sleeved on the outer surface of the connecting column 105. The other end of the return spring 107 is fixedly installed on the left side of the operating table body 1. The right side of the rotating rod 102 is fixed... A forward-rotating lead screw 108 is installed, and a reverse-rotating lead screw 109 is fixedly installed on the right side of the forward-rotating lead screw 108. The outer surface of the right side of the reverse-rotating lead screw 109 is movably embedded in the right side of the inner wall of the operating table body 1. A crossbeam 101 is fixedly installed inside the operating table body 1. Slider 111 is threadedly connected to the outer surfaces of both the forward-rotating lead screw 108 and the reverse-rotating lead screw 109. A slide groove 110 is opened inside the crossbeam 101. The bottom outer surfaces of the two sliders 111 are slidably connected to the inner surface of the slide groove 110. Support rods 112 are movably connected to both sides of the two sliders 111. The other ends of the four support rods 112 are movably connected to hinges 113. A table plate 114 is fixedly installed on the top of the four hinges 113. Support columns 115 are fixedly installed around the bottom of the table plate 114.

[0031] In this embodiment, the operator can first push the limiting block 106 to the right, causing it to slide to the right via the connecting column 105 and compress the return spring 107, thereby disengaging it from the limiting gear 104. Then, by turning the rocker handle 103, the rotation rod 102 transmits power to the forward lead screw 108, which in turn transmits power to the reverse lead screw 109. When the forward and reverse lead screws 108 and 109 are rotating, they will drive the slider 111 to slide outward via the groove 110 on the crossbeam 101, and the slider 111 will pull the support rod 112 to move. The support rod 112 rotates and flips via hinge 113. When the support rod 112 rotates, it pushes the platform 114 upward, and the platform 114 pulls the support column 115 to slide upward inside the operating table body 1, thereby adjusting the height of the platform 114. Furthermore, the structure of the forward rotating screw 108 and the limiting gear 104 not only allows the operator to drive the entire adjustment system to complete the height adjustment of the platform 114 simply by rotating the crank 103, but also ensures safety during the adjustment process through the design of the limiting block 106.

[0032] Example 2, as Figures 1 to 4 As shown, the outer surfaces of the four support columns 115 are movably embedded inside the operating table body 1. The table 114 is provided with a vacuum adsorption platform 116. The top of the table 114 is fixedly installed with a gantry frame 2. Electric push rods 201 are fixedly installed on both sides of the top of the gantry frame 2. Connecting plates 202 are fixedly installed at the bottom of the two electric push rods 201. A hot air blower 203 is fixedly installed on the top of the gantry frame 2. An air outlet pipe 204 is fixedly installed on the left side of the hot air blower 203. The outer surface of the air outlet pipe 204 is movably embedded in the top side of the inner wall of the gantry frame 2. A nozzle 205 is fixedly installed at the other end of the air outlet pipe 204. The nozzle 205 is fixedly embedded inside the connecting plate 202.

[0033] In this embodiment, personnel can first place the silicon wafer on the vacuum adsorption platform 116 and start the vacuum adsorption platform 116 through its drive system to adsorb and fix the silicon wafer. Then, through the power supply system of the electric push rod 201 on the gantry 2, the electric push rod 201 is started, so that when it extends, it can drive the nozzle 205 to descend through the connecting plate 202. After it descends to the appropriate position, personnel can start the hot air blower 203 through its power supply system. When it is running, it can transport hot air through the air outlet pipe 204 into the interior of the nozzle 205 and spray hot air through the nozzle 205 to heat the silicon wafer. Through the structure of the electric push rod 201 and the nozzle 205, not only can the silicon wafer be adsorbed and fixed by the vacuum adsorption platform 116, but it can also ensure that the silicon wafer maintains a stable position during the heating process, avoiding the impact of the heating effect due to the movement or vibration of the silicon wafer. At the same time, it can provide an appropriate temperature during the film peeling operation, reduce the adhesion between the film and the silicon wafer, and make the film layer easier to peel off.

[0034] Working principle: In use, the operator can first push the limit block 106 to the right, causing it to slide to the right through the connecting column 105 and compress the return spring 107, thereby disengaging it from the limit gear 104. Then, by turning the rocker handle 103, the rotation rod 102 transmits power to the forward lead screw 108, which in turn transmits power to the reverse lead screw 109. When the forward and reverse lead screws 108 and 109 rotate, they drive the slider 111 to slide outward through the groove 110 on the crossbeam 101, and the slider 111 pulls the support rod 112 forward. The system moves while simultaneously rotating via hinge 113. When the support rod 112 rotates, it pushes the platform 114 upwards, and the platform 114 pulls the support column 115 upwards inside the operating table body 1, thereby adjusting the height of the platform 114. Furthermore, the design of the forward rotating screw 108 and the limiting gear 104 allows the operator to drive the entire adjustment system to adjust the height of the platform 114 simply by rotating the crank 103. At the same time, the design of the limiting block 106 ensures safety during the adjustment process. In use, personnel can first place the silicon wafer on the vacuum adsorption platform 116 and start the vacuum adsorption platform 116 through its drive system to adsorb and fix the silicon wafer. Then, through the power supply system of the electric push rod 201 on the gantry 2, the electric push rod 201 is started, so that when it extends, it can drive the nozzle 205 to descend through the connecting plate 202. After it descends to the appropriate position, personnel can start the hot air blower 203 through its power supply system. When it is running, it can transport hot air through the air outlet pipe 204 into the interior of the nozzle 205 and spray hot air through the nozzle 205 to heat the silicon wafer. Through the structure of the electric push rod 201 and the nozzle 205, not only can the silicon wafer be adsorbed and fixed by the vacuum adsorption platform 116, but it can also ensure that the silicon wafer maintains a stable position during the heating process, avoiding the impact of the silicon wafer's movement or vibration on the heating effect. At the same time, it can provide an appropriate temperature during the film peeling operation, reducing the adhesion between the film and the silicon wafer, making the film layer easier to peel off.

[0035] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the present utility model.

Claims

1. A film-peeling operating table for silicon wafer thinning processing, comprising an operating table body (1), characterized in that: A rotating rod (102) is movably embedded in the left side of the operating console body (1). A crank (103) is fixedly installed on the left side of the rotating rod (102). A limiting gear (104) is fixedly sleeved on the outer surface of the rotating rod (102). A connecting column (105) is fixedly installed on the left side of the operating console body (1). A limiting block (106) is slidably connected to the outer surface of the connecting column (105). The limiting block (106) meshes with the limiting gear (104). The right side of the limiting block (106) is fixed. A return spring (107) is installed, the inner surface of which is movably sleeved on the outer surface of the connecting column (105). The other end of the return spring (107) is fixedly installed on the left side of the operating table body (1). A forward rotation screw (108) is fixedly installed on the right side of the rotating rod (102). A reverse rotation screw (109) is fixedly installed on the right side of the forward rotation screw (108). The outer surface of the reverse rotation screw (109) is movably embedded in the right side of the inner wall of the operating table body (1).

2. The film-peeling operating table for silicon wafer thinning processing according to claim 1, characterized in that: A crossbeam (101) is fixedly installed inside the operating table body (1), and sliders (111) are threadedly connected to the outer surfaces of the forward rotation screw (108) and the reverse rotation screw (109).

3. The film-peeling operating table for silicon wafer thinning processing according to claim 2, characterized in that: The crossbeam (101) has a groove (110) inside, and the bottom outer surfaces of the two sliders (111) are slidably connected to the inner surface of the groove (110).

4. The film-peeling operating table for silicon wafer thinning processing according to claim 3, characterized in that: Both sides of the two sliders (111) are movably connected to support rods (112), and the other ends of the four support rods (112) are movably connected to hinges (113).

5. The film-peeling operating table for silicon wafer thinning processing according to claim 4, characterized in that: A platform (114) is fixedly installed on the top of each of the four hinges (113), and support columns (115) are fixedly installed around the bottom of each platform (114).

6. The film-peeling operating table for silicon wafer thinning processing according to claim 5, characterized in that: The outer surfaces of the four support columns (115) are movably embedded inside the operating table body (1). The table (114) is provided with a vacuum adsorption platform (116), and a gantry frame (2) is fixedly installed on the top of the table (114).

7. The film-peeling operating table for silicon wafer thinning processing according to claim 6, characterized in that: Electric push rods (201) are fixedly installed on both sides of the top of the gantry frame (2), and connecting plates (202) are fixedly installed at the bottom of the two electric push rods (201). A hot air blower (203) is fixedly installed on the top of the gantry frame (2).

8. The film-peeling operating table for silicon wafer thinning processing according to claim 7, characterized in that: An air outlet pipe (204) is fixedly installed on the left side of the hot air blower (203). The outer surface of the air outlet pipe (204) is movably embedded in the top side of the inner wall of the gantry frame (2). A nozzle (205) is fixedly installed at the other end of the air outlet pipe (204). The nozzle (205) is fixedly embedded inside the connecting plate (202).

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