Semiconductor embedded type vehicle-mounted refrigerator based on TEC

Abstract

According to the semiconductor embedded type vehicle-mounted refrigerator based on the TEC, an inner container is embedded in a shell, and an opening is formed in the upper end of the inner container; the inner container comprises a cold storage area inner container and a freezing area inner container; a refrigeration area refrigeration assembly and a freezing area refrigeration assembly are arranged in the refrigeration area inner container and the freezing area inner container respectively. The refrigeration area refrigeration assembly and the freezing area refrigeration assembly are both achieved based on a TEC refrigeration module and share one heat dissipation system, and water cooling plates in the refrigeration area refrigeration assembly and the freezing area refrigeration assembly are connected in series through a pipeline and connected with a water cooling row through a pipeline. The refrigeration area refrigeration assembly and the freezing area refrigeration assembly are the same in structure and comprise semiconductor refrigeration pieces, the cold ends of the semiconductor refrigeration pieces are connected with cold end fins, cold end fans are arranged on the cold end fins, and the hot ends of the semiconductor refrigeration pieces are connected with water cooling plates. According to the working principle of the Peltier effect, rapid cooling of a freezing area can be achieved, and the refrigerating effect of 0 DEG C can be achieved within 8 minutes.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of semiconductor embedded vehicle-mounted refrigerator based on TEC. BACKGROUND

[0002] Embedded vehicle-mounted refrigerator is one of vehicle-mounted refrigerator, its installation position is in the trunk of vehicle, main body is embedded in vehicle body, refrigerator door and control panel are exposed outside the trunk, facilitate user operation and take and place article.The traditional vehicle-mounted refrigerator is mostly using compressor refrigeration technology, there is high energy consumption, noise, volume and weight are larger and the like defects.Semiconductor refrigeration technology with its low noise, small size, light weight, no pollution, can work stably in high temperature, low temperature and humid environment, gradually be applied to refrigeration field, especially in the application of vehicle-mounted refrigerator. SUMMARY

[0003] The technical problem to be solved by the utility model is: how to solve the high energy consumption, noise and the like defects of traditional vehicle-mounted refrigerator, provide a kind of semiconductor embedded vehicle-mounted refrigerator based on TEC.

[0004] The technical scheme of the utility model is specifically as follows:

[0005] A kind of semiconductor embedded vehicle-mounted refrigerator based on TEC, including the shell of upper end opening, embedding inner container in shell, and the upper end opening of inner container;

[0006] The inner container includes refrigeration area inner container and freezing area inner container, refrigeration area inner container is hinged with refrigeration area flip cover, and freezing area inner container is hinged with freezing area flip cover;And refrigeration area refrigeration assembly and freezing area refrigeration assembly are respectively arranged in refrigeration area inner container and freezing area inner container;

[0007] The refrigeration assembly and freezing area refrigeration assembly based on TEC refrigeration module are realized, and a set of heat dissipation system is shared by the two, and the water-cooled plate in the refrigeration assembly and freezing area refrigeration assembly is connected in series by pipeline, and is connected by pipeline connection water-cooled row;The refrigeration assembly and freezing area refrigeration assembly structure are same, and all include semiconductor refrigeration piece, semiconductor refrigeration piece cold end connects cold end fin, and cold end fan is arranged on cold end fin, and semiconductor refrigeration piece hot end is connected with water-cooled plate.

[0008] Refrigeration area inner container and freezing area inner container are packaged together, and upper turning edge is arranged at the upper portion of two, and space is left between upper turning edge and the shell outside for filling the heat preservation layer of inner container.

[0009] Grating is arranged on the inner container wall at the rear end of refrigeration area inner container and freezing area inner container.

[0010] Arc-shaped air duct is arranged at the rear end of refrigeration assembly and freezing area refrigeration assembly, and cold end fan of cold end fin is installed between grating and arc-shaped air duct.

[0011] Second air holes are arranged on the front side and the rear side of the shell, and first air holes are arranged on the left side and the right side of the shell.

[0012] The bottom of the shell is provided with a bottom plate, the bottom plate is provided with an inner container fixing seat, the inner container is arranged on the inner container fixing seat, the bottom plate is further provided with a water cooling row fixing seat, the water cooling row fixing seat is fixedly provided with a water cooling row, and the water cooling row is provided with a fan for auxiliary heat dissipation.

[0013] The bottom plate is further provided with a heat dissipation water tank, and the heat dissipation water tank is located below the freezing area inner container.

[0014] Hand buckle positions are arranged on the two sides of the shell.

[0015] A control panel is arranged on the upper surface of the shell.

[0016] The semiconductor embedded vehicle-mounted refrigerator based on TEC has the advantages that the refrigerator utilizes the Peltier effect as the working principle, can realize rapid cooling of the freezing area, and realizes the refrigeration effect of 0 DEG C in 8 minutes. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a whole structure schematic view of the utility model;

[0018] Figure 2 It is an explosion view of the utility model;

[0019] Figure 3 It is a structure view of the refrigeration assembly. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0021] As shown in Figure 1 , Figure 2 A semiconductor embedded vehicle-mounted refrigerator based on TEC, comprising a shell 1 with an upper opening, an inner container 2 embedded in the shell 1, the upper end of the inner container 2 being open, and a heat preservation layer arranged between the shell 1 and the inner container 2.

[0022] The inner container 2 comprises a refrigeration zone inner container 23 and a freezing zone inner container 24, the refrigeration zone inner container 23 is hinged with the refrigeration zone flip cover 12, and the freezing zone inner container 24 is hinged with the freezing zone flip cover 11. It should be noted that the refrigeration zone inner container 23 and the freezing zone inner container 24 are packaged together, and an upper turning edge 21 is arranged at the upper part of the two, and a space is left between the upper turning edge 21 and the outer shell 1 for filling the heat preservation layer of the inner container.

[0023] And the refrigeration zone refrigeration assembly 7 and the freezing zone refrigeration assembly 8 are arranged in the refrigeration zone inner container 23 and the freezing zone inner container 24 respectively. Better, the grating 22 is arranged on the inner container wall at the rear end of the refrigeration zone inner container 23 and the freezing zone inner container 24.

[0024] The bottom of the shell 1 is provided with a bottom plate 4, the bottom plate 4 is provided with an inner container fixing seat 41, and the inner container 2 is arranged on the inner container fixing seat 41. Better, the water cooling row fixing seat 42 is also arranged on the bottom plate 4, and the water cooling row 6 is fixedly arranged on the water cooling row fixing seat 42, and the fan is installed on the water cooling row 6 to assist heat dissipation. In addition, the heat dissipation water tank 5 is also arranged on the bottom plate 4, and the heat dissipation water tank 5 is located below the freezing zone inner container 24, so that the volume of the freezing zone inner container 24 is smaller than that of the refrigeration zone inner container 23.

[0025] Further, the hand buckle position 13 is arranged on both sides of the shell 1.

[0026] Further, the second air hole 15 is arranged on the front side and the rear side of the shell 1, and the first air hole 14 is arranged on the left side and the right side of the shell 1 respectively. The first air hole 14 corresponds to the internal heat dissipation water row, and the second air hole 15 serves as the air inlet of the heat dissipation system.

[0027] Further, the control panel 3 is arranged on the upper surface of the shell 1.

[0028] The refrigeration zone refrigeration assembly 7 and the freezing zone refrigeration assembly 8 are core components of the vehicle-mounted refrigerator, and are used for cooling the refrigeration zone and the freezing zone respectively. The refrigeration zone refrigeration assembly 7 and the freezing zone refrigeration assembly 8 are both realized based on a TEC refrigeration module, and share a set of heat dissipation system. The water cooling plates in the refrigeration zone refrigeration assembly 7 and the freezing zone refrigeration assembly 8 are connected in series through pipelines, and are connected with the water cooling row 6 through the pipelines, and are cooled through the heat dissipation fins and the cooling pipeline in the water cooling row 6, and the fan is installed on the water cooling row 6 to assist heat dissipation. The refrigeration zone refrigeration assembly 7 and the freezing zone refrigeration assembly 8 both adopt the air cooling mode to reduce the temperature in the cavity.

[0029] The refrigeration assembly 7 of the refrigeration area and the refrigeration assembly 8 of the freezing area are identical in structure, and each comprises a semiconductor refrigeration sheet 73, the cold end of the semiconductor refrigeration sheet 73 is connected with a cold end fin 72, the cold end fin 72 is provided with a cold end fan 71, and the hot end of the semiconductor refrigeration sheet 73 is connected with a water cooling plate 74, which mainly cools the hot surface of the semiconductor refrigeration sheet 73, and the water cooling plate 74 is connected with a water cooling system.

[0030] The cold end fin 72 and the semiconductor refrigeration sheet 73 are evenly coated with a heat-conducting material between the cold end of the semiconductor refrigeration sheet 73 and the cold end fin 72 and between the hot end of the semiconductor refrigeration sheet 73 and the water cooling plate 74, so that sufficient heat conduction can be achieved.

[0031] The water cooling system in the utility model adopts a closed-loop water cooling system to ensure that the heat source can be effectively cooled, and the water in the heat dissipation water tank 5 is transported to the water cooling row 6 after absorbing heat through the water cooling plate 74, and exchanges heat with the surrounding air on the cooling fins, and meanwhile, a fan is additionally installed on the water cooling row 6 to accelerate the air flow and enhance the heat dissipation effect.

[0032] Further, the refrigeration assembly 7 of the refrigeration area and the refrigeration assembly 8 of the freezing area are each provided with an arc-shaped air duct, the cold end fan of the cold end fin 72 is installed between the grille 22 and the arc-shaped air duct, the internal air of the vehicle-mounted refrigerator is circulated and cooled when the vehicle-mounted refrigerator starts to cool, the refrigeration efficiency can be greatly improved, the temperature in the cavity can be quickly reduced to below zero, and the heat preservation layer is tightly attached to the outer side of the inner container 2 and is designed in a random shape.

[0033] The utility model also integrates other system functions, including: a vehicle-mounted refrigerator control module, which is used for controlling the temperature, humidity, opening state and other parameters of the refrigerator and communicating data with the vehicle information entertainment system; a vehicle information entertainment system, which is integrated with a display screen, a touch screen, a voice recognition module, a remote operation module and the like, and is used for interacting with the vehicle-mounted refrigerator control module; a sensor module, which includes a temperature sensor, a humidity sensor, a door state sensor and the like, and is used for monitoring the environmental state in the vehicle-mounted refrigerator in real time and transmitting data to the vehicle information entertainment system; a remote operation module, which supports control through a smart phone APP or other remote equipment, and realizes temperature setting, on-off control and other operations of the vehicle-mounted refrigerator by the vehicle owner outside the vehicle; a voice control module, which operates the vehicle-mounted refrigerator through the voice command of the vehicle owner, such as voice temperature adjustment, refrigerator on-off and the like. The user can also separately operate and set the temperature of the two temperature areas through the control panel. The vehicle function integration system timely reminds the vehicle owner when an abnormality occurs, reduces the risk of refrigerator failure, and enhances driving safety.

[0034] The semiconductor vehicle-mounted refrigerator adopts a semiconductor chip to realize refrigeration through water cooling heat dissipation and conduction technology and automatic voltage and current control technology, thereby completely solving the application problems that cannot be solved by mechanical refrigeration refrigerator, such as medium pollution and mechanical vibration, and having more significant energy-saving characteristics in the small-capacity low-temperature refrigeration box of the vehicle-mounted refrigerator.

[0035] The utility model discloses a kind of semiconductor embedded vehicle-mounted refrigerator devices based on TEC based on semiconductor refrigeration piece design, and the device refrigeration is realized by semiconductor refrigeration piece.TEC system can effectively reduce energy consumption while being miniaturized design, suitable for vehicle-mounted power supply, ice-making unit includes two refrigeration pieces, compact in size, power is small, cost is low, refrigeration speed is fast, noise is small.

[0036] The above is only preferred embodiment of the utility model, it should be pointed out, for the person skilled in the art, without departing from the overall concept of the utility model, can make some changes and improvements, these should be regarded as the protection scope of the utility model.

Claims

1. A TEC-based semiconductor embedded in-vehicle refrigerator, characterized by: The shell (1) with an upper opening, the inner container (2) is embedded in the shell (1), and the upper end of the inner container (2) is open; The inner container (2) comprises a refrigeration zone inner container (23) and a freezing zone inner container (24), the refrigeration zone inner container (23) is hinged with a refrigeration zone flip cover (12), the freezing zone inner container (24) is hinged with a freezing zone flip cover (11), and the refrigeration zone inner container (23) and the freezing zone inner container (24) are respectively provided with a refrigeration zone refrigeration assembly (7) and a freezing zone refrigeration assembly (8); The refrigeration zone refrigeration assembly (7) and the freezing zone refrigeration assembly (8) are both realized based on a TEC refrigeration module, share a set of heat dissipation systems, and the water-cooled plates in the refrigeration zone refrigeration assembly (7) and the freezing zone refrigeration assembly (8) are connected in series through pipelines and connected with the water-cooled row (6) through the pipelines; the refrigeration zone refrigeration assembly (7) and the freezing zone refrigeration assembly (8) are structurally identical and both comprise a semiconductor refrigeration sheet (73), the semiconductor refrigeration sheet (73) is connected with a cold end fin (72) at a cold end, the cold end fin (72) is provided with a cold end fan (71), and the semiconductor refrigeration sheet (73) is connected with a water-cooled plate (74) at a hot end.

2. A TEC-based semiconductor embedded car refrigerator according to claim 1, characterized in that: The refrigeration zone inner container (23) and the freezing zone inner container (24) are packaged together, an upper turning edge (21) is arranged at the upper portions of the two, and a space is left between the upper turning edge (21) and the outer shell (1) for filling a heat preservation layer of the inner container (2).

3. A TEC-based semiconductor embedded car refrigerator, according to claim 1, characterized in that: A grille (22) is arranged on the inner container wall at the rear ends of the refrigeration zone inner container (23) and the freezing zone inner container (24).

4. A TEC-based semiconductor embedded car refrigerator according to claim 3, characterized in that: Arc-shaped air ducts are arranged at the rear ends of the refrigeration zone refrigeration assembly (7) and the freezing zone refrigeration assembly (8), and the cold end fan of the cold end fin (72) is arranged between the grille (22) and the arc-shaped air duct.

5. A TEC-based semiconductor embedded in-vehicle refrigerator according to claim 1, characterized in that: Second air holes (15) are arranged on the front side and the rear side of the shell (1), and first air holes (14) are arranged on the left side and the right side of the shell (1).

6. A TEC-based semiconductor embedded in-vehicle refrigerator according to claim 1, characterized in that: A bottom plate (4) is arranged at the bottom of the shell (1), the inner container (2) is arranged on an inner container fixing seat (41) arranged on the bottom plate (4), a water-cooled row fixing seat (42) is further arranged on the bottom plate (4), a water-cooled row (6) is fixedly arranged on the water-cooled row fixing seat (42), and a fan is arranged on the water-cooled row (6) to assist heat dissipation.

7. A TEC-based semiconductor embedded car refrigerator according to claim 6, characterized in that: A heat dissipation water tank (5) is further arranged on the bottom plate (4) and located below the freezing zone inner container (24).

8. The TEC-based semiconductor embedded in-vehicle refrigerator of claim 1, wherein: Hand buckle positions (13) are arranged on the two sides of the shell (1).

9. A TEC-based semiconductor embedded car refrigerator, according to claim 1, characterized in that: A control panel (3) is arranged on the upper surface of the shell (1).

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