Semiconductor test switching tool

Abstract

The utility model relates to the semiconductor test field, and especially relates to a semiconductor test switching tool comprising a bottom plate, a top plate, two test mounting plates and a pressing mounting plate, the bottom plate and the top plate are fixedly connected through four columns, the number of the columns is two, and the number of the pressing mounting plates is two. Lifting cylinders are mounted on the front and rear sides of the upper end of the test mounting plate, a trigger plate is arranged on the lower end face of the test mounting plate, and the upper end of the trigger plate is fixedly connected with the test mounting plate through a second stand column; according to the utility model, the lower mounting plate is driven by the lifting cylinder to move downwards, the test device is pressed by the positioning rod, then the test mounting plate is driven by the lifting cylinder to move downwards, the trigger plate is attached to the upper part of the tested device, and meanwhile, the test needle on the trigger plate is aligned with the detection contact of the tested device through the test groove on the lower mounting plate; and the plurality of trigger plates are adaptive to the plurality of tested devices, so that the plurality of devices can be conveniently tested, and the test efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor test especially relates to a semiconductor test adapter tool. BACKGROUND

[0002] Semiconductor device is the electrically conductive body between the insulator, using the special electric characteristics of semiconductor material to complete the specific function electronic device, can be used to produce, control, receive, transform, amplify signal and carry out energy conversion, in the production process of semiconductor device, need to test the packaged semiconductor device, generally by a plurality of test needle and semiconductor contact, realize test;

[0003] The existing semiconductor test adopts probe to align the detection contact of the plate body, can only measure one every time, the test efficiency is very low, is not suitable for batch large-scale production, and the structure is single, in batch test, single test mode leads to low test efficiency.

[0004] Therefore, in view of the above existing semiconductor test efficiency is low, therefore, can design a semiconductor test adapter tool to test a plurality of devices, improve test efficiency. UTILITY MODEL CONTENT

[0005] In order to overcome the existing semiconductor test efficiency is low.

[0006] The utility model discloses a technical scheme for a semiconductor test adapter tool, including bottom plate, still including top plate, test installation board and lower pressure installation board, bottom plate and top plate are fixedly connected through stand one, and stand one is provided with four, test installation board is provided with two, and the front and rear side of test installation board upper end is installed with lift cylinder, and the lower end of test installation board is provided with trigger plate, and the upper end of trigger plate is fixedly connected with test installation board through stand two, and the lower end of trigger plate is provided with test needle, and lower pressure installation board is provided with two, and the lower installation board is provided with test groove, and the left and right side of lower pressure installation board upper end is installed with lift cylinder, and the lower end is provided with positioning rod, and the upper end of bottom plate is installed with water cooling plate, and the upper end of water cooling plate is provided with the device to be tested.

[0007] Preferably, the lift cylinder drives the lower pressure installation board to move, so that the test needle can be in contact with the detection contact of the plate body, the overall structure is simple, convenient to maintain, and the trigger plate can be replaced according to the product, convenient for debugging, and the device to be tested is installed on the water cooling plate, convenient for heat dissipation, ensure the accuracy of test data.

[0008] As preferred, the outer side of the surface of the test mounting plate is fixedly installed with a connecting block, a linear bearing is arranged on the connecting block, the connecting block is staggered and two, a guide column is slidingly installed in the linear bearing, and the upper and lower ends of the guide column are fixedly connected with the bottom plate and the top plate respectively.

[0009] As preferred, the outer side of the surface of the test mounting plate is fixedly installed with a connecting block, a linear bearing is arranged on the connecting block, the connecting block is staggered and two, a guide column is slidingly installed in the linear bearing, and the upper and lower ends of the guide column are fixedly connected with the bottom plate and the top plate respectively. The surface of the test mounting plate is provided with test grooves, the test grooves are equally spaced, the number is half of the test device, and the lower end of the test mounting plate is fixedly installed with a positioning rod on both sides of the test groove.

[0010] As preferred, the lifting cylinder and the test mounting plate are mutually adapted and provided with two groups, each group of lifting cylinder is provided with four, the output ends of the two lifting cylinders are fixedly connected with the upper end of the test mounting plate, the output ends of the two lifting cylinders are fixedly connected with the left and right ends of the test mounting plate, and the upper end of the lifting cylinder is fixedly connected with the top plate through the connecting fixed plate.

[0011] As preferred, the test needle on the trigger plate and the test groove on the test mounting plate are one-to-one corresponding, and the length and width of the trigger plate are greater than those of the test groove.

[0012] As preferred, the water cooling plate and the bottom plate are detachably connected through bolts, the water cooling plate is internally provided with a water cooling circulation cavity, and the water cooling plate is provided with a circulation port on one side end face.

[0013] As preferred, the tested device and the test groove are one-to-one corresponding, the tested device is positioned by the first positioning plate and the second positioning plate, the first positioning plate is symmetrically provided with two front and back, the second positioning plate is symmetrically provided with two left and right, the first positioning plate and the second positioning plate are provided with a rectangular positioning groove, the tested device is placed in the positioning groove, and the tested device is adapted with the positioning rod.

[0014] The utility model discloses the beneficial effect:

[0015] 1、 the semiconductor test switching tool, first by the lifting cylinder drive down mounting plate moves down, through the positioning rod press the test device, then by the lifting cylinder drive test mounting plate moves down again, trigger plate is adhered to the upper of the tested device, make the test needle on the trigger plate pass through the test groove on the down mounting plate and align the detection contact of the tested device, realize test, and multiple trigger plates adapt multiple tested devices, and the test of multiple devices is completed conveniently, and the test efficiency is improved.

[0016] 2、 the semiconductor test switching tool, through the replacement of trigger plate, convenient debugging, adapt different test products, and the product is positioned by the tested device, the alignment of test needle and contact is convenient, and the convenience is increased. Attached Figure Description

[0017] Figure 1 The diagram shown illustrates the overall structure of the semiconductor testing adapter of this utility model. Figure 1 ;

[0018] Figure 2 The diagram shown illustrates the overall structure of the semiconductor testing adapter of this utility model. Figure 2 ;

[0019] Figure 3 The diagram shown is a schematic representation of the water-cooled plate structure of the semiconductor testing adapter of this utility model.

[0020] Figure 4 The diagram shown is a schematic of the semiconductor test adapter trigger board structure of this utility model.

[0021] Explanation of reference numerals in the attached drawings: 1. Base plate; 2. Top plate; 3. Column 1; 4. Test mounting plate; 41. Connecting block; 42. Linear bearing; 43. Guide column; 5. Press-down mounting plate; 51. Positioning rod; 6. Lifting cylinder; 61. Connecting and fixing plate; 7. Column 2; 8. Trigger plate; 9. Test probe; 10. Water-cooled plate; 11. Positioning plate 1; 12. Positioning plate 2. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Please see Figures 1-4This utility model provides an embodiment: a semiconductor testing adapter, including a base plate 1, a top plate 2, a test mounting plate 4, and a pressing mounting plate 5. The base plate 1 and the top plate 2 are fixedly connected by four columns 3. Two test mounting plates 4 are provided. Connecting blocks 41 are fixedly installed on the outer surface of the test mounting plate 4. Linear bearings 42 are provided on the connecting blocks 41. The two connecting blocks 41 are distributed in an alternating manner. Guide columns 43 are slidably installed in the linear bearings 42. The upper and lower ends of the guide columns 43 are fixedly connected to the base plate 1 and the top plate 2, respectively. A lifting cylinder 6 is installed on the upper side of the test mounting plate 4. The upper surface of the pressing mounting plate 5 is provided with... There is a trigger plate 8, the upper end of which is fixedly connected to the test mounting plate 4 via the second column 7. The lower end face of the trigger plate 8 is provided with a test pin 9. The upper end face of the base plate 1 is equipped with a water-cooling plate 10, and the upper end face of the water-cooling plate 10 is provided with the device under test. The lifting cylinder 6 first drives the lower mounting plate 1 to move downward, and the positioning rod 51 presses down on the test device. Then the lifting cylinder 6 drives the test mounting plate 4 to move downward, so that the test pin 9 can form a contact with the detection contact of the plate body to realize the detection. The overall structure is simple and easy to maintain. The trigger plate 8 can be replaced according to the product, which is convenient for debugging. The device under test is installed on the water-cooling plate 10, which facilitates heat dissipation and ensures the accuracy of the test data.

[0024] Please see 1 and Figure 2 In this embodiment, the surface of the pressure mounting plate 5 is provided with test slots, and there are four test slots distributed at equal intervals. Positioning rods 51 are fixedly installed on both sides of the lower end of the pressure mounting plate 5 at the test slots. The test needles 9 correspond one-to-one with the test slots. The length and width of the trigger plate 8 are greater than the length and width of the test slots. The trigger plate 8 is installed at the lower end of the support column 2 7, and the upper end of the support column 2 7 is installed at the lower end of the test mounting plate 4. The test needles 9 are fixed on the trigger plate to facilitate test contact, and the trigger plate 8 can be replaced for easy debugging.

[0025] Please see Figure 2 and Figure 4 In this embodiment, two sets of lifting cylinders 6, test mounting plate 4, and lower mounting plate 5 are mutually adapted to each other. Each set has four lifting cylinders 6. The output ends of two lifting cylinders 6 are fixedly connected to the upper end of the test mounting plate 4, and the output ends of two lifting cylinders 6 are fixedly connected to the left and right ends of the lower mounting plate 5. The upper end of the lifting cylinder 6 is fixedly connected to the top plate 2 through the connecting fixing plate 61. The multiple lifting cylinders 6 drive the test mounting plate 4 and the lower mounting plate 5 to move downward. At the same time, the guide column 43 and the linear bearing 42 ensure the stability of the movement.

[0026] Please see Figure 1 and Figure 3In this embodiment, the water-cooled plate 10 and the base plate 1 are detachably connected by bolts. The water-cooled plate 10 has a water-cooled circulation chamber inside and a circulation port on one side of the water-cooled plate 10. The device under test and the test slot correspond one-to-one. The device under test is composed of a positioning plate 11 and a positioning plate 12. There are two positioning plates 11 arranged symmetrically front and back, and two positioning plates 12 arranged symmetrically left and right. A rectangular positioning groove is provided between the positioning plates 11 and 12. The rectangular positioning groove is adapted to the positioning rod 51. The product to be tested is placed in the rectangular positioning groove so that the bottom of the product is in contact with the water-cooled plate 10. At the same time, the positioning rod 51 presses down on the device under test during the test, which is more conducive to heat dissipation. The positioning plate is used for positioning, which facilitates the alignment of the test probe 9 and the product contact.

[0027] During operation, the product to be tested is placed in the rectangular positioning slot and attached to the water-cooling plate 10 for heat dissipation. The positioning plate is used for positioning to facilitate the alignment of the test probe 9 and the product contact. First, the lifting cylinder 6 drives the lower mounting plate 5 to move downward, pressing the test device with the positioning rod. Then, the lifting cylinder drives the test mounting plate to move downward. The test probe 9 on the trigger plate 8 extends through the test slot, allowing the test probe 9 to contact the contact and complete the test. When the test mounting plate 4 and the lower mounting plate 5 are raised and lowered, the guide column 43 is used for guidance to increase the stability of the movement. Multiple trigger plates 8 can be adapted to multiple devices under test, which can facilitate the testing of multiple devices and improve the testing efficiency. At the same time, the replacement of the trigger plate 8 is convenient for debugging and can be adapted to different test products. The overall structure is relatively simple and easy to maintain.

[0028] Through the above steps, the lifting cylinder 6 drives the test mounting plate 4 and the lower mounting plate 5 to move, so that the test probe 9 can fit with the detection contact of the plate to realize the test. The overall structure is simple and easy to maintain. The trigger plate 8 can be replaced according to the product for easy debugging. The device under test is installed on the water-cooled plate 10 for easy heat dissipation, ensuring the accuracy of the test data and solving the problem of low efficiency in existing semiconductor testing.

Claims

1. A semiconductor testing adapter, comprising a base plate (1), characterized in that: It also includes a top plate (2), a test mounting plate (4) and a pressure mounting plate (5). The bottom plate (1) and the top plate (2) are fixedly connected by a column (3). There are four columns (3) and two test mounting plates (4). Lifting cylinders (6) are installed on the front and rear sides of the upper end of the test mounting plate (4). A trigger plate (8) is installed on the lower end of the test mounting plate (4). The upper end of the trigger plate (8) is fixedly connected to the test mounting plate (4) by a column (2). A test needle (9) is installed on the lower end of the trigger plate (8). There are two pressure mounting plates (5). A test groove is installed on the lower mounting plate. Lifting cylinders (6) are installed on the left and right sides of the upper end of the pressure mounting plate (5). A positioning rod (51) is installed on the lower end. A water-cooled plate (10) is installed on the upper end of the bottom plate (1). The device under test is installed on the upper end of the water-cooled plate (10).

2. The semiconductor test adapter according to claim 1, characterized in that: A connecting block (41) is fixedly installed on the outer side of the test mounting plate (4). A linear bearing (42) is provided on the connecting block (41). There are two connecting blocks (41) in an alternating manner. A guide column (43) is slidably installed in the linear bearing (42). The upper and lower ends of the guide column (43) are fixedly connected to the bottom plate (1) and the top plate (2) respectively.

3. The semiconductor test adapter according to claim 1, characterized in that: A connecting block (41) is fixedly installed on the outer side of the surface of the pressure mounting plate (5). A linear bearing (42) is provided on the connecting block (41). There are two connecting blocks (41) in an alternating manner. A guide column (43) is slidably installed in the linear bearing (42). The upper and lower ends of the guide column (43) are fixedly connected to the bottom plate (1) and the top plate (2) respectively. A test groove is opened on the surface of the pressure mounting plate (5). The test grooves are evenly distributed and the number is half of the test device. Positioning rods (51) are fixedly installed on both sides of the lower end of the pressure mounting plate (5) located in the test groove.

4. A semiconductor test adapter according to claim 1, characterized in that: There are two sets of lifting cylinders (6) and test mounting plate (4) that are adapted to each other. Each set of lifting cylinders (6) has four cylinders. The output ends of two lifting cylinders (6) are fixedly connected to the upper end of the test mounting plate (4). The output ends of two lifting cylinders (6) are fixedly connected to the left and right ends of the pressing mounting plate (5). The upper end of the lifting cylinder (6) is fixedly connected to the top plate (2) through the connecting fixing plate (61).

5. A semiconductor test adapter according to claim 3, characterized in that: The test pins (9) on the trigger plate (8) correspond one-to-one with the test slots on the pressure mounting plate (5). The length and width of the trigger plate (8) are greater than the length and width of the test slots.

6. A semiconductor test adapter according to claim 1, characterized in that: The water-cooled plate (10) and the base plate (1) are detachably connected by bolts. The water-cooled plate (10) has a water-cooled circulation chamber inside and a circulation port is provided on one side end face of the water-cooled plate (10).

7. A semiconductor test adapter according to claim 3, characterized in that: The device under test and the test slot are in one-to-one correspondence. The position of the device under test is determined by positioning plate one (11) and positioning plate two (12). There are two positioning plates one (11) arranged symmetrically in front and back, and two positioning plates two (12) arranged symmetrically in the left and right. A rectangular positioning slot is provided between positioning plate one (11) and positioning plate two (12). The device under test is placed in this positioning slot and the device under test and the positioning rod (51) are compatible.

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