Leakage-proof semiconductor wafer ultrasonic cleaning device

Abstract

The utility model relates to the technical field of ultrasonic cleaning, in particular to a leakage-proof semiconductor wafer ultrasonic cleaning device, which comprises an ultrasonic cleaning box body and a sealing mechanism, and is characterized in that through the arrangement of an insertion opening, a sealing strip, a waterproof layer, an observation window, a handle and an insertion stick, firstly, a semiconductor wafer is placed in a placing frame; a water pump is started, cleaning liquid is pumped from a liquid storage tank and flows into a cleaning pool through a liquid inlet pipe, a communicating pipe and a liquid outlet pipe, a cover body is closed, an inserting rod is inserted into an inserting opening for preliminary fixation, a sealing strip and a waterproof layer prevent the cleaning liquid from leaking, an ultrasonic generator works to generate high-frequency ultrasonic waves, and the ultrasonic waves are driven to rotate to drive the ultrasonic generator to rotate. Bubbles are formed in the cleaning liquid, dirt and impurities on the surface of the wafer are impacted and stripped when the wafer is broken, the wafer can be observed through the observation window during cleaning without opening the cover body, the liquid stop valve is opened to discharge the cleaning liquid after cleaning is completed, and the liquid outlet of the liquid storage tank can supplement or discharge the cleaning liquid.

Description

TECHNICAL FIELD

[0001] The utility model relates to ultrasonic cleaning technical field especially relates to a leak -proof semiconductor wafer ultrasonic cleaning device. BACKGROUND

[0002] The ultrasonic cleaning machine is by ultrasonic generator emitted high frequency oscillation signal, through transducer conversion high frequency mechanical oscillation and spread to cleaning solvent, ultrasonic in cleaning solvent sparse and dense phase interval forward radiation, make liquid flow and produce ten thousand of diameter 50-500mu m microbubble, exist in liquid microbubble vibration under the action of sound field, to the article clean.

[0003] Through the retrieval, the semiconductor wafer ultrasonic cleaning equipment with publication number CN208427464U is specifically disclosed, and the semiconductor wafer ultrasonic cleaning equipment includes a rack, an ultrasonic cleaning unit is arranged in the rack, the ultrasonic cleaning unit is composed of an ultrasonic cleaning tank, an ultrasonic generator and an ultrasonic vibration plate, the ultrasonic cleaning tank is arranged at the right side of the rack, the ultrasonic generator is arranged at the left side of the rack, the ultrasonic vibration plate is arranged at the lower end of the ultrasonic cleaning tank and is arranged in the ultrasonic cleaning tank in cooperation with the ultrasonic generator, a manual flushing table is arranged in the rack, the manual flushing table is arranged above the ultrasonic generator, an electrical control box is arranged on the rack, water inlet valves and drain valves are arranged on the ultrasonic cleaning tank and are electrically connected with the electrical control box, a water gun device and an air gun device are arranged on the side of the manual flushing table and are arranged in cooperation with the products in the manual flushing table.

[0004] The sealing performance of the existing ultrasonic cleaning machine cover body is poor, when the device is used, the vibration of the cleaning solvent will collide with the inner wall of the cleaning cavity, so that the cleaning solvent splashes out of the cleaning cavity, and the semiconductor wafer ultrasonic cleaning equipment in the above-mentioned comparative case also lacks sealing performance, and the cleaning solvent is easy to splash out of the cleaning cavity during use, causing liquid leakage.

[0005] Therefore, it is necessary to invent a leak-proof semiconductor wafer ultrasonic cleaning device to solve the above problems. UTILITY MODEL CONTENTS

[0006] The utility model aims at providing a leak-proof semiconductor wafer ultrasonic cleaning device, and particularly relates to the technical field of ultrasonic cleaning, so as to solve the problem that the sealing performance of the existing ultrasonic cleaning machine cover body is poor, and the cleaning solvent will collide with the inner wall of the cleaning cavity when the device is used, so that the cleaning solvent splashes out of the cleaning cavity.

[0007] In order to achieve the above object, the utility model provides the following technical scheme: A liquid leakage prevention semiconductor wafer ultrasonic cleaning device, including ultrasonic cleaning box and sealing mechanism, the top of ultrasonic cleaning box is provided with cleaning pool, the side of ultrasonic cleaning box is hingedly connected with cover, both sides of ultrasonic cleaning box are fixedly installed with sealing mechanism, the inside of ultrasonic cleaning box is provided with ultrasonic generator, the rear side of ultrasonic cleaning box is fixedly connected with infusion mechanism, the inside of ultrasonic cleaning box is fixedly provided with storage mechanism,

[0008] The sealing mechanism includes a socket, both sides of the ultrasonic cleaning box are fixedly installed with the socket, the top end of the ultrasonic cleaning box is fixedly bonded with a sealing strip, the inner cavity of the ultrasonic cleaning box is provided with a waterproof layer, the inside of the cover is embeddedly installed with an observation window, one side of the cover is fixedly installed with a handle, both sides of the cover are fixedly installed with a plug stick.

[0009] Preferably, the plug stick is used in cooperation with the socket, and the cover is movably sleeved with the ultrasonic cleaning box through the plug stick.

[0010] Preferably, the infusion mechanism includes a longitudinal liquid outlet pipe, the rear side of the ultrasonic cleaning box is fixedly connected with a liquid outlet pipe, one end of the liquid outlet pipe is sleeved with a sealing ring, the other end of the liquid outlet pipe is fixedly connected with a liquid stop valve, one end of the liquid stop valve is fixedly connected with a communication pipe, one end of the communication pipe is fixedly connected with a water pump, one end of the water pump is fixedly installed with a liquid inlet pipe, one end of the liquid inlet pipe is penetratively connected with a liquid storage tank, one side of the liquid storage tank is fixedly provided with a liquid outlet.

[0011] Preferably, the size of the liquid outlet pipe is consistent with that of the liquid inlet pipe, and the size of the communication pipe is consistent with that of the liquid outlet pipe.

[0012] Preferably, the storage mechanism includes a sliding block, both sides of the inner wall of the cleaning pool are fixedly installed with the sliding block, the top of the sliding block is fixedly provided with a buckle, one side of the sliding block is slidably connected with a placing frame, both sides of the placing frame are provided with a sliding groove, and both sides of the top of the placing frame are provided with a clamping frame.

[0013] Preferably, the placing frame is slidably connected with the ultrasonic cleaning box, and the buckle fixedly arranged on the top of the sliding block is clampingly connected with the clamping frame provided on both sides of the top of the placing frame.

[0014] Compared with the prior art, the ultrasonic cleaning device has the advantages that: the semiconductor wafer is first placed into the placing frame through the combination of the sliding groove, the sliding block, the buckle and the clamping frame, then the water pump is started to draw the cleaning liquid from the liquid storage tank into the cleaning pool, the leakage is prevented through the sealing strip and the waterproof layer after the cover is closed, the ultrasonic generator generates high-frequency ultrasonic waves to clean the wafer, the cleaning process can be observed through the observation window, the cleaning liquid can be discharged by opening the liquid stop valve after the cleaning is completed, the leakage of the cleaning liquid is effectively prevented through the sealing strip, the waterproof layer and the sealing ring of the liquid outlet pipe, in the cleaning process, the operator can observe the cleaning condition of the wafer in real time through the transparent observation window without opening the cover, the risk of the leakage of the cleaning liquid and the decline of the cleaning effect caused by frequent opening of the cover is avoided, the operator can timely adjust the cleaning parameters, and the cleaning effect is ensured to be in the best state, when the cleaning work is completed, the cleaning liquid is smoothly discharged through the liquid outlet pipe by opening the liquid stop valve, and the sealing ring on the liquid outlet pipe further ensures the sealing property in the discharging process, and the leakage of the cleaning liquid is prevented, in addition, the sealing property and the waterproof layer design of the equipment not only ensure the safety and the high efficiency of the cleaning process, but also make the maintenance and the maintenance of the equipment more simple and convenient. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is an outside appearance structure schematic view of the ultrasonic cleaning device of the utility model;

[0016] Figure 2 It is a sealing mechanism structure schematic view of the utility model;

[0017] Figure 3 It is a waterproof layer and observation window structure schematic view of the utility model;

[0018] Figure 4 It is a liquid delivery mechanism structure schematic view of the utility model;

[0019] Figure 5 It is a storage mechanism structure schematic view of the utility model;

[0020] Figure 6 It is the utility model Figure 5 It is an enlarged structure schematic view of A in the utility model;

[0021] Figure 7 It is a buckle and placing frame structure schematic view of the utility model.

[0022] In the figure: 1, ultrasonic cleaning box body; 2, cleaning pool; 3, cover body; 4, sealing mechanism; 401, socket; 402, sealing strip; 403, waterproof layer; 404, observation window; 405, handle; 406, plug; 5, ultrasonic generator; 6, liquid delivery mechanism; 601, liquid outlet pipe; 602, sealing ring; 603, liquid stop valve; 604, connecting pipe; 605, water pump; 606, liquid inlet pipe; 607, liquid storage tank; 608, liquid outlet; 7, storage mechanism; 701, sliding block; 702, buckle; 703, placing frame; 704, sliding slot; 705, clamping frame. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0024] Please refer to Figures 1-7 The present application provides a technical solution: a liquid leakage prevention semiconductor wafer ultrasonic cleaning device, comprising an ultrasonic cleaning box body 1 and a sealing mechanism 4, the top of the ultrasonic cleaning box body 1 is provided with a cleaning pool 2, one side of the ultrasonic cleaning box body 1 is hingedly connected with a cover body 3, both sides of the ultrasonic cleaning box body 1 are fixedly installed with the sealing mechanism 4, the inside of the ultrasonic cleaning box body 1 is provided with an ultrasonic generator 5, the rear side of the ultrasonic cleaning box body 1 is fixedly connected with a liquid delivery mechanism 6, and the inside of the ultrasonic cleaning box body 1 is fixedly provided with a storage mechanism 7.

[0025] The sealing mechanism 4 comprises a socket 401, the two sides of the ultrasonic cleaning tank body 1 are fixedly installed with the socket 401, the top end of the ultrasonic cleaning tank body 1 is fixedly bonded with a sealing strip 402, the inner cavity of the ultrasonic cleaning tank body 1 is provided with a waterproof layer 403, the inside of the cover body 3 is embeddedly installed with an observation window 404, one side of the cover body 3 is fixedly installed with a handle 405, the two sides of the cover body 3 are fixedly installed with a plug 406, first, the semiconductor wafer to be cleaned is placed in the cleaning pool 2 at the top of the ultrasonic cleaning tank body 1, the cover body 3 hingedly connected on one side of the ultrasonic cleaning tank body 1 is inserted into the sockets 401 on the two sides of the ultrasonic cleaning tank body 1 through the plugs 406 on the two sides to realize preliminary fixation, when the cover body 3 is closed, the sealing strip 402 fixedly bonded at the top end of the ultrasonic cleaning tank body 1 is tightly attached to the cover body 3, at the same time, the waterproof layer 403 in the inner cavity of the ultrasonic cleaning tank body 1 also plays a role, which together prevent the cleaning liquid from leaking, then, the ultrasonic generator 5 starts to work to generate high-frequency ultrasonic waves, these ultrasonic waves propagate in the cleaning liquid to form countless micro-bubbles, the bubbles release strong energy in the moment of breaking, which generates strong impact force and micro-jet to impact, strip and disperse the dirt and impurities on the surface of the semiconductor wafer, in the cleaning process, the operator can observe the cleaning condition of the wafer through the observation window 404 embeddedly installed in the inside of the cover body 3 without opening the cover body 3 to affect the cleaning effect and cause the risk of liquid leakage.

[0026] Further, the plug 406 is used in cooperation with the socket 401, the cover body 3 is movably sleeved with the ultrasonic cleaning tank body 1 through the plug 406, through the setting of the plug 406 and the socket 401, the plugs 406 on the two sides of the cover body 3 are inserted into the sockets 401 on the two sides of the ultrasonic cleaning tank body 1, which can play a role in preliminarily fixing the cover body 3 to ensure the position stability of the cover body 3 in the closed state.

[0027] Further, the infusion mechanism 6 comprises a longitudinal outflow pipe 601, the rear side of the ultrasonic cleaning tank 1 is fixedly connected with the outflow pipe 601, one end of the outflow pipe 601 is sleeved with a sealing ring 602, the other end of the outflow pipe 601 is fixedly connected with a liquid stop valve 603, one end of the liquid stop valve 603 is fixedly connected with a communication pipe 604, one end of the communication pipe 604 is fixedly connected with a water pump 605, one end of the water pump 605 is fixedly installed with an inflow pipe 606, one end of the inflow pipe 606 is penetratingly connected with a liquid storage tank 607, one side of the liquid storage tank 607 is fixedly provided with a liquid discharge port 608, first, the water pump 605 is started to work, then the cleaning liquid is extracted from the liquid storage tank 607 through the inflow pipe 606, the inflow pipe 606 is penetratingly connected with the liquid storage tank 607, so that the cleaning liquid can be stably extracted, then the cleaning liquid is transmitted to the communication pipe 604, finally the cleaning liquid is transmitted to the outflow pipe 601 and flows into the cleaning pool 2, the sealing ring 602 sleeved with one end of the outflow pipe 601 prevents liquid leakage during the inflow process, when it is needed to discharge the cleaning liquid, the liquid stop valve 603 is opened, so that the cleaning liquid flows out of the cleaning pool 2 through the outflow pipe 601, the liquid discharge port 608 on one side of the liquid storage tank 607 can be used to supplement new cleaning liquid or discharge old liquid when needed.

[0028] Further, the size of the outflow pipe 601 is consistent with that of the inflow pipe 606, the size of the communication pipe 604 is consistent with that of the outflow pipe 601, through the setting of the communication pipe 604, the communication pipe 604 serves as a key component for connecting the outflow pipe 601, the size of the communication pipe 604 is the same as that of the outflow pipe 601, which helps to ensure smooth flow of the fluid in the communication pipe 604.

[0029] Further, the storage mechanism 7 comprises a sliding block 701, the inner wall of the cleaning pool 2 is fixedly installed with the sliding block 701 on both sides, the top of the sliding block 701 is fixedly provided with a buckle 702, one side of the sliding block 701 is slidingly connected with a placing frame 703, the placing frame 703 is provided with a sliding groove 704 on both sides, the top of the placing frame 703 is provided with a clamping frame 705 on both sides, first, the sliding grooves 704 on both sides of the placing frame 703 are aligned with the sliding block 701, then the placing frame 703 is pushed to slidingly connect to a suitable position along the sliding block 701, the buckle 702 on the top of the sliding block 701 cooperates with the clamping frame 705 on both sides of the top of the placing frame 703, when the placing frame 703 slides to a specific position, the buckle 702 can be clamped into the clamping frame 705, which plays a role in fixing the placing frame 703, preventing the placing frame 703 from accidentally sliding during the cleaning process or when affected by external force, in this way, the semiconductor wafer to be cleaned can be safely and stably stored in the placing frame 703.

[0030] Further, the placing frame 703 is in sliding connection with the ultrasonic cleaning box body 1, the buckle 702 fixedly arranged at the top of the sliding block 701 is in clamping connection with the clamping frames 705 opened at the top of the two sides of the placing frame 703, through the arrangement of the buckle 702, when the buckle 702 is clamped with the clamping frames 705 at the top of the placing frame 703, the position of the placing frame 703 is fixed, in the ultrasonic cleaning process, the placing frame 703 is prevented from moving accidentally due to water flow impact, vibration and other factors, and the stability and safety of cleaning are ensured.

[0031] Working principle: first, the semiconductor wafer to be cleaned is placed in the placing frame 703, then the sliding grooves 704 on the two sides of the placing frame 703 are aligned with the sliding block 701, then the placing frame 703 is pushed to slide along the sliding block 701 to the appropriate position, the buckle 702 at the top of the sliding block 701 cooperates with the clamping frames 705 at the top of the two sides of the placing frame 703, when the placing frame 703 slides to a specific position, the buckle 702 can be clamped into the clamping frame 705 to fix the placing frame 703, prevent the placing frame 703 from accidentally sliding during cleaning or when affected by external force, then start the water pump 605 to work, draw the cleaning liquid from the liquid storage tank 607 through the liquid inlet pipe 606, one end of the liquid inlet pipe 606 penetrates the liquid storage tank 607 to ensure that the cleaning liquid can be stably drawn, then transmitted to the communication pipe 604, finally transmitted to the liquid outlet pipe 601, and finally flowed into the cleaning pool 2, the sealing ring 602 sleeved at one end of the liquid outlet pipe 601 prevents liquid leakage during liquid inlet, finally the handle 405 is used to close the cover 3, the insertion rods 406 on the two sides of the cover 3 are inserted into the insertion ports 401 on the two sides of the ultrasonic cleaning box body 1 to realize preliminary fixation, when the cover 3 is closed, the sealing strip 402 fixedly bonded at the top of the ultrasonic cleaning box body 1 tightly abuts against the cover 3, at the same time, the waterproof layer 403 in the inner cavity of the ultrasonic cleaning box body 1 also plays a role, together preventing the cleaning liquid from leaking, then the ultrasonic generator 5 starts to work to generate high-frequency ultrasonic waves, these ultrasonic waves propagate in the cleaning liquid to form countless micro-bubbles, the bubbles release strong energy in the moment of breaking, and strong impact force and micro-jet are generated to impact, strip and disperse the dirt and impurities on the surface of the semiconductor wafer, in the cleaning process, the operator can observe the cleaning condition of the wafer through the observation window 404 embedded and installed in the cover 3 without opening the cover 3 to affect the cleaning effect and cause the risk of liquid leakage, after cleaning is completed, the liquid stop valve 603 is opened to make the cleaning liquid flow out of the cleaning pool 2 through the liquid outlet pipe 601, the liquid discharge port 608 on one side of the liquid storage tank 607 can be used to supplement new cleaning liquid or discharge old liquid when needed.

[0032] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A liquid leakage-proof ultrasonic cleaning device for semiconductor wafers, comprising an ultrasonic cleaning tank (1) and a sealing mechanism (4), characterized in that: The top of the ultrasonic cleaning box (1) is provided with a cleaning pool (2), one side of the ultrasonic cleaning box (1) is hingedly connected with a cover (3), both sides of the ultrasonic cleaning box (1) are fixedly installed with sealing mechanisms (4), the inside of the ultrasonic cleaning box (1) is provided with an ultrasonic generator (5), the rear side of the ultrasonic cleaning box (1) is fixedly connected with a liquid feeding mechanism (6), and the inside of the ultrasonic cleaning box (1) is fixedly provided with a storage mechanism (7). The sealing mechanism (4) comprises a socket (401), both sides of the ultrasonic cleaning box (1) are fixedly installed with the socket (401), the top end of the ultrasonic cleaning box (1) is fixedly bonded with a sealing strip (402), the inner cavity of the ultrasonic cleaning box (1) is provided with a waterproof layer (403), the inside of the cover (3) is embeddedly installed with an observation window (404), one side of the cover (3) is fixedly installed with a handle (405), and both sides of the cover (3) are fixedly installed with insertion poles (406).

2. The liquid leakage preventing ultrasonic cleaning apparatus for semiconductor wafers according to claim 1, wherein: The insertion pole (406) is used in cooperation with the socket (401), and the cover (3) is movably sleeved with the ultrasonic cleaning box (1) through the insertion pole (406).

3. The liquid leakage preventing ultrasonic cleaning apparatus for semiconductor wafers according to claim 1, wherein: The liquid feeding mechanism (6) comprises a longitudinal liquid outlet pipe (601), the rear side of the ultrasonic cleaning box (1) is fixedly connected with the liquid outlet pipe (601), one end of the liquid outlet pipe (601) is sleeved with a sealing ring (602), the other end of the liquid outlet pipe (601) is fixedly connected with a liquid stop valve (603), one end of the liquid stop valve (603) is fixedly connected with a communication pipe (604), one end of the communication pipe (604) is fixedly connected with a water pump (605), one end of the water pump (605) is fixedly installed with an inlet pipe (606), one end of the inlet pipe (606) is penetratively connected with a liquid storage tank (607), and one side of the liquid storage tank (607) is fixedly provided with a liquid discharge port (608).

4. The liquid leakage preventing ultrasonic cleaning apparatus for semiconductor wafers according to claim 3, wherein: The liquid outlet pipe (601) and the inlet pipe (606) are the same in size, and the communication pipe (604) and the liquid outlet pipe (601) are the same in size.

5. The liquid leakage preventing ultrasonic cleaning apparatus for semiconductor wafers according to claim 1, wherein: The storage mechanism (7) comprises a sliding block (701), the inner walls of the cleaning pool (2) are fixedly installed with the sliding blocks (701), the top of the sliding block (701) is fixedly provided with a buckle (702), one side of the sliding block (701) is slidably connected with a placing frame (703), both sides of the placing frame (703) are provided with sliding grooves (704), and both sides of the top of the placing frame (703) are provided with clamping frames (705).

6. The liquid leakage preventing ultrasonic cleaning apparatus for semiconductor wafers according to claim 5, wherein: The placing frame (703) is slidably connected with the ultrasonic cleaning box (1), and the buckle (702) fixedly arranged on the top of the sliding block (701) is clamped and connected with the clamping frames (705) provided on both sides of the top of the placing frame (703).

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