Infrared receiving module

Abstract

The utility model discloses an infrared receiving module, which relates to the technical field of infrared sensors and comprises a circuit board. The infrared receiving head comprises a body and three pins, the body is electrically connected with the circuit board through the three pins, and the body is provided with a nose bridge protrusion; the body is provided with an adsorption plane, the adsorption plane is perpendicular to the vertical direction, the adsorption plane is located above the nose bridge protrusion, and the adsorption plane is used for adsorption of a suction cup mechanical arm. Therefore, the suction plane can provide a uniform contact surface, the suction cup can be completely attached to the suction plane, then the suction cup can apply uniform suction force to a body in the infrared receiving head, and therefore it is ensured that the infrared receiving head can be stably sucked by the suction cup in the suction cup mechanical arm; the phenomenon that the infrared receiving head falls off in the carrying process due to unstable adsorption of the suction cup mechanical arm is effectively avoided, the time for installing the infrared receiving head cannot be increased due to falling off, and then the installation efficiency of the infrared receiving module is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to infrared sensor technical field, especially relate to an infrared receiving module. BACKGROUND

[0002] The infrared receiving module in the air conditioner is a kind of for receiving the infrared light signal sent by air conditioner remote controller and converting infrared light signal into electric signal, and then the key component of controlling air conditioner operation.Infrared receiving module usually includes infrared receiving head and circuit board, and infrared receiving head is electrically connected with circuit board.In the automatic installation process of air conditioner, there is provided with infrared receiving module automatic installation process, and the electronic components such as infrared receiving head are installed on circuit board by chucking hand, to complete the installation of infrared receiving module.In the prior art, the infrared receiving head in infrared receiving module is usually nose bridge type infrared receiving head, that is, infrared receiving head has nose bridge protrusion.Chucking hand can adsorb nose bridge protrusion of infrared receiving head and carry infrared receiving head, so that chucking hand can carry infrared receiving head to corresponding installation position on circuit board.In the process of carrying infrared receiving head by chucking hand, chucking hand cannot be completely attached with infrared receiving head, and it is easy to cause infrared receiving head to fall off in carrying process due to unstable adsorption, and then it is necessary for chucking hand to re-adsorb and position, increase the time of installing infrared receiving head on circuit board, and reduce the installation efficiency of infrared receiving module. SUMMARY

[0003] The utility model aims at at least one of the technical problems existing in the prior art is solved.For this purpose, the utility model provides an infrared receiving module, which can avoid the infrared receiving head from falling off due to unstable adsorption of chucking hand, and is beneficial to improve the installation efficiency of infrared receiving module.

[0004] The infrared receiving module according to the utility model embodiment, including circuit board;Infrared receiving head, the infrared receiving head includes body and three pins, the body is connected with the circuit board by three pins, and the body has nose bridge protrusion;The adsorption plane is arranged on the body, the adsorption plane is perpendicular to the up-down direction, the adsorption plane is located above the nose bridge protrusion, and the adsorption plane is used for chucking hand adsorption.

[0005] At least has the following beneficial effects:

[0006] The infrared receiving head comprises a body and three pins, and the three pins are connected with the body. In the automatic mounting process of the infrared receiving module, when the suction cup manipulator needs to carry the infrared receiving head to the circuit board, the suction cup in the suction cup manipulator can adsorb the adsorption plane on the body. Since the adsorption plane is perpendicular to the up-down direction, the adsorption plane can provide a uniform contact surface, so that the suction cup can completely fit the adsorption plane, and then the suction cup can apply a uniform adsorption force to the body in the infrared receiving head, thereby ensuring that the infrared receiving head can be stably adsorbed by the suction cup in the suction cup manipulator, effectively avoiding the infrared receiving head from falling off in the carrying process due to unstable adsorption, so that the time for mounting the infrared receiving head will not increase due to falling, and then the mounting efficiency of the infrared receiving module is improved.

[0007] According to the infrared receiving module of the embodiment of the utility model, the body is equipped with a protruding block, and the adsorption plane is arranged on the protruding block.

[0008] According to the infrared receiving module of the embodiment of the utility model, the circuit board is equipped with a positioning structure, and the circuit board is equipped with three pads in the area corresponding to the positioning structure, and the positioning structure is used for positioning the body, so that the three pins are respectively in abutment with the three pads.

[0009] According to the infrared receiving module of the embodiment of the utility model, the positioning structure is a positioning hole, one side of the body away from the adsorption plane is equipped with a positioning block, and the positioning block is arranged in the positioning hole, so that the body is abutted on the circuit board, and the three pins are respectively in abutment with the three pads.

[0010] According to the infrared receiving module of the embodiment of the utility model, the thickness of the positioning block is less than or equal to the depth of the positioning hole.

[0011] According to the infrared receiving module of the embodiment of the utility model, the projection of the positioning block and the positioning hole in the up-down direction is a rectangle.

[0012] According to the infrared receiving module of the embodiment of the utility model, the circuit board is equipped with a plurality of mounting holes, and the plurality of mounting holes are used for screwing.

[0013] According to the infrared receiving module of the embodiment of the utility model, the edge of the circuit board is equipped with a relief hole.

[0014] The additional aspects and advantages of the utility model will be partially given in the following description, some will become obvious from the following description, or be known by the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0015] The utility model will be further described in combination with the drawings and embodiments, wherein:

[0016] Figure 1 Structure diagram of the infrared receiving module according to the embodiment of the present application is shown in the figure;

[0017] Figure 2 Structure diagram of the infrared receiving head in the infrared receiving module according to the embodiment of the present application is shown in the figure;

[0018] Figure 3 Side view diagram of the infrared receiving head in the infrared receiving module according to the embodiment of the present application is shown in the figure;

[0019] Figure 4 Exploded structure diagram of the infrared receiving module according to the embodiment of the present application is shown in the figure;

[0020] Figure 5 Sectional view diagram of the infrared receiving module according to the embodiment of the present application is shown in the figure;

[0021] Reference signs:

[0022] Circuit board 100; positioning hole 110; mounting hole 120; avoiding hole 130; solder pad 140;

[0023] Infrared receiving head 200; nose bridge protrusion 210; bump 220; adsorption plane 221; positioning block 230; pin 240; body 250. DETAILED DESCRIPTION

[0024] The embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the present application, and cannot be understood as limiting the present application.

[0025] In the description of the present application, it is understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as limiting the present application.

[0026] In the description of the present application, the plural means more than two. If there is a description of first, second, only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0027] In the description of the utility model, unless otherwise explicitly limited, the words such as setting, installing, connecting should be understood broadly, and the skilled in the art can determine the specific meaning of the above words in the utility model according to the specific content of the technical scheme.

[0028] Reference Figures 1 to 3 The infrared receiving module according to the utility model embodiment comprises a circuit board 100 and an infrared receiving head 200.

[0029] The infrared receiving head 200 comprises a body 250 and three pins 240, the body 250 is connected with the circuit board 100 through the three pins 240, and the body 250 is provided with a nose bridge protrusion 210.

[0030] It should be explained that the nose bridge type infrared receiving head 200 is flat, similar to a nose bridge, and therefore named. The surface of the nose bridge protrusion 210 of the infrared receiving head 200 is a convex arc surface. Since the infrared receiving head 200 is installed on the circuit board 100 in the form of a patch, the suction mechanical hand can only carry the infrared receiving head 200 by adsorbing the nose bridge protrusion 210 of the infrared receiving head 200. When the suction mechanical hand adsorbs the nose bridge protrusion 210 of the infrared receiving head 200, since the surface of the nose bridge protrusion 210 of the infrared receiving head 200 is an arc surface, and because of the unevenness of the arc surface, the suction disc in the suction mechanical hand cannot completely adhere to the arc surface, resulting in that the adsorption force of the suction disc is weak in some areas of the arc surface, and even there may be an area that is not in contact, thereby reducing the adsorption force and adsorption stability of the suction disc, and further causing the suction mechanical hand to easily fall off the infrared receiving head 200 in the carrying process due to unstable adsorption.

[0031] The infrared receiving head 200 comprises a body 250 and three pins 240, the body 250 is electrically connected with the circuit board 100 through the three pins 240, and the nose bridge protrusion 210 is arranged on the body 250. In the embodiment of the utility model, the body 250 comprises a substrate, a photosensitive element, a signal processing IC and a packaging glue. The photosensitive element is mounted on the substrate, and the photosensitive element is used for receiving an infrared signal. The signal processing IC is mounted on the substrate and is electrically connected with the photosensitive element. The three pins 240 are all mounted on one side of the substrate and are electrically connected with the signal processing IC, and the three pins 240 are respectively a left pin 240, a middle pin 240 and a right pin 240. The packaging glue is wrapped outside the substrate, and the three pins 240 are stretched out from the packaging glue and are welded with the pads 140 on the circuit board 100, that is, the body 250 is connected with the circuit board 100 through the three pins 240, and the adsorption plane 221 is arranged on the packaging glue. The infrared receiving head 200 is a common electronic component, and the corresponding principle and structure will not be further described.

[0032] In the embodiment of the utility model, the infrared receiving module further comprises a filter, an amplifier, a rectifier circuit group, a demodulation circuit group, a filter, a power supply circuit group and an output interface. The infrared receiving head 200, the filter, the amplifier, the rectifier circuit group, the demodulation circuit group, the filter, the power supply circuit group and the output interface cooperate with each other to complete the basic function of the infrared receiving module, and the filter, the amplifier, the rectifier circuit group, the demodulation circuit group, the filter, the power supply circuit group and the output interface are all common electronic components in the infrared receiving module, and the corresponding principle and structure will not be further described.

[0033] As an embodiment of the utility model, the adsorption plane 221 is arranged on the nose bridge protrusion 210 of the infrared receiving head 200.

[0034] It can be understood that the infrared receiving head 200 comprises a body 250 and three pins 240, and the three pins 240 are all connected with the body 250. In the automatic mounting process of the infrared receiving module, when the suction cup mechanical hand needs to carry the infrared receiving head 200 to the circuit board 100, the suction cup in the suction cup mechanical hand can adsorb the adsorption plane 221 on the body 250. Since the adsorption plane 221 is perpendicular to the up-down direction, the adsorption plane 221 can provide a uniform contact surface, so that the suction cup can completely fit the adsorption plane 221, and then the suction cup can exert a uniform adsorption force on the body 250 in the infrared receiving head 200, thereby ensuring that the infrared receiving head 200 can be stably adsorbed by the suction cup in the suction cup mechanical hand, effectively avoiding that the infrared receiving head 200 falls off in the carrying process due to unstable adsorption, so that the time for mounting the infrared receiving head 200 will not increase due to falling, and then the installation efficiency of the infrared receiving module is improved.

[0035] It needs to be explained that the suction cup in the suction cup manipulator is close to the body 250 in the infrared receiving head 200 from top to bottom and adsorbs the body 250. In the embodiment of the utility model, the adsorption plane 221 is located at the upper position of the nose bridge protrusion 210, which avoids the interference of the nose bridge protrusion 210 on the adsorption of the suction cup, and ensures that the suction cup in the suction cup manipulator can only and smoothly adsorb the adsorption plane 221 on the body 250.

[0036] Reference Figure 2 And Figure 3 The body 250 is provided with a protrusion 220, and the adsorption plane 221 is arranged on the protrusion 220. It can be understood that the upper surface of the protrusion 220 on the body 250 is the adsorption plane 221. On the one hand, the adsorption plane 221 is arranged on the protrusion 220, so that the adsorption plane 221 can be located above the nose bridge protrusion 210, and then the suction cup in the suction cup manipulator can be smoothly adsorbed on the adsorption plane 221. On the other hand, the protrusion 220 can increase the overall structural rigidity of the infrared receiving head 200, so that the infrared receiving head 200 can more effectively resist the vibration from the operation of the air conditioner when the infrared receiving head 200 is subjected to the vibration, and prevent the infrared receiving head 200 from being damaged due to the vibration.

[0037] In the prior art, after the suction cup manipulator installs the infrared receiving head 200 and other electronic components on the circuit board 100, the infrared receiving head 200 and other electronic components need to enter the reflow soldering equipment together with the circuit board 100 for reflow soldering, so that the infrared receiving head 200 and other electronic components can be welded on the circuit board 100 to complete the production of the infrared receiving module. During the installation of the infrared receiving head 200, the suction cup manipulator only places the infrared receiving head 200 on the corresponding position of the circuit board 100, so that the three pins 240 of the infrared receiving head 200 can respectively abut against the corresponding three pads 140 on the circuit board 100. Then the circuit board 100 is sent into the reflow soldering equipment, so that the three pins 240 of the infrared receiving head 200 are respectively welded on the corresponding three pads 140 of the circuit board 100. During the movement of the circuit board 100 in the reflow soldering equipment, the position of the infrared receiving head 200 and the circuit board 100 may be offset, which easily causes the misalignment between the three pins 240 of the infrared receiving head 200 and the pads 140, resulting in poor welding and reducing the yield of the infrared receiving module.

[0038] Reference Figure 4 And Figure 5The circuit board 100 is provided with a positioning structure, and the area of the circuit board 100 corresponding to the positioning structure is provided with three pads 140. The positioning structure is used for positioning the body 250, so that the three pins 240 are respectively abutted against the three pads 140, and the three pins 240 are respectively welded on the three pads 140. It can be understood that, in the process of mounting the infrared receiving head 200, the suction disc mechanical hand can place the body 250 of the infrared receiving head 200 on the positioning structure on the circuit board 100. The positioning structure plays a positioning role on the body 250, so that the three pins 240 on the body 250 can be respectively abutted against the three pads 140 on the circuit board 100. Then, the circuit board 100 and the electronic components such as the infrared receiving head 200 on the circuit board 100 are sent into a reflow soldering device to be reflow soldered. In the process of moving the circuit board 100 in the reflow soldering device, the positioning structure can always play a positioning role on the body 250, so that the body 250 cannot be deviated relative to the circuit board 100 in the moving process, that is, the three pins 240 on the body 250 can always abut against the three pads 140, so that the three pins 240 can be accurately welded on the three pads 140, and the yield of the infrared receiving module is ensured.

[0039] In the embodiment of the utility model, three pins 240 are respectively left pin 240, middle pin 240 and right pin 240, and left pin 240, middle pin 240 and right pin 240 are respectively power positive pin 240 (VCC), power negative pin 240 (GND) and signal pin 240 (OUT). The three pads 140 of the circuit board 100 corresponding to the positioning structure area are respectively power pin 240 (VCC) pad 140, ground pin 240 (GND) pad 140 and signal pin 240 (OUT) pad 140. The power positive pin 240, the power negative pin 240 and the signal pin 240 are welded with the power pin 240 pad 140, the ground pin 240 pad 140 and the signal pin 240 pad 140 respectively to realize the infrared signal receiving function of the infrared receiving head 200. After the three pins 240 of the infrared receiving head 200 are welded with the three pads 140 respectively, the body 250 is electrically connected with the circuit board 100 through the three pins 240. The connection relationship between the three pins 240 and the pads 140 on the circuit board 100 and the corresponding working principle are the technology in the common infrared receiving module, which will not be further described here. Specifically, the circuit board 100 is also provided with a plurality of pads 140 (not shown in the figure) for connecting other electronic components, and the plurality of pads 140 are all arranged on the upper surface of the circuit board 100, which will not be further described here.

[0040] Reference Figure 4 And Figure 5, the positioning structure is the positioning hole 110, the body 250 is provided with the positioning block 230 on the side away from the adsorption plane 221, the positioning block 230 is arranged in the positioning hole 110, so that the body 250 is abutted on the circuit board 100, and the three pins 240 are respectively abutted on the three pads 140. It can be understood that during the installation of the infrared receiver head 200, the adsorption disc mechanical arm can place the body 250 of the infrared receiver head 200 on the area of the circuit board 100 corresponding to the positioning hole 110, so that the positioning block 230 on the body 250 can extend into the positioning hole 110 on the circuit board 100, and also so that the body 250 and the three pins 240 are all abutted on the upper surface of the circuit board 100. The inner wall of the positioning hole 110 can be abutted on the positioning block 230 on the body 250, which limits the offset of the body 250 relative to the circuit board 100, so that the inner wall of the positioning hole 110 plays a positioning role on the body 250, and then the three pins 240 on the body 250 are accurately abutted on the three pads 140 respectively, which ensures that the circuit board 100 moving in the reflow soldering equipment will not cause the position offset of the body 250 relative to the circuit board 100, avoids the misalignment between the three pins 240 and the pads 140, so that the three pins 240 can be accurately welded on the three pads 140 respectively, and then the three pins 240 are electrically connected with the three pads 140 respectively. It needs to be explained that after the positioning block 230 extends into the positioning hole 110, the body 250 is abutted on the upper surface of the circuit board 100, and the three pins 240 are abutted on the three pads 140 respectively, at this time, the body 250 and the three pins 240 both play a balanced supporting role, so that the whole infrared receiver head 200 can be stably abutted on the circuit board 100. Specifically, the projections of the body 250, the positioning block 230 and the positioning hole 110 in the up-down direction are respectively the first projection, the second projection and the third projection, the second projection and the third projection both fall in the first projection, the second projection falls in the third projection, and the area of the second projection is close to that of the third projection.

[0041] Reference Figure 5 , the thickness of the positioning block 230 is less than or equal to the depth of the positioning hole 110. It can be understood that the thickness of the positioning block 230 is less than or equal to the depth of the positioning hole 110, so that after the positioning block 230 extends into the positioning hole 110, the lower end of the positioning block 230 will not extend out of the positioning hole 110, so as to ensure that after the circuit board 100 is installed in the shell, the positioning block 230 will not affect the normal installation of the circuit board 100. Reference Figure 4The projection of the positioning block 230 and the positioning hole 110 in the up-down direction is rectangular. It can be understood that the inner wall of the rectangular positioning hole 110 can be in abutment with the rectangular positioning block 230, which not only avoids the deviation of the positioning block 230 and the body 250 relative to the circuit board 100, but also avoids the rotation of the positioning block 230 and the body 250 relative to the circuit board, so that the three pins 240 can be more accurately in abutment with the three pads 140, respectively.

[0042] With reference to Figure 1 and Figure 4 A plurality of mounting holes 120 are arranged on the circuit board 100, and the plurality of mounting holes 120 are used for the screw to pass through. It can be understood that when the circuit board 100 needs to be mounted on a shell or other components, the screw can pass through the mounting hole 120 on the circuit board 100 and be tightened, so that the nut of the screw is in abutment with the circuit board 100, and the circuit board 100 can be fixedly mounted on the shell or other components, which will not be described further here. Figure 1 and Figure 4 The edge of the circuit board 100 is provided with a relief hole 130. It can be understood that after the circuit board 100 is mounted in the matched shell, the corresponding structure in the shell can extend into the relief hole 130 on the edge of the circuit board 100. The relief hole 130 on the edge of the circuit board 100 plays a relief role, so that the circuit board 100 can be smoothly mounted in the shell, that is, the infrared receiving module can be mounted in the shell.

[0043] The technical features of the above-described embodiments can be combined in any manner. In order to make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the present application.

[0044] Of course, the present application is not limited to the above-mentioned embodiments, and those skilled in the art can make equivalent modifications or replacements without departing from the spirit of the present application. These equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. An infrared receiving module, characterized by comprising: The application relates to an infrared receiving head (200) and a circuit board (100) comprising the infrared receiving head (200). The infrared receiving head (200) comprises a body (250) and three pins (240), the body (250) is connected with the circuit board (100) through the three pins (240), and the body (250) is provided with a nose bridge protrusion (210). The body (250) is provided with an adsorption plane (221) which is perpendicular to the up-down direction, the adsorption plane (221) is located above the nose bridge protrusion (210), and the adsorption plane (221) is used for adsorption by a chuck mechanical hand. The body (250) is provided with a convex block (220), and the adsorption plane (221) is arranged on the convex block (220).

2. The infrared receiving module of claim 1, wherein: The circuit board (100) is provided with a positioning structure, the circuit board (100) is provided with three pads (140) corresponding to the area of the positioning structure, the positioning structure is used for positioning the body (250) so that the three pins (240) are respectively in abutment with the three pads (140).

3. The infrared receiving module of claim 1, wherein: The positioning structure is a positioning hole (110), the body (250) is provided with a positioning block (230) on the side away from the adsorption plane (221), the positioning block (230) is arranged in the positioning hole (110), so that the body (250) is abutted against the circuit board (100), and the three pins (240) are respectively in abutment with the three pads (140).

4. The infrared receiving module of claim 3, wherein: The thickness of the positioning block (230) is less than or equal to the depth of the positioning hole (110).

5. The infrared receiving module of claim 4, wherein: The projection of the positioning block (230) and the positioning hole (110) in the up-down direction is a rectangle.

6. The infrared receiving module of claim 4, wherein: The circuit board (100) is provided with a plurality of mounting holes (120), and the plurality of mounting holes (120) are used for screw penetration.

7. The infrared receiving module of claim 1, wherein: The edge of the circuit board (100) is provided with a relief hole (130).

8. The infrared receiving module of claim 1, wherein: ​

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