The invention discloses a superfine
pitch bonding wire
chopper structure with a side wire incoming function and a using method thereof, and relates to the technical field of
semiconductor packaging, the superfine
pitch bonding wire
chopper structure comprises a
workbench, a lifting platform, a lifting counting mechanism, a switching mechanism, a pay-off
pipe, a
chopper mechanism and a
smoke suction mechanism, and the lifting platform is slidably arranged between the
workbench and a mounting frame; the lifting counting mechanism is arranged on the mounting frame, the switching mechanism is arranged on the lifting table, the chopper mechanism is arranged on the lifting table, and the
smoke suction mechanism is arranged on the lifting table. By means of the arrangement mode that the lifting counting mechanism, the switching mechanism, the pay-off
pipe, the chopper mechanism and the
smoke suction mechanism are matched, after the designated number of times is reached, the chopper is switched through the switching mechanism, bonding quality reduction caused by abrasion is avoided, the switched chopper is cleaned, and the bonding quality is improved. And meanwhile, the smoke suction mechanism can suck cleaned impurities and possibly generated smoke, smoke and chippings are effectively collected, manual intervention is reduced in the whole process, and the production efficiency is improved.