Semiconductor chip lead frame leadframe depression bar assembly

Abstract

The utility model relates to the field of semiconductor processing devices, in particular to a leadframe depression bar assembly of a semiconductor chip lead frame, which comprises a depression bar, the depression bar comprises a first section, a second section and a third section which are connected in sequence, the projection of the second section on a horizontal plane is in a trapezoid shape with the waist approaching from the first section to the third section, and the projection of the second section is in a trapezoid shape with the waist approaching from the first section to the third section. The pressing strip is a macromolecule resin strip. The pressing strip is made of a material with the hardness lower than that of the lead frame, so that the pressing strip is prevented from scratching the surface of the lead frame, no chippings are generated after the pressing strip is continuously used for a long time, and the pressing strip can be used in a dust-free workshop.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor processing device especially to a semiconductor chip lead frame leadframe pressing strip subassembly. BACKGROUND

[0002] When processing semiconductor chips, the lead frame needs to be placed in a jig, and then clamped by a pressing strip subassembly for further processing of the chip. However, in actual use, it is found that if a pressing strip with high hardness is used, the surface of the lead frame may be scratched. If a pressing strip with low hardness is used, although the surface of the lead frame can be prevented from being scratched, after a large number of continuous use, the pressing strip is in contact with the surface of the lead frame, and a large amount of friction between the pressing strip and the surface of the lead frame causes the pressing strip to produce debris, which cannot be used in a dust-free environment such as a dust-free workshop. SUMMARY

[0003] In order to solve the problem that the pressing strip may scratch the surface of the chip, the utility model provides a semiconductor chip lead frame leadframe pressing strip subassembly.

[0004] The utility model provides a semiconductor chip lead frame leadframe pressing strip subassembly adopts the following technical scheme:

[0005] A semiconductor chip lead frame leadframe pressing strip subassembly, comprising a pressing strip, the pressing strip comprises a first segment, a second segment and a third segment connected in turn, the projection of the second segment on the horizontal plane is a trapezoid with the waist closing to the third segment from the first segment, and the pressing strip is a high polymer resin strip.

[0006] In one specific implementation scheme, a fixing hole is formed on the first segment.

[0007] In one specific implementation scheme, the included angle between the second segment and the third segment is ∠α, and 130°≤∠α≤140°.

[0008] In one specific implementation scheme, one end of the third segment away from the second segment is provided with a guide inclined surface, so that after the guide inclined surface is in contact with the edge of the lead frame, the third segment is guided to slide to the top surface of the lead frame.

[0009] In one specific implementation scheme, the included angle between the first segment and the second segment is ∠β, and 140°≤∠β≤150°.

[0010] In one specific implementation, the first segment is arranged on the adjusting block, the adjusting block is provided with an adjusting hole, the connecting rod is arranged in the adjusting hole, the adjusting block is provided with a connecting hole communicating with the adjusting hole, and the connecting hole is provided with a locking screw.

[0011] In one specific implementation, one end of the connecting rod is provided with a connecting block, and the connecting block is provided with a mounting hole.

[0012] In one specific implementation, the mounting hole is a long strip-shaped hole.

[0013] In one specific implementation, the third segment is provided with a warping segment away from one end of the second segment, and an included angle between the warping segment and the third segment is ∠γ, 25°≤γ≤35°.

[0014] In summary, the utility model has the following beneficial effects:

[0015] 1. The high polymer resin material has good wear resistance, and the hardness is lower than that of the lead frame, so that the chip surface will not be scratched, the pressing strip made of the high polymer resin material can tightly clamp the chip, and no debris will be generated after long-time continuous friction. The design that the second segment gradually reduces in width can provide sufficient support effect for the third segment, improve the stability of the third segment when pressing the lead frame, and avoid breakage.

[0016] 2. The adjusting rod on the sliding connecting rod can adjust the position of the pressing strip, so that the pressing strip can more accurately clamp the lead frame. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a schematic view of the overall structure of example 1.

[0018] Figure 2 is a schematic view of the structure of the adjusting block.

[0019] Figure 3 is a schematic view of the structure of the pressing strip.

[0020] Figure 4 is a schematic view of the overall structure of example 2.

[0021] BRIEF DESCRIPTION OF DRAWINGS 1. pressing strip; 11. first segment; 12. second segment; 13. third segment; 14. warping segment; 2. fixing hole; 3. guide inclined surface; 4. adjusting block; 5. connecting rod; 6. adjusting hole; 7. locking screw; 8. connecting block; 9. mounting hole; 10. connecting hole. DETAILED DESCRIPTION

[0022] The following will be described in detail in combination with the accompanying drawings. Figures 1-4The utility model discloses make further detailed description to the utility model.

[0023] Embodiment 1:

[0024] Referring to Figure 1 And Figure 2 , the leadframe pressing strip assembly includes pressing strip 1, adjusting block 4 and connecting rod 5, pressing strip 1 is fixed on adjusting block 4, adjusting hole 6 is passed through on adjusting block 4, and connecting rod 5 is arranged in adjusting hole 6. Adjusting block 4 and pressing strip 1 can be provided with multiple groups, and are provided with two groups in the embodiment. Sliding adjusting block 4 can adjust the spacing between pressing strip 1 along the length direction of connecting rod 5, so that pressing strip 1 can adapt to leadframes of different models and can accurately clamp the leadframes.

[0025] Referring to Figure 1 And Figure 2 , connecting hole 10 is formed in adjusting block 4 and is communicated with adjusting hole 6, and locking screw 7 is screw-connected in connecting hole 10. By screwing locking screw 7, adjusting block 4 can be fixed on connecting rod 5, so that the position-adjusted pressing strip 1 is positioned and fixed. One end of connecting rod 5 is fixed with connecting block 8, and long strip-shaped mounting hole 9 is formed in connecting block 8. By arranging a screw in mounting hole 9, connecting block 8 can be fixed on the chip processing equipment, and the mounting position of pressing strip 1 is adjusted through long strip-shaped mounting hole 9, so that the leadframes can be better clamped.

[0026] Referring to Figure 1 And Figure 3 , pressing strip 1 includes first section 11, second section 12 and third section 13 connected in sequence, first section 11, second section 12 and third section 13 are integrally formed, first section 11 is used for fixed connection with adjusting block 4, third section 13 is used for applying pressure to the leadframe, and third section 13 is arranged below first section 11, that is, when third section 13 is clamped on the leadframe, first section 11 is above third section 13. The projection of second section 12 on the horizontal plane presents a trapezoidal shape with the waist approaching first section 11 to third section 13, that is, the width of one end of second section 12 close to first section 11 is larger, and the width of one end of second section 12 close to third section 13 is smaller. Through the gradually reduced width of second section 12, the stable support to third section 13 is guaranteed, the stability of the connection between third section 13 and second section 12 is improved, and the connection between third section 13 and second section 12 is not easy to break.

[0027] Pressing strip 1 is a high-molecular resin strip, the hardness of the high-molecular resin is lower than that of the leadframe, and the high-molecular resin has good wear resistance. When the high-molecular resin strip contacts the surface of the leadframe, the surface of the leadframe will not be scratched, and no debris will be generated when the high-molecular resin strip is rubbed against the leadframe for a long time.

[0028] Referring to Figure 1 And Figure 3, the included angle between the second section 12 and the third section 13 is ∠α, 130°≤∠α≤140°. The included angle between the first section 11 and the second section 12 is ∠β, 140°≤∠β≤150°.

[0029] With reference to Figure 1 And Figure 3 The first section 11 is provided with a fixing hole 2, and the first section 11 is fixed on the adjusting block 4 by screwing a screw in the fixing hole 2, so that the first section 11 is fixedly connected with the adjusting block 4, and the fixed connection between the pressing strip 1 and the adjusting block 4 is realized.

[0030] With reference to Figure 1 And Figure 3 The third section 13 is provided with a guide inclined surface 3 at one end away from the second section 12. When the lead frame contacts the guide inclined surface 3, as the lead frame approaches the first section 11, the third section 13 is driven by the guide inclined surface 3 to slide upward, so that the lead frame is clamped quickly and conveniently.

[0031] Embodiment 2:

[0032] With reference to Figure 4 The difference between embodiment 2 and embodiment 1 is that the third section 13 is integrally formed with a warping section 14 at one end away from the second section 12, and the included angle between the warping section 14 and the third section 13 is ∠γ, 25°≤γ≤35°. When the lead frame moves, the large bending angle of the warping section 14 makes the lead frame more easily clamped between the warping section 14 and the workbench, so that the third section 13 clamps the lead frame conveniently.

[0033] The above are preferred embodiments of the utility model, which do not limit the protection scope of the utility model, so that: any equivalent changes made according to the structure, shape and principle of the utility model should be covered in the protection scope of the utility model.

Claims

1. A semiconductor chip leadframe binder assembly, characterized by: The application relates to a compression strip (1) comprising a first section (11), a second section (12) and a third section (13) connected in sequence, the projection of the second section (12) on a horizontal plane is a trapezoid with the waist of the trapezoid being closer to the third section (13) than to the first section (11), and the compression strip (1) is a polymer resin strip.

2. The semiconductor chip leadframe press-pack assembly of claim 1, wherein: A fixing hole (2) is formed in the first section (11).

3. The semiconductor chip leadframe press-pack assembly of claim 1, wherein: The included angle between the second section (12) and the third section (13) is alpha (130 DEG <= alpha <= 140 DEG).

4. The semiconductor chip leadframe press-pack assembly of claim 1, wherein: A guide inclined surface (3) is arranged at the end of the third section (13) away from the second section (12), so that the guide inclined surface (3) is in contact with the edge of a lead frame, and the third section (13) is guided to slide to the top surface of the lead frame.

5. The semiconductor chip leadframe press-pack assembly of claim 1, wherein: The included angle between the first section (11) and the second section (12) is beta (140 DEG <= beta <= 150 DEG).

6. The semiconductor chip leadframe press-pack assembly of claim 1, wherein: An adjusting block (4) and a connecting rod (5) are further arranged, the first section (11) is arranged on the adjusting block (4), an adjusting hole (6) is formed in the adjusting block (4), the connecting rod (5) is arranged in the adjusting hole (6), a connecting hole (10) is formed in the adjusting block (4) and is in communication with the adjusting hole (6), and a locking screw (7) is arranged in the connecting hole (10).

7. The semiconductor chip leadframe press-pack assembly of claim 6, wherein: One end of the connecting rod (5) is provided with a connecting block (8), and a mounting hole (9) is arranged on the connecting block (8).

8. The semiconductor chip leadframe press-pack assembly of claim 7, wherein: The mounting hole (9) is an elongated hole.

9. The semiconductor chip leadframe press-pack assembly of claim 1, wherein: An upwarping section (14) is arranged at the end of the third section (13) away from the second section (12), and the included angle between the upwarping section (14) and the third section (13) is gamma (25 DEG <= gamma <= 35 DEG).

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