Heat conduction cable, heat dissipation assembly and aerospace equipment

Abstract

The utility model provides a heat conduction cable, a heat dissipation assembly and aerospace equipment, and relates to the technical field of aerospace equipment temperature control. According to the heat conduction cable provided by the invention, the stacked multi-layer graphene is used as a part for forming the cable main body, the graphene has the flexible characteristic, the heat conductivity is greater than or equal to 1600W / (m.K), the heat conductivity is higher than that of copper, the density of the material is lower than that of copper, and meanwhile, the thermal expansion coefficient is lower than that of copper. Therefore, according to the heat conduction cable provided by the invention, the heat dissipation requirement and the light weight requirement of the aerospace equipment can be met, and meanwhile, the positioning precision of the chip, subjected to heat dissipation, of the aerospace equipment and the stability and quality of signal transmission can be ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of space equipment temperature control, in particular to a heat conduction cable, a heat dissipation assembly and space equipment. BACKGROUND

[0002] In the prior art, the main heat dissipation assembly of a high-power chip in space equipment such as a satellite is a copper heat conduction cable assembly. The copper heat conduction cable assembly uses a copper wire woven mesh or a copper foil as a flexible heat conduction body, and is fixed on a copper plate at both ends by welding or other methods, and then one end is connected to a refrigerator and the other end is connected to a high-power chip.

[0003] However, the copper heat conduction cable assembly has the following three shortcomings: first, the theoretical thermal conductivity of pure copper is 398 W / (m·K), and the heat conduction performance of the flexible heat conduction band processed from pure copper has a physical upper limit; second, the density of copper is 8.9 g / cm 3 , which is difficult to meet the requirement of lightweight of space products; third, the thermal expansion coefficient of copper reaches 18x10 -6 / K, and thermal stress and fatigue are generated due to frequent temperature rise at the hot end and temperature drop at the cold end during product operation, thereby affecting the positioning accuracy of the chip to be cooled and the stability and quality of signal transmission. CONTENT OF THE INVENTION

[0004] Therefore, the present application provides a heat conduction cable, a heat dissipation assembly and space equipment, which aims to solve the above technical problems to some extent.

[0005] Firstly, the present application provides a heat conduction cable, which is used in a heat dissipation assembly of space equipment, and the heat dissipation assembly further comprises a cold source, and the heat conduction cable comprises:

[0006] a cable body, the cable body comprising a cladding member and a plurality of layers of graphene stacked, the cladding member being cladded on the outside of the plurality of layers of graphene, the cable body having an extension direction and first and second ends opposite to each other in the extension direction;

[0007] a first coupling portion connected with the first end and a second coupling portion connected with the second end;

[0008] wherein the first coupling portion is used for connecting with a heat generating device of the space equipment, and the second coupling portion is used for connecting with the cold source.

[0009] On the basis of the above technical solution, preferably, the cladding member comprises a metal layer covering the outermost layer of the plurality of layers of graphene.

[0010] On the basis of any of the above technical solutions, preferably, the metal layer is fixedly connected with the first connecting part, and the metal layer is also fixedly connected with the second connecting part.

[0011] On the basis of any of the above technical solutions, preferably, the heat-conducting cable comprises a first connecting piece and a second connecting piece, the first connecting piece connects the metal layer with the first connecting part, and the second connecting piece connects the metal layer with the second connecting part.

[0012] On the basis of any of the above technical solutions, preferably, the metal layer is also welded with the first connecting part, and the metal layer is also welded with the second connecting part.

[0013] On the basis of any of the above technical solutions, preferably, the first connecting piece and the second connecting piece are both metal structures.

[0014] On the basis of any of the above technical solutions, preferably, the heat-conducting cable further comprises a heat insulation layer, and the heat insulation layer is arranged between the metal layer and the multilayer graphene.

[0015] On the basis of any of the above technical solutions, preferably, the thickness of each layer of graphene is 0.05 mm, and the thickness of the multilayer graphene is 2-3 mm.

[0016] In a second aspect, the present application provides a heat-dissipating assembly, which comprises the heat-conducting cable as described above.

[0017] In a third aspect, the present application provides a space flight device, which comprises the heat-dissipating assembly as described above.

[0018] According to the heat-conducting cable provided by the present application, the multilayer graphene in a stacked manner is used as a part of the cable body, the graphene has the characteristics of flexibility, the thermal conductivity is ≥1600 W / (m·K), the thermal conductivity is higher than that of copper, the density of the material itself is lower than that of copper, and the thermal expansion coefficient is lower than that of copper. Therefore, the heat-conducting cable provided by the present application can meet the heat-dissipating requirement and the light-weight requirement of the space flight device, and can also ensure the positioning accuracy of the chip to be cooled in the space flight device and the stability and quality of signal transmission.

[0019] In order to make the above objectives, characteristics and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are referred to. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be considered as limiting the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0021] Figure 1 A schematic diagram showing an axonometric view of a heat conducting cable according to an embodiment of the present application is shown;

[0022] Figure 2 A schematic diagram showing an axonometric view of a second coupling portion of a heat conducting cable according to an embodiment of the present application is shown.

[0023] Reference signs:

[0024] 10 - cable body; 20 - first coupling portion; 30 - second coupling portion. DETAILED DESCRIPTION

[0025] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0026] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0027] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0028] In addition, the technical solutions among various embodiments can be combined with each other, but the combination of the technical solutions should be considered not to exist and not within the protection scope of the present application, on the basis that the combination of the technical solutions can be realized by the ordinary skilled in the art, when the combination of the technical solutions appears contradictory or unachievable.

[0029] According to the first aspect of the embodiment of the present application, the structure and working principle of the heat-conducting cable are described in detail below with reference to the accompanying drawings.

[0030] According to the heat-conducting cable provided by the embodiment of the present application, the heat-conducting cable is used in a heat dissipation assembly of a space device, the heat dissipation assembly further includes a cold source, and the heat-conducting cable includes a cable main body 10, a first connecting part 20, and a second connecting part 30. In the embodiment, the cable main body 10 includes a cladding member and a plurality of stacked graphene layers, the cladding member is cladded on the outer side of the plurality of stacked graphene layers, the cable main body 10 has an extension direction and first and second ends opposite to each other in the extension direction, the first connecting part 20 is connected with the first end, and the second connecting part 30 is connected with the second end.

[0031] In the embodiment, the first connecting part 20 is used to be connected with a heat generating device of the space device, and the second connecting part 30 is used to be connected with the cold source.

[0032] In this way, according to the heat-conducting cable provided by the embodiment of the present application, the plurality of stacked graphene layers are used as the part of the cable main body 10, the graphene has the flexible characteristic, the thermal conductivity is greater than or equal to 1600 W / (m·K), the thermal conductivity is higher than that of copper, the density of the material itself is lower than that of copper, and the thermal expansion coefficient is lower than that of copper. Therefore, according to the heat-conducting cable provided by the embodiment of the present application, the heat dissipation requirement, the lightweight requirement of the space device can be met, and the positioning accuracy of the chip to be cooled of the space device and the stability and quality of the signal transmission can be ensured.

[0033] Before the present application is proposed, as mentioned in the background section of the present application, the heat-conducting cable is usually manufactured in the form of copper material braiding, because it is necessary to ensure that the heat-conducting cable has flexibility. In actual space devices, such heat generating devices as chips and cold sources are not always directly opposite to each other, but are often misaligned in space. In order to cope with such misalignment, a flexible heat-conducting structure needs to be used to connect the heat generating device and the cold source, and the flexible heat-conducting structure is used to extend in a meandering manner, so as to connect the heat generating device and the cold source.

[0034] In embodiments, as described above, the prior art tends to use a flexible cable woven from copper material, such as a flexible cable formed by interweaving a plurality of copper wires, in this way to ensure that the cable woven heat conducting cable has flexibility. The cross-sectional area of the copper wire used in this weaving manner is limited, and due to the weaving, there is a gap between the copper wires, both of which limit the thermal conductivity of the heat conducting cable. According to the heat conducting cable provided in embodiments of the present application, the stacked multi-layer graphene itself has high thermal conductivity and flexibility, which solves the problems brought by the copper woven heat conducting cable.

[0035] In embodiments, the cladding member can play a role in protecting the multi-layer graphene described above, avoiding direct exposure of the graphene to the external environment, and damage caused by winding and contact with other components.

[0036] According to the heat conducting cable provided in embodiments of the present application, the cladding member can include a metal layer covering the outermost layer of the multi-layer graphene described above. As an example, the cladding member may, for example, be a metal foil cladded on the outermost layer of the multi-layer graphene, which may, for example, be formed of an aluminum alloy or copper.

[0037] According to the heat conducting cable provided in embodiments of the present application, the metal layer can be fixedly connected with the first coupling part 20, and the metal layer is also fixedly connected with the second coupling part 30.

[0038] In embodiments, the first coupling part 20 and the second coupling part 30 may, for example, each be a block structure, and each of the first coupling part 20 and the second coupling part 30 can have a through hole, the first end of the cable body 10 can be inserted into the through hole of the first coupling part 20, and the second end of the cable body 10 can be inserted into the through hole of the second coupling part 30.

[0039] In embodiments, the first coupling part 20 and the second coupling part 30 may, for example, be the same structure. Taking the first coupling part 20 as an example, the first coupling part 20 can also have an opening in communication with the through hole, and a connecting piece can be provided at the opening position, the opening part is compressed by the connecting piece to reduce the cross-sectional area of the through hole, so as to compress the first end of the cable body 10 located in the through hole. Similarly, the second end of the cable body 10 can also be compressed and fixed in the same way.

[0040] In embodiments, the metal layer described above can also be inserted into the corresponding through hole and then compressed, so as to be connected to the first coupling part 20 and the second coupling part 30.

[0041] According to the heat conducting cable provided in embodiments of the present application, the heat conducting cable can include a first connecting piece and a second connecting piece, the first connecting piece can connect the metal layer with the first coupling part 20, and the second connecting piece can connect the metal layer with the second coupling part 30.

[0042] In embodiments, the first and second connecting members are the connecting members of the compression cable body 10 as mentioned above. As an example, the first and second connecting members can each be a bolt, which can pass through the corresponding opening and be fixed by a nut. Tightening or loosening the nut can adjust the tightness of the through hole.

[0043] According to the heat-conducting cable provided in embodiments of the present application, the metal layer can also be welded to the first connecting part 20 and the second connecting part 30. As an example, the metal layer can be welded to the first connecting part 20 and the second connecting part 30 by laser welding, so as to increase the strength of the two ends of the cable body 10.

[0044] According to the heat-conducting cable provided in embodiments of the present application, the first connecting part 20 and the second connecting part 30 can each be a metal structure, such as an aluminum alloy structure or a copper structure.

[0045] In embodiments, the heat-conducting cable can further include a thermal insulation layer, which is arranged between the metal layer and the multilayer graphene. Specifically, the upper and lower sides of the multilayer graphene are both covered by the metal layer. Therefore, the thermal insulation layer can be arranged on the upper and lower sides of the multilayer graphene, and then the metal layer can be covered on the outer side of the thermal insulation layer. The thermal insulation layer can be formed of, for example, a polyamide material.

[0046] According to the heat-conducting cable provided in embodiments of the present application, the thickness of each layer of graphene is 0.05 mm. Specifically, the thickness of the multilayer graphene can be 2-3 mm, that is, 40-60 layers of graphene can be used. Specifically, 40, 50 or 60 layers of graphene can be used. In this number of layers and thickness, the number of layers of graphene can ensure the strength of the cable body 10 and effectively achieve effective heat conduction.

[0047] According to the heat-conducting cable provided in embodiments of the present application, the multilayer graphene in a stacked manner is used as part of the cable body 10. The graphene has a flexible characteristic, a heat conductivity ≥1600 W / (m·K), a higher heat conductivity than copper, a lower density of the material itself than copper, and a lower thermal expansion coefficient than copper. Therefore, the heat-conducting cable provided in embodiments of the present application can meet the heat dissipation requirements and lightweight requirements of aerospace equipment, and can also ensure the positioning accuracy of the chips to be cooled of the aerospace equipment and the stability and quality of signal transmission.

[0048] According to the heat-conducting cable provided in embodiments of the present application, the heat-conducting cable uses graphene with a higher heat conductivity and a higher flexibility as a flexible part, so as to meet the heat dissipation requirements of mobile high-power chips or imaging chips.

[0049] According to a second aspect of the embodiments of the present application, a heat dissipation assembly is provided, which comprises the heat conduction cord as above, and has the advantages as above, which will not be repeated here. The heat dissipation assembly further comprises a cold source, which can be a refrigerator.

[0050] According to a third aspect of the embodiments of the present application, a space device is provided, which can comprise the heat dissipation assembly as above, and can have the advantages as above, which will not be repeated here. In embodiments, the space device can be, for example, a satellite or a spacecraft.

[0051] The above merely describes the preferred embodiments of the present application, and is not intended to limit the protection scope of the present application. Any equivalent structure transformation made according to the innovative concept of the present application, or direct / indirect application in other related technical fields, shall be included in the protection scope of the present application.

Claims

1. A heat-conducting cable, characterized in that, The heat-conducting cable is used in a heat dissipation component of aerospace equipment, the heat dissipation component further includes a cold source, and the heat-conducting cable includes: The cable body includes a covering member and stacked multilayer graphene, the covering member covering the outside of the multilayer graphene, and the cable body has an extension direction and a first end and a second end opposite to each other in the extension direction. A first connecting part and a second connecting part, wherein the first connecting part is connected to the first end and the second connecting part is connected to the second end; The first connecting part is used to connect to the heating element of the aerospace equipment, and the second connecting part is used to connect to the cold source; The coating component includes a metal layer covering the outermost layer of the multilayer graphene; The heat-conducting cable also includes a heat-insulating layer, which is disposed between the metal layer and the multilayer graphene; The insulation layer is formed of polyamide.

2. The heat-conducting cable according to claim 1, characterized in that, The metal layer is fixedly connected to the first connecting part, and the metal layer is also fixedly connected to the second connecting part.

3. The heat-conducting cable according to claim 2, characterized in that, The heat-conducting cable includes a first connector and a second connector. The first connector connects the metal layer to the first connecting portion, and the second connector connects the metal layer to the second connecting portion.

4. The heat-conducting cable according to claim 3, characterized in that, The metal layer is also welded to the first connecting portion, and the metal layer is also welded to the second connecting portion.

5. The heat-conducting cable according to claim 3, characterized in that, Both the first and second connectors are metal structures.

6. The heat-conducting cord according to claim 1, characterized in that, The thickness of each layer of graphene is 0.05 mm, and the thickness of the multilayer graphene is 2-3 mm.

7. A heat dissipation component, characterized in that, The heat dissipation component includes a heat-conducting cable as described in any one of claims 1 to 6.

8. A spacecraft device, characterized in that, The aerospace equipment includes the heat dissipation component as described in claim 7.

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