Radiator structure for graphics card test

By designing a heatsink structure suitable for graphics card testing, the problem of non-universal heatsinks in graphics card testing was solved, achieving convenient and efficient heat dissipation in graphics card testing, and reducing costs and time.

CN223598197UActive Publication Date: 2025-11-25WUHAN LINGJIU MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202423131949.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-18
Publication Date
2025-11-25
Estimated Expiration
2034-12-18

AI Technical Summary

Technical Problem

The heatsinks used in current graphics card testing are not compatible with different brands and types of graphics cards, and the adhesive connection method is not secure, increasing testing costs and time.

Method used

A heatsink structure was designed, comprising a heatsink plate, a fan, and heat sink fins. It achieves flexible connection with the graphics card through adjustment holes and positioning parts. Combined with copper bumps and a sealing plate design, it improves heat dissipation efficiency and structural stability.

Benefits of technology

It achieves universality and ease of operation in graphics card testing, reduces testing costs, improves heat dissipation efficiency and connection robustness, and reduces waiting time.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of graphics card testing, in particular to a radiator structure for graphics card testing, which comprises a radiating plate, a fan arranged on the radiating plate and a radiating fin opposite to the fan, the radiating fin is fixed with the radiating plate through a locking part, a plurality of adjusting holes are arranged on the radiating plate, and the fan is arranged on the radiating plate. One end of the adjusting hole faces the center of the cooling fin, the cooling plate penetrates through the adjusting hole through a positioning part to be fixed to an external display card, and the positioning part comprises a bolt which is located in the adjusting hole, penetrates through the adjusting hole and is in threaded connection with the external display card. According to the radiator structure for the display card test, the adjusting hole and the positioning part are additionally arranged on the radiating plate, and when the radiator structure is connected with test display cards with different positioning hole structures, the position of the radiator can be adjusted through the adjusting hole and the positioning part to be matched with the positions of the positioning holes in the display cards, so that the operation is more convenient and faster in the display card test process; therefore, the test cost is reduced, and the universality of the radiator structure for testing various graphics cards is realized.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a display card test technical field, specifically for a radiator structure for display card test. BACKGROUND

[0002] With the continuous development of display card technology and the continuous improvement of the performance requirement of GPU chip, various manufacturers have developed high-performance display cards of different structural types, and the display card is accompanied by significant heat generation while providing high performance. In the display card test, the heat dissipation problem of display cards of different brands and types will face great challenges. The radiator for display card test needs to have the characteristics of strong compatibility, convenient use and fast heat dissipation speed.

[0003] With the development of technology, there are more and more types of existing display cards, and different manufacturers also have different designs of display card structure. Especially in the display card test process, different positioning holes of display cards will use different structures of radiators. Because of the different positions of the positioning holes, the existing display card test radiator fixed with positioning bolts cannot be universal, which increases the test cost. Moreover, the connection mode of the heat dissipation fins is usually adhesion. During the test, the heat dissipation fins need to be tested after being firmly pasted, which increases the waiting time and reduces the efficiency. Moreover, the pasting mode is not firm. UTILITY MODEL CONTENT

[0004] To achieve the above purpose, the utility model provides the following technical scheme: a radiator structure for display card test, comprising a heat dissipation plate, a fan installed on the heat dissipation plate, and a heat dissipation fin installed opposite to the fan, the heat dissipation fin is fixed with the heat dissipation plate through a locking part, a plurality of adjusting holes are formed on the heat dissipation plate, one end of the adjusting hole faces the center of the heat dissipation fin, and the heat dissipation plate is fixed with an external display card through a positioning part passing through the adjusting hole.

[0005] Further, the positioning part comprises a bolt threaded connected with the external display card and passing through the adjusting hole, and a gasket is sleeved between the outer side of the bolt and the plate surface of the heat dissipation plate.

[0006] Further, the locking part comprises two fixed plates, a plurality of pressing strips are fixed between the two fixed plates, a plurality of grooves with the same number as the pressing strips and suitable for the pressing strips are formed on the top of the heat dissipation fin, and the fixed plates are fixed with the heat dissipation plate through bolts, and a C-shaped gasket is sleeved between the outer side of the bolt and the fixed plate.

[0007] Further, the top of the gap in the middle of the heat dissipation fin is formed with an enclosing plate.

[0008] Further, one half of the enclosing plate is communicated with the groove.

[0009] Further, the bottom of the heat dissipation plate is formed with a protrusion below the heat dissipation fin, and the protrusion and the heat dissipation plate are integrally formed and made of copper as a heat conductive material.

[0010] Further, the fan is also fixed on the heat dissipation plate through a bolt, the bottom of the bolt is threadedly connected with a nut, and a gasket is sleeved between the outer side of the bolt and the fan.

[0011] Compared with the prior art, the technical scheme has the following beneficial effects:

[0012] The heat dissipation device for testing a graphics card has the adjusting holes and the positioning part on the heat dissipation plate, and when the graphics card with different positioning hole structures is connected, the position of the heat dissipation device can be adjusted through the adjusting holes and the positioning part, and the position of the positioning hole on the graphics card is matched, so that the operation is more convenient and fast during the testing of the graphics card, the testing cost is reduced, and the universality of the heat dissipation device for testing various types of graphics cards is realized. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a structural schematic view of the utility model;

[0014] Figure 2 It is a bottom view of the utility model;

[0015] Figure 3 It is a three-dimensional view of the heat dissipation fin in the utility model;

[0016] Figure 4 It is a three-dimensional view of the fixing plate connecting structure in the utility model.

[0017] In the drawing: 1, heat dissipation plate; 2, fan; 3, adjusting hole; 4, fixing plate; 5, pressing strip; 6, heat dissipation fin; 7, bolt; 8, slot; 9, protrusion; 10, C-shaped washer; 11, gasket; 12, nut; 13, sealing plate. DETAILED DESCRIPTION

[0018] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0019] Please refer to Figures 1-4The heat sink structure for testing the display card in the embodiment comprises a heat plate 1, and heat fins 6 installed on the heat plate 1, the bottom of the heat fins 6 is connected with the plate surface of the heat plate 1 through the heat-conducting glue, and a fan 2 is installed in the gap opposite to the heat fins 6, four adjusting holes 3 are arranged on the heat fins 6, one end of the four adjusting holes 3 is opposite to the four edges of the heat fins 6 respectively, and the heat plate 1 is fixed with the external display card through the positioning part.

[0020] In the above structure, the adjusting hole is opposite to the positioning hole of the external display card, and the positioning part is connected with the positioning hole, so that the heat plate is installed on the display card for testing, the structure of the display card is not the same, the positioning part can be moved in the adjusting hole and connected with the positioning hole of the display card, and the universality of the heat sink structure for testing various display cards is realized, so that the cost of testing is reduced.

[0021] The positioning part comprises a plurality of bolts 7 arranged in the adjusting hole 3 and the fan 2, the outer side of the bolt 7 is sleeved with a gasket 11 between the corresponding fan 2 and the heat plate 1, the two bolts 7 on the fan 2 are arranged through the heat plate 1, and the bottom of the bolt 7 is threadedly connected with a nut 12. The bolt is connected with the positioning hole of the display card after being moved in the adjusting hole, so that the universality is realized, the bolt passes through the fan and the heat plate, is matched by the nut, the fan can be conveniently installed, the bolt is prevented from being directly pressed into the soft material under the action of the gasket, the surface of the connecting part is prevented from being damaged, the pressure applied by the bolt is uniformly distributed, damage caused by local stress concentration is prevented, the friction of the contact surface is increased, and the fastening effect of the connection is improved.

[0022] In addition, the top of the gap of the heat fins 6 is formed with an enclosing plate 13. Under the action of the enclosing plate, the design effectively guides the airflow through the gap between the heat fins, avoids the short circuit phenomenon of the airflow, ensures that the air blown by the fan can flow through the entire surface of the heat fins efficiently, increases the speed of the airflow, and improves the heat exchange efficiency, thereby significantly enhancing the heat dissipation performance. Although the top is sealed by the enclosing plate, the protruding part of the heat fins is still exposed to the airflow, and the effective heat dissipation area is increased. The design combines the advantages of the closed and open heat dissipation, ensures the effective utilization of the airflow, maximizes the heat dissipation surface area, and the enclosing plate also forms a support at the top of the heat fins, thereby improving the overall strength of the heat fins.

[0023] Further, the bottom of the heat sink 1 is formed with a protrusion 9 below the fin 6. The protrusion 9 is integrally formed with the heat sink 1 and is made of copper as a heat-conducting material. Specifically, oxygen-free copper with high thermal conductivity is selected to ensure efficient heat conduction. Through this design, the protrusion can effectively conduct heat from the heat source to the fin, thereby improving the efficiency of the entire heat dissipation system. During installation, heat-conducting glue is applied to the protrusion to make the protrusion adhere to the graphics card more firmly and improve the heat conduction effect.

[0024] As Figure 1 , 3 and 4, the top of the heat sink 1 is fixed with two fixing plates 4 on both sides of the fin 6 through bolts 7. A C-shaped washer 10 is sleeved between the outside of the bolt 7 and the top plate of the fixing plate 4. Two groups of pressing strips 5 are fixed between the two fixing plates 4. The top of the fin 6 is provided with a number of slots 8 that are the same as the pressing strips 5 and are adapted to the pressing strips 5. By installing the fixing plate, the pressing strip is pressed into the slot, so part of the pressing strip is embedded in the sealing plate. Therefore, the slot can limit the pressing strip, thereby effectively improving the positioning of the fin and preventing displacement. At the same time, the locking screw is convenient to disassemble, replace or maintain. The C-shaped washer is elastically deformed when the bolt is tightened, providing continuous pressure and increasing friction to prevent loosening caused by vibration or impact. The pressing strip can also improve the adhesion of the fin and the heat sink to improve the heat conduction effect.

[0025] The working principle of the above embodiment is as follows:

[0026] By adjusting the position of the bolt in the hole, it can be suitable for the installation of graphics cards with different structures. After installation, the protrusion can improve the adhesion to the graphics card, and the fin is placed on the upper position of the protrusion. Then, the pressing strip is pressed into the slot, and the fixing plate is locked by the screw, which can facilitate the installation of the fin and improve the firmness. During testing, because the heat sink and the protrusion are made of copper, heat will be dissipated through the heat sink and also conducted to the top of the fin through the fin. The gap channel of the fin is aligned by the fan, thereby increasing the effective heat dissipation area under the sealing plate. This design combines the advantages of closed and open heat dissipation, which not only ensures the effective use of airflow but also maximizes the heat dissipation surface area.

[0027] The entire workflow is complete, and the contents not described in detail in this specification are all existing technologies known to those skilled in the art.

[0028] It is to be understood that the phrases such as "first" and "second", and the like, can merely be used to distinguish one entity or action from another, without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0029] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the present application, which is defined by the appended claims and their equivalents.

Claims

1. A heatsink structure for graphics card testing, characterized in that: It includes a heat sink (1) and a fan (2) mounted on the heat sink (1), and a heat sink (6) mounted opposite to the fan (2). The heat sink (6) is fixed to the heat sink (1) by a locking part. The heat sink (1) has several adjustment holes (3). One end of the adjustment hole (3) faces the center of the heat sink (6). The heat sink (1) is fixed to the external graphics card by a positioning part passing through the adjustment hole (3).

2. The heatsink structure for graphics card testing according to claim 1, characterized in that: The positioning part includes a bolt (7) that passes through the adjustment hole (3) and is threaded to the external graphics card. A gasket (11) is fitted between the outer side of the bolt (7) and the surface of the heat sink (1).

3. The heatsink structure for graphics card testing according to claim 2, characterized in that: The locking part includes two fixing plates (4), and several pressure strips (5) are fixed between the two fixing plates (4). The top of the heat sink (6) has the same number of slots (8) as the pressure strips (5) and are adapted to each other. The fixing plate (4) is fixed to the heat sink (1) by bolts (7). A C-type washer (10) is sleeved between the outside of the bolt (7) and the fixing plate (4).

4. The heatsink structure for graphics card testing according to claim 3, characterized in that: A sealing plate (13) is formed at the lower part of the top opening of the gap in the heat sink (6).

5. A heatsink structure for graphics card testing according to claim 4, characterized in that: The sealing plate (13) is connected to the slot (8) at one half of its length.

6. A heatsink structure for graphics card testing according to claim 4, characterized in that: The bottom of the heat sink (1) is located below the heat sink (6) and a protrusion (9) is formed. The protrusion (9) and the heat sink (1) are integrally formed and both are made of copper as the heat-conducting material.

7. A heatsink structure for graphics card testing according to claim 2, characterized in that: The fan (2) is also fixed to the heat sink (1) by bolts (7), the bottom of which is threaded with a nut (12), and a washer (11) is fitted between the outside of the bolt (7) and the fan (2).