PXIe submodule and system

Abstract

The embodiment of the utility model discloses a PXIe submodule and a system. The PXIe sub-module comprises a carrier card; a service daughter card; the board-to-board connector is electrically connected with the carrier card and the service daughter card, and is used for receiving the signal transmitted by the carrier card, outputting the signal transmitted by the carrier card to the service daughter card, receiving the signal transmitted by the service daughter card, and outputting the signal transmitted by the service daughter card to the carrier card; the signal transmitted by the board-to-board connector comprises a high-frequency analog signal. According to the PXIe submodule and the system provided by the embodiment of the utility model, the flexibility and the expandability of equipment can be improved.

Description

TECHNICAL FIELD

[0001] The embodiment of the utility model relates to test measurement technology, especially relate to a PXIe submodule and system. BACKGROUND

[0002] The acquisition and playing board card based on the service function of PXIE (PXI (PCI (Peripheral Component Interconnection, component interconnection) extensions for Instrumentation, PCI extension for instrumentation system) Express) is a kind of high-performance equipment for data acquisition and signal playing, and is widely used in various application scenarios needing high-bandwidth data processing.

[0003] At present, the existing PXIe submodule, usually all devices are integrated together, affect the flexibility and scalability of equipment. UTILITY MODEL CONTENT

[0004] The embodiment of the utility model provides a kind of PXIe submodule and system, to improve the flexibility and scalability of equipment.

[0005] First, the embodiment of the utility model provides a kind of PXIe submodule, comprising:

[0006] Board card;

[0007] Service subcard;

[0008] Board-to-board connector, electrically connected with the board card and the service subcard, for receiving the signal transmitted by the board card, and outputting the signal transmitted by the board card to the service subcard, and also for receiving the signal transmitted by the service subcard, and outputting the signal transmitted by the service subcard to the board card;The signal transmitted by the board-to-board connector includes high-frequency analog signal.

[0009] Optionally, the board-to-board connector includes a high-frequency connector and a high-density connector, the board card and the service subcard are electrically connected through the high-frequency connector, and also electrically connected through the high-density connector, the high-frequency connector is used for transmitting high-frequency analog signal, and the high-density connector is used for transmitting clock signal and power signal.

[0010] Optionally, the high-density connector is two, one of which is used for transmitting clock signal, and the other is used for transmitting power signal.

[0011] Optionally, the service sub-card comprises an analog front-end circuit, the analog front-end circuit is electrically connected with the board-to-board connector, and the analog front-end circuit is used for receiving an externally transmitted analog signal, processing the analog signal, and transmitting the processed analog signal to the board-to-board connector.

[0012] Optionally, the carrier card comprises a signal acquisition circuit, a digital processing circuit and a heat sink, the digital processing circuit, the signal acquisition circuit and the board-to-board connector are electrically connected in sequence, the signal acquisition circuit is used for acquiring an analog signal transmitted by the board-to-board connector and converting the analog signal into a digital signal, the digital processing circuit is used for processing the digital signal, and the heat sink is used for dissipating heat of the carrier card.

[0013] Optionally, the PXIe sub-module further comprises a communication interface, and the communication interface is located on the service sub-card and / or the carrier card.

[0014] Optionally, the service sub-card is at least one, and different service sub-cards are communicatively connected with the carrier card through the board-to-board connector.

[0015] Optionally, the board-to-board connector comprises a socket and a plug, and the socket and the plug are matched.

[0016] Optionally, the socket and the carrier card are integrated on the same circuit board.

[0017] Optionally, the plug and the service sub-card are integrated on the same circuit board.

[0018] In a second aspect, the utility model embodiment provides a PXIe service function system, including the PXIe sub module as described in the first aspect.

[0019] The PXIe sub module and system provided by the utility model embodiment, the PXIe sub module comprises: a carrier card;Service sub-card;Board-to-board connector, electrically connected with the carrier card and the service sub-card, for receiving the signal transmitted by the carrier card, and outputting the signal transmitted by the carrier card to the service sub-card, also for receiving the signal transmitted by the service sub-card, and outputting the signal transmitted by the service sub-card to the carrier card;The signal transmitted by the board-to-board connector comprises a high-frequency analog signal.The PXIe sub module and system provided by the utility model embodiment, the service sub-card communicates with the carrier card through the board-to-board connector, and by replacing different service sub-cards, a plurality of different functions can be realized, thereby improving the flexibility and scalability of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a structure schematic view of the PXIe sub module provided by the utility model embodiment;

[0021] Figure 2is a structural block diagram of a PXIe sub-module provided by the embodiment of the utility model,

[0022] Figure 3 is a schematic view of a board-to-board connector and a carrier card provided by the embodiment of the utility model,

[0023] Figure 4 is another structural block diagram of a PXIe sub-module provided by the embodiment of the utility model,

[0024] Figure 5 is a schematic view of a service sub-card provided by the embodiment of the utility model,

[0025] Figure 6 is a schematic view of a multi-channel analog signal acquisition provided by the embodiment of the utility model,

[0026] Figure 7 is a schematic view of the basic principle of a waveform generator provided by the embodiment of the utility model. DETAILED DESCRIPTION

[0027] The utility model will be further described in detail below in combination with the drawings and embodiments.It can be understood that the specific embodiments described herein are only used to explain the utility model and not limit the utility model.In addition, it should be noted that, in order to facilitate the description, only the part related to the utility model is shown in the drawings and not all structures.

[0028] Figure 1 is a structural schematic view of a PXIe sub-module provided by the embodiment of the utility model, Figure 2 is a structural block diagram of a PXIe sub-module provided by the embodiment of the utility model. Refer to Figure 1 and Figure 2 , PXIe sub-module, comprising: carrier card 10, service sub-card 20, board-to-board connector 30, wherein, board-to-board connector 30 is electrically connected with carrier card 10 and service sub-card 20, is used to receive the signal transmission of carrier card 10, and the signal transmission of carrier card 10 is output to service sub-card 20, is also used to receive the signal transmission of service sub-card 20, and the signal transmission of service sub-card 20 is output to carrier card 10;The signal transmission of board-to-board connector 30 includes high-frequency analog signal.

[0029] Specifically, the board-to-board connector 30 is electrically connected with the carrier card 10 and the service sub-card 20 through different ports. The port of the board-to-board connector 30 can be a slot structure or a plug structure. When the plug of the board-to-board connector 30 is inserted into the matching slot, the plug is connected with the circuit in the slot through the pins on the plug, so that the service sub-card 20 communicates with the carrier card 10 through the board-to-board connector 30. The signal transmitted by the service sub-card 20 is an analog signal. When the service sub-card 20 transmits the signal to the board-to-board connector 30, the board-to-board connector 30 transmits the signal of the service sub-card 20 to the carrier card 10. The carrier card 10 performs analog-to-digital conversion on the received signal, converts the analog signal into a digital signal, and processes the digital signal. The service sub-card 20 communicates with the carrier card 10 through the board-to-board connector 30. By replacing different service sub-cards 20, various functions can be realized, thereby improving the flexibility and scalability of the device.

[0030] The PXIe sub-module provided in the embodiment includes a carrier card, a service sub-card, and a board-to-board connector electrically connected with the carrier card and the service sub-card. The board-to-board connector is used to receive the signal transmitted by the carrier card and output the signal transmitted by the carrier card to the service sub-card, and is also used to receive the signal transmitted by the service sub-card and output the signal transmitted by the service sub-card to the carrier card. The signal transmitted by the board-to-board connector includes a high-frequency analog signal. The PXIe sub-module provided in the embodiment is used for the service sub-card to communicate with the carrier card through the board-to-board connector. By replacing different service sub-cards, various functions can be realized, thereby improving the flexibility and scalability of the device.

[0031] Figure 3 is a schematic view of the board-to-board connector and the carrier card provided in the embodiment of the utility model. Referring to Figure 3 Optionally, the board-to-board connector 30 includes a high-frequency connector 31 and a high-density connector 32. The carrier card 10 and the service sub-card 20 are electrically connected through the high-frequency connector 31 and the high-density connector 32. The high-frequency connector 31 is used to transmit a high-frequency analog signal, and the high-density connector 32 is used to transmit a clock signal and a power signal.

[0032] Exemplarily, the distance H1 between one end of the high-density connector 32 and one side edge of the circuit board on which the high-density connector 32 is located is 72 mm, the height H2 of the high-frequency connector 31, i.e., the distance between one end of the high-frequency connector 31 and one side edge of the circuit board on which the high-frequency connector 31 is located, is 24 mm, and the distances L1 and L2 between one side of the high-density connector 32 and the other side edge of the circuit board on which the high-density connector 32 is located are 71.5 mm and 70 mm, respectively. Specifically, the carrier card 10 and the service sub-card 20 realize transmission of analog signals through the high-frequency connector 31 and realize transmission of clock signals and power signals through the high-density connector 32. The carrier card 10 and the service sub-card 20 are electrically connected to the high-frequency connector 31 and the high-density connector 32 through different ports, respectively, to realize communication between the carrier card 10 and the service sub-card 20. The high-frequency connector 31 is designed to meet the requirement of high-bandwidth analog signals, to ensure low insertion loss, return loss and good isolation during signal transmission. The high-density connector 32 is used to transmit clock signals and power signals, to provide a flexible power supply and clock control scheme. The high-density connector 32 not only provides power connection, but also supports transmission of low-speed communication signals and clock signals, to ensure coordinated operation of the entire system. By using the high-frequency connector 31 and combining reasonable height combination and analog signal line arrangement, the quality of analog signal transmission is optimized. By using the high-density connector 32 and combining reasonable arrangement of clock power signals and the like, the requirement of a large number of pins between the cards is met.

[0033] Moreover, the board-to-board connector transmits high-frequency analog signals rather than high-speed digital signals, and the selection of the type of the board-to-board connector needs to solve the insertion loss, return loss and isolation caused by the analog signals during transmission. The height selection needs to meet the requirement of isolation index and also needs to consider the layout and heat dissipation of the carrier card and the service sub-card. For application scenarios with strict timing requirements, there should be clock and corresponding synchronization signals, which can be transmitted from the service sub-card to the carrier card or transmitted from the carrier card to the service sub-card. Voltage reference signals are used to provide reference voltages for the analog signals, and calibration signals are used to provide calibration functions for the analog signals.

[0034] Further, the high-frequency connector 31 can realize low-loss and high-fidelity signal transmission in a high-frequency environment. Its special design structure and material selection make the signal attenuation in the transmission process extremely small, thereby ensuring the integrity and accuracy of the signal, which is crucial for high-speed data transmission applications, such as when transmitting broadband signals of the service daughter card 20, to ensure that the carrier card 10 receives clear and stable broadband signals. The high-frequency connector 31 has a wide frequency range and can adapt to the transmission of high-frequency signals of various frequencies, with a wide range of applications, which means that using high-frequency connectors in the system can reduce the types of connectors required for different frequency signal transmission, simplify system design, reduce costs, and improve system compatibility and integration. The high-frequency connector 31 can effectively reduce signal reflection through optimized internal structure and impedance matching design, avoiding distortion and energy loss caused by reflection during signal transmission, allowing more efficient signal transmission and improving signal transmission efficiency. The high-frequency connector 31 uses precise manufacturing processes and high-quality materials to ensure good electrical contact and mechanical stability between the various components of the connector, which can maintain a stable connection state for a long time and reduce signal interruptions or transmission errors caused by poor contact, suitable for highly reliable environments such as aerospace, military communications, etc. The high-frequency connector 31 has excellent shielding performance, which can effectively block external electromagnetic interference from affecting signal transmission, while also preventing its own signals from radiating outward and interfering with other devices, ensuring the purity and stability of signal transmission and ensuring the normal operation of the system in complex electromagnetic environments. As electronic devices continue to evolve towards miniaturization and lightweight, the high-frequency connector 31 also evolves towards miniaturization, with its compact size and light weight meeting the strict requirements of modern electronic devices for space and weight, helping to achieve small design of devices and improve portability and flexibility of devices, such as in smartphones, tablets and other handheld devices. The high-frequency connector 31 has a reasonable insertion force and guiding structure, allowing operators to easily and accurately perform insertion and removal operations, improving device maintenance efficiency and reducing the risk of damaging the connector or device due to improper insertion and removal. The high-frequency connector 31 complies with international standards and specifications, has good compatibility, and can be matched and connected with similar devices or connectors produced by different manufacturers, making it easy for users to expand, upgrade and replace devices, enhancing the scalability and flexibility of the system. The high-frequency connector 31 can work normally in different working environment conditions, including high temperature, low temperature, humidity, dust and other harsh environments, with strong environmental adaptability and durability, ensuring stable operation of the device in various complex environments.

[0035] Optionally, the frequency of the high-frequency analog signal is greater than 100MHz and less than 28GHz, and the high-density connector 32 includes a plurality of pins. Exemplarily, the density of the pins corresponds to an adjacent pin spacing of 1mm.

[0036] Specifically, the high-density connector 32 can realize the transmission and connection of a large number of signals in a relatively small space. The compact design allows multiple pins to be closely arranged, thereby reducing the space occupied by the connector in the device, facilitating the miniaturization and lightweight design of the device, and enabling the device to be more compact and portable. The high-density connector 32 integrates multiple pins, which can effectively reduce the complexity of internal wiring of the device. Compared with using multiple ordinary connectors to achieve the same number of signal connections, using a high-density connector can greatly simplify the layout and connection of the circuit, reduce wiring costs and error probability, and improve production efficiency and device reliability. The pins of the high-density connector 32 are usually made of high-quality metal materials and are subjected to special surface treatment, which can ensure extremely low contact resistance during connection, thereby reducing energy loss and attenuation of signals during transmission and avoiding problems such as signal interruption or error codes caused by poor contact, thereby improving the efficiency and reliability of signal transmission. One high-density connector 32 can replace multiple ordinary connectors, thereby reducing the procurement cost of the connector. At the same time, since the number of connectors used is reduced, the assembly difficulty of the device during assembly is also reduced, thereby improving the yield. When the device needs to be upgraded or expanded, the compatibility and versatility of the high-density connector play an important role. Since it follows certain standards and specifications, new devices or modules can be easily connected and integrated with existing systems through the high-density connector, without the need to make large-scale changes to the connector architecture of the entire system, thereby reducing the difficulty and cost of system upgrade and expansion, and improving the scalability and compatibility of the device. The high-density connector is designed to fully consider the convenience of plugging, and usually has reasonable plugging force and guiding structure, so that the operator can easily and accurately perform plugging operation without the need to use special tools or apply excessive force, thereby improving the maintenance efficiency and user experience of the device. The board-to-board connector can realize quick connection and disconnection, thereby saving the time for debugging and maintaining the device. In scenarios where the device needs to be connected and tested frequently, such as instrument connection in test equipment and scientific research experiments, the quick connection feature of the high-density connector can significantly improve work efficiency.

[0037] It should be noted that the specific size of the frequency and pin spacing is only illustrative, and the specific size can be determined according to actual business function requirements, which is not limited herein.

[0038] Reference Figure 3 Optionally, the high-density connector 32 is two, one of which is used to transmit a clock signal, and the other is used to transmit a power signal.

[0039] Specifically, two high-density connectors 32 are located at two ends of the high-frequency connector 31 respectively.

[0040] Figure 4 is a structural block diagram of another PXIe sub-module provided by the embodiment of the utility model, Figure 5 is a schematic diagram of a service sub-card provided by the embodiment of the utility model. Figure 4 and Figure 5 Optionally, the service sub-card 20 comprises an analog front-end circuit 21, the analog front-end circuit 21 is electrically connected with the board-to-board connector 30, and the analog front-end circuit 21 is used for receiving an analog signal transmitted externally, processing the analog signal, and transmitting the processed analog signal to the board-to-board connector 30.

[0041] Specifically, the analog front-end circuit 21 processes the received analog signal, such as amplification, filtering and the like, and transmits the processed analog signal to the board-to-board connector 30, so as to transmit the processed analog signal to the carrier card 10 through the board-to-board connector 30. The service sub-card 20 is compact in design, and the quality and stability of signal transmission are ensured through precise layout and wiring design of each circuit. The interface design of the service sub-card 20 is fine, which ensures that the connection with the carrier card is stable and reliable, and facilitates replacement and maintenance.

[0042] Reference Figure 3 and Figure 4 Optionally, the carrier card 10 comprises a signal acquisition circuit 13, a digital processing circuit 11 and a heat sink 12, the digital processing circuit 11, the signal acquisition circuit 13 and the board-to-board connector 30 are electrically connected in sequence, the signal acquisition circuit 13 is used for acquiring the analog signal transmitted by the board-to-board connector and converting the analog signal into a digital signal, the digital processing circuit 11 is used for processing the digital signal, and the heat sink 12 is used for heat dissipation of the carrier card 10.

[0043] The digital processing circuit 11 stores and processes digital signals. When the card 10 is working, it will generate heat. If the heat cannot be dissipated in time, the internal temperature of the card 10 will rise rapidly, which will affect its performance and service life. Therefore, the heat sink 12 is needed to dissipate the heat generated by the card 10 to the surrounding environment, ensuring that the card 10 works in the appropriate temperature range, thereby ensuring the stable operation and service life of the equipment. The heat sink 12 can be an integrated heat sink. An integrated heat sink is a heat dissipation device that integrates multiple heat dissipation components or functions together, including an integrated air-cooled heat sink, an integrated water-cooled heat sink, and an integrated semiconductor heat sink. An integrated air-cooled heat sink is usually composed of a heat sink and a fan. The heat sink is made of metal materials such as aluminum or copper, with a large heat dissipation area. The fan is responsible for accelerating air flow and improving heat dissipation efficiency. Some integrated air-cooled heat sinks have an integrated design of the heat sink and the fan, with a more compact overall structure and easier installation. Integrated air-cooled heat sinks are widely used in various electronic devices, such as computer CPUs, graphics cards, and motherboard chipsets. For general power consumption electronic components, an integrated air-cooled heat sink can provide sufficient heat dissipation capacity to meet the normal operation requirements of the equipment. An integrated water-cooled heat sink is mainly composed of a water-cooled head, a water-cooled pipe, a water-cooled row, and a water pump. These components are assembled into a whole when they leave the factory, without the need for users to install a complex water-cooled circulation system, greatly reducing the installation difficulty. The water-cooled head is closely attached to the heat-generating component, and the heat is carried away by the water-cooled liquid, then transmitted to the water-cooled row through the water-cooled pipe, and finally dissipated to the air by the fan on the water-cooled row. Compared with air-cooled heat sinks, integrated water-cooled heat sinks have better heat dissipation effects, can effectively reduce the temperature of high-power components, and improve the stability and performance of the equipment. At the same time, due to the large heat capacity of the water-cooled liquid, the temperature change is more gradual, reducing the impact of temperature fluctuations on components. Integrated water-cooled heat sinks are mainly used for high-performance computer hardware, such as high-end CPUs and high-performance graphics cards. An integrated semiconductor heat sink utilizes the Peltier effect of semiconductor materials. When a direct current passes through a circuit composed of two different semiconductor materials, heat absorption or heat release occurs at the junction. An integrated semiconductor heat sink is usually composed of a semiconductor refrigeration sheet, a heat sink, and a fan. One side of the refrigeration sheet absorbs heat to lower the temperature of the object, and the other side dissipates heat through the heat sink and fan. Integrated semiconductor heat sinks have the advantages of fast refrigeration speed and obvious cooling effect, which can quickly reduce the temperature of heat-generating components to a low level, effectively improving the performance and stability of the equipment. In addition, integrated semiconductor heat sinks have a relatively small size, making them easy to install and use, suitable for small electronic devices with limited space and high temperature control requirements, such as mobile phone heat sinks and small server heat modules. In scenarios requiring rapid cooling, such as temporary cooling of a computer CPU under high load, an integrated semiconductor heat sink can also play a good role.

[0044] Optionally, the PXIe sub-module further comprises a communication interface, which is located on the service sub-card and / or the carrier card.

[0045] Specifically, the service sub-card and the carrier card can be provided with a communication interface, such as a SPI (Serial Peripheral Interface, serial peripheral interface) communication interface, a UART (Universal Asynchronous Receiver Transmitter, universal asynchronous receiver transmitter) protocol communication interface, and a LVDS (Low Voltage Differential Signaling, low voltage differential signaling) level differential single-ended general input and output pin. The UART communication interface is a universal asynchronous receiver, a serial communication logic circuit, which can be independently formed into a chip or embedded into other chips as a module, such as a single-chip microcomputer provided with a UART module. The UART communication interface complies with a serial communication timing protocol, and its level standard is usually related to the connected device, such as a TTL (Transistor Transistor Logic, transistor-transistor logic) level when connected with a single-chip microcomputer, 0 corresponding to 0V and 1 corresponding to 3.3V or 5V. The SPI communication interface is a serial peripheral interface, a high-speed synchronous serial communication interface, which is mainly used for short-distance communication between a microcontroller and an external device. The SPI communication interface usually controls the communication process by a master device, synchronizes data transmission through a clock signal, and has a high data transmission rate and a simple hardware interface.

[0046] Optionally, the service sub-card is at least one, and different service sub-cards are connected in communication with the carrier card through a board-to-board connector.

[0047] Specifically, different functional service sub-cards, such as service sub-cards corresponding to the functions of an oscilloscope, a spectrum analyzer, and the like, can be connected in communication with the carrier card through the board-to-board connector. When one service sub-card is disconnected from the board-to-board connector, another service sub-card can be connected to the board-to-board connector, and by replacing different sub-cards, a plurality of different functions can be realized, thereby improving the flexibility and scalability of the system. This design reduces the need for repeated design of the carrier card, so that the developer can focus on the design of the analog front-end card, and the product development cycle is accelerated.

[0048] Optionally, the board-to-board connector comprises a socket and a plug, and the socket and the plug are matched to ensure normal signal transmission.

[0049] Optionally, the slot and the carrier card are integrated on the same circuit board. The plug and the service sub-card are integrated on the same circuit board. The plug on the circuit board integrated with the service sub-card is inserted into the slot on the circuit board integrated with the carrier card, so as to realize the transmission of signals through the board-to-board connector. In this way, the length and complexity of the signal transmission path between the board-to-board connector and the carrier card can be reduced, and the attenuation, distortion and delay of the signal in the transmission process can be reduced, thereby improving the integrity and transmission speed of the signal, which is particularly important for the processing of high-speed and high-frequency signals. Moreover, through reasonable layout and wiring planning, electromagnetic interference and electromagnetic compatibility can be better controlled. The elements prone to electromagnetic interference are isolated from the elements sensitive to electromagnetic interference or shielding measures are taken, which can effectively reduce the influence of electromagnetic interference on signal quality, ensure the quality of communication signals, and improve the stability and reliability of the equipment. Compared with using multiple separate circuit boards to realize different functions, integration on the same circuit board can reduce the number of circuit boards, the use of connectors and the number of related electronic elements, thereby reducing the procurement cost and inventory cost of raw materials, and reducing the connection and assembly process between circuit boards, labor cost and production time, improving production efficiency, while also reducing the failure probability caused by poor connection, improving the yield of products, and reducing production cost; more functions can be integrated in a limited space to meet the demand for miniaturization and thinness of modern electronic equipment, making the equipment more portable and easy to use; reasonable planning of the layout of elements and wiring on the circuit board can make full use of the space of the circuit board, avoid space waste, and make the internal structure of the equipment more compact, leaving more space for the integration of other components or functions. Since the number of connectors and wires between circuit boards is reduced, the risk of failure caused by loose connectors, poor contact, oxidation and other problems is reduced, and the reliability and stability of the system are improved, especially in harsh working environments such as high temperature, high humidity and vibration. Reducing the number of connection points can significantly improve the reliability of the equipment. The slot and the carrier card of the board-to-board connector are integrated on the same circuit board, which is conducive to unified heat dissipation design and thermal management. By reasonably arranging heat dissipation structures such as heat sinks, heat generated on the circuit board can be more effectively dissipated, preventing local overheating from damaging elements and prolonging the service life of the equipment. When the function of the equipment needs to be upgraded or expanded, only the related elements or circuits on the same circuit board need to be modified and updated, without the need to replace the entire circuit board or redesign complex connection relationships, thereby reducing the difficulty and cost of system upgrade and improving the scalability and compatibility of the equipment; it is convenient for technicians to diagnose and locate faults, which can quickly find fault points and repair them, reducing downtime and maintenance costs of the equipment, and facilitating daily maintenance and maintenance of the equipment, such as through test points and diagnostic interfaces on the circuit board, the area and specific elements of the fault can be quickly detected, improving maintenance efficiency.

[0050] In one embodiment, for multi-channel radio frequency transceiver applications, the single-ended-to-differential circuit of the analog signal is placed in the service subcard, and different models can be selected according to the signal frequency band of the application, and different packaging can directly adjust the board design of the service subcard. The board material of the board can also be customized according to the different frequency bands and different analog indicators. Due to the simple circuit of the service subcard, the product development efficiency is accelerated, and the product development delivery is ensured. Exemplarily, Figure 6 is a schematic diagram of a multi-channel analog signal acquisition provided by an embodiment of the present application. Referring to Figure 6 , 8-channel acquisition B1-B8 and 8-channel playback C1-C8 are integrated, and the externally input analog signal is converted into a differential signal by the single-ended-to-differential circuit A1-A8 of the service subcard and output to the board card. The differential signal output by the board card is converted into a single-ended signal by the single-ended-to-differential circuit and output, and in cooperation with the customized high-integration external radio frequency connector and the customized shield, better isolation can be provided.

[0051] In another embodiment, taking a waveform generator as an example, Figure 7 is a schematic diagram of the basic principle of a waveform generator provided by an embodiment of the present application. Referring to Figure 7 , the externally input analog signal is transmitted to the receiving end DC-B of the waveform generator. The waveform generator is a double-channel digitizer and a double-channel arbitrary waveform generator. The waveform generator converts the analog signal and outputs the converted analog signal to the board card. The waveform generator is provided with a matching reference common-mode voltage by the reference voltage provided by the board card, and the output signal of the board card is output to the external interface through the receiving end of the waveform generator. This example also includes a calibration circuit for analog signal calibration, and uses the SPI of the digital input and output part as a control interface.

[0052] It should be noted that the size of each parameter in this embodiment is only illustrative, and can be determined according to actual device requirements, which is not limited herein.

[0053] The PXIe sub-module provided by the embodiment adopts a separation design of a carrier card and a sub-card, wherein the carrier card is responsible for a digital processing part, and a service sub-card is responsible for an analog front-end part, and the modular design enables different analog front-ends with different requirements to be realized by replacing the service sub-card without the need of redesigning the whole board card.

[0054] To sum up, by means of the above technical means, the embodiment achieves the design goals of high efficiency, flexibility and economy in a high-bandwidth data acquisition and playback device, has obvious advantages in structure and function, and performs well in process and cost, and provides a more efficient and economical solution for the test and measurement field.

[0055] The PXIe service function system provided by the embodiment of the utility model has the beneficial effects of the PXIe sub-module provided by any embodiment of the utility model.

[0056] It should be noted that the above is only a preferred embodiment of the utility model and the technical principle applied. Those skilled in the art will understand that the utility model is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, readjustments, combinations and substitutions without departing from the protection scope of the utility model. Therefore, although the utility model has been described in more detail through the above embodiments, the utility model is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the utility model, and the scope of the utility model is determined by the appended claims.

Claims

1. A PXIe submodule, characterized in that, include: Card carrier; Business sub-card; The board-to-board connector is electrically connected to the carrier card and the service sub-card, and is used to receive signals transmitted by the carrier card and output the signals transmitted by the carrier card to the service sub-card. It is also used to receive signals transmitted by the service sub-card and output the signals transmitted by the service sub-card to the carrier card. The signals transmitted by the board-to-board connector include high-frequency analog signals.

2. The PXIe submodule according to claim 1, characterized in that, The board-to-board connector includes a high-frequency connector and a high-density connector. The carrier card and the service sub-card are electrically connected through the high-frequency connector and also through the high-density connector. The high-frequency connector is used to transmit high-frequency analog signals, and the high-density connector is used to transmit clock signals and power signals.

3. The PXIe submodule according to claim 2, characterized in that, The high-density connector consists of two parts, one for transmitting clock signals and the other for transmitting power signals.

4. The PXIe submodule according to claim 1, characterized in that, The service sub-card includes an analog front-end circuit, which is electrically connected to the board-to-board connector. The analog front-end circuit is used to receive externally transmitted analog signals, process the analog signals, and transmit the processed analog signals to the board-to-board connector.

5. The PXIe submodule according to claim 1, characterized in that, The carrier card includes a signal acquisition circuit, a digital processing circuit, and a heat sink. The digital processing circuit, the signal acquisition circuit, and the board-to-board connector are electrically connected in sequence. The signal acquisition circuit is used to acquire the analog signal transmitted by the board-to-board connector and convert the analog signal into a digital signal. The digital processing circuit is used to process the digital signal. The heat sink is used to dissipate heat from the carrier card.

6. The PXIe submodule according to claim 1, characterized in that, There is at least one service sub-card, and different service sub-cards are communicatively connected to the carrier card through the board-to-board connector.

7. The PXIe submodule according to claim 1, characterized in that, The board-to-board connector includes a slot and a plug, the slot and the plug being mated.

8. The PXIe submodule according to claim 7, characterized in that, The slot and the carrier card are integrated on the same circuit board.

9. The PXIe submodule according to claim 7, characterized in that, The plug and the service sub-card are integrated on the same circuit board.

10. A PXIe service function system, characterized in that, Includes the PXIe submodule as described in any one of claims 1-9.

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