A temperature measurement module and a temperature measurement device

Abstract

The utility model relates to temperature measurement technical field especially relates to a temperature measurement module and temperature measurement equipment. The utility model discloses temperature measurement module, including the main control module of built -in wireless communication module, set up with the collection module of microbolometer and thermocouple sensor, and be used for the power module of power supply for main control module and collection module. The main control module can compensate the temperature distribution information that microbolometer sensor obtains according to the ambient temperature information that thermocouple sensor obtains, to output the temperature measurement data that calibrates through ambient temperature. Make temperature measurement module not only have the temperature measurement range of wide, and ensure the high accuracy of temperature measurement, no matter under extreme environment or face the object of temperature change bigger, can provide stable, reliable temperature data, greatly promote the applicability and precision of temperature measurement.

Description

TECHNICAL FIELD

[0001] The utility model relates to temperature measurement technical field, especially relate to a temperature measurement module and temperature measurement equipment. BACKGROUND

[0002] Temperature measurement is the basic core technology in the fields of industrial production, equipment operation and maintenance, consumer electronics, scientific research monitoring, etc. Its measurement accuracy, scene adaptability and use convenience directly affect the work efficiency and safety. Current mainstream temperature measurement products are mainly contact type temperature measurement instruments and non-contact type temperature measurement instruments. Among them, the contact type temperature measurement instrument relies on the direct contact between the probe and the object to measure the temperature, and the scene and range are limited, which cannot adapt to high-temperature equipment, precision components, long-distance targets and other non-contact or difficult-to-contact scenes. At the same time, the upper limit of temperature measurement completely depends on the temperature resistance of the probe material, and ordinary metal probes cannot meet the needs of high-temperature scenes. The probes made of special high-temperature resistant materials have high cost and are difficult to popularize on a large scale. The non-contact type temperature measurement instrument mainly detects the temperature of the object through the principle of infrared radiation. Although it solves the scene limitation of the contact type product, it often has low accuracy when measuring a wide range, or it needs to manually adjust the measurement parameters multiple times, resulting in low efficiency in actual application. SUMMARY

[0003] In order to solve the problem that the temperature measurement range and accuracy of the existing non-contact temperature measurement equipment are difficult to balance, the utility model provides a temperature measurement module and temperature measurement equipment.

[0004] The technical problem of the utility model is solved by providing a temperature measurement module, which comprises:

[0005] A main control module, wherein the main control module is built-in with a wireless communication module;

[0006] An acquisition module, comprising a microbolometer and a thermoelectric pile sensor, wherein the microbolometer is used to acquire temperature distribution information of a target object, the thermoelectric pile sensor is used to acquire environmental temperature information, and the microbolometer and the thermoelectric pile sensor are in communication connection with the main control module;

[0007] A power supply module, which is in electrical connection with the main control module and the acquisition module and supplies power for them.

[0008] Preferably, the main control module adopts an ESP32-S3 chip, the acquisition module adopts an MI0802 thermal imaging camera module, and the MI0802 thermal imaging camera module is in communication connection with the ESP32-S3 chip through an SPI interface.

[0009] Preferably, the wireless communication module comprises a Wi-Fi module and a Bluetooth module.

[0010] Preferably, the acquisition module further comprises an optical lens group, and a horizontal field of view angle of the optical lens group is 45°±5° or 90°±5°.

[0011] Preferably, the power supply module comprises:

[0012] an interface circuit for electrical connection with an external power supply;

[0013] a charge-discharge circuit, the charge-discharge circuit being provided with a battery interface for electrical connection with a battery;

[0014] a power input end of the charge-discharge circuit is electrically connected with the interface circuit, for charging the battery when the interface circuit is connected with the external power supply;

[0015] a power output end of the charge-discharge circuit is electrically connected with the master control module and the acquisition module, for supplying power to the master control module and the acquisition module and simultaneously charging the battery when the interface circuit is connected with the external power supply, or for supplying power to the master control module and the acquisition module by the battery connected through the battery interface when the interface circuit is not connected with the external power supply.

[0016] Preferably, the power supply module further comprises a voltage stabilizing circuit, a power input end of the voltage stabilizing circuit being connected with the battery and the interface circuit, and a power output end of the voltage stabilizing circuit being electrically connected with the master control module and the acquisition module.

[0017] Preferably, the interface circuit is a Type-C USB interface circuit, and the Type-C USB interface circuit is further in communication connection with the master control module.

[0018] Preferably, the ESP32-S3 chip is electrically connected with a key circuit, the key circuit comprising a first key and a second key, the first key being connected with an enable pin of the ESP32-S3 chip, and the second key being connected with a GPIO0 pin of the ESP32-S3 chip.

[0019] Preferably, the master control module is further electrically connected with an RGB indicator light circuit.

[0020] The utility model provides another technical scheme to solve the above technical problems, and provides a temperature measuring device, which comprises a device main body and the temperature measuring module, the master control module of the temperature measuring module is provided with an extension pin, and the device main body is electrically connected with the temperature measuring module through the extension pin.

[0021] Compared with the prior art, the temperature measuring module and the temperature measuring device provided by the utility model have the following beneficial effects:

[0022] 1. The temperature measurement module provided in the embodiment of the utility model, including built -in wireless communication module's main control module, set up with micro bolometer and thermocouple sensor's collection module, and be used for main control module and collection module power supply's power supply module. Wireless communication module is used for sending the temperature data collected by collection module to remote terminal for display, analysis or storage. Micro bolometer is used for obtaining temperature distribution information of target object, and micro bolometer can measure target in long distance, and can cover wide range from low temperature to high temperature. Thermocouple sensor is used for obtaining environmental temperature information, and micro bolometer and thermocouple sensor are in communication connection with main control module, and main control module can compensate the temperature distribution information obtained by micro bolometer sensor according to the environmental temperature information obtained by thermocouple sensor, to output the temperature measurement data calibrated by environmental temperature. Therefore, the temperature measurement module in the utility model not only has a wide temperature measurement range, can adapt to various complex measurement requirements from low temperature to high temperature, and ensures the high accuracy of temperature measurement. Whether in extreme environment or facing the object with large temperature change, stable and reliable temperature data can be provided, the applicability and precision of temperature measurement are greatly improved, and the problem that traditional equipment is difficult to reconcile between wide range and high precision is solved.

[0023] 2. The temperature measurement module provided in the embodiment of the utility model, the main control module adopts ESP32-S3 chip, the collection module adopts MI0802 thermal imaging camera module, and the MI0802 thermal imaging camera module is in communication connection with the ESP32-S3 chip through the SPI interface. The ESP32-S3 chip has powerful data processing capability, can effectively process complex data from the MI0802 thermal imaging camera module, and quickly realizes the collection and processing of temperature information. The MI0802 thermal imaging camera module can accurately and real-timely capture the temperature distribution of the surface of the object, provide high-resolution thermal imaging images, and has a wide range of applications, and can be applied to low-temperature and high-temperature environments. The SPI interface can realize high-speed and low-delay data transmission, and ensure that the temperature collection module and the main control module can timely and stably exchange a large amount of data.

[0024] 3. The temperature measurement module provided in the embodiment of the utility model, the wireless communication module includes Wi-Fi module and Bluetooth module, Wi-Fi is suitable for long-distance communication or large data transmission scene, and Bluetooth is suitable for short-distance and low-power application, which makes the temperature measurement module realize dual-mode communication, can adapt to different working environments, and users can select Wi-Fi or Bluetooth according to the needs of specific application scene, improve the flexibility, reliability and stability of communication mode.

[0025] 4. The temperature measurement module provided in the embodiment of the utility model, the acquisition module further includes an optical lens group, the optical lens group is used for focusing infrared radiation to the surface of the microbolometer, the 45-degree field of view angle can avoid excessive background information interference, is suitable for high-precision and long-distance temperature measurement, the 90-degree field of view angle is suitable for wide-range, high-efficiency real-time temperature measurement.According to the requirement of specific application scene, the appropriate field of view angle is selected, the flexibility, precision and temperature measurement efficiency of the temperature measurement module can be greatly improved.

[0026] 5. The temperature measurement module provided in the embodiment of the utility model, the power supply module includes: an interface circuit for electrical connection with an external power supply; a charge-discharge circuit, the charge-discharge circuit is provided with a battery interface for electrical connection with a battery; the power input end of the charge-discharge circuit is electrically connected with the interface circuit, for charging the battery when the interface circuit is connected with the external power supply; the power output end of the charge-discharge circuit is electrically connected with the main control module and the acquisition module, for supplying power to the main control module and the acquisition module and charging the battery at the same time when the interface circuit is connected with the external power supply; or when the interface circuit is not connected with the external power supply, the battery connected through the battery interface supplies power to the main control module and the acquisition module. The design makes the power supply scheme of the temperature measurement module more flexible, which can directly supply power through the interface circuit or supply power through the battery, prolonging the power supply time. And when using battery power supply, it can work independently, increasing its use scene.

[0027] 6. The temperature measurement module provided in the embodiment of the utility model, the power supply module further includes a voltage stabilizing circuit, the power input end of the voltage stabilizing circuit is connected with the battery and the interface circuit, and the power output end thereof is electrically connected with the main control module and the acquisition module. The voltage stabilizing circuit ensures that the output voltage is within a predetermined range, which can avoid damage to electronic components due to unstable voltage and prolong the service life of the temperature measurement module.

[0028] 7. The temperature measurement module provided in the embodiment of the utility model, the interface circuit is a Type-C USB interface circuit, the Type-C USB interface circuit is further in communication connection with the main control module, and can be used for realizing program debugging and serial communication function while supplying power.

[0029] 8. The temperature measurement module provided in the embodiment of the utility model, the ESP32-S3 chip is electrically connected with a key circuit, the key circuit includes a first key and a second key, the first key is connected with the enable pin of the ESP32-S3 chip, and the second key is connected with the GPIO0 pin of the ESP32-S3 chip. The first key can control the enable or disable of the ESP32-S3 chip, and plays a power management role, and the second key can configure the start mode of the ESP32-S3 chip, such as making it enter the BOOT mode, so that the program recovery or re-burning can be conveniently carried out, which is helpful to improve the development and debugging efficiency.

[0030] 9. The temperature measurement module provided in the embodiment of the utility model, the main control module is still electrically connected with RGB pilot lamp circuit, can express the state information of temperature measurement module current according to the different display state of RGB pilot lamp circuit, convenient for user observation.

[0031] 10. The utility model embodiment further provides a kind of temperature measurement equipment, including equipment main body and above-mentioned temperature measurement module, the main control module of temperature measurement module leads out expansion pin, and equipment main body is electrically connected with temperature measurement module by expansion pin.This temperature measurement equipment has the same beneficial effect with above-mentioned one temperature measurement module, not do here superfluously. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical scheme in the embodiment of the utility model, the drawings needed to be used in the embodiment or prior art description will be simply introduced as follows, obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to these drawings without creative labor for ordinary skilled in the art.

[0033] Figure 1 It is the frame schematic diagram of the temperature measurement module provided in the first embodiment of the utility model Figure 1 .

[0034] Figure 2 It is the frame schematic diagram of the wireless communication module of the temperature measurement module provided in the first embodiment of the utility model.

[0035] Figure 3 It is the frame schematic diagram of the acquisition module of the temperature measurement module provided in the first embodiment of the utility model.

[0036] Figure 4 It is the circuit schematic diagram of the main control module of the temperature measurement module provided in the first embodiment of the utility model.

[0037] Figure 5 It is the circuit schematic diagram of the acquisition module of the temperature measurement module provided in the first embodiment of the utility model.

[0038] Figure 6 It is the frame schematic diagram of the temperature measurement module provided in the first embodiment of the utility model Figure 2 .

[0039] Figure 7 It is the circuit schematic diagram of the interface circuit of the temperature measurement module provided in the first embodiment of the utility model.

[0040] Figure 8 It is the circuit schematic diagram of the charge-discharge circuit of the temperature measurement module provided in the first embodiment of the utility model.

[0041] Figure 9Is the circuit schematic of the voltage stabilizing circuit of the temperature measurement module provided by the first embodiment of the utility model.

[0042] Figure 10 Is the circuit schematic of the key circuit of the temperature measurement module provided by the first embodiment of the utility model.

[0043] Figure 11 Is the circuit schematic of the RGB indicating lamp circuit of the temperature measurement module provided by the first embodiment of the utility model.

[0044] Figure 12 Is the temperature measurement device and frame schematic provided by the second embodiment of the utility model.

[0045] Figure 13 Is the pin definition and layout schematic of the interface pad of the temperature measurement device provided by the second embodiment of the utility model.

[0046] The figure mark explanation is as follows:

[0047] 1, temperature measurement module;2, temperature measurement device;3, terminal device;4, external power supply;5, battery;

[0048] 10, main control module;20, acquisition module;30, power supply module;40, key circuit;50, RGB indicating lamp circuit;60, device main body;70, extension pin;

[0049] 101, wireless communication module;102, Wi-Fi module;103, Bluetooth module;201, micro bolometer;202, thermoelectric pile sensor;203, optical lens group;301, interface circuit;302, charge and discharge circuit;303, battery interface;304, voltage stabilizing circuit;

[0050] S1, first key;S2, second key. Specific implementation

[0051] In order to make the utility model's purpose, technical scheme and advantage more clear and obvious, the following is combined with the drawing and the implementation example, and the utility model is further explained in detail. It should be understood that the specific embodiments described herein are only used to explain the utility model, and are not used to limit the utility model.

[0052] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or a middle element can exist. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0053] In the utility model, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "transverse", "longitudinal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used for better describing the utility model and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0054] In addition to indicating the orientation or positional relationship, the above-mentioned terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the utility model can be understood according to the specific situation.

[0055] In addition, the terms "mounting", "setting", "providing", "connecting", "connecting" should be understood broadly. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific situation.

[0056] Please refer to Figure 1 The utility model provides a kind of temperature measurement module 1, comprising:

[0057] Master module 10, wireless communication module 101 is built in master module;

[0058] Acquisition module 20, including microbolometer 201 and thermoelectric pile sensor 202, microbolometer 201 is used to obtain the temperature distribution information of target object, and thermoelectric pile sensor 202 is used to obtain environmental temperature information, and microbolometer 201 and thermoelectric pile sensor 202 are connected with master module 10 in communication;

[0059] Power supply module 30 is electrically connected with master module 10 and acquisition module 20 respectively and supplies power for it.

[0060] Master module 10 is configured to compensate the temperature distribution information obtained by microbolometer 201 according to the environmental temperature information obtained by thermoelectric pile sensor 202, to output the temperature measurement data calibrated by environmental temperature.

[0061] It can be understood that the microbolometer 201 can measure the temperature by detecting the infrared radiation of the target object surface, can measure the target at a long distance, realize non-contact temperature measurement, and can cover a wide range from low temperature to high temperature; the thermocouple sensor 202 can provide higher thermal sensitivity and faster response speed. The main control module 10 processes the received temperature distribution information and environmental temperature information, adjusts the temperature distribution information obtained by the microbolometer 201 in real time according to the environmental temperature information obtained by the thermocouple sensor 202, and can further output accurate temperature measurement data in real time.

[0062] It can be understood that the wireless communication module 101 enables the temperature measurement data to be transmitted to the remote terminal device 3 in real time and accurately for display, analysis or storage, so that the user can perform temperature monitoring at any time and anywhere. At the same time, the power supply module 30 ensures the reliability of the temperature measurement module 1 during long-time continuous work, and reduces the risk of measurement interruption or data loss caused by power problems.

[0063] It can be understood that the temperature measurement module 1 in the embodiment not only has a wide temperature measurement range, but also ensures high accuracy of temperature measurement. Whether in extreme environments or facing objects with large temperature changes, stable and reliable temperature data can be provided, greatly improving the applicability and accuracy of temperature measurement, and solving the problem that traditional temperature measurement equipment is difficult to reconcile between wide range and high precision. The infrared radiation energy distribution of the target object can be detected in real time, and the object surface temperature distribution map and thermal imaging image can be generated through quantitative processing, so as to provide accurate temperature detection and thermal imaging analysis for the user.

[0064] Further, referring to Figure 2 The wireless communication module 101 includes a Wi-Fi module 102 and a Bluetooth module 103.

[0065] It can be understood that the Wi-Fi module 102 is suitable for scenarios requiring long-distance communication or large data transmission, while the Bluetooth module 103 is suitable for short-distance and low-power applications, which enables the temperature measurement module 1 to realize dual-mode communication and adapt to different working environments. The user can select to use Wi-Fi or Bluetooth to communicate with the terminal device 3 according to the needs of the specific application scene, improving the flexibility, reliability and stability of communication.

[0066] Further, referring to Figure 3 The acquisition module 20 further includes an optical lens group 203, and the horizontal field of view angle of the optical lens group 203 is 45°±5° or 90°±5°.

[0067] It can be understood that the optical lens group 203 is used to focus infrared radiation to the surface of the microbolometer 201, and the 45° horizontal field of view angle can avoid excessive background information interference, which is suitable for high-precision and long-distance temperature measurement, and the 90° horizontal field of view angle is suitable for wide-range, high-efficiency real-time temperature measurement. According to the needs of specific application scenarios, the appropriate field of view angle is selected, which can greatly improve the flexibility, precision and temperature measurement efficiency of the temperature measurement module 1. The horizontal field of view angle is limited to a tolerance of 5° to avoid errors in actual production.

[0068] As some specific examples, the field of view angle parameters of the optical lens group 203 are: diagonal field of view angle 56°, horizontal field of view angle 45°, vertical field of view angle 34°; or diagonal field of view angle 122°, horizontal field of view angle 90°, vertical field of view angle 67°.

[0069] Preferably, the main control module 10 can use an ESP32-S3 chip as the main control chip, and the acquisition module 20 can use a thermal imaging camera module with a model of MI0802, which is in communication connection with the ESP32-S3 chip through an SPI interface.

[0070] It can be understood that the ESP32-S3 chip has strong data processing capability and can effectively process complex data from the MI0802 thermal imaging camera module, quickly realize temperature information acquisition and processing. The MI0802 thermal imaging camera module has an 80x62 pixel infrared array, and a hybrid architecture that combines the synergistic advantages of microbolometer and thermopile pixel technology, can accurately and in real time capture the temperature distribution of the surface of the target object, provide high-resolution thermal imaging images, and have a wide range of applications, and can be applied to low-temperature and high-temperature environments. The SPI interface can realize high-speed and low-delay data transmission, and the ESP32-S3 chip communicates with the MI0802 thermal imaging camera module through the SPI interface, so that the thermal imaging data collected by the MI0802 thermal imaging camera module can be obtained in time and stably and further analyzed and processed.

[0071] At the data transmission and interaction level, the ESP32-S3 chip can establish a Wi-Fi AP hotspot or connect to an existing Wi-Fi network through the Wi-Fi function, and then output thermal imaging images and temperature measurement data to a remote terminal device 3 through the HTTP protocol. In addition, the ESP32-S3 chip can also interact with the application program on the terminal device 3 through Bluetooth, obtain setting information from the application program, modify its internal configuration, and then feed back the configuration result to the application program of the terminal device 3.

[0072] It can be understood that the field of view angle parameters of the MI0802 thermal imaging camera module can have different field of view angle parameters, such as horizontal field of view angles of 45°, 90°, etc., through different lens configurations, and users can flexibly select corresponding lens configurations according to requirements.

[0073] It can be understood that the specific circuit layout of the master module 10 and the acquisition module 20 is not limited in this embodiment. Figure 4 and Figure 5 A specific example is shown in Figure 4 is a circuit schematic diagram of the master module 10 using an ESP32-S3 chip as a master chip, Figure 5 is a circuit schematic diagram of the acquisition module 20 using an MI0802 thermal imaging camera module, wherein the MI0802 thermal imaging camera module is not shown and is connected through the flexible board FPC1 in the circuit schematic diagram.

[0074] Please further refer to Figure 6 The power supply module 30 includes: an interface circuit 301 for electrical connection with an external power supply 4; a charge-discharge circuit 302, which is provided with a battery interface 303 for electrical connection with a battery 5; a power input end of the charge-discharge circuit 302 is electrically connected with the interface circuit 301, for charging the battery 5 when the interface circuit 301 is connected with the external power supply 4; a power output end of the charge-discharge circuit 302 is electrically connected with the master module 10 and the acquisition module 20, for supplying power to the master module 10 and the acquisition module 20 and simultaneously charging the battery 5 when the interface circuit 301 is connected with the external power supply 4; or the battery 5 connected through the battery interface 303 supplies power to the master module 10 and the acquisition module 20 when the interface circuit 301 is not connected with the external power supply 4.

[0075] Optionally, the battery 5 can be configured as a detachable external device, or built-in in the temperature measurement module 1 and as a part of the power supply module 30, and electrically connected with the charge-discharge circuit 302 through the battery interface 303; the battery 5 and the interface circuit 301 can directly supply power to the acquisition module 20, or indirectly supply power to the acquisition module 20 through the master module 10.

[0076] It can be understood that the design of the power supply module 30 makes the power supply scheme of the temperature measurement module 1 more flexible, which can directly supply power through the interface circuit 301 or supply power through the battery 5, thereby prolonging the power supply time. When the battery 5 is used for power supply, the temperature measurement module 1 can work independently without relying on an additional external power supply, thereby increasing the use scenarios of the temperature measurement module 1.

[0077] Optionally, the interface circuit 301 is a USB interface circuit, which is further in communication connection with the master module 10. The USB interface circuit can be used for program debugging and serial communication functions while supplying power.

[0078] Preferably, the interface circuit 301 is a Type-C USB interface circuit, which is further in communication connection with the master module 10. When the master module 10 adopts an ESP32-S3 chip as the master chip, it can be programmed through the Type-C USB interface circuit.

[0079] It can be understood that in the present embodiment, the specific circuit layout of the interface circuit 301 is not limited. As a specific example, Figure 7 The circuit schematic diagram of the interface circuit 301 as a Type-C USB interface circuit is shown in FIG. 6.

[0080] It can be understood that in the present embodiment, the specific circuit layout of the charging and discharging circuit 302 is also not limited. As a specific example, please refer to Figure 8 The charging and discharging circuit 302 selects an ETA6098 chip as the core, and the BATS pin thereof is electrically connected to the battery 5 through the battery interface J1, which can ensure the safe and stable charging of the battery 5 and provide flexible power management for the entire temperature measurement module 1.

[0081] Further, please refer to Figure 6 The power supply module 30 further includes a voltage stabilizing circuit 304, the power input end of which is electrically connected to the battery 5 and the interface circuit 301, and the power output end of which is electrically connected to the master module 10 and the acquisition module 20.

[0082] It can be understood that the voltage stabilizing circuit 304 ensures that the output voltage is within a predetermined range, which can avoid damage to electronic components due to unstable voltage and prolong the service life of the temperature measurement module 1.

[0083] It can be understood that in the present embodiment, the specific circuit layout of the voltage stabilizing circuit 304 is not limited. As a specific example, please refer to Figure 9 The voltage stabilizing circuit 304 includes two voltage stabilizing chips, namely a linear voltage stabilizer LP5907 and a switching voltage stabilizer MP1605. The linear voltage stabilizer LP5907 has the advantage of low output noise, and the switching voltage stabilizer MP1605 has high output efficiency. The use of these two voltage stabilizing chips can meet the needs of noise sensitivity and high-efficiency power supply, and can adapt to different load requirements.

[0084] Illustratively, the main power supply of the temperature measurement module 1 is provided by the interface circuit 301 or the battery 5, and the voltage stabilizing circuit 304 provides stable 3.3V voltage for the MI0802 thermal imaging camera module and the ESP32-S3 chip, and the charging and discharging circuit 302 obtains the charging voltage from the interface circuit 301.

[0085] Please refer to Figure 6The temperature measurement module 1 is further provided with a key circuit 40 electrically connected with the main control module 10. The key circuit 40 controls the opening, closing and starting mode of the main control module 10 through the keys of the external device.

[0086] It can be understood that the specific circuit layout of the key circuit 40 is not limited in the embodiment. Please refer to Figure 10 As a specific example, the ESP32-S3 chip is electrically connected with the key circuit 40. The key circuit 40 includes a first key S1 and a second key S2. The first key S1 is connected with the enable pin (EN pin) of the ESP32-S3 chip through a pull-up resistor R4. When the first key S1 is not pressed, the enable pin is kept at a high level of 3.3V by the pull-up resistor. When the first key S1 is pressed, the enable pin is grounded through the first key S1. The second key S2 is connected with the GPIO0 pin of the ESP32-S3 chip through a pull-up circuit R3. When the second key S2 is not pressed, the GPIO0 pin is kept at a high level of 3.3V by the pull-up resistor. When the second key S2 is pressed, the GPIO0 pin is grounded through the second key S2. A capacitor C9 is further included. One end of the capacitor C9 is connected between the first key S1 and the pull-up resistor R4, and the other end is grounded. When the test module 1 starts to power on, the capacitor C9 is in a charging state, so the enable pin is equivalent to being grounded. When the capacitor C9 is fully charged, the enable pin is equivalent to being pulled up to 3.3V. This makes the subsequent circuit controlled by the enable of the ESP32-S3 chip of the test module 1 delay power on, ensuring the stability of the circuit. The time of the delayed power on can be set by modifying the capacitance value of the capacitor C9.

[0087] It can be understood that the GPIO (General-Purpose Input / Output) pin is the general input / output pin of the ESP32-S3 chip, and the GPIO0 pin of the ESP32-S3 chip can be used for starting mode configuration. The first key can control the enable or disable of the ESP32-S3 chip, which plays a role in power management. The second key can configure the starting mode (BOOT mode) of the ESP32-S3 chip to guide the loader, which can conveniently restore or reprogram the program, and is helpful to improve the efficiency of development and debugging.

[0088] Further, please continue to refer to Figure 6 The main control module 10 is further electrically connected with an RGB indicator light circuit 50. The RGB indicator light circuit 50 includes an RGB indicator light. The main control module 10 controls the RGB indicator light. Different display states of the RGB indicator light represent the current state information of the temperature measurement module 1, which is convenient for users to observe.

[0089] Understandably, when the master module 10 adopts the ESP32-S3 chip as the master chip, the ESP32-S3 chip is electrically connected with the RGB indicator light circuit 50, the ESP32-S3 chip can output debugging information through the USB interface circuit, and can control the RGB indicator light to display different colors.

[0090] Understandably, in the embodiment, the specific circuit layout of the RGB indicator light circuit 50 is not limited. Figure 11 As a specific example, the RGB indicator light circuit 50 includes a common anode RGB LED, the common anode terminal of which is connected with the 3.3V voltage output of the power supply module 30, and the cathode R, cathode G and cathode B terminals are electrically connected with three GPIO pins of the ESP32-S3 chip through current limiting resistors R13, R14 and R15 respectively. As an optional implementation, the model of the common anode RGB LED is MHPA1921RGBDT-S.

[0091] As a specific example, when the temperature measurement module 1 is normally working, the power supply module 30 outputs stable 3.3V voltage, the master module 10 (such as the ESP32-S3 chip) is successfully powered on, initializes the acquisition module 20 (such as the MI0802 thermal imaging camera module), and obtains the thermal imaging image and other information collected by the acquisition module 20. The wireless communication module 101 of the master module 10 establishes a Wi-Fi AP hotspot or accesses an existing Wi-Fi network. The RGB indicator light will flash green during the initialization process, indicating that the temperature measurement module 1 is normally running. After the terminal device 3 is connected to the device through the HTTP protocol, the thermal imaging image and temperature information output by the master module 10 (such as the ESP32-S3 chip) can be obtained. In addition, the terminal device 3 can also communicate with the temperature measurement module 1 through Bluetooth, and after pairing connection, the information of the master module 10 can be obtained and modified.

[0092] As another specific example, when the acquisition module 20 fails to initialize, the master module 10 program runs abnormally, and the Wi-Fi AP hotspot and Bluetooth functions cannot be normally started. At this time, the RGB indicator light will keep red state, indicating the abnormal state of the temperature measurement module 1. When the voltage of the battery 5 is too low and no external power is connected through the interface circuit 301 (such as the Type-C USB interface circuit), the temperature measurement module 1 will cut off the main power supply, and the RGB indicator light will be extinguished.

[0093] Please refer to Figure 12 The utility model provides a temperature measurement device 2, including device main body 60 and above -mentioned temperature measurement module 1, the master module 10 of temperature measurement module 1 leads to have extension pin 70, and device main body 60 is electrically connected with temperature measurement module 1 through extension pin 70.

[0094] Understandably, the main control module 10 of the temperature measurement module 1 reserves unoccupied hardware pin resources, and forms the expansion pin 70 for connecting the device body 60 by standardizing the design and centralized layout of the hardware pins; the device body 60 realizes signal interaction, data transmission and power supply adaptation with the temperature measurement module 1 by establishing physical and electrical connection with the expansion pin 70, and finally forms a functional temperature measurement device 2.

[0095] Specifically, when the expansion pin 70 is introduced, the idle pins of the main control module 10 can be integrated in the edge area of the temperature measurement module 1, and the pitch of the expansion pin 70 can be uniformly expanded by vertical pin arrangement to mark its function definition, facilitating user use.

[0096] Understandably, in the embodiment, the device body 60 refers to the core carrier for realizing functional extension of the temperature measurement device 2, which can cover all peripheral devices with electrical connection and signal interaction capability. For example, the device body 60 can be a sensor device, an actuator device, a display module, etc.

[0097] As a specific example, please refer to Figure 13 When the main control module 10 adopts the ESP32-S3 chip, the expansion pin 70 is the idle pin of the ESP32-S3 chip. The number of expansion pins 70 is 20, Figure 12 The pin definition and layout diagram of the expansion pin 70 are shown in the figure. Among them, the 2nd pin is defined as 3V3, which is a 3.3V power output pin; the 4th pin is defined as GND, which is a ground pin; the 7th pin is defined as SCL, and the 9th pin is defined as SDA, which are communication pins; the 1st pin is defined as TXD0, and the 3rd pin is defined as RXD0, which are UART interface pins; the remaining pins are general GPIO pins, which fully utilize the rich hardware resources of the ESP32-S3 chip.

[0098] Understandably, the temperature measurement device 2 has all the beneficial effects of the above-mentioned temperature measurement module 1, and can break through the limitation of single temperature measurement function, and can flexibly adapt to display, sensing, control and other peripheral devices according to scene requirements, reducing the cost of customized development.

[0099] The above only describes the preferred embodiments of the present application, and is not intended to limit the present application, and any modification, equivalent replacement and improvement made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature measuring module, characterized in that: include: The main control module has a built-in wireless communication module. The acquisition module includes a microbolometer and a thermopile sensor. The microbolometer is used to acquire temperature distribution information of the target object, and the thermopile sensor is used to acquire ambient temperature information. The microbolometer and the thermopile sensor are communicatively connected to the main control module. The power supply module is electrically connected to and supplies power to the main control module and the acquisition module, respectively.

2. The temperature measurement module of claim 1, wherein: The main control module uses an ESP32-S3 chip, and the acquisition module uses an MI0802 thermal imaging camera module. The MI0802 thermal imaging camera module communicates with the ESP32-S3 chip via an SPI interface.

3. The temperature measurement module of claim 1, wherein: The wireless communication module includes a Wi-Fi module and a Bluetooth module.

4. The temperature measurement module of claim 1, wherein: The acquisition module also includes an optical lens group, the horizontal field of view of which is 45°±5° or 90°±5°.

5. The temperature measurement module of claim 1, wherein: The power supply module includes: Interface circuitry for electrical connection to an external power source; A charging and discharging circuit, wherein the charging and discharging circuit is provided with a battery interface for electrically connecting to a battery; The power input terminal of the charging and discharging circuit is electrically connected to the interface circuit, and is used to charge the battery when the interface circuit is connected to an external power source. The power output terminal of the charging and discharging circuit is electrically connected to the main control module and the acquisition module so that when the interface circuit is connected to an external power source, it supplies power to the main control module and the acquisition module and charges the battery at the same time; or when the interface circuit is not connected to an external power source, the battery connected through the battery interface supplies power to the main control module and the acquisition module.

6. The temperature measurement module of claim 5, wherein: The power supply module also includes a voltage regulator circuit. The power input terminal of the voltage regulator circuit is connected to the battery and the interface circuit, and its power output terminal is electrically connected to the main control module and the acquisition module.

7. The temperature measurement module of claim 5, wherein: The interface circuit is a Type-C USB interface circuit, which is also communicatively connected to the main control module.

8. The temperature measurement module of claim 2, wherein: The ESP32-S3 chip is electrically connected to a button circuit, which includes a first button and a second button. The first button is connected to the enable pin of the ESP32-S3 chip, and the second button is connected to the GPIO0 pin of the ESP32-S3 chip.

9. The temperature measurement module of claim 1, wherein: The main control module is also electrically connected to an RGB indicator light circuit.

10. A temperature measuring device, characterized by: The device includes a main body and a temperature measuring module as described in any one of claims 1-9, wherein the main control module of the temperature measuring module has an extension pin, and the main body of the device is electrically connected to the temperature measuring module through the extension pin.

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