MEMS piezoresistive tactile sensor and intelligent device

Abstract

The utility model provides an MEMS piezoresistive tactile sensor and an intelligent device, and the sensor comprises a deformation mechanism which comprises a deformation main body and a force transmission support column, and the force transmission support column is connected to the center of the deformation main body; the sensitive response mechanism comprises a base body and cantilever beams, a hollow response area is arranged on the base body, and the multiple cantilever beams extend from the edge of the response area to the center and abut against the force transmission supporting column. According to the utility model, the force received by the deformation mechanism is transmitted to the sensitive response mechanism through the deformation mechanism, deformation signal transmission is carried out by the cantilever beam to achieve the purpose of tactile sensing, and the hollow structure of the response area can provide a larger deformation space for the cantilever beam, so that the cantilever beam has the effect of amplifying the stress of the deformation mechanism; therefore, the sensitivity of the sensor is improved. Compared with a conventional touch sensor at the present stage, the touch sensor has the advantages of being simple in structure, convenient to produce and machine, good in linearity, high in anti-interference capability, high in precision, high in sensitivity and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor technical field, specifically points to a MEMS piezoresistive tactile sensor and intelligent device. BACKGROUND

[0002] In today's era of rapid technological development, MEMS piezoresistive tactile sensors play a crucial role in numerous fields. They can convert externally applied pressure into measurable electrical signals, enabling the detection of tactile information. However, existing MEMS piezoresistive tactile sensors have significant technical bottlenecks in terms of sensitivity and applicability, which limit their potential for use in precision applications.

[0003] Currently, the low sensitivity of such sensors is one of the main factors limiting their development, directly affecting the sensor's ability to detect subtle pressure changes. In applications requiring high-precision tactile information, such as delicate surgical procedures and robotic tactile feedback systems, existing sensors often fail to meet the requirements. More importantly, existing MEMS piezoresistive tactile sensors do not perform well in precision applications. In these situations, sensors need to accurately and stably detect small pressure changes and have high resistance to environmental changes. However, existing sensors often perform poorly in these areas, limiting their application in precision engineering and high-end manufacturing. SUMMARY

[0004] Therefore, the utility model wants to overcome the technical problem of insufficient sensitivity and precision of piezoresistive sensors in the prior art, and provide a MEMS piezoresistive tactile sensor and intelligent device.

[0005] To solve the above technical problems, the utility model provides a MEMS piezoresistive tactile sensor, which comprises: a deformation mechanism, the deformation mechanism comprises a deformation body and at least one force transmission pillar, the force transmission pillar is connected to the outer surface of the deformation body and located at the center of the deformation body; a sensitive response mechanism, the sensitive response mechanism comprises a base and a plurality of cantilever beams, the base is provided with a hollow response area, the response area is provided corresponding to the force transmission pillar, a plurality of the cantilever beams are respectively connected to the base and all extend from the edge of the response area to the center, and the extension ends of any cantilever beam are in mutual abutment with the force transmission pillar.

[0006] In an embodiment of the utility model, the cantilever beam comprises an extension part and a contact part, the extension part and the contact part are perpendicular to each other in the plane of the base, wherein one end of the extension part is connected to the base, the other end extends towards the center of the response area, and the contact part is in mutual abutment with the force transmission pillar.

[0007] In an embodiment of the utility model, the deformation main body gradually contracts in the direction away from the sensitive response mechanism, and the center of the deformation main body is on the central axis of the force transmission column.

[0008] In an embodiment of the utility model, the deformation mechanism further comprises at least one positioning column, at least one positioning hole is arranged on the base body, and the positioning column is correspondingly inserted into the at least one positioning hole to connect the deformation mechanism and the sensitive response mechanism.

[0009] In an embodiment of the utility model, the sensitive response mechanism further comprises a central support column arranged between the extended ends of the plurality of cantilever beams to reduce the crosstalk between the interferences.

[0010] In an embodiment of the utility model, a plurality of solder pads are further arranged on the base body, and the plurality of solder pads are correspondingly arranged on one side of the plurality of cantilever beams.

[0011] In an embodiment of the utility model, the cantilever beam further comprises at least one diffusion resistor.

[0012] In an embodiment of the utility model, the deformation mechanism comprises a plurality of force transmission columns, the plurality of force transmission columns are uniformly connected to the deformation main body, and the plurality of force transmission columns are symmetrically arranged at the center of the surface of the deformation main body, and the plurality of force transmission columns are respectively abutted to the plurality of cantilever beams.

[0013] In an embodiment of the utility model, the deformation main body comprises a body and a functional layer, and the functional groove is connected to the outer surface of the body; the base body comprises a single crystal silicon wafer with an N-type <100> crystal direction.

[0014] The utility model further provides an intelligent device comprising at least one MEMS piezoresistive tactile sensor.

[0015] The above technical scheme of the utility model has the following advantages compared with the prior art:

[0016] The MEMS piezoresistive tactile sensor and the intelligent device have the advantages of simple structure, convenient production and processing, good linearity, strong anti-interference ability, high precision, high sensitivity and wide application and development prospects in the industry. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to make the content of the utility model more easily be clearly understood, the following according to the specific embodiment of the utility model and combining with the drawings, the utility model is further detailed.

[0018] Figure 1 It is the three-dimensional structure schematic diagram of the MEMS piezoresistive tactile sensor in the preferred embodiment of the utility model;

[0019] Figure 2 It is the three-dimensional structure schematic diagram of the deformation mechanism in the MEMS piezoresistive tactile sensor shown in Figure 1

[0020] Figure 3 It is the three-dimensional structure schematic diagram of the sensitive response mechanism in the MEMS piezoresistive tactile sensor shown in Figure 1

[0021] Figure 4 It is the three-dimensional structure schematic diagram of the sensitive response mechanism in the MEMS piezoresistive tactile sensor shown in Figure 3

[0022] Description of the Drawings Reference Signs: 100, deformation mechanism;110, deformation main body;120, positioning support;130, force transmission support;200, sensitive response mechanism;210, base;211, response area;212, positioning hole;213, pad;220, cantilever beam;221, extension;222, contact part;223, diffusion resistance;230, center support column. DETAILED DESCRIPTION

[0023] The utility model is further explained below combining with the drawings and specific embodiment, so that the person skilled in the art can better understand the utility model and can be implemented, but the embodiment is not as the limitation of the utility model. Example one

[0024] Referring to Figure 1 ​​​As shown, the MEMS piezoresistive tactile sensor provided by the embodiment comprises a deformation mechanism 100, the deformation mechanism 100 comprises a deformation body 110 and at least one force transmission pillar 130, the force transmission pillar 130 is connected to the outer surface of the deformation body 110 and located at the center of the deformation body 110; a sensitive response mechanism 200, the sensitive response mechanism 200 comprises a base body 210 and a plurality of cantilever beams 220, the base body 210 is provided with a hollow response area 211, the response area 211 is arranged corresponding to the force transmission pillar 130, and a plurality of cantilever beams 220 are respectively connected to the base body 210 and all extend from the edge of the response area 211 to the center, and the extension ends of any cantilever beam 220 are in abutment with the force transmission pillar 130.

[0025] The MEMS piezoresistive tactile sensor provided by the embodiment transmits the force received by the deformation mechanism 100 to the sensitive response mechanism 200 and transmits the deformation signal by the cantilever beam 220 to achieve the purpose of tactile sensing, wherein the hollow structure of the response area 211 can provide a larger deformation space for the cantilever beam 220, so that the cantilever beam 220 has the effect of amplifying the force of the deformation mechanism 100, thereby achieving the purpose of improving the sensitivity of the sensor. Compared with the conventional tactile sensor at the present stage, the application has the advantages of simple structure, convenient production and processing, good linearity, strong anti-interference ability, high precision and high sensitivity, and has a broad use and development prospect in the industry.

[0026] In the embodiment, the deformation mechanism 100 is used to bear the external contact pressure, which is preferably a PDMS (Polydimethylsiloxane) material. The PDMS material can remain stable within a wide temperature range, and at the same time, the deformation mechanism 100 can have good flexibility, so that it can be stretched and bent without breaking. Further, the deformation body 110 in the embodiment gradually shrinks away from the sensitive response mechanism 200, which is preferably a prism structure, so that the deformation mechanism 100 has higher structural stability and can bear larger pressure without plastic deformation. Such stability helps to maintain the long-term stability and reliability of the sensor. In addition, the prism structure can effectively transmit the applied pressure to the sensitive element of the sensor, reduce the loss of force in the transmission process, and improve the response speed, linearity and repeatability of the sensor. In different embodiments, the deformation body 110 can be designed in different shapes according to actual use requirements, and the utility model does not make specific limitations.

[0027] In the embodiment, the force transmission column 130 is preferably a flat disc structure connected to the lower surface of the deformation main body 110, with its center on the central axis of the force transmission column 130, to transmit the force of the deformation main body 110 to the sensitive response mechanism 200. Specifically, it can extrude the extended end of the cantilever beam 220 after being subjected to force, thereby causing the cantilever beam 220 to deform. Specifically, its arrangement at the center of the deformation main body 110 can achieve uniform distribution of the acting force, and its large surface area can also improve the contact effect between it and the sensitive response mechanism 200, thereby minimizing the transmission loss of force. In different embodiments, it can also be configured in other shapes according to actual use requirements, and the utility model does not make specific limitations.

[0028] Specifically, the deformation main body 110 in the embodiment includes a body and a functional layer, and the functional groove is connected to the outer surface of the body. In the embodiment, the functional layer is configured as a protective layer or an adhesive layer sprayed on the surface of the deformation main body 110 to improve the durability of the deformation main body 110 or increase the adhesion, such as an ultraviolet resistant coating, a stain resistant coating, etc.

[0029] Referring to Figure 2 As shown in the figure, in order to improve the connection stability between the deformation mechanism 100 and the sensitive response mechanism 200, and avoid the deviation of the two during the deformation mechanism 100 is subjected to force, the deformation mechanism 100 further comprises at least one positioning column 120, and the base 210 is provided with at least one positioning hole 212, and the positioning column 120 is correspondingly inserted into at least one of the positioning holes 212 to connect the deformation mechanism 100 and the sensitive response mechanism 200. Specifically, the deformation mechanism 100 in the embodiment further comprises four positioning columns 120, which are respectively arranged at the four corners of the side of the deformation main body 110 facing the sensitive mechanism, so as to form a stable insertion structure with the base 210. Further, the cross-sectional area of the positioning column 120 in the embodiment is much smaller than that of the force transmission column 130, thereby reducing the influence of the positioning column 120 on the force transmission process.

[0030] Referring to Figure 3 and Figure 4 As shown in the figure, the sensitive response mechanism 200 in the embodiment is used for signal receiving, conversion and transmission, and the base 210 is provided with a plurality of solder pads 213, and the plurality of solder pads 213 are correspondingly arranged on one side of the plurality of cantilever beams 220, so that it can complete the connection of the Wheatstone bridge through metal wires, and then be connected to the external detection circuit. Specifically, the base 210 is preferably a single crystal silicon wafer with a thickness of 300 μm and an N-type <100> crystal direction, and a star-shaped hollow response area 211 is arranged at the center thereof, and four cantilever beams 220 are correspondingly arranged at the four corners of the response area 211, thereby achieving optimal collection and transmission of force.

[0031] Further, the four cantilever beams 220 in the embodiment are uniformly and symmetrically arranged, and any of the cantilever beams 220 comprises an extension part 221 and a contact part 222, which are arranged perpendicular to each other in the plane where the base body 210 is located, wherein one end of the extension part 221 is connected to the base body 210, and the other end extends towards the center of the response area 211, and the contact parts 222 abut against each other at the force transmission column 130. Specifically, the cantilever beam 220 is preferably in a "T" shape structure, and in different embodiments, it can be arranged in other structures with the same effect, and it can also be arranged in other quantities according to actual use, and the utility model does not make specific limitations on this. Further, the cantilever beam 220 in the embodiment further comprises at least one diffusion resistance 223, and it should be noted that the diffusion resistance 223 on the cantilever beam is not sensitive to changes in external humidity, static electricity, etc. Based on the configuration of the diffusion resistance 223, the sensor in the embodiment has good anti-external interference performance, thereby avoiding the problem that the conventional piezoelectric touch sensor can only detect pressure changes and has poor response to static touch. In addition, in the embodiment, the sensitive response mechanism 200 further comprises a center support column 230, which is arranged between the extension ends of the plurality of cantilever beams 220 to reduce inter-channel crosstalk, thereby further improving the corresponding speed and accuracy of the MEMS piezoresistive touch sensor.

[0032] The preparation process of the MEMS piezoresistive touch sensor in the embodiment is as follows:

[0033] First, the deformation mechanism 100 is processed and prepared: based on the 3D printing processing technology, according to the sensitivity and range requirements of the required sensor, configure a PDMS solution with appropriate solidifying agent content, after mixing, the solution may produce bubbles, which can be removed by vacuum degassing treatment to avoid affecting the quality of the final product; Next, pour the mixed PDMS solution into the mold, put it into the oven and heat and cure at a temperature of 60-100℃, after curing, carry out post-processing such as deburring, trimming edges, polishing surfaces, etc. In different use scenarios, a protective layer or adhesive layer can also be prepared outside the deformation mechanism 100 according to actual use requirements, such as ultraviolet resistant coating, anti-fouling coating, etc., thus completing the processing and preparation of the deformation mechanism 100,

[0034] Next, the sensitive response mechanism 200 is processed and prepared: a piece of N-type <100> single crystal silicon wafer with a thickness of 300 μm is selected, and a piece of BF33 glass sheet with a thickness of 300 μm is selected. A dense SIO2 film is grown on the surface of the silicon wafer as a shielding oxide layer through a dry oxygen process. Then, P-type light doping and P-type heavy doping are completed on the front surface through photolithography and ion implantation process, and the atoms are activated through high-temperature furnace tube annealing. The piezoresistor is made, and after being taken out, the shielding oxide layer is removed using BOE solution (Buffered Oxide Etch). Then, the active area of the sensing cantilever beam 220 is made on the back surface through photolithography and deep reactive ion etching process. Then, the following steps are performed in sequence: anodic bonding is performed on the back surface of the silicon wafer and the bare glass sheet (carrier sheet), a passivation layer is deposited on the front surface through PECVD, the front positioning hole 212 is made through photolithography and reactive ion etching process, the connection between the front metal wire and the ion implantation area is completed through magnetron sputtering, photolithography and metal dry etching process, ohmic contact between the metal wire and the silicon in the ion implantation area is completed through alloying process in a nitrogen environment, the passivation layer is made to protect the surface elements of the chip, the lead pad 213 is exposed through photolithography and reactive ion etching process, and the front surface is etched to the bonding surface through photolithography and deep reactive ion etching process to release the cantilever beam 220 processing. Thus, the manufacturing of the sensitive response mechanism 200 is completed.

[0035] Finally, the deformation mechanism 100 and the sensitive response mechanism 200 are connected through the positioning pillar 120 and the positioning hole 212. Embodiment Two

[0036] This embodiment provides another MEMS piezoresistive tactile sensor, which has the same main structure and working principle as embodiment one, and will not be described in detail here. In this embodiment, only the number and shape of the force transmission pillars 130 in the deformation mechanism 100 are adjusted to have better docking transmission accuracy. Specifically, the deformation mechanism 100 includes a plurality of force transmission pillars 130, the plurality of force transmission pillars 130 are uniformly connected to the deformation body 110, and are symmetrically arranged at the center of the surface of the deformation body 110. The plurality of force transmission pillars 130 respectively abut against the plurality of cantilever beams 220. Embodiment Three

[0037] This embodiment provides a smart device, which includes at least one MEMS piezoresistive tactile sensor described in embodiment one.

[0038] The MEMS piezoresistive tactile sensor and the intelligent device have the advantages that the force received by the deformation mechanism 100 is transmitted to the sensitive response mechanism 200, and the deformation signal transmission is performed by the cantilever beam 220, so that the purpose of tactile sensing is achieved, the hollow structure of the response area 211 can provide a larger deformation space for the cantilever beam 220, the cantilever beam 220 has the effect of amplifying the force of the deformation mechanism 100, and the purpose of improving the sensitivity of the sensor is achieved. Compared with the conventional tactile sensor at the present stage, the application has the advantages of simple structure, convenient production and processing, good linearity, strong anti-interference ability, high precision and high sensitivity, and has a wide use and development prospect in the industry.

[0039] Obviously, the above embodiments are only examples for clearly illustrating, and are not limitation to the embodiments. For ordinary skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, all the embodiments are not required to be exhausted, and the obvious changes or variations derived therefrom are still within the protection scope of the utility model.

Claims

1. A MEMS piezoresistive tactile sensor characterized by: The MEMS pressure-resistance touch sensor comprises a deformation mechanism and a sensitive response mechanism. The deformation mechanism comprises a deformation body and at least one force transmission pillar, the force transmission pillar is connected to the outer surface of the deformation body and is located in the center of the deformation body. The sensitive response mechanism comprises a base body and a plurality of cantilever beams, the base body is provided with a hollow response area corresponding to the force transmission pillar, and the plurality of cantilever beams are respectively connected to the base body and extend from the edge of the response area to the center.

2. The MEMS piezoresistive tactile sensor of claim 1, wherein: The cantilever beam comprises an extension part and a contact part, the extension part and the contact part are arranged perpendicular to each other in the plane of the base body, wherein one end of the extension part is connected to the base body and the other end extends towards the center of the response area, and the contact part abuts against the force transmission pillar.

3. The MEMS piezoresistive tactile sensor of claim 1, wherein: The deformation body gradually shrinks in the direction away from the sensitive response mechanism, and the center of the deformation body is on the central axis of the force transmission pillar.

4. The MEMS piezoresistive tactile sensor of claim 1, wherein: The deformation mechanism further comprises at least one positioning pillar, the base body is provided with at least one positioning hole, and the positioning pillar is inserted into the at least one positioning hole to connect the deformation mechanism and the sensitive response mechanism.

5. The MEMS piezoresistive tactile sensor of claim 1, wherein: The sensitive response mechanism further comprises a central support pillar arranged between the extension ends of the plurality of cantilever beams to reduce the crosstalk between the interlayers.

6. The MEMS piezoresistive tactile sensor of claim 1, wherein: The base body is further provided with a plurality of pads, and the plurality of pads are arranged on one side of the plurality of cantilever beams.

7. The MEMS piezoresistive tactile sensor of claim 1, wherein: The cantilever beam further comprises at least one diffusion resistance.

8. The MEMS piezoresistive tactile sensor of claim 1, wherein: The deformation mechanism comprises a plurality of force transmission pillars, the plurality of force transmission pillars are uniformly connected to the deformation body and are symmetrically arranged at the surface center of the deformation body, and the plurality of force transmission pillars abut against the plurality of cantilever beams.

9. The MEMS piezoresistive tactile sensor of claim 1, wherein: The deformation body comprises a body and a functional layer, the functional groove is connected to the outer surface of the body; and the base body comprises an N-type <100> single crystal silicon wafer.

10. A smart device, characterized by: The MEMS pressure-resistance touch sensor comprises at least one of the MEMS pressure-resistance touch sensors according to any one of claims 1-9.

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