Semiconductor pin trimming and forming equipment

Abstract

The utility model relates to the technical field of semiconductor production, in particular to semiconductor pin rib cutting and forming equipment, which comprises a conveying device and a rib cutting device, the rib cutting device comprises a hob wheel and a cutter wheel support seat, the hob wheel is hinged on the cutter wheel support seat, and when a conveying belt moves along a conveying direction a, the hob wheel rotates and processes a semiconductor on the conveying belt. According to the utility model, the rib cutting device with the hob wheel is arranged on the conveying device for conveying the semiconductors, and the rib cutting tool is driven by the rotation of the hob wheel to perform rib cutting processing on the semiconductors passing through the lower part of the hob wheel; the conveying speed of the conveying belt does not need to be limited by interval conveying of stepping type blanking and cutting or follow-up speed of flowing type follow-up cutting any more, the operation speed of the conveying belt for conveying semiconductors is greatly increased, the production cycle of the semiconductors is shortened, the production efficiency is improved, a blanking device or a mechanical arm is not needed, the equipment manufacturing cost is reduced, and the production efficiency is improved. The production and processing cost is reduced, and the production benefits of users are improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically a semiconductor lead cutting and forming equipment. Background Technology

[0002] In semiconductor manufacturing, after the semiconductor packaging process is completed, the metal leads or wires connecting the semiconductors generally need to be cut to separate individual semiconductor structures and ensure that the leads meet standard lengths. Improving cutting accuracy and efficiency is a key challenge for process improvement. Most existing lead-cutting equipment uses step-by-step punching or flow-following cutting. Step-by-step punching can cut a relatively large number of semiconductors in a single pass, but requires the production line to stop and wait until the punching step is completed. Flow-following cutting can cut a fixed quantity at a fixed point without stopping the production line, but the amount cut at a time is small, and the production line speed cannot be too fast. Faced with ever-increasing processing demands and limited production space, the above-mentioned lead-cutting methods still cannot fully meet production needs in terms of processing efficiency, and there is still room for improvement.

[0003] To address the above shortcomings, we need to develop a semiconductor lead cutting and forming equipment to meet the needs of a wide range of users. Utility Model Content

[0004] To address the aforementioned problem that existing semiconductor lead cutting processes cannot meet production needs in terms of processing efficiency, the technical solution adopted by this utility model is as follows:

[0005] A semiconductor lead cutting and forming apparatus includes a conveying device for conveying semiconductors and a lead cutting device for lead cutting processing. The lead cutting device includes a roller with a lead cutting cutter mounted on it and a cutter wheel support mounted on the conveying device. The roller is hinged to the cutter wheel support. When the conveyor belt carrying the semiconductors moves along the conveying direction a, the roller rotates, causing the lead cutting cutter to rotate about the rotation axis b of the roller and process the semiconductors on the conveyor belt.

[0006] As described above, in a semiconductor lead cutting and forming device, the roller is equipped with an elastic deformation member that facilitates stable processing. The elastic deformation member can contact and elastically press the semiconductor on the conveyor belt to limit the position of the semiconductor during processing.

[0007] In the semiconductor lead cutting and forming equipment described above, the elastic deformable member and the lead cutting tool are respectively arranged circumferentially around the rotation axis b of the roller wheel on the rolling surface of the roller wheel, and the lead cutting tool is respectively provided on both sides of the roller wheel near the elastic deformable member.

[0008] As described above, in a semiconductor lead cutting and forming device, the cutter wheel support includes a first support and a second support respectively mounted on both sides of the conveying device, and the roller wheel includes a hinged axle, which is mounted on the first support and the second support respectively via bearing components.

[0009] In the semiconductor lead cutting and forming equipment described above, the axle is equipped with a limiting bushing for limiting the axial position of the hobbing wheel, and the limiting bushing is located between the hobbing wheel and the cutter wheel support.

[0010] As described above, in a semiconductor lead cutting and forming device, the conveyor belt is provided with a rack structure, the rack structure is in the same direction as the conveying direction a, and the hobbing wheel is provided with a gear structure for meshing with the rack structure. The gear structure adopts an external tooth shape and is circumferentially arranged around the rotation axis b of the hobbing wheel. When the conveyor belt moves along the conveying direction a, it drives the hobbing wheel to rotate, so that the lead cutting tool can process the semiconductor on the conveyor belt.

[0011] As described above, in a semiconductor lead cutting and forming apparatus, the rack structure includes a first rack and a second rack. The first rack is positioned near one edge of the conveyor belt, and the second rack is positioned near the other edge of the conveyor belt. The gear structure includes a first gear for meshing with the first rack and a second gear for meshing with the second rack. The semiconductor is located in the space between the first rack and the second rack. In another semiconductor lead cutting and forming apparatus, the conveyor belt is provided with a tray for limiting the placement position of the semiconductor. The tray has a limiting cavity for inserting the semiconductor and a clearance groove for avoiding the lead cutting tool on the side near the cutting roller. The lead cutting tool is parallel to the conveying direction a.

[0012] As described above, a semiconductor lead cutting and forming device includes a conveying base for smooth sliding of the conveyor belt. The conveying base has a conveying groove on the side near the roller for restricting the directional movement of the conveyor belt. A conveying roller for supporting the conveyor belt is installed below the position corresponding to the semiconductor path in the conveying groove. The conveying groove has a receiving groove for accommodating the conveying roller. A plurality of the conveying rollers are arranged at intervals along the conveying direction a.

[0013] As described above, a semiconductor lead cutting and forming device includes a conveying base comprising a conveying pad installed in the receiving groove. The conveying pad is located below the roller. When the conveyor belt moves, it drives the semiconductor through the space between the conveying pad and the roller. The conveying pad has a protective surface for limiting the height of the conveyor belt. After the conveying pad is installed, the protective surface is flush with the conveying plane of the conveying groove for supporting the conveyor belt.

[0014] The beneficial effects of this utility model are as follows:

[0015] 1. This utility model installs a cutting device with a roller cutter on the semiconductor conveying device. The rotation of the roller cutter drives the cutting cutter to cut the semiconductor passing under the roller cutter. The conveying speed of the conveyor belt is no longer limited by the interval conveying of step-type punching and cutting or the following speed of flow-type follow-cutting, which greatly improves the operating speed of the conveyor belt to transport semiconductors, shortens the semiconductor production cycle, and speeds up production efficiency. There is no need to use a punching device or a robot, which reduces equipment manufacturing costs and production and processing costs. The equipment has a simple structure, is easy to maintain, and improves the user's production efficiency.

[0016] 2. This utility model has an elastic deformation member installed on the roller cutter wheel. The elastic deformation member presses the semiconductor on the conveyor belt before the cutting tool cuts, which helps to limit the deviation of the semiconductor during processing. In addition, a material tray for limiting the placement position of the semiconductor can be installed on the conveyor belt. The limiting cavity of the material tray can also limit the deviation of the semiconductor during processing, enhance the stability of the semiconductor during processing, improve the cutting accuracy, and improve the production quality.

[0017] 3. This utility model features a gear structure on the roller cutter wheel and a rack structure on the conveyor belt. When the gear and rack mesh, they can drive the roller cutter wheel to rotate synchronously through tooth meshing as the conveyor belt moves. This eliminates the need for an external drive device to drive the roller cutter wheel and achieves rotary cutting. Furthermore, the cutting positioning accuracy is higher. The spacing of the cutting blades on the roller cutter wheel can correspond to the spacing of the semiconductors on the conveyor belt, preventing misaligned cutting that could lead to production defects. This improves the accuracy of the cutting blades during cutting and enhances production quality.

[0018] 4. This utility model has a conveyor roller and a conveyor pad installed on the conveyor base, which provides more stable support for the conveyor belt during the process of conveying semiconductors, improves the smoothness and stability of the conveying. The conveyor pad is located below the roller, which can limit the position of the semiconductor falling under the force during processing, making the cutting smoother, preventing the semiconductor from falling and causing the cutter to fall, and improving the stability and accuracy of the cutting. Attached Figure Description

[0019] Figure 1 This is a perspective view of a semiconductor lead cutting and forming device according to the present invention.

[0020] Figure 2 This is an exploded perspective view of a semiconductor lead cutting and forming device according to the present invention.

[0021] Figure 3 This is a top view of a semiconductor lead cutting and forming device according to the present invention.

[0022] Figure 4 This is a side view of a semiconductor lead cutting and forming device according to the present invention.

[0023] Figure 5 for Figure 3 AA section view.

[0024] Figure 6 for Figure 5 A magnified view of B.

[0025] Figure 7 This is an enlarged view of the material tray of this utility model. Detailed Implementation

[0026] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0027] Example 1:

[0028] like Figures 1 to 5 The semiconductor lead cutting and forming equipment shown includes a conveying device 1 for conveying semiconductors and a lead cutting device 2 for lead cutting processing. The lead cutting device 2 includes a roller wheel 21 on which a lead cutting cutter 211 is mounted and a cutter wheel support 24 mounted on the conveying device 1. The lead cutting cutter 211 is a cutting blade or cutting edge for rotary cutting of the semiconductor lead lead portion. The lead cutting cutter 211 is detachably mounted on the rolling surface 213 on the outer side of the roller wheel 21. The lead cutting cutter 211 is parallel to the conveying direction to facilitate accurate repeatable cutting. The cutter wheel support 24 is a hinged support for the lead cutting device 2 to support the roller wheel 21. The axle 22 of the roller wheel 21 is hinged to the cutter wheel support 24, so that the roller wheel 21 can rotate circumferentially about the rotation axis b of the axle 22 relative to the cutter wheel support 24.

[0029] More specifically, the conveying device 1 includes a conveyor belt 11 for carrying semiconductors. The conveyor belt 11 can directionally convey and transport semiconductors (semi-finished products to be processed) along the conveying direction a. The conveyor belt 11 is driven by an external drive device to move. The semiconductors (which can be transported by an external conveying device or a robot) are placed on the conveyor belt 11 and moved directionally along the conveying direction a by the conveyor belt 11. In use, when the conveyor belt 11 moves along the conveying direction a, the roller wheel 21 rotates, causing the cutting tool 211 to rotate around the rotation axis b of the roller wheel 21. The tip or blade of the cutting tool 211 is affected by the rotation and cuts into the lead position of the semiconductor, so as to realize that the rotation of the roller wheel 21 drives the cutting tool 211 to process the semiconductor on the conveyor belt 11. During the movement, the lead portion of the semiconductor is cut from the side closer to the conveying direction a to the side away from the conveying direction a, until the excess lead portion is completely removed. The finished semi-finished product continues to be conveyed and moved along the conveying direction a to enter the next process.

[0030] As another embodiment 101 of embodiment 1, the wheel axle 22 can be hinged to the cutter wheel support seat 24 via the bearing component 243 or the self-lubricating bushing, which improves the flexibility of rotation, reduces the wear of the wheel axle 22 affected by rotation, and improves the coaxiality accuracy of rotation.

[0031] As another embodiment 102 of embodiment 1, such as Figures 1 to 3 as well as Figure 6 The semiconductor lead cutting and forming equipment shown here, in order to better position the semiconductor during processing and avoid positional displacement or deviation caused by force during processing, resulting in cutting deviation, has an elastic deformation member 212 installed on the roller 21 for stable processing. The elastic deformation member 212 can be made of plastic, rubber or soft composite material. The elastic deformation member 212 is mounted on the roller 21 and can rotate with the roller 21. When the semiconductor moves to a position close to the roller 21, the elastic deformation member 212 contacts and elastically presses the semiconductor on the conveyor belt 11. The elastic pressing force restricts the position of the semiconductor on the conveyor belt 11. The lead cutting tool 211 then presses or cuts the semiconductor, achieving the positioning and limiting effect of the semiconductor during processing, improving the cutting accuracy and improving production quality.

[0032] As another embodiment 103 of embodiment 102, such as Figures 1 to 4The semiconductor lead cutting and forming equipment shown has an elastic deformable element 212 and a lead cutting cutter 211 arranged circumferentially around the rotation axis b of the roller 21 on the rolling surface 213 of the roller 21. The arrangement positions of the elastic deformable element 212 and the lead cutting cutter 211 correspond to the arrangement positions of the semiconductors on the conveyor belt 11. That is, when a semiconductor moves directly below the roller 21, the semiconductor is also located at the pressing center of the elastic deformable element 212 and the cutting edge center of the lead cutting cutter 211. The distance between adjacent semiconductors along the conveying direction on the conveyor belt 11 is converted into the circumferential arc length position of the elastic deformable element 212 and the lead cutting cutter 211 on the rolling surface 213. When adjacent semiconductors along the conveying direction are conveyed, the elastic deformable element 212 and the lead cutting cutter 211 on the rolling surface 213 can correspondingly press and cut the semiconductor lead below, achieving the effect of cutting one semiconductor with one cut.

[0033] As another embodiment 104 of embodiment 102, such as Figures 1 to 3 as well as Figure 5 The semiconductor lead cutting and forming equipment shown has a roller 21 with cutting tools 211 on both sides near the elastic deformation member 212. The cutting tools 211 on both sides can cut the leads on both sides of the corresponding position of the semiconductor at the same time, improving the convenience of cutting.

[0034] As another embodiment 105 of embodiment 1, such as Figure 5 The semiconductor lead cutting and forming equipment shown includes a cutter wheel support 24 comprising a first support 241 and a second support 242 respectively installed on both sides of the conveying device 1. The axle 22 of the cutter wheel 21 is respectively installed on the first support 241 and the second support 242 via bearings 243. The first support 241 and the second support 242 provide support from both sides of the axial direction of the cutter wheel 21, balancing the downward force and rotational stability of the cutter wheel 21.

[0035] As another embodiment 106 of embodiment 1, such as Figure 5 The semiconductor lead cutting and forming equipment shown includes a wheel axle 22 with a limiting bushing 221 for limiting the axial position of the hobbing wheel 21 and a key for limiting the rotational position of the hobbing wheel 21. The limiting bushing 221 can be installed on the outer surface of the wheel axle 22 using one of the following limiting connection methods: threaded connection, elastic friction connection, or snap-fit ​​connection. The limiting bushing 221 is located between the hobbing wheel 21 and the cutter wheel support 24. In use, the axial positioning of the hobbing wheel 21 on the wheel axle 22 is first adjusted, and then the limiting bushing 221 is used to limit the axial position of the hobbing wheel 21 on the wheel axle 22, thus limiting the position of the hobbing wheel 21 from both sides to prevent the hobbing wheel 21 from slipping and displacing during rotation.

[0036] Example 2:

[0037] Based on Example 1, such as Figures 1 to 4 The semiconductor lead cutting and forming equipment shown includes a conveyor belt 11 with a rack structure 12. The rack structure 12 is in the same direction as the conveying direction a, and the teeth of the rack structure 12 face the side of the roller cutter wheel 21. The rack structure 12 can be made of plastic, rubber, or a soft composite material to accommodate the flexible conveying and rotation of the conveyor belt 11. The roller cutter wheel 21 is equipped with a gear structure 23 for meshing with the rack structure 12. The rack structure 12 can mesh with the gear structure 23, and the teeth of the gear structure 23 face outwards. The teeth of the gear structure 23 are circumferentially arranged around the rotation axis b of the roller cutter wheel 21 near the outer side. Positioned or circumferentially arranged on the rolling surface 213, when the conveyor belt 11 moves along the conveying direction a, the rack structure 12 drives the gear structure 23 to rotate, causing the gear structure 23 to drive the hobbing wheel 21 to rotate. The cutting tool 211 can process the semiconductor on the conveyor belt 11 under the force of the rotation of the hobbing wheel 21. By using the rack structure 12 and the gear structure 23, the conveyor belt 11 can drive the hobbing wheel 21 to rotate, without relying on an external drive device to drive the rotation of the hobbing wheel 21. This improves the synchronization and stability of the cutting process during processing, reduces the equipment assembly and procurement costs, simplifies the structure for easy installation, and improves the installation and maintenance efficiency of the equipment.

[0038] As another embodiment 201 of embodiment 2, such as Figures 1 to 4 The semiconductor lead cutting and forming equipment shown includes a rack structure 12 comprising a first rack 121 and a second rack 122. The first rack 121 is positioned near one edge of the conveyor belt 11, and the second rack 122 is positioned near the other edge of the conveyor belt 11. The gear structure 23 includes a first gear 231 for meshing with the first rack 121 and a second gear 232 for meshing with the second rack 122. During conveying, the semiconductor is located in the space between the first rack 121 and the second rack 122. The lead cutting tool 211 and the elastic deformation member 212 are also located between the first gear 231 and the second gear 232, so that the roller wheel 21 can be subjected to force from both sides when rotating, thus balancing the rotational force and improving the rotational stability of the roller wheel 21. This avoids the durability problems of misalignment or severe wear on one side after long-term use due to unilateral force.

[0039] Example:

[0040] Based on Example 1, to better limit the position of the semiconductor on the conveyor belt 11 during transport, and to better limit the position of the semiconductor on the conveyor belt 11 during processing, such as... Figures 1 to 7The semiconductor lead cutting and forming equipment shown has a material tray 13 on the conveyor belt 11 for limiting the placement of semiconductors. The material tray 13 has a limiting cavity 131 for placing semiconductors and a clearance groove 132 for avoiding the lead cutting tool 211 on the side near the roller 21. The limiting cavity 131 can be one, two or more. The user can adjust the setting according to the processing volume required for a single semiconductor processing to adapt to different semiconductor quantity usage scenarios, improve the accuracy of the lead cutting process, and improve the lead cutting efficiency.

[0041] Example 3:

[0042] Based on Example 1, such as Figures 1 to 6 The semiconductor lead cutting and forming equipment shown includes a conveying device 1 comprising a conveying base 14 for smooth sliding of a conveyor belt 11. The conveying base 14 is a base for the conveying mechanism that supports the conveyor belt 11. A cutter wheel bracket 24 is installed on the outer side of the conveying base 14. A conveying groove 141 for restricting the directional movement of the conveyor belt 11 is provided on the side of the conveying base 14 near the cutter wheel 21. The conveyor belt 11 moves and is transported in the conveying groove 141 in the conveying direction a. The conveying groove 141 has a conveying plane 1411 for contacting the conveyor belt 11. The conveying plane 1411 is a smooth and flat surface parallel to the surface of the conveyor belt 11. A conveying roller 143 for supporting the conveyor belt 11 is installed below the position corresponding to the semiconductor path in the conveying groove 141. The conveying groove 141 has a receiving groove 142 for accommodating the conveying roller 143. Several conveying rollers 143 are arranged at intervals along the conveying direction a, which can simultaneously support the conveyor belt 11 at the position of the conveying base 14, reduce sliding friction, and improve the smoothness and stability of sliding.

[0043] As another embodiment 301 of embodiment 3, such as Figure 2 and Figure 5 The semiconductor lead cutting and forming equipment shown includes a conveyor base 14 comprising a conveyor pad 15 installed in a receiving groove 142. The conveyor pad 15 is located below the roller 21. When the conveyor belt 11 moves, it carries the semiconductor through the space between the conveyor pad 15 and the roller 21. The conveyor pad 15 has a protective surface 151 for limiting the elastic drop height of the conveyor belt 11. The protective surface 151 is located on the side of the conveyor pad 15 facing the roller 21. The conveyor groove 141 has a conveying plane 1411 for supporting the conveyor belt 11. After the conveyor pad 15 is installed in the receiving groove 142, the protective surface 151 is flush with the conveying plane 1411, so that when the semiconductor is processed under force, the conveyor belt 11 can avoid elastic drop that would lead to incomplete cutting, avoid the production of defective products, improve production quality, and improve processing stability.

[0044] like Figures 1 to 7 As shown, the specific embodiments of this utility model are as follows:

[0045] Before processing, the semiconductor (semi-finished product to be processed) is placed on the tray 13 on the conveyor belt 11 by an external conveying device or a robot. The bottom of the semiconductor is inserted into the limiting cavity 131 of the tray 13. The external driving device drives the conveyor belt 11 to move smoothly in the conveying direction a (i.e. towards the direction close to the roller 21). Several conveying rollers 143 located below the conveyor belt 11 support the conveyor belt 11, making the movement of the conveyor belt 11 more stable.

[0046] When the conveyor belt 11 moves, the rack structure 12 on the conveyor belt 11 drives the gear structure 23 on the roller cutter wheel 21 through meshing, so that the roller cutter wheel 21 can rotate synchronously with the conveyor belt 11.

[0047] During processing, when the semiconductor moves to a position close to the roller 21, the elastic deformation member 212 contacts and elastically presses the semiconductor on the conveyor belt 11. The position of the semiconductor on the conveyor belt 11 is restricted by the elastic pressing force. The cutting tool 211 then presses or cuts the lead portion of the semiconductor. The cutting tool 211 extends into the clearance groove 132 of the tray 13 and cuts off the lead portion of the semiconductor. The conveyor pad 15 located below the conveyor belt 11 abuts against the bottom of the conveyor belt 11, so that the cutting tool 211 can smoothly cut off the lead portion of the semiconductor and smoothly extend into the clearance groove 132, completing the cutting process.

[0048] After processing, the conveyor belt 11 continues to drive the semiconductor to move in the conveying direction a (i.e., in the direction away from the roller 21), ready to enter the next process.

[0049] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A semiconductor lead cutting and forming equipment, characterized in that: The device includes a conveying device (1) for conveying semiconductors and a cutting device (2) for cutting semiconductors. The cutting device (2) includes a roller (21) on which a cutting tool (211) is mounted and a tool wheel support (24) mounted on the conveying device (1). The roller (21) is hinged to the tool wheel support (24). When the conveying device (1) moves along the conveying direction a of the conveyor belt (11) for carrying semiconductors, the roller (21) rotates so that the cutting tool (211) rotates about the rotation axis b of the roller (21) and processes the semiconductors on the conveyor belt (11).

2. The semiconductor lead cutting and forming equipment according to claim 1, characterized in that: The roller (21) is equipped with an elastic deformation member (212) for stable processing. The elastic deformation member (212) can contact and elastically press the semiconductor on the conveyor belt (11) to limit the position of the semiconductor during processing.

3. The semiconductor lead cutting and forming equipment according to claim 2, characterized in that: The elastic deformable member (212) and the tendon cutting tool (211) are respectively arranged circumferentially around the rotation axis b of the hobbing wheel (21) on the rolling surface (213) of the hobbing wheel (21). The hobbing wheel (21) is provided with the tendon cutting tool (211) at positions close to both sides of the elastic deformable member (212).

4. The semiconductor lead cutting and forming equipment according to claim 1, characterized in that: The cutter wheel support base (24) includes a first support base (241) and a second support base (242) respectively installed on both sides of the conveying device (1). The hobbing wheel (21) includes a wheel axle (22) for hinge. The wheel axle (22) is installed on the first support base (241) and the second support base (242) respectively through a bearing (243).

5. The semiconductor lead cutting and forming equipment according to claim 4, characterized in that: The axle (22) is equipped with a limiting bushing (221) for limiting the axial position of the hobbing wheel (21), and the limiting bushing (221) is located between the hobbing wheel (21) and the cutter wheel support seat (24).

6. The semiconductor lead cutting and forming equipment according to claim 1, characterized in that: The conveyor belt (11) is provided with a rack structure (12), which is in the same direction as the conveying direction a. The hobbing wheel (21) is provided with a gear structure (23) for meshing with the rack structure (12). The gear structure (23) adopts an external tooth shape and is circumferentially arranged around the rotation axis b of the hobbing wheel (21). When the conveyor belt (11) moves along the conveying direction a, it drives the hobbing wheel (21) to rotate so that the cutting tool (211) can process the semiconductor on the conveyor belt (11).

7. A semiconductor lead cutting and forming device according to claim 6, characterized in that: The rack structure (12) includes a first rack (121) and a second rack (122). The first rack (121) is located near one edge of the conveyor belt (11), and the first rack (121) is located near the other edge of the conveyor belt (11). The gear structure (23) includes a first gear (231) for meshing with the first rack (121) and a second gear (232) for meshing with the second rack (122). The semiconductor is located in the space between the first rack (121) and the second rack (122).

8. A semiconductor lead cutting and forming apparatus according to any one of claims 1-7, characterized in that: The conveyor belt (11) is provided with a tray (13) for limiting the placement position of semiconductors. The tray (13) has a limiting cavity (131) for placing semiconductors and a clearance groove (132) for avoiding the cutting tool (211) on the side near the roller (21). The cutting tool (211) is parallel to the conveying direction a.

9. A semiconductor lead cutting and forming device according to claim 8, characterized in that: The conveying device (1) includes a conveying base (14) for the smooth sliding of the conveyor belt (11). The conveying base (14) has a conveying groove (141) on the side near the roller (21) for restricting the directional movement of the conveyor belt (11). The conveying groove (141) has a conveying roller (143) for supporting the conveyor belt (11) installed below the position corresponding to the semiconductor path. The conveying groove (141) has a receiving groove (142) for accommodating the conveying roller (143). A plurality of the conveying rollers (143) are arranged at intervals along the conveying direction a.

10. A semiconductor lead cutting and forming device according to claim 9, characterized in that: The conveying base (14) includes a conveying pad (15) installed in the receiving groove (142). The conveying pad (15) is located below the roller (21). When the conveyor belt (11) moves, it drives the semiconductor through the space between the conveying pad (15) and the roller (21). The conveying pad (15) has a pad surface (151) for limiting the height of the conveyor belt (11). After the conveying pad (15) is installed, the pad surface (151) is flush with the conveying plane (1411) of the conveying groove (141) for supporting the conveyor belt (11).

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