Laser-induced modification equipment for preparing wafer-level glass through hole

Abstract

The utility model discloses laser-induced modification equipment for preparing a wafer-level glass through hole, which belongs to the technical field of glass through hole laser processing in the TGV industry and comprises a host, a wafer loading device, a manipulator and a wafer edge finder, automatic feeding and discharging among all the mechanisms are achieved through the mechanical arm, manpower is saved, the working efficiency of equipment is improved, and damage to glass sheets is reduced; before the glass enters the main machine to be subjected to laser processing, the glass is positioned through the wafer edge finder, and then the X / Y / Z-direction moving unit and the rotating unit are arranged in the main machine, so that high-precision processing is realized in cooperation with laser pulse light emission, the stability is high, and the processing precision of the equipment is improved.

Description

Technical Field

[0001] This utility model belongs to the field of glass through-hole laser processing technology in the TGV industry, specifically relating to a laser-induced modification device for wafer-level glass through-hole preparation. Background Technology

[0002] TGV technology achieves electrical connection by creating vertically penetrating micro-vias on a glass substrate and filling the vias with conductive material. It has advantages such as excellent high-frequency electrical characteristics, low cost of large-size ultra-thin glass substrates, simple process flow, and strong mechanical stability, and is widely used in semiconductor chip display and packaging fields.

[0003] Currently, various glass hole-forming technologies have been developed for processing through-holes in glass, including sandblasting, photosensitive glass, plasma etching, focused discharge, and laser ablation. However, due to the fragility and chemical inertness of glass, current methods suffer from problems such as damaging the glass and causing an uneven surface, low processing efficiency, and inability to achieve large-scale mass production.

[0004] Laser-induced etching (LAI) modifies glass using pulsed lasers, followed by selective etching with an etchant to form through-holes. It offers advantages such as low cost and high efficiency, and has promising prospects for large-scale application. However, existing glass through-hole processing equipment suffers from low precision and stability in wafer-level glass through-hole drilling when using lasers to modify glass. Utility Model Content

[0005] In response to one or more of the above-mentioned defects or improvement needs of the existing technology, this utility model provides a laser-induced modification device for wafer-level glass through-hole preparation, which can automatically load and unload materials, save manpower, and has accurate positioning and high processing precision.

[0006] To achieve the above objectives, this utility model provides a laser-induced modification device for wafer-level glass via fabrication, comprising:

[0007] As a further improvement of this utility model, the host, wafer loading device, robot arm, and wafer edge finder are included.

[0008] The robotic arm is positioned between the wafer loading device, the wafer edge finder, and the host computer, and is used for loading and unloading glass.

[0009] The wafer edge finder positions the glass.

[0010] The host includes a moving component, a stage, and a laser processing component; the moving component is mounted on a support platform, and the stage is mounted on the moving component to support and fix the glass, and to adjust the horizontal position of the glass; the laser processing component is used to perform laser processing on the glass.

[0011] The moving component includes an X-axis moving unit, a Y-axis moving unit, and a rotating unit; the X-axis moving unit is disposed on the support platform, the Y-axis moving unit is disposed on the X-axis moving unit, the rotating unit is disposed on the Y-axis moving unit, and the platform is disposed on the rotating unit to adjust the horizontal position and correct deviation of the platform.

[0012] As a further improvement of this utility model, the laser processing assembly includes a laser, an optical path box, a laser processing head, and a Z-axis moving unit; the laser, the optical path box, and the Z-axis moving unit are disposed on the support platform, and the laser processing head is disposed on the Z-axis moving unit so that the height of the laser processing head can be adjusted by the Z-axis moving unit.

[0013] As a further improvement of this utility model, it also includes a visual positioning component, which is fixedly mounted on the laser processing head to perform visual positioning of the glass.

[0014] As a further improvement of this utility model, one or more sets of strip-shaped protrusions are provided on the upper surface of the platform, each set of strip-shaped protrusions being a square or wafer outline shape that is continuously or discontinuously distributed; multiple adsorption holes are provided on the strip-shaped protrusions, and the adsorption holes are connected to a negative pressure generating device.

[0015] As a further improvement of this utility model, multiple sets of strip-shaped protrusions are distributed radially at intervals along the surface of the platform.

[0016] As a further improvement of this utility model, multiple pressure relief holes are provided at the non-strip-shaped protrusions on the platform.

[0017] As a further improvement of this utility model, each group of strip protrusions is discontinuously distributed, and multiple groups of strip protrusions are arranged alternately in the shape of wafer outline and square along the radial direction of the stage.

[0018] As a further improvement of this utility model, the upper surface of the platform also includes an auxiliary support protrusion, which is disposed inside a set of strip protrusions or between two sets of strip protrusions.

[0019] As a further improvement of this utility model, the wafer edge finder includes a disk, a rotating assembly, and a sensor; the disk is disposed on the rotating assembly to adsorb and fix the glass, and the rotating assembly drives the glass to rotate; the sensor is disposed on the outer periphery of the disk to determine the position of the glass notch by scanning the edge of the glass to achieve positioning.

[0020] As a further improvement of this utility model, the wafer loading device is configured as two, each containing a loading basket and a unloading basket.

[0021] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0022] In summary, the beneficial effects of the above-described technical solutions conceived by this utility model compared with the prior art include:

[0023] (1) The laser-induced modification equipment for wafer-level glass via fabrication of this utility model is equipped with a robot arm corresponding to the wafer loading device, wafer edge finder and main unit, so as to realize automatic loading and unloading between the various mechanisms through the robot arm, saving manpower, improving equipment working efficiency and reducing glass sheet damage; at the same time, before the glass enters the main unit for laser processing, it is first positioned by the wafer edge finder, and then X / Y / Z direction moving unit and rotation unit are set in the main unit to cooperate with laser pulse output to achieve high-precision processing, strong stability and improve the processing accuracy of the equipment.

[0024] (2) The laser-induced modification equipment for wafer-level glass through-hole preparation of this utility model uses the cooperation of visual positioning component and rotating unit to position and correct the glass, thereby further improving the processing positioning accuracy; by setting the material basket in the wafer loading device, the initial positioning of the glass is achieved by positioning the material basket through the wafer loading device, thereby realizing multi-level positioning of the equipment from loading to processing, ensuring processing accuracy.

[0025] (3) The laser-induced modification equipment for wafer-level glass through-hole preparation of this utility model sets multiple sets of strip protrusions on the stage to form a partitioned adsorption stage according to the glass size, which is compatible with glass of various sizes and shapes, improves the applicability of the equipment, so that when processing products of different sizes, only the size of the basket and mechanical fingers needs to be changed, without the need to change the stage, effectively reducing the time and cost required when changing production products.

[0026] (4) The laser-induced modification equipment for wafer-level glass through-hole preparation of this utility model has independent mechanisms and reasonable structural design, which realizes high-speed and high-precision glass through-hole processing. It effectively solves the problems of low efficiency of manual loading and unloading, low precision of wafer-level glass through-hole processing, poor stability and low efficiency leading to high cost, and promotes the mass production process of TGV glass through-hole technology. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1This is a schematic diagram of the overall structure of the laser-induced modification equipment for wafer-level glass via fabrication in this embodiment of the present invention;

[0029] Figure 2 This is a schematic diagram of the overall structure of the host in an embodiment of this utility model;

[0030] Figure 3 and Figure 4 This is a top view of the platform in one embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of the platform mechanism in one embodiment of the present invention.

[0032] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically: 1. Main unit; 101. Base; 102. Marble platform; 103. First linear slide; 104. Second linear slide; 105. DD motor; 106. Stage; 1061. Strip protrusion; 1062. Adsorption hole; 1063. Pressure relief hole; 1064. Auxiliary support protrusion; 107. Laser; 108. Optical path box; 109. Third linear slide; 110. Vision positioning component; 111. Laser processing head; 2. Wafer loading device; 3. Robotic arm; 4. Wafer edge finder. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model. Furthermore, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0034] In the description of this utility model, it should be understood that, unless otherwise stated, the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0035] Furthermore, unless otherwise stated, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] Example:

[0039] Please see Figures 1-5 The laser-induced modification equipment for wafer-level glass via fabrication in a preferred embodiment of this utility model includes an independently configured host 1, a wafer loading device 2, a robotic arm 3, and a wafer edge finder 4. The robotic arm 3 sequentially transfers the glass in the basket placed in the wafer loading device 2 to the wafer edge finder 4 and the host 1 for positioning and laser processing.

[0040] Specifically, such as Figure 1 As shown in the preferred embodiment, two wafer loading devices 2 are provided, which respectively carry the upper loading basket and the lower loading basket, so as to position the basket by the wafer loading device 2, that is, to initially position the glass, and can automatically open the cover to prevent the glass in the basket from being contaminated or broken.

[0041] Furthermore, the robotic arm 3 is positioned between the host machine 1, the wafer loading device 2, and the wafer edge finder 4, for sequential loading and unloading between the loading basket in the wafer loading device 2, the wafer edge finder 4, the host machine 1, and the unloading basket in the wafer loading device 2. In actual operation, the robotic arm 3 picks up glass from the loading basket and loads it onto the wafer edge finder 4, then unloads the glass from the wafer edge finder 4 and loads it onto the host machine 1. After processing by the host machine 1, it picks up the glass again and places it into the unloading basket.

[0042] Preferably, such as Figure 1 The robot arm 3 shown is a four-axis robot arm with an adsorption arm at its end to grip glass by vacuum adsorption, and the adsorption arm can rotate 360°; the robot arm 3 is connected to an electronic control system to control the robot arm 3 to perform loading and unloading actions.

[0043] Furthermore, such as Figure 1 As shown, the wafer edge finder 4 includes a disk, a rotating assembly, and a sensor; wherein, the disk is a vacuum adsorption disk, which is set on the rotating assembly, and the sensor is set on the outer periphery of the circular platform, so as to vacuum adsorb and fix the glass after it is placed in place by the disk, and the rotating assembly causes the disk to rotate the wafer glass, so that the sensor located on the periphery of the disk scans the edge of the rotating glass to determine the position of the glass notch, and then performs secondary positioning of the glass.

[0044] Furthermore, such as Figure 2 As shown, the host 1 includes a support platform and a mobile component, a stage 106, a laser processing component, and a vision positioning component 110 disposed on the support platform.

[0045] The support platform includes a base 101 and a marble platform 102 set on the base 101, with a vibration isolation pad between the two to ensure the stability of the host machine 1 during processing.

[0046] Furthermore, the moving assembly includes an X-axis moving unit, a Y-axis moving unit, and a rotating unit; wherein the X-axis moving unit is disposed on the marble platform 102 and includes a first linear slide 103 that can reciprocate along the X-axis; the Y-axis moving unit is disposed on the first linear slide 103 and includes a second linear slide 104 that can reciprocate along the Y-axis; the rotating unit is disposed on the second linear slide 104 and includes a DD motor 105 that can be driven to rotate along its own axis.

[0047] In actual setup, both the first linear slide 103 and the second linear slide 104 are driven by linear motors and guided by linear guide rails that slide with them to improve motion accuracy. Furthermore, it is preferable to set grating ruler assemblies for the first linear slide 103 and the second linear slide 104 respectively, so as to provide high-precision position signals through the grating ruler assemblies, and to work together to ensure high positioning accuracy, repeatability and high processing speed of the equipment.

[0048] Accordingly, the stage 106 is mounted on the DD motor 105, and the DD motor 105 drives the stage 106 to rotate, thereby realizing the positioning and correction function of the glass on the stage 106.

[0049] Preferably, such as Figures 3 to 5 As shown, in which, Figure 3 and Figure 4 This is a top view of the platform. Figure 5 This is a schematic diagram of the stage structure. One or more sets of strip-shaped protrusions 1061 are provided on the stage 106 to support the glass, reducing the contact area between the stage 106 and the glass. Preferably, a laser-resistant coating is deposited on the supporting surface of the strip-shaped protrusions 1061 to reduce the risk of damage to the stage surface and dust generation caused by laser irradiation. Simultaneously, multiple adsorption holes 1062 are evenly distributed on the surface of the strip-shaped protrusions 1061. The internal air passages of the multiple adsorption holes 1062 on each set of strip-shaped protrusions 1061 are interconnected, while the internal air passages of the adsorption holes 1062 on multiple sets of strip-shaped protrusions 1061 are isolated. The adsorption holes 1062 are connected to a negative pressure generating device to use the surface of the strip-shaped protrusions 1061 as an adsorption surface to adsorb and fix the wafer glass. The dense adsorption holes 1062 on the strip-shaped protrusions 1061 enhance the adsorption stability of the glass.

[0050] Each group of strip-shaped protrusions 1061 is a continuously distributed square or wafer-like outer contour shape, used to adsorb square or circular glass wafers. See also Figure 3 , Figure 3 The image shows three sets of strip-shaped protrusions 1061, each forming a square, with the three sets of protrusions 1061 radially spaced apart. To accommodate wafers of different shapes, multiple sets of strip-shaped protrusions 1061 are radially spaced on the stage 106 to accommodate glass of different sizes. Preferably, multiple pressure relief holes 1063 are provided on the stage 106 at positions other than the strip-shaped protrusions 1061, wherein the pressure relief holes 1063 are connected to the atmosphere to prevent local deformation of the glass during adsorption. As one possible implementation, the pressure relief holes 1063 penetrate through the thickness direction of the stage 106.

[0051] As another alternative implementation, the set of strip protrusions 1061 can also be intermittently arranged squares or circles, see [reference]. Figure 4 , Figure 4 The diagram shows two sets of discontinuously distributed strip protrusions 1061 with wafer outer contour shapes, and one set of continuously distributed strip protrusions 1061 with wafer outer contour shapes. When the strip protrusions 1061 are discontinuously arranged, it is not necessary to provide pressure relief holes 1063 on the stage 106.

[0052] Multiple sets of strip-shaped protrusions 1061 are arranged radially at intervals on the stage 106, which can accommodate glass of different sizes. This avoids the need to replace the stage 106 when changing product sizes and also avoids the need to manufacture multiple stages 106 of different sizes, thus reducing production costs. Each set of strip-shaped protrusions 1061 can be distributed along the outer contour of the wafer or in a square pattern to accommodate glass of different shapes. It can also provide coarse positioning of the shape when manual loading and unloading is required, saving visual positioning time.

[0053] See Figure 5 This is a schematic diagram of a stage structure for one possible implementation. More preferably, multiple sets of strip-shaped protrusions 1061 are arranged radially at intervals along the stage 106, each set of protrusions 1061 being discontinuously distributed, and the multiple sets of protrusions 1061 are arranged in alternating patterns of wafer outline and square shapes along the radial direction of the stage 106. In some preferred embodiments, see... Figure 5 It also includes auxiliary support protrusions 1064, which can be disposed inside a group of strip protrusions 1061 or between two groups of strip protrusions 1061, and can be radial or other shapes. The auxiliary support protrusions 1064 can also be provided with adsorption holes 1062 to provide more stable adsorption.

[0054] Furthermore, such as Figure 2 As shown, the laser processing assembly includes a laser 107, an optical path box 108, a Z-axis moving unit, and a laser processing head 111; wherein, the laser 107 and the optical path box 108 are locked on the marble platform 102; the Z-axis moving unit is disposed on the marble platform 102 and includes a third linear slide 109, which can reciprocate along the Z direction perpendicular to the marble platform 102 under the drive of a linear motor; the laser processing head 111 is disposed on the third linear slide 109 to adjust the focusing height of the laser processing head 111 on the glass under the drive of the third linear slide 109.

[0055] In actual operation, the laser is emitted by the laser 107 and enters the optical path box 108. The optical path box 108 changes the direction of the laser and then it is vertically emitted from the laser processing head 111 and focused onto the glass surface to perform laser processing on the glass.

[0056] Furthermore, the vision positioning component 110 is locked onto the laser processing head 111, and its axis is set along the Z direction to perform vision positioning on the incoming glass placed on the stage 106.

[0057] Furthermore, the process of drilling holes in glass using the aforementioned laser-induced modification equipment for wafer-level glass via fabrication is as follows:

[0058] (1) Place the loading basket filled with glass onto the wafer loading device 2, and position the basket using the wafer loading device 2;

[0059] (2) The material basket is opened automatically. The robot arm 3 grabs the wafer glass with the vacuum adsorption surface facing up, and rotates it 180 degrees so that the adsorption surface faces down, and places the wafer glass on the disk of the wafer edge finder 4.

[0060] (3) The wafer edge finder 4 uses vacuum adsorption to fix the wafer glass, and drives the wafer glass to rotate through the rotating component. The wafer notch position is obtained by scanning the outer edge of the wafer glass through the sensor, and the wafer glass is repositioned.

[0061] (4) The robotic arm 3 picks up the wafer glass on the disk and places it on the stage 106 of the host 1;

[0062] (5) The stage 106 is activated for vacuum adsorption, and the wafer glass is adsorbed and fixed on the stage 106. The horizontal position of the wafer glass is adjusted by the X-axis and Y-axis moving units, and it is moved to the bottom of the vision positioning component 110. The Z-axis moving unit is adjusted to make the vision positioning component 110 focus and image, and the wafer glass is photographed for visual positioning. When the position of the wafer glass is deviated, the DD motor 105 is rotated to correct the deviation. When mass-producing the same graphic product, the first processing requires manual vision positioning and plate setting, and subsequent processing is automatic vision positioning.

[0063] After visual positioning calibrates the center of the wafer glass, the X-axis moving unit and Y-axis moving unit are used to adjust the center of the wafer glass to the center coordinates of the visual positioning component 110, and then the center of the wafer glass is moved from the center coordinates of the visual positioning component 110 to the center coordinates of the laser processing head 111.

[0064] Then, the laser processing head 111 is moved to the focusing height on the wafer glass by the third linear slide 109, the laser 107 is started, the laser is emitted vertically after passing through the optical path box 108 and the laser processing head 111 and focused on the surface of the wafer glass, and the wafer glass is drilled under the coordinated high-speed movement of the first linear slide 103 and the second linear slide 104.

[0065] After processing, the vacuum of stage 106 is broken, and the robot arm 3, with its adsorption surface facing down, adsorbs and grabs the processed wafer glass, rotates it 180 degrees, and places it into the unloading basket inside the wafer loading device 2. When processing square glass, step (3) can be omitted.

[0066] This invention relates to a laser-induced modification device for wafer-level glass through-hole (TGV) fabrication. Its mechanisms are independent and rationally designed, enabling high-speed, high-precision glass through-hole processing. This advances the mass production of TGV glass through-hole technology and has promising application prospects and widespread value. Furthermore, the triple positioning accuracy is further enhanced through a wafer loading device, a wafer edge finder, and visual positioning. The technical solution described in this application achieves excellent processing accuracy, with hole spacing accuracy controllable within ≤±4μm and positioning accuracy reaching ≤±3μm, which can be maintained long-term, effectively improving the processing accuracy and applicability of the equipment.

[0067] It should be noted that the wafer-grade glass described in this application refers to existing wafer sizes, such as wafer glass of 12 inches and below, or square glass of similar size.

[0068] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A laser-induced modification device for wafer-level glass through-hole fabrication, characterized in that, Includes main unit, wafer loading device, robotic arm and wafer edge finder; The robotic arm is positioned between the wafer loading device, the wafer edge finder, and the host computer, and is used for loading and unloading glass. The wafer edge finder positions the glass. The host includes a moving component, a stage, and a laser processing component; the moving component is mounted on a support platform, and the stage is mounted on the moving component to support and fix the glass, and to adjust the horizontal position of the glass; the laser processing component is used to perform laser processing on the glass. The moving component includes an X-axis moving unit, a Y-axis moving unit, and a rotating unit; the X-axis moving unit is disposed on the support platform, the Y-axis moving unit is disposed on the X-axis moving unit, the rotating unit is disposed on the Y-axis moving unit, and the platform is disposed on the rotating unit to adjust the horizontal position and correct deviation of the platform.

2. The laser-induced modification equipment for wafer-level glass via fabrication according to claim 1, characterized in that, The laser processing assembly includes a laser, an optical path box, a laser processing head, and a Z-axis moving unit; the laser, the optical path box, and the Z-axis moving unit are disposed on the support platform, and the laser processing head is disposed on the Z-axis moving unit so that the height of the laser processing head can be adjusted by the Z-axis moving unit.

3. The laser-induced modification equipment for wafer-level glass via fabrication according to claim 2, characterized in that, It also includes a vision positioning component, which is fixedly mounted on the laser processing head to perform vision positioning of the glass.

4. The laser-induced modification equipment for wafer-level glass via fabrication according to claim 1, characterized in that, One or more sets of strip-shaped protrusions are provided on the upper surface of the carrier platform. Each set of strip-shaped protrusions is a square or wafer outline shape that is continuously or discontinuously distributed. Multiple adsorption holes are provided on the strip-shaped protrusions, and the adsorption holes are connected to a negative pressure generating device.

5. The laser-induced modification equipment for wafer-level glass through-hole fabrication according to claim 4, characterized in that, Multiple sets of strip-shaped protrusions are distributed radially at intervals along the surface of the platform.

6. The laser-induced modification equipment for wafer-level glass via fabrication according to claim 4, characterized in that, Multiple pressure relief holes are provided at the non-strip-shaped protrusions on the platform.

7. The laser-induced modification equipment for wafer-level glass via fabrication according to claim 4, characterized in that, Each group of strip protrusions is discontinuously distributed, and multiple groups of strip protrusions are arranged alternately in the shape of wafer outline and square shape along the radial direction of the stage.

8. The laser-induced modification equipment for wafer-level glass via fabrication according to claim 4, characterized in that, The upper surface of the platform also includes auxiliary support protrusions, which are disposed inside a set of strip protrusions or between two sets of strip protrusions.

9. The laser-induced modification equipment for wafer-level glass via fabrication according to claim 1, characterized in that, The wafer edge finder includes a disk, a rotating assembly, and a sensor; the disk is disposed on the rotating assembly to adsorb and fix the glass, and the rotating assembly drives the glass to rotate; the sensor is disposed on the outer periphery of the disk to determine the position of the glass notch by scanning the edge of the glass to achieve positioning.

10. The laser-induced modification equipment for wafer-level glass via fabrication according to claim 1, characterized in that, The wafer loading device is configured with two parts, each containing a loading basket and a unloading basket.

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