Mass welding equipment
By designing the stage, adjustment, detection, and laser processing mechanisms, the precision and environmental control issues of Micro LED welding equipment were solved, enabling high-precision welding and online detection, and improving the equipment's processing capabilities and environmental cleanliness.
Patent Information
- Application Number
- CN202423176417.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-20
AI Technical Summary
Existing micro LED welding equipment suffers from insufficient welding precision, low yield, lack of finished product inspection and processing environment control, resulting in the need for secondary inspection of finished products, serious environmental pollution of products, and the inability of the equipment to process in large quantities.
A mass welding device was designed, including a stage mechanism, an adjustment mechanism, a detection mechanism, and a laser processing mechanism. The detection mechanism detects the position of the carrier board and the substrate, the adjustment mechanism adjusts the parallelism and alignment of the carrier board and the substrate, the laser processing mechanism performs chip welding, and a finished product detection mechanism performs online detection. A purification mechanism maintains a clean processing environment.
It improves welding precision and yield, enables online inspection of finished products, reduces defect rate, ensures the cleanliness of the processing environment, and has a large-scale processing capacity.
Smart Images
Figure CN223616950U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of LED production technology, specifically relating to a mass welding device. Background Technology
[0002] After mass transfer of micron-sized light-emitting diodes (Micro LEDs) to the panel, the following results are obtained: Figure 1 The temporary carrier board shown (hereinafter referred to as the carrier board) contains RGB chips. The RGB chips will subsequently need to be soldered onto a power-conducting substrate (such as...). Figure 2 (As shown in the image), this process is called mass soldering. In actual processing, it involves controlling aspects such as the parallelism and distance between the carrier board and the substrate, and the angle adjustment of the solder joints between individual chips and the substrate.
[0003] Existing micro LED welding equipment suffers from problems such as insufficient welding precision and low yield. It lacks finished product inspection and processing environment control, resulting in the need for secondary inspection of the finished products on other independent equipment. The quality is poor, the products are seriously polluted by the environment, and the equipment does not have the characteristics of large-scale sample production, so it can only process a small number of products. Utility Model Content
[0004] In response to one or more of the above-mentioned defects or improvement needs of the prior art, this utility model provides a mass welding device that can improve the welding accuracy of chips, reduce the defect rate, and improve the processing environment of the device.
[0005] To achieve the above objectives, this utility model provides a mass welding device, which includes a stage mechanism, an adjustment mechanism, a detection mechanism, and a laser processing mechanism;
[0006] The stage mechanism includes a plate stage and a substrate stage, wherein the plate stage is used to place the plate and the substrate stage is used to place the substrate.
[0007] The adjustment mechanism includes an adjustment component and a pressing component connected to the adjustment component; the adjustment component can drive the pressing component to move along the X-axis and Y-axis directions, so that the pressing component can move between the carrier plate stage and the substrate stage; the pressing component is provided with a suction cup, which is used to pick up the carrier plate; the pressing component can drive the suction cup to move along the Z-axis direction, drive the suction cup to rotate around the Z-axis direction, and adjust the parallelism of the suction cup;
[0008] The detection mechanism is used to detect the position of the carrier plate and the substrate. The pressing assembly adjusts the position of the suction cup holding the carrier plate according to the detection result of the detection mechanism, so that the carrier plate and the substrate are parallel and the positioning points on the carrier plate are aligned with the positioning points on the substrate. During welding, the pressing assembly drives the suction cup to move downward, so that the carrier plate, which has been adjusted to a certain position, is pressed onto the substrate. The laser beam emitted by the laser processing mechanism can pass through the pressing assembly and act on the carrier plate to weld the chip on the carrier plate onto the substrate.
[0009] As a further improvement of this utility model, it also includes a finished product inspection mechanism, which is disposed between the carrier stage and the substrate stage to inspect the substrate with the chip soldered on.
[0010] As a further improvement of this utility model, the detection mechanism includes a first laser rangefinder, a positioning detection component, and an alignment component;
[0011] The first laser rangefinder is positioned below the substrate stage. When the carrier plate is positioned above the substrate, the first laser rangefinder can measure the parallelism between the carrier plate and the substrate through the substrate stage. The pressing assembly adjusts the parallelism of the carrier plate according to the detection result of the first laser rangefinder.
[0012] The positioning detection component is mounted on the pressing component. The adjusting component can move the positioning detection component to above the carrier plate stage. The positioning detection component detects the flatness and positioning points of the carrier plate on the carrier plate stage. The alignment component detects the positioning points of the substrate.
[0013] As a further improvement of this utility model, the positioning detection component includes a camera and a second laser rangefinder. The camera is used to detect the positioning point of the carrier plate, and the second laser rangefinder is used to detect the flatness of the carrier plate.
[0014] As a further improvement of this utility model, the laser processing mechanism includes a moving component and a laser processing component. Both the laser processing component and the alignment component are disposed on the moving component, so that the moving component can drive the alignment component and the laser processing component to move above the substrate stage.
[0015] As a further improvement of this utility model, it also includes an outer cover and a purification mechanism. The platform mechanism, adjustment mechanism, laser processing mechanism, detection mechanism and the purification mechanism are all arranged inside the outer cover. One end of the purification mechanism is connected to the external environment and the other end is connected to the environment inside the outer cover. A fan and a filter element are arranged inside the purification mechanism so that the external gas is input into the outer cover through the fan and the input gas is filtered and purified through the filter element.
[0016] As a further improvement of this utility model, the pressing assembly is provided with a pressure sensor for detecting the pressure value between the carrier plate and the substrate when the pressing assembly presses down, and the pressing assembly stops pressing down after the pressure reaches the set value.
[0017] As a further improvement of this utility model, the adjustment component includes an X-axis moving module, a Y-axis moving module and a Z-axis moving module. The X-axis moving module drives the pressing component to move in the X-axis direction, the Y-axis moving module drives the pressing component to move in the Y-axis direction, and the Z-axis moving module drives the pressing component to move in the Z-axis direction.
[0018] As a further improvement of this utility model, the pressing assembly includes a lifting drive, a rotating component, and a leveling component. The rotating component is connected to the power output end of the lifting drive, the leveling component is disposed on the rotating component, and the suction cup is disposed on the leveling component. The lifting drive, the rotating component, and the leveling component are all provided with through holes along the Z-axis in the middle. The part of the suction cup that contacts the carrier plate is made of transparent material, so that the laser can pass through the rotating component and the leveling component and act on the carrier plate through the suction cup.
[0019] As a further improvement of this utility model, the carrier plate platform is provided with a first air inlet, a first adsorption chamber, and a first adsorption hole that are interconnected; the first adsorption chamber is connected to a first vacuum generating component through the first air inlet to evacuate the first adsorption chamber, and the carrier plate is adsorbed and fixed on the carrier plate platform through the first adsorption hole; and / or,
[0020] The substrate platform is provided with a second air inlet, a second adsorption chamber and a second adsorption hole that are interconnected; the second adsorption chamber is connected to a second vacuum generating component through the second air inlet to evacuate the second adsorption chamber and to adsorb and fix the substrate on the substrate platform through the second adsorption hole.
[0021] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.
[0022] In summary, the beneficial effects of the above-described technical solutions conceived by this utility model compared with the prior art include:
[0023] This invention relates to a mass welding equipment that places a carrier plate and a substrate on a carrier plate stage and a substrate stage, respectively. A detection mechanism detects the positions of the carrier plate and substrate. Based on the detection results, an adjustment mechanism drives a pressing component to pick up the carrier plate and press it parallel to the substrate, ensuring that the positioning points on the carrier plate align with those on the substrate. A laser processing mechanism then welds the chips from the carrier plate to the substrate, achieving mass welding of chips. This equipment boasts high welding precision and a high yield rate. Furthermore, a finished product inspection mechanism integrated within the equipment detects the welding effect, allowing for finished product yield testing within the same equipment after welding is completed. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0025] Figure 1 This is a schematic diagram of the RGB chip carrier board of this utility model;
[0026] Figure 2 This is a schematic diagram of the substrate of this utility model;
[0027] Figure 3 This is a schematic diagram of the overall structure of the mass welding equipment in this embodiment of the utility model;
[0028] Figure 4 This is a side view of the substrate stage in an embodiment of this utility model;
[0029] Figure 5 This is an attached view of the substrate stage in an embodiment of this utility model;
[0030] Figure 6 This is a schematic diagram of the structure of the laser processing mechanism in an embodiment of this utility model.
[0031] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically: 1. Laser processing mechanism; 11. Moving component; 12. Laser processing component; 121. Laser processing head; 2. Base; 21. Frame; 22. Marble tabletop; 23. Shock-absorbing pad; 3. Purification mechanism; 4. Platform mechanism; 41. Carrier plate platform; 42. Substrate platform; 421. Second air inlet; 43. First laser rangefinder; 44. Pressure plate; 5. Adjustment mechanism; 51. X-axis moving module; 52. Y-axis moving module; 53. Pressing component; 531. Through hole; 6. Positioning detection component; 7. Alignment component; 8. Finished product inspection mechanism. Detailed Implementation
[0032] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model. Furthermore, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.
[0033] In the description of this utility model, it should be understood that, unless otherwise explicitly specified and limited, the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0034] Furthermore, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.
[0035] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0036] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0037] Example:
[0038] Please see Figures 3-6 The mass welding equipment in the preferred embodiment of this utility model includes a base 2 and a stage mechanism 4, an adjustment mechanism 5, a laser processing mechanism 1, and a detection mechanism disposed on the base 2. The stage mechanism 4 supports the temporary carrier plate and the substrate, the detection mechanism detects the position of the carrier plate and the substrate, the adjustment mechanism 5 adjusts the position of the carrier plate so that the carrier plate is parallel to the substrate and the positioning points on the carrier plate are aligned with the positioning points on the substrate, and the adjusted carrier plate is pressed onto the substrate. Then, the laser beam emitted by the laser processing mechanism 1 passes through the adjustment mechanism 5 and acts on the carrier plate to weld the chip (RGB chip) on the carrier plate to the substrate.
[0039] Specifically, such as Figure 3 As shown, the base 2 includes a frame 21 and a marble tabletop 22. The frame 21 has sufficient rigidity to ensure the stability of the load-bearing part. The marble tabletop 22 is set on the frame 21, and preferably a shock-absorbing pad 23 is set between the frame 21 and the marble tabletop 22 to isolate the vibration of the equipment during the processing and ensure the processing accuracy.
[0040] Furthermore, in the preferred embodiment, the platform mechanism 4 is disposed on the marble countertop 22, including a platform platform 41 for placing a carrier plate and a substrate platform 42 for placing a substrate; wherein the platform platform 41 is provided with a first air inlet, a first adsorption chamber and a plurality of first adsorption holes that are interconnected, the first adsorption chamber is connected to a first vacuum generating assembly through the first air inlet so that the first vacuum generating assembly evacuates the first adsorption chamber and adsorbs and fixes the carrier plate on the platform platform 41 through the first adsorption holes on the surface of the platform platform 41.
[0041] Preferably, a first stop is also provided on the carrier plate stage 41 to perform initial positioning of the carrier plate when it is loaded onto the carrier plate stage 41.
[0042] Accordingly, such as Figure 4 and Figure 5As shown, the substrate stage 42 is mounted on the marble countertop 22 via a pressure plate 44. The part of the substrate stage 42 that contacts the plate is made of transparent glass. The substrate stage 42 is provided with a second air inlet 421, a second adsorption chamber, and a plurality of second adsorption holes that are interconnected. The second adsorption chamber is connected to a second vacuum generating component through the second air inlet 421. The second vacuum generating component evacuates the second adsorption chamber to generate negative pressure, and the substrate is adsorbed and fixed on the substrate stage 42 through the second adsorption holes on the surface of the substrate stage 42, ensuring that the substrate does not shift during the processing.
[0043] Preferably, a second baffle is also provided on the substrate stage 42 to perform initial positioning of the substrate when it is loaded onto the substrate stage 42.
[0044] Furthermore, in the preferred embodiment, the adjustment mechanism 5 includes an adjustment component and a pressing component 53, wherein the adjustment component is disposed on the marble countertop 22, and the pressing component 53 is connected to the adjustment component, so that the pressing component 53 can be moved along the X-axis and Y-axis directions by the adjustment component, so that the pressing component 53 can move between the carrier plate stage 41 and the substrate stage 42.
[0045] Specifically, the adjustment components include an X-axis moving module 51 and a Y-axis moving module 52. The pressing component 53 is mounted on the X-axis moving module, the X-axis moving module 51 is mounted on the Y-axis moving module 52, and the Y-axis moving module 52 is mounted on the marble countertop 22. The X-axis moving module 52 drives the pressing component 53 to move in the X-axis direction, and the Y-axis moving module 52 drives the pressing component 53 to move in the Y-axis direction. This embodiment does not limit the specific structure of the X-axis moving module 51 and the Y-axis moving module 52, as long as they enable the pressing component 53 to move in the X-axis and Y-axis directions.
[0046] Meanwhile, the pressing assembly 53 is equipped with a suction cup to pick up the carrier plate placed on the carrier plate stage 41. The pressing assembly 53 can drive the suction cup to move along the Z-axis, drive the suction cup to rotate around the Z-axis, and adjust the parallelism of the suction cup.
[0047] Specifically, the pressing assembly 53 includes a lifting drive, a rotating component, and a leveling component. The rotating component is connected to the power output end of the lifting drive, the leveling component is mounted on the rotating component, and the suction cup is mounted on the leveling component. Simultaneously, a through hole 531 along the Z-axis is provided in the middle of the lifting drive, rotating component, and leveling component to reserve a welding channel for the laser processing mechanism 1. The part of the suction cup that contacts the carrier plate is made of a transparent material, allowing the laser to pass through the rotating component and leveling component, and act on the carrier plate through the suction cup, enabling the carrier plate to be pressed onto the substrate for welding under a certain pressure. This embodiment does not limit the specific structure of the lifting drive, rotating component, and leveling component, as long as the lifting drive can drive the suction cup to move up and down, the rotating component can rotate the suction cup, and the leveling component can adjust the horizontality of the suction cup, so that the positioning point of the carrier plate is aligned with the positioning point of the substrate, and the carrier plate and substrate are parallel.
[0048] Preferably, a pressure sensor is also provided on the pressing assembly to detect the pressure value between the carrier plate and the substrate when the adjusting assembly drives the pressing assembly 53 to press down on the carrier plate, and the pressing assembly stops pressing down after the pressure reaches the set value.
[0049] Further, in the preferred embodiment, the detection mechanism includes a first laser rangefinder 43, a positioning detection component 6, and an alignment component 7; wherein, the first laser rangefinder 43 is disposed below the substrate stage 42, and the material of the contact portion between the substrate stage 42 and the substrate plate is made transparent, so that when the substrate plate is above the substrate, the first laser rangefinder 43 can measure the parallelism between the substrate plate and the substrate through the substrate stage 42, and the pressing component 53 adjusts the parallelism of the substrate plate according to the detection result of the first laser rangefinder 43, so that the substrate plate can be pressed onto the substrate with a certain pressure for welding. Preferably, as Figure 4 As shown, multiple first laser rangefinders 43 are spaced apart below the substrate stage 42 to detect the parallelism at multiple locations between the carrier and the substrate. It can be understood that the side of the carrier with the chip faces the substrate, and the parallelism detected by the first laser rangefinders 43 refers to the parallelism between the chip on the carrier and the substrate. During mass welding, parallelism between the chip and the substrate is beneficial for improving the accuracy of mass welding.
[0050] Accordingly, the positioning detection component 6 is disposed on the pressing component 53, so that the positioning detection component 6 can be moved above the carrier plate stage by adjusting the component, and the flatness and positioning points of the carrier plate on the carrier plate stage 41 can be detected by the positioning detection component 6.
[0051] Specifically, the positioning detection component 6 includes a first camera and a second laser rangefinder, which detects the positioning points of the carrier plate by means of the first camera and scans the surface of the carrier plate carrying the RGB chip by means of the second laser rangefinder to detect the flatness of the carrier plate.
[0052] Understandably, during actual production, mark points, or positioning points, are set on the carrier plate. The position of the positioning points on the carrier plate can be detected and recorded by the first camera.
[0053] Accordingly, the alignment component 7 includes a second camera to detect the position of the mark point (i.e., the positioning point) on the substrate and record the positioning point to adjust the position of the carrier board in accordance with the position of the carrier board detected by the positioning detection component 6, so that the chip on the carrier board is parallel to the substrate and the positioning point on the carrier board is aligned with the positioning point on the substrate.
[0054] Furthermore, in the preferred embodiment, the laser processing mechanism 1 is disposed on the marble tabletop 22 and includes a moving component 11 and a laser processing component 12. The moving component 11 is disposed on the marble tabletop 22, and the laser processing component 12 and the alignment component 7 are both disposed on the moving component 11. The moving component 11 drives the alignment component 7 to move above the substrate stage 42 to detect the position of the substrate. The moving component 11 also drives the laser processing head 121 of the laser processing component 12 to move directly above the substrate, so that the laser emitted by the laser processing head 121 irradiates the substrate to weld the RGB chip on the substrate onto the substrate.
[0055] Furthermore, in a preferred embodiment, the mass welding equipment also includes a finished product inspection mechanism 8, which is disposed between the carrier stage 41 and the substrate stage 42, so as to inspect the substrate with the chip welded on by the finished product inspection mechanism 8 before the finished product is unloaded, and check the welding quality and welding yield of the chip.
[0056] like Figure 1 As shown, the finished product inspection mechanism 8 is preferably an AOI inspection camera. The finished product inspection mechanism is located below the marble countertop 22, and the marble countertop 22 has a notch corresponding to the finished product inspection mechanism, so that the finished product inspection mechanism can inspect the substrate with the chip soldered on.
[0057] Furthermore, an outer cover is provided for the entire equipment, and the platform mechanism 4, adjustment mechanism 5, laser processing mechanism 1 and finished product inspection mechanism 8 are all enclosed in the outer cover to separate the processing environment of the equipment from the outside world. The outer cover is made of aluminum profile frame and aluminum-plastic panel to avoid dust pollution of the entire processing environment caused by long-term use of the outer cover.
[0058] Preferably, the mass transfer equipment inside the outer casing is also equipped with a purification mechanism 3, which is located inside the outer casing and mounted on the frame 21. One end of the purification mechanism is connected to the external environment, and the other end is connected to the environment inside the outer casing. A fan and a filter element are installed inside the purification mechanism to introduce external gas into the outer casing through the fan and filter and purify the introduced gas through the filter element. This allows for the continuous introduction of clean airflow into the outer casing when the equipment is powered on, ensuring the cleanliness of the platform mechanism 4 during the loading, processing, and unloading processes, thereby ensuring that the carrier plate, substrate, and welded finished product have a high degree of cleanliness.
[0059] Furthermore, the working process of the mass welding equipment of this utility model is as follows:
[0060] (1) Manually or automatically load the carrier board with RGB chip onto the carrier board stage 41, and load the substrate onto the substrate stage 42.
[0061] (2) The adjustment component drives the camera and the second laser rangefinder in the positioning detection component 6 to move. The second laser rangefinder starts and scans the surface of the carrier plate to determine its flatness. The camera adaptively detects the mark points on the carrier plate according to the flatness of the carrier plate, determines the position of the mark points on the carrier plate and records it.
[0062] (3) The adjusting component moves the pressing component above the carrier plate;
[0063] (4) The moving component 11 drives the alignment component 7 to move above the substrate, detects the mark points on the substrate, determines the position of the mark points on the substrate and records it.
[0064] It is understandable that in actual operation, steps (3) and (4) can be executed sequentially or simultaneously.
[0065] (5) The lifting drive unit moves the suction cup downward to pick up the carrier plate, and the adjustment component moves the carrier plate to above the substrate;
[0066] (6) The first laser rangefinder 43 is started to check the parallelism between the lower surface of the carrier board and the substrate, and adjusts the parallelism between the carrier board and the substrate by adjusting the leveling component so that the chip on the lower surface of the carrier board is parallel to the substrate.
[0067] (7) Based on the position of the mark point on the carrier plate recorded by the positioning detection component 6 and the position of the mark point on the substrate recorded by the alignment component 7, the rotating component drives the carrier plate to rotate around the Z-axis, and adjusts the angle of the carrier plate in the horizontal direction so that the mark point on the carrier plate is aligned with the mark point on the substrate.
[0068] (8) The lifting drive unit drives the suction cup to press down, so that the carrier plate is pressed on the substrate, and stops pressing down when the pressure sensor reaches the set pressure value;
[0069] (9) The moving component 11 drives the laser processing component 12 to move, so that the laser processing head 121 is above the carrier plate, and the laser processing head 121 emits laser to weld the chip on the carrier plate to the substrate.
[0070] (10) The adjustment component drives the pressing component 53 to unload the waste substrate to the unloading station. The pressing component 53 then moves to the top of the substrate and picks up the substrate with the chip soldered on it. It moves the substrate to the top of the finished product inspection mechanism 8. The finished product inspection mechanism 8 inspects and records the soldering effect and yield.
[0071] (11) Manual or automatic feeding and soldering of substrates with chips.
[0072] The mass welding equipment of this invention is highly integrated, occupies little space, improves welding accuracy, reduces the defect rate of finished products, and effectively improves the processing environment of the equipment, thus having good application prospects and promotion value.
[0073] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A mass welding equipment, characterized in that, It includes a stage mechanism, an adjustment mechanism, a testing mechanism, and a laser processing mechanism; The stage mechanism includes a carrier plate stage and a substrate stage. The carrier plate stage is used to place the carrier plate, and the substrate stage is used to place the substrate. The adjustment mechanism includes an adjustment component and a pressing component connected to the adjustment component; the adjustment component can drive the pressing component to move along the X-axis and Y-axis directions, so that the pressing component can move between the carrier plate stage and the substrate stage; the pressing component is provided with a suction cup, which is used to pick up the carrier plate; the pressing component can drive the suction cup to move along the Z-axis direction, drive the suction cup to rotate around the Z-axis direction, and adjust the parallelism of the suction cup; The detection mechanism is used to detect the position of the carrier plate and the substrate. The pressing assembly adjusts the position of the suction cup holding the carrier plate according to the detection result of the detection mechanism, so that the carrier plate and the substrate are parallel and the positioning points on the carrier plate are aligned with the positioning points on the substrate. During welding, the pressing assembly drives the suction cup to move downward, so that the carrier plate, which has been adjusted to a certain position, is pressed onto the substrate. The laser beam emitted by the laser processing mechanism can pass through the pressing assembly and act on the carrier plate to weld the chip on the carrier plate onto the substrate.
2. The mass welding equipment according to claim 1, characterized in that, It also includes a finished product testing mechanism, which is located between the carrier stage and the substrate stage to test the substrate with the chip soldered on it.
3. The mass welding equipment according to claim 1, characterized in that, The detection mechanism includes a first laser rangefinder, a positioning detection component, and an alignment component; The first laser rangefinder is positioned below the substrate stage. When the carrier plate is positioned above the substrate, the first laser rangefinder can measure the parallelism between the carrier plate and the substrate through the substrate stage. The pressing assembly adjusts the parallelism of the carrier plate according to the detection result of the first laser rangefinder. The positioning detection component is mounted on the pressing component. The adjusting component can move the positioning detection component to above the carrier plate stage. The positioning detection component detects the flatness and positioning points of the carrier plate on the carrier plate stage. The alignment component detects the positioning points of the substrate.
4. The mass welding equipment according to claim 3, characterized in that, The positioning detection component includes a camera and a second laser rangefinder. The camera is used to detect the positioning point of the carrier plate, and the second laser rangefinder is used to detect the flatness of the carrier plate.
5. The mass welding equipment according to claim 3, characterized in that, The laser processing mechanism includes a moving component and a laser processing component. Both the laser processing component and the alignment component are disposed on the moving component, so that the moving component can drive the alignment component and the laser processing component to move above the substrate stage.
6. The mass welding equipment according to claim 1, characterized in that, It also includes an outer cover and a purification mechanism. The platform mechanism, adjustment mechanism, laser processing mechanism, detection mechanism and the purification mechanism are all located inside the outer cover. One end of the purification mechanism is connected to the external environment and the other end is connected to the environment inside the outer cover. The purification mechanism is equipped with a fan and a filter element so that the external gas is introduced into the outer cover through the fan and the introduced gas is filtered and purified through the filter element.
7. The mass welding equipment according to claim 1, characterized in that, The pressing assembly is equipped with a pressure sensor, which is used to detect the pressure value between the carrier plate and the substrate when the pressing assembly presses down, and the pressing assembly stops pressing down after the pressure reaches the set value.
8. The mass welding equipment according to claim 1, characterized in that, The adjustment component includes an X-axis moving module and a Y-axis moving module. The X-axis moving module drives the pressing component to move in the X-axis direction, and the Y-axis moving module drives the pressing component to move in the Y-axis direction.
9. The mass welding equipment according to claim 1, characterized in that, The pressing assembly includes a lifting drive, a rotating component, and a leveling component. The rotating component is connected to the power output end of the lifting drive. The leveling component is disposed on the rotating component, and the suction cup is disposed on the leveling component. The lifting drive, the rotating component, and the leveling component all have through holes along the Z-axis in their middle portions. The part of the suction cup that contacts the carrier plate is made of transparent material, allowing the laser to pass through the rotating component and the leveling component and act on the carrier plate through the suction cup.
10. The mass welding equipment according to claim 1, characterized in that, The carrier plate platform is provided with a first air inlet, a first adsorption chamber, and a first adsorption hole that are interconnected; the first adsorption chamber is connected to a first vacuum generating component through the first air inlet to evacuate the first adsorption chamber, and the carrier plate is adsorbed and fixed on the carrier plate platform through the first adsorption hole; and / or, The substrate platform is provided with a second air inlet, a second adsorption chamber and a second adsorption hole that are interconnected; the second adsorption chamber is connected to a second vacuum generating component through the second air inlet to evacuate the second adsorption chamber and to adsorb and fix the substrate on the substrate platform through the second adsorption hole.