Laser processing device

Abstract

The embodiment of the utility model discloses a laser processing device which comprises a machine base, a laser used for emitting laser beams, a scanning mechanism and an object carrying movement mechanism. The scanning mechanism is connected with the laser; laser beams emitted by the laser device pass through the scanning mechanism and then are emitted to form emergent laser with a waist part, and an included angle A is formed between the emitting direction of the emergent laser and the direction perpendicular to the processing breadth of the scanning mechanism; wherein the included angle A and the beam waist included angle B of the emergent laser meet the condition that A is greater than or equal to B; the object carrying movement mechanism is arranged on the machine base and is opposite to the scanning mechanism. The machining device provided by the utility model can reduce the machining difficulty of high-precision profile tolerance and surface roughness.

Description

Technical Field

[0001] This utility model relates to the field of laser processing technology, and in particular to a laser processing device. Background Technology

[0002] With the development of materials surface technology, surface polishing has become an increasingly important technology. Polishing, also known as mirror finishing, is a surface finishing process that produces flat surfaces with minimal deformation and no scratches. In industrial applications, the requirements for material surface roughness are becoming increasingly stringent, evolving from micrometer, submicrometer, and nanometer levels to sub-nanometer levels. To meet these application needs, various polishing techniques have been applied in industrial production. Polishing techniques include: mechanical polishing, ultrasonic polishing, chemical polishing, ion beam polishing, electrolytic polishing, fluid polishing, magnetic abrasive polishing, and laser polishing. These polishing techniques are widely used in electronic equipment, precision machinery, instruments, optical components, and medical devices.

[0003] Laser polishing involves the interaction of a laser beam with a material surface to achieve a polishing process. In related technologies, to prevent the workpiece from blocking the laser during processing, it is necessary to position the workpiece and the laser at a certain angle, which is technically challenging. Utility Model Content

[0004] This invention provides a laser processing device to solve the problem in the prior art that the workpiece to be processed and the laser need to be at a certain angle, which makes operation difficult.

[0005] This utility model provides a laser processing device, comprising:

[0006] Base;

[0007] A laser is mounted on the base.

[0008] A scanning mechanism is connected to the laser; the laser beam emitted by the laser passes through the scanning mechanism and is emitted to form an outgoing laser with a waist, and the emission direction of the outgoing laser forms an angle A with the direction perpendicular to the processing area of ​​the scanning mechanism; wherein, the angle A and the waist angle B of the outgoing laser satisfy: A≥B;

[0009] The object-carrying mechanism is mounted on the base and positioned opposite to the scanning mechanism.

[0010] Furthermore, the scanning mechanism includes a galvanometer and a field lens, the galvanometer being connected to the laser and the field lens being connected to the galvanometer; the galvanometer and the field lens together define the processing area of ​​the scanning mechanism.

[0011] Furthermore, the galvanometer is a two-dimensional scanning galvanometer.

[0012] Furthermore, the scanning angle C of the galvanometer is in the range of -25° to 25°, and the included angle A is smaller than the included angle C.

[0013] Furthermore, the field lens is a non-telecentric field lens, and the non-telecentric field lens is connected to the two-dimensional scanning galvanometer.

[0014] Furthermore, 3°≤A≤20°.

[0015] Furthermore, 3°≤B≤8°.

[0016] Furthermore, it also includes a lifting mechanism, which is disposed on the base and drives the scanning mechanism.

[0017] Furthermore, the cargo-carrying motion mechanism includes:

[0018] A first movable component is disposed on the base;

[0019] The second moving component is disposed on the first moving component, wherein the moving directions of the first moving component and the second moving component are perpendicular to each other;

[0020] A rotating component is disposed on the second moving component, the rotating component being configured to drive the workpiece to be processed to rotate.

[0021] Furthermore, the processing device also includes a base, disposed on the machine base, wherein the laser, the scanning mechanism and the loading motion mechanism are mounted on the base.

[0022] The technical solution provided by this utility model has the following advantages compared with the prior art:

[0023] This invention provides a laser processing device in which a workpiece movement mechanism is mounted on the base. This mechanism is configured to fix the workpiece and adjust its processing position. A laser beam is emitted from a laser, passes through a scanning mechanism, and exits. The emitted laser beam has a waist, and its emission direction forms an angle A with the direction perpendicular to the processing surface. The angle A and the waist angle B of the emitted laser beam satisfy A ≥ B. This prevents the workpiece from obstructing the emitted laser, achieving high precision in contour and surface roughness. Furthermore, the scanning mechanism in this invention ensures the emitted laser beam forms an angle A, eliminating the need for angle adjustments to the workpiece or the scanning mechanism. Therefore, this laser processing device reduces processing difficulty while ensuring processing accuracy. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0027] Figure 1 A schematic diagram of the processing device provided by this utility model is shown.

[0028] Figure 2 It shows Figure 1 A schematic diagram of the scanning mechanism and focusing mechanism.

[0029] Figure 3 It shows Figure 1 Schematic diagram of the structure of the medium-loaded motion mechanism;

[0030] Figure 4 A schematic diagram of the processing apparatus provided in an embodiment of this application processing a workpiece is shown.

[0031] Figure 5 This illustration shows a comparison between the processing area of ​​the processing apparatus provided in this application and the processing area in the prior art when processing the workpiece;

[0032] Figure 6 The scanning angle C of the galvanometer is shown in the figure;

[0033] Figure 7 The beam waist characteristics of the laser beam after being focused by the field lens are shown.

[0034] Figure Labels

[0035] 100-Base;

[0036] 200-laser;

[0037] 300 - Scanning mechanism; 320 - Galvanometer; 330 - Field lens

[0038] 310 - Lifting mechanism;

[0039] 500 - Carrying and moving mechanism;

[0040] 510 - First moving component;

[0041] 520 - Second moving component;

[0042] 530 - Rotary assembly;

[0043] 531-Base;

[0044] 532 - Fasteners;

[0045] 600 - Base;

[0046] 700-Electrical Control Box;

[0047] 800-Computer. Detailed Implementation

[0048] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Similar component reference numerals in the drawings represent similar components. Obviously, the embodiments described below are only some embodiments of this utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0049] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0050] It should also be understood that the terminology used in this specification of embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the present invention. As used in this specification of embodiments of the present invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0051] This utility model embodiment provides a laser processing apparatus, including a base 100, a laser 200, a scanning mechanism 300, and a loading and moving mechanism 500. The laser 200 is disposed on the base 100 and is used to emit a laser beam. The scanning mechanism 300 is connected to the laser 200. The laser beam emitted by the laser 200 passes through the scanning mechanism 300 and emits a beam with a waist, and the emission direction of the emitted laser forms an angle A with the direction perpendicular to the processing surface of the scanning mechanism 300; wherein the angle A and the waist angle B of the emitted laser beam satisfy: A ≥ B; the loading and moving mechanism 500 is disposed on the base 100 and is opposite to the scanning mechanism 300. (Reference) Figure 4 , Figure 6 and Figure 7 Angles A and B are shown in the diagram. Note that angles A and B are for illustrative purposes only and do not represent actual angle values.

[0052] It should be noted that the laser beam emitted by laser 200, after passing through scanning mechanism 300, will have a laser waist, meaning the laser has a waist (see reference). Figure 7 The laser beam waist is the thinnest part of the laser beam emitted by the laser. Generally, during laser polishing, it is necessary to ensure that the laser beam waist is located on the surface of the workpiece to obtain the best processing effect.

[0053] When polishing the surface of a workpiece with a laser, the workpiece may block the laser beam. The laser processing device provided by this invention adjusts the angle A between the emitted laser beam from the scanning mechanism 300 and the processing surface perpendicular to the scanning mechanism 300, and simultaneously adjusts the relative positions of the workpiece movement mechanism 500 and the scanning mechanism 300. This ensures that the angle A between the emitted laser beam direction and the direction perpendicular to the processing surface, and the beam waist angle B of the emitted laser beam, satisfy A ≥ B. This prevents the workpiece from blocking the emitted laser, achieving high-precision contour accuracy and surface roughness. Furthermore, by adjusting the angle A between the emitted laser beam and the processing surface perpendicular to the scanning mechanism 300 through the scanning mechanism 300, this invention eliminates the need for angle adjustments to the workpiece or the scanning mechanism. Therefore, the laser processing device provided by this invention reduces processing difficulty while ensuring processing accuracy.

[0054] like Figure 1 and Figure 2 As shown, in the technical solution of this utility model embodiment, the scanning mechanism 300 includes a galvanometer 320 and a field lens 330. The galvanometer 320 is connected to the laser 200, and the field lens 330 is connected to the galvanometer 320. The galvanometer 320 and the field lens 330 together define the processing area of ​​the scanning mechanism 300.

[0055] The galvanometer 320 is configured to receive the laser beam emitted by the laser 100 to scan the contour of the workpiece, so that the emitted laser performs contour processing on the workpiece within the processing area.

[0056] The field mirror 330 is configured to receive the laser beam after passing through the galvanometer 320 and focus the laser beam to form an outgoing laser.

[0057] Thus, the laser beam emitted from the laser 200 is emitted sequentially after the galvanometer 320 and the field lens 330. The galvanometer 320 receives the laser beam emitted from the laser 200 and deflects it to scan the contour of the workpiece, so that the emitted laser performs contour processing on the workpiece within the processing area of ​​the scanning mechanism 300. The field lens 330 focuses the laser beam, and the focused laser beam polishes the surface of the workpiece.

[0058] In this invention, the processing area is defined by the combined action of the galvanometer 320 and the field mirror 330. The deflection effect of the galvanometer 320 enables the emitted laser to perform contour processing on the workpiece within the processing area, thereby improving processing accuracy and reducing the requirements for the contour of the workpiece itself.

[0059] In the above embodiments, the base 100 serves a supporting function, and it can adopt any structure with supporting function known in the art. This utility model does not make any special limitation.

[0060] In some examples of this utility model, the base 100 includes a support frame and a support plate. The support frame has a receiving space, and the support plate is disposed on the support frame to provide a support surface for other mechanisms of the processing device.

[0061] In the processing apparatus provided by this utility model, the laser 200 transmits the laser beam through an optical fiber, directing it into the galvanometer 320, and then out through the field mirror 330. The emitted laser beam from the scanning mechanism 300 can perform laser polishing on the contour of the workpiece.

[0062] The scanning mechanism has a beam input end, from which the laser beam enters, and a beam output end, from which the laser beam is deflected and focused before exiting.

[0063] In some embodiments of this invention, the galvanometer 320 is a two-dimensional scanning galvanometer, so that the processing contour line formed by scanning is located within a planar processing area. The two-dimensional scanning galvanometer includes an X-axis galvanometer and a Y-axis galvanometer. The laser beam emitted from the laser passes sequentially through the X-axis galvanometer and the Y-axis galvanometer, respectively, deflecting the laser beam in the X and Y directions. After deflection, the laser beam is focused by the field lens 330 and then emitted. After passing through the two-dimensional scanning galvanometer and the field lens, a two-dimensional region (plane) is generated, guiding the laser to any position within it; this region is called the processing area. The deflection is performed by the X-axis galvanometer and the Y-axis galvanometer, which are driven to deflect by a galvanometer motor.

[0064] In existing technologies, processing is performed by changing the angle of the workpiece or the galvanometer. When the processing contour is projected onto the workpiece, deformation and distortion occur, resulting in... Figure 5 The outline shown is 2 (distorted machining scan outline), and outline 2 is different from the theoretical machining scan outline (e.g. Figure 5 The outline shown in Figure 1) has a certain deviation. When the laser beam processes the workpiece along the distorted processing scanning outline, the surface will be distorted after actual processing. It is necessary to perform contour compensation on the graphic based on the actual processing and inspection results, and increase the processing steps.

[0065] like Figure 4 As shown, in this invention, since the sum of the angle A between the processing contour line formed by the scanning mechanism and the laser beam is 90°, the processing surface can remain horizontal. The processing contour line projected onto the workpiece will not be distorted, thus improving processing accuracy. Furthermore, since the emitted laser beam from the scanning mechanism is already deflected, there is no need to adjust the angle of the workpiece or the scanning mechanism itself, reducing processing difficulty.

[0066] The laser processing device of this invention can process either a flat or curved surface. Under the action of the galvanometer 320, the emitted laser can form a processing contour line that matches the surface contour of the workpiece according to the shape of the workpiece.

[0067] In this embodiment of the invention, the two-dimensional scanning galvanometer helps to form a horizontal processing area, meaning that scanning any shape of line or surface occurs on a horizontal plane. This allows the laser to exhibit a certain angular characteristic when the workpiece is near the edge of the horizontal processing area, thus helping to form an angle D between the laser beam and the workpiece. This reduces the probability of the workpiece blocking the light due to the beam waist characteristic caused by laser focusing, which is beneficial for high contour accuracy and surface roughness polishing of the workpiece. Here, angle D is equal to angle A.

[0068] In this embodiment of the utility model, reference is made to Figure 6The scanning angle C of the galvanometer ranges from -25° to 25°, and the included angle A is smaller than the included angle C. 。 Among them, the included angle C is as follows Figure 6 The angles shown are positive. When the tilt direction of the laser beam is... Figure 6 When the tilt direction of the laser beam is opposite, the included angle C is a negative angle. For example, if the scanning angle of the galvanometer is ±25°, the field lens will limit the actual maximum scanning angle of the galvanometer to only ±20°. It can achieve the laser tilt angle by itself, so that the workpiece and the laser are at a certain angle. This can help the processing area of ​​the two-dimensional scanning galvanometer to be perpendicular to the surface to be processed, and help to make the included angle A greater than the waist angle B, thereby further reducing the occurrence of light blocking by the workpiece and surface distortion after processing.

[0069] In some embodiments of this utility model, 3°≤A≤20° can further avoid the workpiece from blocking the laser and the distortion of the curved surface after processing.

[0070] The processing contour line formed by the outgoing laser emitted from the scanning mechanism 300 of this invention is deviated from the position directly below the scanning mechanism 300 on the processing surface, and the deviation distance of the processing contour line is positively correlated with the focal length of the field lens 330.

[0071] The smaller the focal length of the field lens 330, the larger the waist angle B. In order for the laser focus to be projected onto the surface of the workpiece and to avoid interference between the scanning mechanism 300 and the workpiece, in some embodiments of this utility model, 3°≤B≤8° can prevent the scanning mechanism from hitting the workpiece and can also prevent the lens of the scanning mechanism 300 from being damaged by the spatter generated during processing.

[0072] In this embodiment of the invention, when the processing plane is perpendicular to the surface of the workpiece, the included angle A is equal to the included angle D formed by the laser beam and the workpiece. The larger the included angle D, the larger the amount removed in a single processing operation, and the greater the relative roughness, making it suitable for roughing. The closer the included angle D is to the waist angle B, the smaller the amount removed in a single operation, and the smaller the relative roughness, making it suitable for finishing. Therefore, when the included angle D and the waist angle B are within the above-mentioned ranges, both roughing and finishing can be achieved.

[0073] In some embodiments of this invention, the field lens is a non-telecentric field lens, which corresponds to the setting of a two-dimensional scanning galvanometer. Since the laser processing device of this invention is used for laser polishing, and to improve processing efficiency, the working distance of the laser is not very long. Using a high-resolution, wide-field-of-view non-telecentric field lens ensures stable imaging quality while reducing costs.

[0074] Please continue reading. Figure 1As shown, in some embodiments of this utility model, the processing device further includes a base 600 disposed on the machine base 100, wherein the laser 200, the galvanometer mechanism 300 and the loading motion mechanism 500 are mounted on the base 600.

[0075] In the above embodiments, the base 600 can be made of marble, which has a good coefficient of thermal expansion and high precision. The base 600 can also be made of other materials well known in the art.

[0076] Please continue reading. Figure 1 As shown, in some embodiments of this utility model, the processing device further includes an electrical control box 700 and a computer 800, which are disposed on the machine base 100.

[0077] Specifically, the electrical control box 700 may include some devices and systems well known in the art, such as industrial computers, control systems, circuit systems, etc.

[0078] Further improvements can be made to further reduce processing costs. Please refer to [link / reference]. Figure 2 As shown, in some embodiments of this utility model, the processing device further includes a lifting mechanism 310. The scanning mechanism 300 is connected to the laser 200; the lifting mechanism 310 is disposed on the base 100 and drives the scanning mechanism 300 to move.

[0079] The cooperation between the scanning mechanism 300 and the lifting mechanism 310 can drive the laser to the straight edge of the workpiece and link with the loading motion mechanism 500 to achieve arc-shaped laser polishing.

[0080] For example, when the workpiece is at different positions within the horizontal processing area of ​​the two-dimensional scanning galvanometer, a processing pattern (including lines and surfaces) is drawn using the two-dimensional scanning galvanometer to achieve different angles D between the emitted laser and the workpiece. The angle D between the emitted laser and the workpiece is calculated as follows: If an F160 field lens is used, the angle D between the emitted laser and the workpiece can be 15°. The offset value of the drawn pattern is calculated using software as tan15° * focal length 160mm = 42.87mm, meaning the pattern is offset from the galvanometer center by 42.87mm.

[0081] In the above embodiments, the scanning path of the two-dimensional scanning galvanometer can be edited with Marking Mate software or other galvanometer control software to create curved surface graphics. This enables the processing of arbitrary curved contours. In other words, for different processing requirements of the workpiece, the galvanometer can be precisely calibrated to ensure high-precision polishing of the contour.

[0082] Furthermore, the laser 200 and scanning mechanism 300 can be replaced according to the material of the workpiece to be processed, so as to improve the adaptability of the processing device.

[0083] Please see Figure 3 As shown, in some embodiments of this utility model, the loading and unloading mechanism 500 includes a first moving component 510, a second moving component 520, and a rotating component 530. The first moving component 510 is disposed on the base 100 and is configured to drive the workpiece to be processed to move along a first direction; the second moving component 520 is disposed on the first moving component 510 and is configured to drive the workpiece to be processed to move along a second direction, wherein the first direction and the second direction are perpendicular to each other; the rotating component 530 is disposed on the second moving component 520 and is configured to drive the workpiece to be processed to rotate.

[0084] In this article, the first direction is as follows Figure 1 The direction indicated by Y in the middle, the second direction as follows Figure 1 The direction indicated by X in the middle.

[0085] In the above embodiments, the workpiece to be processed is fixed and its processing position is adjusted by the linkage between the first moving component 510, the second moving component 520 and the rotating component 530, so as to achieve polishing and contour processing of the complete outer curved surface of the product.

[0086] In some embodiments of this utility model, the rotating component 530 includes a base 531, a motor, and a fixing member 532. The base 531 is disposed on the second moving component 520; the motor is disposed on the base 531; the fixing member 532 is connected to the output shaft of the motor and is configured to fix the workpiece to be processed.

[0087] The following provides a detailed description of how to use the processing device provided by this utility model.

[0088] Draw and import the outline of the workpiece to be processed, and set the processing parameters of the laser 200 and the scanning mechanism 300 based on the outline image of the workpiece to be processed; after the workpiece to be processed is fixed on the fixing part 532 of the rotating component 530, the first moving component 510, the second moving component 520 and the rotating component 530 work together to move the workpiece to the processing point, and process it according to the outline image of the workpiece to achieve the laser-polished surface of the workpiece; after processing is completed, remove the processed workpiece.

[0089] The processing device provided by this utility model can reduce the difficulty of laser processing, has strong versatility, and can be used to process the flat / curved contours of rotating cylindrical and spherical workpieces, the flat / curved contours of workpieces with arbitrary polygonal shapes with rounded corners, and the contours of gradient curved surfaces.

[0090] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0091] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0092] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0093] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0094] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0095] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0096] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Since these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

[0097] The above description describes specific embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A laser processing apparatus, characterized in that, include: Base (100); A laser (200) is disposed on the base (100); A scanning mechanism (300) is connected to the laser (200); the laser beam emitted by the laser (200) passes through the scanning mechanism (300) and emits an outgoing laser beam with a waist, and the emission direction of the outgoing laser beam forms an angle A with the direction perpendicular to the processing area of ​​the scanning mechanism (300); wherein the angle A and the waist angle B of the outgoing laser beam satisfy: A≥B; The loading and moving mechanism (500) is disposed on the base (100) and is disposed opposite to the scanning mechanism (300).

2. The processing apparatus according to claim 1, characterized in that, The scanning mechanism (300) includes a galvanometer (320) and a field lens (330). The galvanometer (320) is connected to the laser (200), and the field lens (330) is connected to the galvanometer (320). The galvanometer (320) and the field lens (330) together define the processing area of ​​the scanning mechanism (300).

3. The processing apparatus according to claim 2, characterized in that, The galvanometer (320) is a two-dimensional scanning galvanometer.

4. The processing apparatus according to claim 2, characterized in that, The scanning angle C of the galvanometer (320) ranges from -25° to 25°, and the angle A is smaller than the angle C.

5. The processing apparatus according to claim 3, characterized in that, The field mirror (330) is a non-telecentric field mirror, and the non-telecentric field mirror is connected to the two-dimensional scanning galvanometer.

6. The processing apparatus according to claim 1, characterized in that, 3°≤A≤20°。 7. The processing apparatus according to claim 1, characterized in that, 3°≤B≤8°。 8. The processing apparatus according to claim 1, characterized in that, It also includes a lifting mechanism (310), which is disposed on the base (100) and drives the scanning mechanism (300).

9. The processing apparatus according to claim 1, characterized in that, The cargo-carrying motion mechanism (500) includes: A first moving component (510) is disposed on the base (100); A second moving component (520) is disposed on top of the first moving component (510), wherein the moving directions of the first moving component and the second moving component are perpendicular to each other; A rotating component (530) is disposed on the second moving component (520).

10. The processing apparatus according to claim 1, characterized in that, The processing device further includes a base (600) disposed on the machine base (100), wherein the laser (200), the scanning mechanism (300) and the material movement mechanism (500) are mounted on the base (600).

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