IC step protection structure based on colloid spraying

Abstract

The utility model discloses an integrated circuit (IC) step protection structure based on colloid spraying, which relates to the technical field of liquid crystal display module manufacture, and is characterized by comprising a plurality of layers of colloid materials sprayed on an IC step of a liquid crystal display module through a colloid spraying process, so that a protection layer with electromagnetic shielding performance is formed on the surface of the IC step. The multi-layer colloid material comprises insulation protection glue and metal protection glue, and has the effect that the multi-layer colloid material is accurately sprayed on the IC step of the liquid crystal display module through a specially designed colloid spraying process to form a simple and efficient protection layer. According to the structural design, a traditional conductive shielding film is completely abandoned, the design framework is greatly simplified, the assembling difficulty and cost are reduced, meanwhile, the film pasting procedure is omitted, the yield loss caused by the problems of bubbles, wrinkles, inaccurate alignment and the like which are possibly generated in the film pasting process is effectively avoided, and the production efficiency and the product quality are remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of liquid crystal display module manufacturing technology, and more specifically, it relates to an IC step protection structure based on colloidal spraying. Background Technology

[0002] Liquid crystal display modules (LCMs) are widely used in modern electronic devices, such as televisions, mobile phones, automotive displays, and commercial displays. The main processes in their production include bonding, mounting, optical bonding, and assembly. Among these, protecting the IC step areas during bonding and assembly is crucial. Traditionally, after bonding the ICs, a conventional protective adhesive (such as UV adhesive) is applied. This adhesive provides dust protection, anti-static properties, and prevents physical scratches. After module assembly, a conductive film is then applied to the step areas to discharge static electricity from the IC surface and improve EMC capabilities.

[0003] However, this traditional process involves multiple steps and various materials, which not only significantly increases production costs but also leads to unstable product performance and reduced yield due to its complexity. For example, the additional cost of conductive film materials, as well as human error and environmental factors in the coating process, can all affect the quality of the final product and production efficiency.

[0004] Therefore, in order to solve the above-mentioned technical problems, this application proposes an IC step protection structure based on colloidal spraying. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide an IC step protection structure based on colloidal spraying.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an IC step protection structure based on colloidal spraying, comprising a multilayer colloidal material sprayed onto the IC step of a liquid crystal display module through a colloidal spraying process, thereby forming a protective layer with electromagnetic shielding performance on its surface, wherein the multilayer colloidal material includes an insulating protective layer and a metal protective layer.

[0007] Preferably, the multilayer adhesive material has a three-layer structure, with insulating protective adhesive A and insulating protective adhesive B at the top and bottom, respectively, and a metal protective adhesive located between insulating protective adhesive A and insulating protective adhesive B.

[0008] Preferably, the insulating protective adhesive A is made of epoxy resin-based insulating adhesive, which is used to prevent external substances from corroding and to enhance the overall structural stability, and its thickness is between 10 and 30 micrometers.

[0009] Preferably, the insulating protective adhesive B is made of polyimide-based insulating adhesive, used to provide a basic adhesion layer and prevent short circuits, and its thickness is between 10 and 30 micrometers.

[0010] Preferably, the metal protective adhesive is made of silver paste, used to form an electromagnetic shielding layer and discharge static electricity from the IC surface, and its thickness is between 5 and 15 micrometers.

[0011] Preferably, the spraying pressure of the colloid spraying process is 0.3-0.5MPa, the spraying speed is 5-10mm / s, and the spraying angle is 60-90 degrees to ensure uniform spraying of the multi-layer colloid material at the IC step.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. This utility model utilizes a specially designed colloidal spraying process to precisely spray this multi-layered colloidal material onto the IC steps of the liquid crystal display module, forming a simple yet efficient protective layer. This structural design completely eliminates the need for traditional conductive shielding films, greatly simplifies the design architecture, reduces the number of components, and lowers assembly difficulty and cost, thereby solving the problem in the background technology where traditional processes involve multiple steps and various materials, leading to a significant increase in production costs.

[0014] 2. This utility model eliminates the film application process, effectively avoiding yield losses caused by problems such as bubbles, wrinkles, and misalignment that may occur during the film application process. It significantly improves production efficiency and product quality, thereby solving the problems in the background technology where additional conductive film material costs and human errors and environmental factors in the film application process may affect the quality and production efficiency of the final product.

[0015] 3. This utility model designs the multi-layer adhesive material into a three-layer structure and rationally selects the specific materials for the three-layer structure, so that the protective structure can effectively replace the traditional conductive shielding film to protect the IC step and has electromagnetic shielding effect. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0017] Figure 1 This is a schematic diagram of a structure for protecting the IC step in the prior art;

[0018] Figure 2 This is a schematic diagram of the specific structure of the improved multilayer adhesive material in this utility model.

[0019] In the diagram: 1. Insulating protective layer; 101. Insulating protective adhesive A; 102. Insulating protective adhesive B; 2. Metal protective layer; 201. Metal protective adhesive. Detailed Implementation

[0020] like Figure 1-2 As shown, this utility model provides an IC step protection structure based on colloidal spraying, including a multilayer colloidal material sprayed onto the IC step of a liquid crystal display module through a colloidal spraying process, thereby forming a protective layer with electromagnetic shielding performance on its surface. The multilayer colloidal material includes an insulating protective layer 1 and a metal protective layer 2.

[0021] Furthermore, the multilayer adhesive material has a three-layer structure. The bottom insulating protective adhesive B102 (which directly contacts the IC step) can be made of polyimide (PI) based insulating adhesive. This material has excellent high-temperature resistance, good mechanical properties, and high insulation, effectively preventing short circuits between the underlying circuit and other components. It also provides a stable base adhesion layer for the entire protective structure, with a thickness between 10 and 30 micrometers to ensure good insulation and adhesion. The middle layer is a metal protective adhesive 201, which can use silver paste as the main component. Silver has excellent conductivity, forming a good electromagnetic shielding layer that effectively blocks external electromagnetic interference and discharges static electricity from the IC surface, ensuring normal IC operation. Its thickness is between 5 and 15 micrometers, ensuring electromagnetic shielding while avoiding excessive impact on the overall structure. The top insulating protective adhesive A101 can be made of epoxy resin based insulating adhesive (it is the outermost layer of the multilayer adhesive material). It has good chemical corrosion resistance and high hardness, preventing external substances from eroding the metal protective adhesive layer, while further enhancing the stability and wear resistance of the overall structure. Its thickness is between 10 and 30 micrometers. Within a 30-micron range, it provides sufficient protection and stability. In summary, this protective structure can effectively replace traditional conductive shielding films to protect the IC step area and also provides electromagnetic shielding. (Insulating protective adhesive A101 and insulating protective adhesive B102 belong to insulating protective layer 1, and metal protective adhesive 201 belongs to metal protective layer 2.)

[0022] Its processing steps are as follows:

[0023] Step 1: Precisely prepare the multi-layer adhesive materials. Prepare the polyimide-based insulating adhesive (insulating protective adhesive B102), silver paste (metal protective adhesive 201), and epoxy resin-based insulating adhesive (insulating protective adhesive A101) according to the predetermined ratio, and mix them thoroughly using professional mixing equipment to ensure that each layer of material is evenly distributed and has stable performance.

[0024] Step 2: Carefully place the LCD module on a specially designed colloid spraying worktable, using a high-precision positioning device to ensure that the IC step is fully exposed and in the optimal spraying position.

[0025] Step 3: Start the adhesive spraying equipment and operate according to the optimal spraying parameters determined through extensive prior experiments. The spraying pressure should be controlled between 0.3 and 0.5 MPa to ensure the adhesive material adheres evenly to the step surface without splashing or dripping. The spraying speed should be set to 5-10 mm / s to ensure uniform thickness of each layer and meet design requirements. The spraying angle should be maintained at 60-90 degrees to accurately cover the IC step and surrounding circuit area. During spraying, strictly follow the bottom-up order of spraying polyimide-based insulating adhesive, silver paste, and epoxy resin-based insulating adhesive. After each layer is applied, appropriate pre-curing treatment can be performed according to the material characteristics, such as low-temperature heating or brief ultraviolet irradiation, to enhance the adhesion between layers.

[0026] Step 4: Perform a full curing process on the sprayed multi-layer adhesive material. If using heat curing, for polyimide-based and epoxy resin-based insulating adhesives, gradually increase the temperature to 150-200℃ and maintain this temperature for 30-60 minutes; for silver paste, control the heating temperature at 80-120℃ for 10-20 minutes. If using light curing, select an appropriate wavelength and intensity of light equipment based on the characteristics of the photosensitive resin used; the irradiation time is generally 5-15 minutes. Through this curing process, the multi-layer adhesive material forms a robust, stable protective layer with good electromagnetic shielding performance at the IC step, completing the construction of the entire protective structure.

[0027] In summary, this invention utilizes a specially designed colloidal spraying process to precisely apply this multi-layered adhesive material to the IC steps of the liquid crystal display module, forming a simple yet efficient protective layer. This structural design completely eliminates the need for traditional conductive shielding films, greatly simplifying the design architecture, reducing the number of components, and lowering assembly difficulty and cost. Furthermore, by eliminating the film application process, it effectively avoids yield losses caused by problems such as bubbles, wrinkles, and misalignment that may occur during film application, significantly improving production efficiency and product quality, and making a significant contribution to reducing the overall production cost of liquid crystal display modules.

[0028] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Those skilled in the art can readily implement this utility model based on the accompanying drawings and the above description. However, any modifications, alterations, or equivalent variations made by those skilled in the art without departing from the scope of the utility model's technical solution, utilizing the disclosed technical content, are considered equivalent embodiments of this utility model. Furthermore, any equivalent changes, alterations, or variations made to the above embodiments based on the essential technology of this utility model are still within the protection scope of this utility model's technical solution.

Claims

1. An IC step protection structure based on colloidal spraying, characterized in that: The method includes a multilayer adhesive material that is sprayed onto the steps of a liquid crystal display module IC using an adhesive spraying process, thereby forming a protective layer with electromagnetic shielding properties on its surface. The multilayer adhesive material includes an insulating protective layer (1) and a metal protective layer (2).

2. The IC step protection structure based on colloidal spraying according to claim 1, characterized in that: The multilayer adhesive material has a three-layer structure, with insulating protective adhesive A (101) and insulating protective adhesive B (102) at the top and bottom, respectively, and a metal protective adhesive (201) located between insulating protective adhesive A (101) and insulating protective adhesive B (102).

3. The IC step protection structure based on colloidal spraying according to claim 2, characterized in that: The insulating protective adhesive A (101) is made of epoxy resin-based insulating adhesive, which is used to prevent external substances from corroding and to enhance the overall structural stability. Its thickness is between 10 and 30 micrometers.

4. The IC step protection structure based on colloidal spraying according to claim 2, characterized in that: The insulating protective adhesive B (102) is made of polyimide-based insulating adhesive, used to provide a basic adhesion layer and prevent short circuits, and its thickness is between 10 and 30 micrometers.

5. The IC step protection structure based on colloidal spraying according to claim 2, characterized in that: The metal protective adhesive (201) is made of silver paste and is used to form an electromagnetic shielding layer and discharge static electricity from the IC surface. Its thickness is between 5 and 15 micrometers.

6. The IC step protection structure based on colloidal spraying according to claim 1, characterized in that: The spraying pressure of the described colloidal spraying process is 0.3-0.5MPa, the spraying speed is 5-10mm / s, and the spraying angle is 60-90 degrees to ensure uniform spraying of multi-layer adhesive materials at the IC step.

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