Impact-resistant chip protection structure

Abstract

The utility model relates to the technical field of protection structures, and discloses an anti-impact chip protection structure which comprises a base mechanism, a chip mechanism is clamped in the middle of the upper end of the base mechanism, a dustproof mechanism is fixedly arranged at the upper end of the base mechanism through threads, and the base mechanism comprises a mounting plate. A mounting groove is formed in the middle of the upper end of the mounting plate, a cooling fin is fixedly arranged in the middle of the mounting groove, a plurality of cooling fins are fixedly arranged at the lower end of the cooling fin, the dustproof mechanism comprises a dustproof net, and a plurality of elastic supporting columns are fixedly arranged on the inner walls of the front end and the rear end of the dustproof net. Pressing blocks are fixedly arranged in the middle of the periphery of the inner surface of the dustproof net. According to the utility model, the radiating fins are made of a copper material with excellent heat-conducting property and can quickly conduct heat generated by the chip, and the radiating fins are arranged at the lower ends of the radiating fins, so that the radiating area is effectively increased, the radiating efficiency is improved, and the stable operation of the chip is ensured.

Description

Technical Field

[0001] This utility model relates to the field of protective structure technology, and in particular to an impact-resistant chip protective structure. Background Technology

[0002] A chip or integrated circuit chip is a tiny electronic device made of semiconductor materials. When a chip is used, a chip protection structure is required. The chip protection structure is to protect the chip from the influence of the external environment, such as temperature, humidity and dust, and at the same time improve the stability and reliability of the chip.

[0003] Existing shock-resistant chip protection structures use protective boxes and other components to place the chip inside and then fix it in place. This protection method is not conducive to chip heat dissipation and affects the subsequent use of the chip. Therefore, those skilled in the art have provided a shock-resistant chip protection structure to solve the problems mentioned in the background art. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing an impact-resistant chip protection structure. The heat sink of this device is made of copper, which has excellent thermal conductivity, and can quickly conduct the heat generated by the chip. The lower end is provided with heat dissipation fins, which effectively increase the heat dissipation area, improve heat dissipation efficiency, and ensure stable chip operation.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an impact-resistant chip protection structure, including a base mechanism, wherein a chip mechanism is snapped into the middle of the upper end of the base mechanism, and a dustproof mechanism is fixedly provided on the upper end of the base mechanism by threads;

[0006] The base mechanism includes a mounting plate, with a mounting groove at the middle of the upper end of the mounting plate. A heat sink is fixedly installed in the middle of the mounting groove, and multiple heat dissipation fins are fixedly installed at the lower end of the heat sink. The dustproof mechanism includes a dustproof net, with multiple elastic support columns fixedly installed on the inner walls of the front and rear ends of the dustproof net, and pressure blocks fixedly installed at the middle of the perimeter of the inner surface of the dustproof net.

[0007] Furthermore, buffer protective pads are fixedly provided at the lower ends of the plurality of pressure blocks, and locking blocks are fixedly provided on both sides of the lower end of the dustproof net.

[0008] Furthermore, the mounting plate has snap-fit ​​grooves on both sides of its upper end, and multiple empty grooves on the middle of the upper end of the mounting plate near both sides.

[0009] Furthermore, mounting blocks are fixedly installed at the middle of the front and rear ends of the dustproof net, and screws are threaded onto the middle of the two mounting blocks.

[0010] Furthermore, the chip structure includes a chip body.

[0011] Furthermore, multiple pins are fixedly disposed on both sides of the chip body.

[0012] Furthermore, threaded rods are threaded at the four corners of the upper end of the mounting plate.

[0013] Furthermore, the mounting plate includes a base layer, and a wear-resistant layer is fixedly disposed on the outer surface of the base layer.

[0014] This utility model has the following beneficial effects:

[0015] 1. This utility model proposes an impact-resistant chip protection structure. The heat sink of this device is made of copper with excellent thermal conductivity, which can quickly conduct the heat generated by the chip. The lower end is provided with heat dissipation fins, which effectively increase the heat dissipation area, improve heat dissipation efficiency, and ensure stable operation of the chip. The dustproof mesh of the dustproof mechanism is woven from stainless steel wire. The mesh size is screened to effectively block dust and impurities without affecting air circulation. The elastic support column is made of rubber, which supports and buffers the dustproof mesh when under pressure. The pressure block, together with the silicone buffer pad at the lower end, fits the chip body, which can reduce the impact of external impact on the chip and limit the chip, thus protecting the chip in all aspects.

[0016] 2. The present invention proposes an impact-resistant chip protection structure. The mounting slot on the mounting plate of this device is adapted to the outer dimensions of the chip mechanism, which facilitates the tight snap-fit ​​of the chip mechanism. The empty slot facilitates the chip pins to pass through and be soldered to the lower circuit board. The snap-fit ​​slot cooperates with the snap-fit ​​block of the dustproof mechanism to achieve quick snap-fit. The design of the mounting block and screw facilitates the fixation of the dustproof mechanism. The overall installation process is simple and efficient. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the unfolded axonometric view of the present invention;

[0018] Figure 2 This is an axonometric view of the present invention;

[0019] Figure 3 This is a top view of the unfolded axonometric view of the present invention;

[0020] Figure 4 This is a bottom-view unfolded axonometric schematic diagram of the present invention;

[0021] Figure 5 This is an enlarged schematic diagram of the mounting plate of this utility model.

[0022] Legend:

[0023] 1. Base mechanism; 2. Chip mechanism; 3. Dustproof mechanism; 101. Mounting plate; 102. Threaded rod; 103. Mounting slot; 104. Heat sink; 105. Empty slot; 106. Snap-fit ​​slot; 107. Heat sink fins; 10101. Base layer; 10102. Wear-resistant layer; 201. Chip body; 202. Pin; 301. Dustproof mesh; 302. Mounting block; 303. Snap-fit ​​block; 304. Screw; 305. Elastic support column; 306. Pressure block; 307. Buffer protective pad. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Reference Figure 1-5 An embodiment of this utility model provides: an impact-resistant chip protection structure, including a base mechanism 1, the base mechanism 1 including a mounting plate 101, a mounting groove 103 is provided at the middle of the upper end of the mounting plate 101, a heat sink 104 is fixedly provided in the middle of the mounting groove 103, a plurality of heat sink fins 107 are fixedly provided at the lower end of the heat sink 104, snap-fit ​​grooves 106 are provided on both sides of the upper end of the mounting plate 101, a plurality of empty grooves 105 are provided at the middle of the upper end of the mounting plate 101 near both sides, threaded rods 102 are threaded at the four corners of the upper end of the mounting plate 101, the mounting plate 101 includes a base layer 10101, a wear-resistant layer 10102 is fixedly provided on the outer surface of the base layer 10101, a chip mechanism 2 is snap-fitted at the middle of the upper end of the base mechanism 1, the chip mechanism 2 includes a chip body 201, a plurality of pins 202 are fixedly provided on both sides of the chip body 201;

[0026] Specifically, in the base mechanism 1, the mounting plate 101 serves as the basic load-bearing component of the entire protective structure. Its base layer 10101 is made of high-strength aluminum alloy, possessing good rigidity and a certain degree of toughness, effectively supporting the entire protective structure and resisting a certain degree of external impact. The wear-resistant layer 10102 is made of tungsten carbide coating, which is applied to the outer surface of the base layer 10101 through a thermal spraying process, greatly improving the wear resistance of the mounting plate 101 and reducing wear caused by friction during daily use. The dimensions of the mounting groove 103 are precisely designed to match the external dimensions of the chip mechanism 2, ensuring that the chip mechanism 2 can be tightly engaged within it. The heat sink 104 is made of copper, as copper has excellent... The chip has excellent thermal conductivity, which can quickly conduct away the heat generated by the chip body 201. Multiple heat dissipation fins 107 are evenly distributed at the lower end of the heat dissipation fins 104, and the shape of the heat dissipation fins 107 is such that this design increases the heat dissipation area and effectively improves the heat dissipation efficiency. The snap-fit ​​slot 106 is used to cooperate with the snap-fit ​​block 303 at the lower end of the dustproof mechanism 3 to realize the quick snap-fit ​​between the dustproof mechanism 3 and the base mechanism 1. The slot 105 facilitates the passage of the chip pins 202 and facilitates the soldering and installation of the chip pins 202 and the lower circuit board. The threaded rod 102 is made of high-strength stainless steel, and its length has been carefully calculated to ensure stable connection with other components during installation without being too long and affecting the compactness of the overall structure.

[0027] Reference Figure 3-4 The upper end of the base mechanism 1 is fixed with a dustproof mechanism 3 by a thread. The dustproof mechanism 3 includes a dustproof net 301. Multiple elastic support columns 305 are fixedly installed on the inner walls of the front and rear ends of the dustproof net 301. Pressure blocks 306 are fixedly installed at the center of the perimeter of the inner surface of the dustproof net 301. Buffer protective pads 307 are fixedly installed at the lower ends of the multiple pressure blocks 306. Locking blocks 303 are fixedly installed on both sides of the lower end of the dustproof net 301. Mounting blocks 302 are fixedly installed at the center of the front and rear ends of the dustproof net 301. Screws 304 are threaded in the middle of the two mounting blocks 302.

[0028] Specifically, the dustproof mesh 301 is woven from stainless steel wire, and the mesh size is strictly selected to effectively block dust, impurities, and other foreign objects from entering the protective structure without affecting airflow and ensuring normal heat dissipation of the chip mechanism 2. The elastic support column 305 is made of rubber, which has good elasticity and cushioning performance. When subjected to external pressure, it can support and cushion the dustproof mesh 301, preventing the dustproof mesh 301 from being damaged due to excessive pressure. The pressure block 306 is made of plastic, which is relatively soft and will not damage the chip body 201. The buffer pad 307 is made of silicone, which has good flexibility and cushioning performance. When the dustproof mechanism 3 is installed on the base mechanism 1, the buffer pad 307 can fit tightly on the chip body 201, which can further buffer and protect the chip body 201, reduce the impact of external impact on the chip body 201, and also restrict the chip to a certain extent. The shape of the card block 303 matches the card slot 106, which is convenient for installation and disassembly. The mounting block 302 is integrally formed with the dustproof mesh 301 through injection molding process, which ensures the integrity and stability of the structure. The dustproof mechanism 3 can be fixed with screws 304.

[0029] Working principle: The mounting plate 101 of the base mechanism 1 is made of high-strength aluminum alloy base 10101, which provides stable support and wear resistance. The mounting groove 103 on the mounting plate 101 is precisely adapted to the chip mechanism 2. The heat sink 104 is made of copper with excellent thermal conductivity. The heat sink 104 has heat sink fins 107 evenly distributed at its lower end to increase the heat dissipation area and quickly conduct heat generated by the chip. The slot 105 facilitates the chip pins 202 to pass through and be soldered to the circuit board. The threaded rod 102 is used for stable connection with other components. The pins 202 on both sides of the chip body 201 of the chip mechanism 2 are soldered to the circuit board through the slot 105, and the whole is snapped into the mounting groove 103 of the base mechanism 1.

[0030] Secondly, the dustproof mechanism 3 engages with the base mechanism 1 through the locking block 303 and the locking slot 106 to achieve quick engagement, and is fixed by screws 304. The dustproof mesh 301 is made of stainless steel wire, which blocks dust while ensuring air circulation for heat dissipation. The internal elastic support column 305 is made of rubber, which supports and buffers the dustproof mesh 301 when subjected to external pressure. The pressure block 306 works in conjunction with the silicone buffer pad 307 at the lower end to reduce the impact of external impact on the chip and also to limit the chip.

[0031] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An impact-resistant chip protection structure, comprising a base mechanism (1), characterized in that: The base mechanism (1) is fitted with a chip mechanism (2) at the middle of its upper end, and the base mechanism (1) is fixed with a dustproof mechanism (3) by threads at its upper end; The base mechanism (1) includes a mounting plate (101), and a mounting groove (103) is provided at the middle of the upper end of the mounting plate (101). A heat sink (104) is fixedly provided in the middle of the mounting groove (103), and a plurality of heat sink fins (107) are fixedly provided at the lower end of the heat sink (104). The dustproof mechanism (3) includes a dustproof net (301), and a plurality of elastic support columns (305) are fixedly provided on the inner walls of the front and rear ends of the dustproof net (301). A pressure block (306) is fixedly provided at the middle of the perimeter of the inner surface of the dustproof net (301).

2. The impact-resistant chip protection structure according to claim 1, characterized in that: Multiple pressure blocks (306) are fixedly provided with buffer protective pads (307) at their lower ends, and the dustproof net (301) is fixedly provided with locking blocks (303) on both sides of its lower end.

3. The impact-resistant chip protection structure according to claim 1, characterized in that: The mounting plate (101) has snap-fit ​​grooves (106) on both sides of its upper end, and multiple empty grooves (105) are provided in the middle of the upper end of the mounting plate (101) near both sides.

4. The impact-resistant chip protection structure according to claim 1, characterized in that: The dustproof net (301) has a mounting block (302) fixedly installed at the middle of the front and rear ends, and a screw (304) is threaded in the middle of the two mounting blocks (302).

5. The impact-resistant chip protection structure according to claim 1, characterized in that: The chip structure (2) includes a chip body (201).

6. The impact-resistant chip protection structure according to claim 5, characterized in that: Multiple pins (202) are fixedly arranged on both sides of the chip body (201).

7. The impact-resistant chip protection structure according to claim 1, characterized in that: Threaded rods (102) are threaded at the four corners of the upper end of the mounting plate (101).

8. The impact-resistant chip protection structure according to claim 1, characterized in that: The mounting plate (101) includes a base layer (10101), and a wear-resistant layer (10102) is fixedly provided on the outer surface of the base layer (10101).

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