Integrated busbar structure

Abstract

The integrated busbar structure comprises a lower insulating film, a busbar, a flexible circuit board and an upper insulating film which are arranged in sequence, the busbar comprises a plurality of confluence pieces used for connecting battery cells in series and / or in parallel, and the confluence pieces are provided with positive electrode contacts and negative electrode contacts used for being connected with the positive electrodes and the negative electrodes of the battery cells. The flexible circuit board is provided with a positive electrode contact and a negative electrode contact, the position between the positive electrode contact and the negative electrode contact is a connection contact, the connection contact is plated with a tin layer, the flexible circuit board is provided with a conductive connection sheet, the conductive connection sheet is coated with solder paste, and the solder paste on the conductive connection sheet and the tin layer on the connection contact are attached and fixed through reflow soldering; the lower insulating film and the upper insulating film are provided with a plurality of process holes, and the process holes are opposite to the positive electrode contact and the negative electrode contact so as to expose the positive electrode contact and the negative electrode contact. Compared with the prior art, the integrated busbar structure provided by the utility model is shorter in manufacturing time and higher in efficiency, and meanwhile, the integrated circuit busbar is more suitable for a cell with a small size.

Description

Technical Field

[0001] This utility model belongs to the field of integrated busbar technology, and specifically relates to an integrated busbar structure. Background Technology

[0002] With the rapid development of new energy technologies, the design of new energy power battery sampling modules faces a series of challenges. Especially with the decreasing size of cylindrical battery cells, traditional sampling line arrangements can no longer meet the new technological requirements. Specifically, as cell size shrinks, there is insufficient space for sampling lines, limiting the module's sampling capabilities and affecting its performance and reliability. If flexible circuit boards are used for sampling, the small cell size necessitates smaller busbars and conductive connectors on the flexible circuit board, increasing the difficulty of soldering. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the existing technology and provide an integrated busbar structure.

[0004] To achieve the above objectives, this utility model discloses an integrated busbar structure, comprising a lower insulating film, a busbar, a flexible circuit board, and an upper insulating film arranged sequentially. The busbar includes multiple bus components for connecting battery cells in series and / or in parallel. Each bus component has positive and negative contacts for connecting to the positive and negative terminals of the battery cells. The position between the positive and negative contacts is a connection contact. The connection contact is plated with a tin layer. The flexible circuit board is provided with a conductive connecting piece. The conductive connecting piece is coated with solder paste. The solder paste on the conductive connecting piece adheres to the tin layer on the connection contact and is fixed by reflow soldering.

[0005] The lower and upper insulating films are provided with multiple process holes, which are opposite to the positive and negative contacts to expose the positive and negative contacts.

[0006] Preferably, the contact point is provided with a through-hole.

[0007] Preferably, there are multiple through-holes.

[0008] Preferably, the plurality of through-holes are evenly distributed.

[0009] Preferably, the lower insulating film and the upper insulating film are PET films, and the lower insulating film and the upper insulating film are fixed by heat pressing.

[0010] Preferably, the lower insulating film, the flexible circuit board, and the upper insulating film are respectively provided with corresponding lower positioning holes, middle positioning holes, and upper positioning holes.

[0011] Preferably, the manifold is provided with a limiting hole.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] During assembly of the integrated busbar structure of this utility model, a tin layer is plated on the connection contacts of the busbar, and solder paste is applied to the conductive connecting piece. The solder paste on the conductive connecting piece is in contact with the tin layer on the connection contact, which can prevent the problem of cold solder joints during the soldering process. The solder paste and tin layer are fixed by reflow soldering. Compared with traditional ultrasonic welding and laser welding methods, this method has a shorter manufacturing time and higher efficiency, and also makes the integrated circuit busbar more suitable for small battery cells.

[0014] The two-layer insulating film not only insulates and protects the busbar and flexible circuit board, but also enhances the overall load-bearing capacity of the product. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the integrated busbar structure in the embodiment;

[0016] Figure 2 for Figure 1 A three-dimensional exploded structural diagram of the integrated busbar structure;

[0017] Figure 3 for Figure 1 A three-dimensional structural diagram of the busbar;

[0018] Lower insulating film 1; process hole 11; lower positioning hole 12;

[0019] Busbar 2; Positive contact 21; Negative contact 22; Connecting contact 23; Through hole 231; Limiting hole 24;

[0020] Flexible circuit board 3; conductive connecting piece 31; central positioning hole 32;

[0021] Upper insulating film 4; upper positioning hole 41. Detailed Implementation

[0022] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] An integrated busbar structure, see Figures 1-3The device includes a lower insulating film 1, a busbar, a flexible circuit board 3, and an upper insulating film 4 arranged sequentially. The busbar includes multiple bus members 2 for connecting battery cells in series and / or in parallel. Each bus member 2 has a positive contact 21 and a negative contact 22 for connecting to the positive and negative terminals of the battery cells. The position between the positive contact 21 and the negative contact 22 is a connection contact 23, which is plated with a tin layer. The flexible circuit board 3 is provided with conductive connecting pieces 31, which are coated with solder paste. The solder paste on the conductive connecting pieces 31 is attached to the solder layer on the connection contact point 23 and fixed by reflow soldering. The bus 2 and the conductive connecting pieces 31 are tightly attached, which can prevent the problem of cold solder joints during the soldering process. The solder paste and the solder layer are fixed by reflow soldering. Compared with traditional ultrasonic soldering and laser soldering, this method has a shorter manufacturing time and higher efficiency. It also makes the integrated circuit busbar more suitable for small-sized battery cells. This is because during the reflow soldering process, the entire integrated busbar is transported into the reflow oven and cooling zone to melt and cool the solder paste. This is more efficient than traditional single-soldering. Since reflow soldering does not require alignment of the connection position of the bus 2 and the conductive connecting pieces 31, it is more suitable for small-sized battery cells.

[0024] In this embodiment, the lower insulating film 1 and the upper insulating film 4 are provided with a plurality of process holes 11. The process holes are opposite to the positive electrode contact 21 and the negative electrode contact 22 to expose the positive electrode contact 21 and the negative electrode contact 22 so as to facilitate the connection of the bus 2 to the battery cell module.

[0025] Preferably, the contact point 23 is provided with a through-hole 231, which facilitates subsequent observation of the soldering effect. At the same time, the solder paste can penetrate into the through-hole 231, which can increase the contact area between the solder paste and the busbar 2 and improve the fixing effect between the busbar 2 and the conductive connecting piece 31.

[0026] Furthermore, there are multiple through-holes 231, which are evenly distributed, making it easier to observe the soldering effect and further improving the fixing effect between the busbar 2 and the conductive connector 31.

[0027] In this embodiment, the lower insulating film 1 and the upper insulating film 4 are PET films. The lower insulating film 1 and the upper insulating film 4 are fixed by hot pressing, which can better insulate and protect the busbar and the flexible circuit board 3.

[0028] In this embodiment, the lower insulating film 1, the flexible circuit board 3, and the upper insulating film 4 are respectively provided with a lower positioning hole 12, a middle positioning hole 32, and an upper positioning hole 41. When the insulating film is hot-pressed, the lower insulating film 1, the flexible circuit board 3, and the upper insulating film 4 can remain relatively fixed, which is beneficial to improving the hot-pressing and fixing effect of the insulating film.

[0029] In this embodiment, the manifold 2 is provided with a limiting hole 24, which can limit and fix the manifold 2 during the welding process, and prevent the manifold 2 from falling off, which would affect the welding quality.

[0030] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. An integrated busbar structure, characterized in that: The device includes a lower insulating film, a busbar, a flexible circuit board, and an upper insulating film arranged in sequence. The busbar includes multiple bus components for connecting battery cells in series and / or in parallel. Each bus component has positive and negative contacts for connecting to the positive and negative terminals of the battery cells. The position between the positive and negative contacts is a connection contact. The connection contact is plated with a tin layer. The flexible circuit board is provided with a conductive connecting piece. The conductive connecting piece is coated with solder paste. The solder paste on the conductive connecting piece adheres to the tin layer on the connection contact and is fixed by reflow soldering. The lower and upper insulating films are provided with multiple process holes, which are opposite to the positive and negative contacts to expose the positive and negative contacts.

2. The integrated busbar structure according to claim 1, characterized in that: The connection point is provided with a through-hole for soldering.

3. The integrated busbar structure according to claim 2, characterized in that: There are multiple through-holes.

4. The integrated busbar structure according to claim 3, characterized in that: The multiple through-holes are evenly distributed.

5. The integrated busbar structure according to claim 1, characterized in that: The lower and upper insulating films are PET films, and the lower and upper insulating films are fixed by heat pressing.

6. The integrated busbar structure according to claim 5, characterized in that: The lower insulating film, the flexible circuit board, and the upper insulating film are respectively provided with corresponding lower positioning holes, middle positioning holes, and upper positioning holes.

7. The integrated busbar structure according to claim 1, characterized in that: The manifold is provided with a limiting hole.

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