Laser processing equipment for half photovoltaic silicon wafer

Abstract

The utility model provides a photovoltaic silicon wafer half piece laser processing equipment, including a processing platform, the processing platform includes a turntable mechanism and at least two laser processing modules, the turntable mechanism includes a turntable and a turntable driver that drives the turntable to rotate, the turntable is uniformly provided with a plurality of bearing jig groups along the circumferential direction, and the laser processing modules are arranged on the turntable. Each bearing jig set comprises at least two bearing jigs, the at least two bearing jigs are arranged in the radial direction of the rotary disc, and each laser processing module corresponds to different bearing jigs in the same bearing jig set. According to the equipment, the multiple bearing jig sets are evenly arranged in the circumferential direction of the rotary disc, each bearing jig set comprises at least two bearing jigs, and the different bearing jigs in the same bearing jig set are machined through different laser machining modules, so that the laser machining breadth is smaller, higher laser machining precision is achieved, and the machining efficiency is improved. And meanwhile, through the processing operation of the plurality of laser processing modules, the processing efficiency of the half photovoltaic silicon wafers is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to photovoltaic silicon wafer processing equipment technical field especially is a kind of photovoltaic silicon wafer laser processing equipment of half piece. BACKGROUND

[0002] Solar photovoltaic cell is the core part of solar cell module, in the production of solar cell, there are two common cell types: full piece cell and half piece cell. Full piece cell refers to the whole cell is made of single crystal silicon. Half piece cell refers to cutting single crystal silicon into two halves, and then connecting two half pieces into cell. Half piece cell can reduce the waste of silicon material, improve the production efficiency and environmental performance of photovoltaic cell module, at the same time, half piece cell performs excellent in thermal stability and PID resistance, which can enhance the life of photovoltaic cell module. Low-loss high-efficiency half piece cell has unique advantages in large-scale application, and is more and more valued by the market.

[0003] At present, the manufacturing cost of half piece cell is high, in order to improve efficiency and reduce cost, the existing half piece cell adopts double piece loading in laser film opening process, so as to realize the processing of two half pieces in one station. This method does not obviously improve the efficiency, because the loading, positioning and detection of each half piece are carried out respectively before laser processing, and two half pieces are processed in a laser processing station, which leads to that the working hours of laser processing station are obviously longer than those of loading, positioning and detection, and affects the processing efficiency of the whole equipment.

[0004] Therefore, it is necessary to optimize the existing equipment. UTILITY MODEL CONTENT

[0005] The utility model solves the technical problem that: provide a kind of photovoltaic silicon wafer laser processing equipment of half piece, can effectively improve the processing efficiency of structure reasonable.

[0006] In order to solve the above technical problem, the technical scheme adopted by the utility model is as follows: a kind of photovoltaic silicon wafer laser processing equipment of half piece, including processing platform, the processing platform includes carousel mechanism and at least two laser processing modules, the carousel mechanism includes carousel and the carousel driver of driving the rotation of carousel, the carousel is uniformly provided with a plurality of bearing jig groups along the circumferential direction, each bearing jig group includes at least two bearing jigs, at least two bearing jigs are arranged along the radial direction of carousel, each laser processing module is respectively arranged in different bearing jigs in same bearing jig group.

[0007] Further, the feeding mechanism and the discharging mechanism each comprise a conveying module for conveying the material, the conveying module comprising at least two groups of conveying lines arranged side by side and a conveying driver for driving the conveying lines to move in the conveying direction, and the at least two groups of conveying lines are connected through a shaft coupling.

[0008] Further, the feeding mechanism and the discharging mechanism each comprise a conveying module for conveying the material, the conveying module comprising at least two groups of conveying lines arranged side by side and a conveying driver for driving the conveying lines to move in the conveying direction, and the at least two groups of conveying lines are connected through a shaft coupling.

[0009] Further, the shaft coupling is a plum blossom type shaft coupling or a cross type shaft coupling.

[0010] Further, the feeding mechanism and the discharging mechanism each comprise a NG discharging module for separating NG material, the NG discharging module comprising a NG discharging mechanical arm and a waste piece groove for accommodating the NG material, and the NG discharging mechanical arm is used to move the NG material on the conveying line to the waste piece groove for storage.

[0011] Further, the waste piece groove forms an angle of 10-15° with the horizontal plane.

[0012] Further, the waste piece groove is provided with a partition plate.

[0013] Further, the feeding mechanism comprises a feeding module, a feeding clamping positioning module, a feeding buffer module and a hidden crack detection module, and the at least two groups of conveying lines of the conveying module of the feeding mechanism pass through the feeding module, the feeding clamping positioning module, the feeding buffer module, the hidden crack detection module and the NG discharging module of the feeding mechanism in sequence and are connected with the transfer mechanism.

[0014] Further, the discharging mechanism comprises an AOI detection module, a NG discharging module of the discharging mechanism, a discharging buffer module, a discharging clamping positioning module and a discharging module, and the at least two groups of conveying lines of the conveying module of the discharging mechanism pass through the AOI detection module, the NG discharging module of the discharging mechanism, the discharging buffer module, the discharging clamping positioning module and the discharging module in sequence.

[0015] Further, the processing platform is provided with a visual positioning mechanism, and the visual positioning mechanism is used for positioning the material placed on the carrying jig.

[0016] The photovoltaic silicon wafer half laser processing equipment has the advantages that the structure is reasonable, and the laser processing efficiency of the photovoltaic silicon wafer half can be effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] The specific structure of the utility model will be described in detail below in combination with the drawings:

[0018] Figure 1 It is the overall structure of the photovoltaic silicon wafer half laser processing equipment of the utility model and the top view;

[0019] Figure 2 It is the top view of the turntable mechanism of the utility model;

[0020] Figure 3 It is the top view of the transfer mechanism of the utility model;

[0021] Figure 4 It is the top view of the conveying mechanism of the utility model;

[0022] Figure 5 It is the front view of the NG blanking module of the utility model;

[0023] 1 - turntable mechanism; 101 - turntable; 102 - bearing fixture group; 103 - inner side material; 104 - outer side material;

[0024] 2 - laser processing module;

[0025] 3 - transfer mechanism; 301 - transfer support arm; 302 - first material grabbing unit; 303 - second material grabbing unit;

[0026] 4 - conveying module; 401 - conveying belt; 402 - material detection unit; 403 - shaft coupling;

[0027] 5 - NG blanking module; 501 - NG blanking mechanical arm; 502 - waste piece groove; 503 - partition;

[0028] 6 - visual positioning mechanism;

[0029] 11 - feeding module; 12 - feeding clamping positioning module; 13 - feeding buffer module; 14 - crack detection module;

[0030] 21 - AOI detection module; 22 - unloading buffer module; 23 - unloading clamping positioning module; 24 - unloading module. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0032] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0033] In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0034] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be connected, or detachable, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0035] In the utility model, unless another definite provision and limitation, first feature is in second feature "on" or "under" can include that first and second features are in direct contact, also can include that first and second features are not in direct contact but contact through other feature between them. Moreover, first feature is in second feature "on", "above" and "upper side" includes that first feature is in second feature directly above and obliquely above, or just indicates that first feature horizontal height is higher than second feature. First feature is in second feature "under", "below" and "under" includes that first feature is in second feature directly below and obliquely below, or just indicates that first feature horizontal height is less than second feature.

[0036] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present specification.

[0037] Embodiment

[0038] Please refer to Figures 1 to 5 The embodiment provides a kind of laser processing equipment of photovoltaic silicon wafer half piece, including processing platform, the processing platform includes carousel mechanism 1 and at least two laser processing modules 2, the carousel mechanism 1 includes carousel 101 and the carousel driver of driving the rotation of carousel 101, carousel 101 is uniformly provided with a plurality of bearing jig groups 102 along the circumferential direction, each bearing jig group 102 includes at least two bearing jigs, at least two bearing jigs are arranged along the radial direction of carousel 101, each laser processing module 2 is correspondingly arranged with different bearing jigs in the same bearing jig group.

[0039] In the embodiment, the processing platform includes carousel mechanism 1 and two laser processing modules 2, the carousel mechanism 1 includes carousel 101 and the carousel driver of driving the rotation of carousel 101, the carousel driver drives carousel 101 to rotate 90 degrees each time.

[0040] Carousel 101 is uniformly provided with four supporting arms along the circumferential direction, each supporting arm is provided with a bearing jig group 102, each bearing jig group 102 is composed of two bearing jigs, one is inner bearing jig close to carousel rotation shaft, and the other is outer bearing jig away from carousel rotation shaft.

[0041] The first, second, third and fourth stations are respectively formed on four directions of the rotating disc 101, wherein the first station is a feeding station, the second station is a standby station, and each of the third and fourth stations is provided with a laser processing module 2, for example, the laser processing module 2 of the third station is used for processing the inner side material 103 on the inner side carrying jig, and the laser processing module 2 of the fourth station is used for processing the outer side material 104 on the outer side carrying jig. By providing one carrying jig corresponding to one laser processing module 2, the laser processing width can be smaller, and the laser processing precision can be higher.

[0042] In operation, two materials to be processed are respectively placed on the inner side carrying jig and the outer side carrying jig of the first arm in the first station, after the placing operation is completed, the rotating disc driver drives the rotating disc 101 to rotate by 90 degrees, and places one material to be processed on each of the inner side carrying jig and the outer side carrying jig of the second arm, after the operation is completed, the rotating disc driver continues to drive the rotating disc 101 to rotate by 90 degrees, at this time, the laser processing module 2 provided in the third station processes the inner side material 103 in the third station, and meanwhile, places one material to be processed on each of the inner side carrying jig and the outer side carrying jig of the third arm. After the processing and placing operations are completed, the rotating disc driver continues to drive the rotating disc 101 to rotate by 90 degrees, and the laser processing module provided in the fourth station processes the outer side material 104 in the fourth station, and meanwhile, places one material to be processed on each of the inner side carrying jig and the outer side carrying jig of the fourth arm. After the processing and placing operations are completed, the rotating disc driver continues to drive the rotating disc 101 to rotate by 90 degrees, at this time, the two processed materials return to the first station, the processed materials are transferred, and new materials to be processed are placed, and the operation is repeated, so as to realize the processing operation of the materials to be processed.

[0043] The laser processing module 2 provided in the third station and the laser processing module 2 provided in the fourth station can simultaneously perform processing operations, that is, when the outer side material 104 in the fourth station is processed, the inner side material 103 in the third station is also simultaneously processed by the corresponding laser processing module 2, and the two materials to be processed are processed in the two stations, thereby reducing the processing time and ensuring the processing efficiency. In addition, since the two materials to be processed are simultaneously processed in a time period, the laser processing time is not prolonged, thereby ensuring the efficiency of the laser processing.

[0044] As preferred in the embodiment, the feeding mechanism and the discharging mechanism are connected with the processing platform through the transfer mechanism 3, the feeding mechanism is used to provide the material to be processed for the processing platform, the discharging mechanism is used to transfer the processed material away from the processing platform, and the transfer mechanism 3 is used to transfer the material to be processed of the feeding mechanism to the carrier jig of the rotating disc mechanism 1 or transfer the processed material from the carrier jig to the discharging mechanism.

[0045] In specific implementation, the feeding mechanism, the discharging mechanism and the transfer mechanism 3 are used to transport the material to be processed, so that the laser processing equipment for the photovoltaic silicon wafer half-piece achieves ideal processing efficiency.

[0046] The transfer mechanism 3 is arranged at one end of the first station close to the processing platform, and the feeding mechanism and the discharging mechanism are arranged at two sides of the transfer mechanism 3 respectively.

[0047] The transfer mechanism 3 specifically includes a transfer driver and a transfer arm 301, the transfer arm 301 is in the shape of "L", and two distal ends of the transfer arm 301 are respectively provided with a first material grabbing unit 302 and a second material grabbing unit 303. The transfer driver can rotate the transfer arm 301 back and forth along the horizontal direction, so as to rotate the first material grabbing unit 302 from the discharging end of the feeding mechanism to the first station and rotate the second material grabbing unit 303 from the first station to the feeding end of the discharging mechanism, or rotate the first material grabbing unit 302 from the first station to the discharging end of the feeding mechanism and rotate the second material grabbing unit 303 from the feeding end of the discharging mechanism to the first station. That is, the action of transferring the material to be processed to the first station and transferring the processed material to the discharging mechanism can be synchronously operated, so as to ensure the transfer efficiency.

[0048] As preferred in the embodiment, the feeding mechanism and the discharging mechanism both include a conveying module 4 used to transport the material, the conveying module 4 includes at least two groups of conveying lines arranged side by side and a conveying driver used to drive the conveying lines to move in the conveying direction, and the at least two groups of conveying lines are connected through a shaft coupling 403.

[0049] In specific implementation, the feeding mechanism and the discharging mechanism both can realize the transportation of the material through the conveying module 4, and the conveying module 4 specifically includes two groups of conveying lines arranged side by side and a conveying driver used to drive the conveying lines to move in the conveying direction. Each group of conveying lines is responsible for the transportation of one material, and the two groups of conveying lines can transport two materials side by side, so as to facilitate the transfer mechanism to transfer the two materials to the two carrier jigs of the first station at the same time.

[0050] In order to ensure the stability and reliability of the material transportation and facilitate the tracking of the position of the material, each group of conveying lines includes two conveying belts 401 arranged in parallel, and a material detection unit 402 can be arranged between the two conveying belts 401.

[0051] In order to simplify the structure of the device, one conveying driver is used to drive two groups of conveying lines, and an axle coupling 403 is arranged between the two groups of conveying lines to synchronize the conveying actions of the two groups of conveying lines.

[0052] As a preferred embodiment in the present embodiment, the axle coupling 403 is a plum blossom type axle coupling or a cross ring type axle coupling.

[0053] In specific implementation, since two groups of conveying lines, i.e., a total of four conveying belts 401, are used to convey the materials, in order to reduce the maintenance difficulty of the conveying lines, the axle coupling 403 is a separable axle coupling such as a plum blossom type axle coupling or a cross ring type axle coupling. When the inner conveying belt needs to be maintained, the connection between the axle coupling 403 and the conveying belt driving shaft is only loosened, the axle coupling 403 is moved to the conveying line on either side, or the axle coupling 403 is separated and then moved to the two groups of conveying lines respectively, so that the disconnection area between the two groups of conveying lines is exposed, and the inner conveying belt 401 can be taken out from the disconnection area by the maintenance personnel. The separable axle coupling has the advantage that the space area outside the shaft can be effectively utilized. After the axle coupling 403 is separated, the space occupied is small, which can reduce the distance between the two groups of conveying lines and make the device more compact as a whole.

[0054] As a preferred embodiment in the present embodiment, the feeding mechanism and the discharging mechanism each include an NG discharging module 5 for separating NG materials, the NG discharging module 5 includes an NG discharging mechanical arm 501 and a waste piece groove 502 for accommodating NG materials, and the NG discharging mechanical arm 501 is used to move the NG materials on the conveying line to the waste piece groove 502 for storage.

[0055] In specific implementation, when the materials are detected to have defects and need to be removed from the processing line, the NG materials on the conveying line can be taken down by the NG discharging mechanical arm 501 of the NG discharging module 5 and moved to the waste piece groove 502 for storage.

[0056] As a preferred embodiment in the present embodiment, the included angle between the waste piece groove 502 and the horizontal plane is 10-15°.

[0057] In specific implementation, since the NG materials are light and thin in sheet structure, they are likely to be unstable due to air resistance during falling, thereby affecting the falling point of the NG materials, and finally causing disordered stacking of the NG materials.

[0058] By setting the waste piece groove 502 to be inclined, when the NG material is moved to above the waste piece groove 502 by the NG unloading mechanical arm 501 and is released, the NG material can slide in the inclined direction under the action of gravity after falling to the bottom of the waste piece groove, realizing automatic arrangement of the NG material and ensuring that the waste piece groove 502 can neatly and effectively accommodate the NG material. In order to ensure the automatic arrangement effect, the included angle between the waste piece groove 502 and the horizontal plane is 10-15°. When the included angle is less than 10°, the NG material cannot overcome the friction, resulting in failure to slide down. When the included angle is greater than 15°, the top end of the waste piece groove 502 will interfere with the NG unloading mechanical arm 501, affecting the unloading of the NG material, or reducing the height of the waste piece groove 502, thereby reducing the inventory of the NG material.

[0059] As a preferred embodiment in the present embodiment, a partition plate 503 is arranged in the waste piece groove 502.

[0060] In specific implementation, the partition plate 503 is arranged in the waste piece groove 502, and the waste piece groove 502 is divided into two storage areas, which respectively accommodate the NG material from the inner side carrying fixture and the NG material from the outer side carrying fixture, effectively avoiding cross stacking of the NG material and being able to more effectively utilize the storage space of the waste piece groove 502.

[0061] As a preferred embodiment in the present embodiment, the feeding mechanism includes a feeding module 11, a feeding clamping positioning module 12, a feeding buffer module 13 and a hidden crack detection module 14. At least two groups of conveying lines of the conveying module 4 of the feeding mechanism pass through the feeding module 11, the feeding clamping positioning module 12, the feeding buffer module 13, the hidden crack detection module 14 and the NG unloading module 5 of the feeding mechanism in sequence and are connected with the transfer mechanism 3.

[0062] In specific implementation, the feeding mechanism is sequentially provided with the feeding module 11, the feeding clamping positioning module 12, the feeding buffer module 13, the hidden crack detection module 14 and the NG unloading module 5 of the feeding mechanism from the feeding end to the unloading end. Two groups of conveying lines of the conveying module 4 of the feeding mechanism pass through the feeding module 11, the feeding clamping positioning module 12, the feeding buffer module 13, the hidden crack detection module 14 and the NG unloading module 5 of the feeding mechanism in sequence and are finally connected with one end of the transfer mechanism 3.

[0063] The material to be processed is transferred from the raw material box to one end of the conveying line by the feeding module 11, is arranged and positioned by the feeding clamping positioning module 12, is temporarily stored in the feeding buffer module 13, is then screened by the hidden crack detection module 14 to obtain NG material and qualified material, the NG material is transferred out of the conveying line by the NG unloading module 5 of the feeding mechanism, and the qualified material is conveyed to the transfer mechanism 3 for transfer and processing.

[0064] As preferred in the embodiment, the unloading mechanism comprises an AOI detection module 21, an NG unloading module 5 of the unloading mechanism, an unloading buffer module 22, an unloading clamping positioning module 23 and an unloading module 24, and at least two groups of conveying lines of the conveying module 4 of the unloading mechanism pass through the AOI detection module 21, the NG unloading module 5 of the unloading mechanism, the unloading buffer module 22, the unloading clamping positioning module 23 and the unloading module 24 in sequence.

[0065] In specific implementation, the unloading mechanism is sequentially provided with the AOI detection module 21, the NG unloading module 5 of the unloading mechanism, the unloading buffer module 22, the unloading clamping positioning module 23 and the unloading module 24 from the feeding end to the unloading end, and two groups of conveying lines of the conveying module 4 of the unloading mechanism pass through the AOI detection module 21, the NG unloading module 5 of the unloading mechanism, the unloading buffer module 22, the unloading clamping positioning module 23 and the unloading module 24 in sequence.

[0066] After the material to be processed is processed, it is transferred from the processing platform to the feeding end of the unloading mechanism by the transfer mechanism 3, is detected by the AOI detection module 21, and the NG material and the qualified material are screened out, the NG material is transferred out of the conveying line by the NG unloading module 5 of the unloading mechanism, and the qualified material is conveyed to the unloading buffer module 22 for temporary storage, then is arranged and positioned by the unloading clamping positioning module 23, and finally is transferred from the conveying line to the discharge box by the unloading module 24.

[0067] As preferred in the embodiment, the processing platform is provided with a visual positioning mechanism 6, which is used for positioning the material placed on the carrying jig.

[0068] In specific implementation, in order to ensure accurate positioning and precise processing of the material to be processed, the processing platform is provided with the visual positioning mechanism 6, which is used for positioning the material placed on the carrying jig, and the angle and position information of the material are sent to the laser processing module 2, the laser processing module 2 adjusts the light emitting direction and light emitting position of the laser according to the angle and position information of the material, so as to realize high-precision processing of the material to be processed.

[0069] The visual positioning mechanism 6 can be arranged at the first station or the second station.

[0070] From the above description, the photovoltaic silicon wafer half piece laser processing equipment has the advantages that the structure is reasonable, and the laser processing efficiency of the photovoltaic silicon wafer half piece can be effectively improved.

[0071] Those skilled in the art can understand that the above-mentioned various embodiments can be freely combined and superimposed without conflict.

[0072] The above is only an embodiment of the present application, and does not limit the patent range of the present application, and any equivalent structure or equivalent process transformation using the content of the present application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection range of the present application.

Claims

1. A laser processing apparatus for photovoltaic silicon wafer halves, characterized by: The machining platform comprises a rotating disc mechanism and at least two laser machining modules, the rotating disc mechanism comprises a rotating disc and a rotating disc driver for driving the rotating disc to rotate, the rotating disc is uniformly provided with a plurality of bearing jig sets in the circumferential direction, each bearing jig set comprises at least two bearing jigs, and the at least two bearing jigs are arranged in the radial direction of the rotating disc, and each laser machining module is arranged corresponding to different bearing jigs in the same bearing jig set.

2. The processing apparatus of claim 1, wherein: The feeding mechanism and the discharging mechanism are connected with the machining platform through the transfer mechanism, the feeding mechanism is used for providing materials to be machined for the machining platform, the discharging mechanism is used for transferring the machined materials away from the machining platform, and the transfer mechanism is used for transferring the materials to be machined of the feeding mechanism to the bearing jigs of the rotating disc mechanism or transferring the machined materials from the bearing jigs to the discharging mechanism.

3. The processing apparatus of claim 2, wherein: The feeding mechanism and the discharging mechanism each comprise a conveying module for conveying materials, the conveying module comprises at least two groups of conveying lines arranged side by side and a conveying driver for driving the conveying lines to move in the conveying direction, and the at least two groups of conveying lines are connected through a shaft coupling.

4. The processing apparatus of claim 3, wherein: The shaft coupling is a plum blossom type shaft coupling or a cross ring type shaft coupling.

5. The processing apparatus of claim 4, wherein: The feeding mechanism and the discharging mechanism each comprise an NG discharging module for separating NG materials, the NG discharging module comprises an NG discharging mechanical arm and a waste piece groove for accommodating NG materials, and the NG discharging mechanical arm is used for moving the NG materials on the conveying lines to the waste piece groove for storage.

6. The processing apparatus of claim 5, wherein: The included angle between the waste piece groove and the horizontal plane is 10-15°.

7. The processing apparatus of claim 6, wherein: The waste piece groove is provided with a partition plate.

8. The processing apparatus of claim 5, wherein: The feeding mechanism comprises a feeding module, a feeding clamping positioning module, a feeding buffer module and a hidden crack detection module, at least two groups of conveying lines of the conveying module of the feeding mechanism pass through the feeding module, the feeding clamping positioning module, the feeding buffer module, the hidden crack detection module and the NG discharging module of the feeding mechanism in sequence and are connected with the transfer mechanism.

9. The processing apparatus of claim 5, wherein: The discharging mechanism comprises an AOI detection module, an NG discharging module of the discharging mechanism, a discharging buffer module, a discharging clamping positioning module and a discharging module, and at least two groups of conveying lines of the conveying module of the discharging mechanism pass through the AOI detection module, the NG discharging module of the discharging mechanism, the discharging buffer module, the discharging clamping positioning module and the discharging module in sequence.

10. The processing apparatus of claim 1, wherein: The machining platform is provided with a visual positioning mechanism, and the visual positioning mechanism is used for positioning the materials placed on the bearing jigs.

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