Temperature and insertion loss test PCB structure and system
By incorporating a multi-layered structure of heating wires and temperature sensing chips within the PCB, the problem of insertion loss measurement error at different temperatures is solved, enabling accurate insertion loss monitoring and ensuring the stability of electronic products.
Patent Information
- Application Number
- CN202422885188.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-11-25
AI Technical Summary
In existing technologies, the measurement of insertion loss of PCBs at different temperatures has a large error, which leads to unstable performance of electronic products.
Design a multilayer PCB structure including a test circuit layer and a heating circuit layer, connected by PP sheet, and set up heating wires and temperature sensing chips. Use a temperature controller to control the temperature of the heating wires. Insertion loss test circuits and temperature sensing chips are connected to the surface pads through vias. An external testing device obtains the insertion loss and temperature.
It enables accurate measurement of insertion loss at different temperatures, reduces measurement errors, and ensures the stability of electronic products.
Smart Images
Figure CN223637654U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to PCB design technical field especially relates to a temperature and insert loss test PCB structure and system. BACKGROUND
[0002] PCB (Printed Circuit Board), Chinese name is printed circuit board. The communication rate of high speed digital system becomes high, the size of large scale integrated circuit shrinks, then the integration density on high speed PCB increases, which makes the temperature on PCB become higher and higher, causes the signal integrity performance of high speed transmission channel on PCB to decline, that is, causes the insert loss (namely insertion loss), the insert loss refers to the weakening degree of signal strength in transmission process when the signal passes through PCB wire, thereby makes the performance of whole electronic product unstable, and even leads to product failure seriously, therefore, the PCB of high speed digital system needs to monitor the signal layer insert loss of PCB when producing, monitors the temperature of PCB generally, places two signal lines with different lengths, measures the loss difference of two lines to accurately obtain the insert loss of this kind of signal line, and measures the temperature of PCB working environment, to obtain the insert loss of PCB under different temperatures comprehensively.
[0003] But PCB works will face different working environment, the temperature is the biggest to the influence that an insert loss shows of PCB, and the temperature of working environment is not very accurate to PCB itself, therefore, the insert loss of PCB under different internal temperatures measured is big error. UTILITY MODEL CONTENTS
[0004] The utility model provides a kind of temperature and insert loss test PCB structure to solve the problem of big error of insert loss of PCB under different internal temperatures measured in prior art.
[0005] Firstly, the utility model provides a kind of temperature and insert loss test PCB structure, PCB is multilayer structure, including test circuit total layer and heating circuit layer, and the test circuit total layer and the heating circuit layer are connected by PP sheet, and the test circuit total layer includes test layer, and the test layer includes insert loss test circuit and temperature measurement chip;
[0006] The heating circuit layer includes heating wire, and the heating wire is used to heat the test layer;
[0007] The heating wire is connected to the surface layer power supply pad of PCB surface layer by guide hole, and the temperature controller outside PCB controls the temperature of the heating wire by the surface layer power supply pad;
[0008] The insertion loss test circuit and the temperature measuring chip are connected to the surface layer test pads of the PCB surface layer through lead holes, and a test device outside the PCB obtains the insertion loss and temperature of the test layer through the surface layer test pads.
[0009] Optionally, the heating circuit layer is further provided with internal power supply pads connected with the heating lines; the internal power supply pads are connected with the surface layer power supply pads.
[0010] Optionally, the number of the internal power supply pads is two, and the two internal power supply pads are connected with the heating lines at the head and tail respectively.
[0011] Optionally, the surface layer test pads include surface layer insertion loss pads and surface layer temperature measuring pads, and the test layer further includes internal temperature measuring pads.
[0012] The insertion loss test circuit is connected with the surface layer insertion loss pads.
[0013] The pins of the temperature measuring chip are connected with the internal temperature measuring pads, and the internal temperature measuring pads are connected with the surface layer temperature measuring pads.
[0014] Optionally, the test circuit total layer further includes a first shielding copper layer and a second shielding copper layer located at the outermost layer, and the test layer is arranged between the first shielding copper layer and the second shielding copper layer.
[0015] Optionally, the first shielding copper layer and the test layer are connected through a PP sheet, and the second shielding copper layer and the test layer are connected through a core plate.
[0016] Optionally, the heating lines are uniformly arranged at the opposite positions of the test layer.
[0017] Optionally, the heating lines are connected with the surface layer power supply pads through wires, the test layer includes lead holes allowing the wires to pass through, and the distance between the lead holes and the edge of the test layer is 1mm.
[0018] Optionally, the distance between the temperature measuring chip and the insertion loss test circuit is at least 40mil.
[0019] In the second aspect, the utility model provides a kind of temperature and insertion loss test PCB system, it is characterized in that, including temperature controller, test device and as the temperature and insertion loss test PCB structure of any one of first aspect, the test device is used to measure insertion loss and temperature.
[0020] The utility model embodiment provides a kind of temperature and insertion loss test PCB structure, PCB is multilayer structure, including test circuit total layer and heating circuit layer, test circuit total layer and heating circuit layer are connected by PP sheet, test circuit total layer includes test layer, and the test layer includes insertion loss test circuit and temperature sensor chip;Heating circuit layer includes heating wire, and heating wire is used to heat test layer;Heating wire is connected to the surface layer power supply pad of PCB surface layer by guide hole, and the temperature controller outside PCB controls the temperature of heating wire by surface layer power supply pad;Insertion loss test circuit and temperature sensor chip are connected to the surface layer test pad of PCB surface layer by guide hole, and the test device outside PCB obtains the insertion loss and temperature of test layer by surface layer test pad.Heating wire is arranged in the adjacent layer of test layer, and the temperature of heating wire is controllable, insertion loss test circuit and temperature sensor chip are arranged in test layer, then the insertion loss and temperature of test layer can be accurately obtained, and the influence of different temperature on insertion loss can be accurately obtained by controlling the temperature change of heating wire.
[0021] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the utility model, and is not used to limit the scope of the utility model. Other features of the utility model will become easy to understand through the following description. BRIEF DESCRIPTION OF DRAWINGS
[0022] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed to be used in the embodiment description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to these drawings without creative labor for those skilled in the art.
[0023] Figure 1 It is a kind of PCB structure schematic diagram provided by the utility model embodiment;
[0024] Figure 2 It is a kind of heating circuit layer structure schematic diagram provided by the utility model embodiment;
[0025] Figure 3 It is a kind of test layer structure schematic diagram provided by the utility model embodiment;
[0026] Figure 4 It is another kind of PCB structure schematic diagram provided by the utility model embodiment. DETAILED DESCRIPTION
[0027] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.
[0028] Figure 1 This is a schematic diagram of a PCB structure provided in an embodiment of the present utility model. The PCB has a multi-layer structure, including a test circuit layer 1 and a heating circuit layer 2. The test circuit layer 1 and the heating circuit layer 2 are connected by a PP sheet. The test circuit layer 1 includes a test layer 11, which includes an insertion loss test circuit 111 and a temperature measuring chip 112.
[0029] Heating circuit layer 2 includes heating wire 21, which is used to heat test layer 11;
[0030] Heating wire 21 is connected to the surface power pad of the PCB through a via. Figure 1 (Not shown in the image), the external temperature controller of the PCB controls the temperature of the heating wire 21 through the surface power pad, making the temperature of the heating wire 21 controllable. The temperature of the heating wire 21 can be adjusted according to actual needs. The heating wire 21 is a resistance heating type. The heating principle of the heating wire 21 mainly utilizes the resistance heating effect generated by the current passing through the conductor to convert electrical energy into heat energy, thereby achieving the purpose of heating.
[0031] Both the insertion loss test circuit 111 and the temperature sensing chip 112 are connected to the surface test pads on the PCB surface through vias. Figure 1 (Not shown in the image), the external testing device on the PCB obtains the insertion loss and temperature of the test layer 11 through the surface test pads. Since the temperature sensing chip 112 and the insertion loss test line 111 are located in the same test layer 11 and are adjacent to each other, the temperature sensing chip 112 can accurately test the ambient temperature of the insertion loss test line 111 when measuring the insertion loss. By adjusting the temperature of the heating wire 21 to regulate the temperature of the test layer 11, the variation of the insertion loss in the test layer under different ambient temperatures can be obtained.
[0032] Specifically, the testing device can be a temperature measuring instrument with temperature measurement function and an insertion loss measuring instrument with insertion loss measurement function, or it can be a device that integrates temperature measurement and insertion loss measurement functions. There are multiple surface test pads on the PCB surface layer, which correspond to the insertion loss test line 111 and the temperature measuring chip 112 respectively. The testing device can obtain the insertion loss and temperature through the corresponding surface test pads.
[0033] PP sheet in PCB is a semi-cured sheet, which is used as an insulating material between adjacent layers of PCB board, also known as pre-impregnated glass cloth, and is a key material for the manufacture of multi-layer printed circuit board (PCB). It is composed of resin and reinforcing materials such as glass cloth, mainly used for interlayer bonding to ensure the mechanical strength and electrical performance of the circuit board.
[0034] The utility model embodiment provides a kind of temperature and insertion loss test PCB structure, PCB is multilayer structure, including test circuit total layer and heating circuit layer, test circuit total layer and heating circuit layer are connected by PP sheet, test circuit total layer includes test layer, and test layer includes insertion loss test circuit and temperature measurement chip;Heating circuit layer includes heating wire, and heating wire is used to heat test layer;Heating wire is connected to the surface layer power supply pad of PCB surface layer by guide hole, and the temperature controller outside PCB controls the temperature of heating wire by surface layer power supply pad;Insertion loss test circuit and temperature measurement chip are all connected to the surface layer test pad of PCB surface layer by guide hole, and the test device outside PCB obtains the insertion loss and temperature of test layer by surface layer test pad.By setting heating wire in the adjacent layer of test layer, the temperature of heating wire is controllable, and by setting insertion loss test circuit and temperature measurement chip in test layer, the insertion loss and temperature of test layer can be accurately obtained, and by controlling the temperature change of heating wire, the influence of different temperatures on insertion loss can be accurately obtained.
[0035] In an optional embodiment, as shown in a structure diagram of heating circuit layer, Figure 2 The internal power supply pad 22 is connected with the surface layer power supply pad, so that the surface layer power supply pad is electrified with the internal power supply pad 22, that is, the power on-off and power size of the heating wire 21 can be controlled through the surface layer power supply pad, that is, whether the heating wire 21 is heated and the heating power size when heated.
[0036] In an optional embodiment, as shown in a structure diagram of heating circuit layer, Figure 2 The number of the internal power supply pad 22 is 2, and the two internal power supply pads 22 are respectively connected with the heating wire 21 at the head and tail.
[0037] In an optional embodiment, the surface layer test pad includes a surface layer insertion loss pad and a surface layer temperature measurement pad, as shown in a structure diagram of test layer, Figure 3 The test layer 11 further includes an internal temperature measurement pad 113.
[0038] The insertion loss test circuit 111 is connected with the surface layer insertion loss pad of PCB surface layer; the surface layer insertion loss pad is used as an output point of insertion loss test circuit 11 to output insertion loss signal.
[0039] The pins of the temperature sensing chip 112 are connected to the internal temperature sensing pad 113; the internal temperature sensing pad 113 is connected to the surface temperature sensing pad, and the surface temperature sensing pad serves as the output point for the temperature signal from the temperature sensing chip 112. During use, the area around the temperature sensing chip 112 should be sealed to prevent cold air from entering and causing heat loss, thus avoiding a decrease in the measured temperature and reducing measurement errors.
[0040] In an optional embodiment, such as Figure 4 The diagram shows another PCB structure. The test circuit layer 1 also includes a first shielding copper layer 12 and a second shielding copper layer 13 located on the outermost layer. The test layer 11 is located between the first shielding copper layer 12 and the second shielding copper layer 13.
[0041] In an optional embodiment, such as Figure 4 As shown, the first shielding copper layer 12 and the test layer 11 are connected by a PP sheet, and the second shielding copper layer 13 and the test layer 11 are connected by a core board.
[0042] The core board is one of the basic components of a PCB (Printed Circuit Board). It is the core structure of a multilayer PCB and consists of copper foil, insulating layers, and copper foil. The main function of the core board is to provide support and conductive paths for the circuit, while also serving as insulation and support.
[0043] In an optional embodiment, the heating wire 21 is uniformly laid opposite the test layer 11. That is, the heating wire 21 is located above or directly below the test layer 11. For example, the heating wire 21 has a line width of 30 mil and a line spacing of 50 mil, and the heating wire 21 is uniformly laid throughout the heating circuit layer 2. Typically, the heating circuit layer 2 also includes a core board, on which the heating wire 21 is disposed. The specific line width of the heating wire 21 can be adjusted according to the required heating rate and power; the greater the required heating rate and power, the greater the required line width.
[0044] In an optional embodiment, the heating wire 21 is connected to the surface power pad via a conductor, and the test layer 11 includes a via that allows the conductor to pass through, the via being 1 mm from the edge of the test layer 11. The advantage of this arrangement is that when the via is located at the edge of the test layer 11, its impact on the insertion loss of the test layer 11 is negligible, thus avoiding any impact of the via on the insertion loss of the test layer 11.
[0045] In an optional embodiment, the temperature sensing chip 112 is at least 40 mil away from the insertion loss test line 111. Maintaining a certain distance can prevent the temperature sensing chip 112 and the insertion loss test line 111 from interfering with each other.
[0046] In an alternative embodiment, the utility model also provides a temperature and insertion loss test PCB system, specifically includes temperature controller, test device and the temperature and insertion loss test PCB structure as the embodiment described above, the test device is used for measuring insertion loss and temperature. Test device can include temperature measuring instrument and insertion loss measuring instrument, also can be the device that integrates temperature and insertion loss function as a whole.
[0047] The PCB structure and the PCB system of the utility model, in general, are that heating wires are arranged on the adjacent layers of the total layer of test circuit (the test circuit is in N layers, and PP sheets or core boards are arranged between two layers, so the adjacent layers refer to N+2 or N-2 layers), connection pads are connected, and the holes are drilled to the surface layer, the power supply is connected to heat the test module, the temperature measuring chip is buried on the test circuit layer and does not affect the signal of the circuit, the chip pin is connected to the pad and drilled, and the pad is connected to the surface layer after electroplating, and the thermometer is connected, so that the temperature change of the signal layer can be monitored in real time, the influence of the temperature change on the insertion loss can be measured, that is, the heating wire and the temperature measuring wire are added near the signal line in the PCB for insertion loss test, the temperature change and the insertion loss under the actual temperature are monitored in real time. During the test, the heating wire is connected to the pad of the outer layer, the power supply with a temperature controller is used for heating, the required test temperature is maintained, the temperature measuring chip is connected to the temperature controller, the temperature of the insertion loss circuit layer is controlled (the computer can also be connected to read continuous temperature data), and the insertion loss line is tested through the pad connected to the outer layer (the network analyzer can be used for calculation). Through the PCB structure of the utility model, the fluctuation of the insertion loss in the PCB with the temperature change can be conveniently monitored in real time.
[0048] It should be understood that the various forms of flow shown above can be used to reorder, add or delete steps. For example, the steps described in the utility model can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions of the utility model can be achieved, which are not limited herein.
[0049] The above specific embodiments do not constitute a limitation on the protection scope of the utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principles of the utility model should be included in the protection scope of the utility model.
Claims
1. A temperature and insertion loss test PCB structure, characterized by, The PCB is a multi-layer structure, comprising a total layer of test circuit and a layer of heating circuit, the total layer of test circuit and the layer of heating circuit are connected by PP sheets, the total layer of test circuit comprises a test layer, the test layer comprises an insertion loss test circuit and a temperature measuring chip; The layer of heating circuit comprises a heating line, the heating line is used for heating the test layer; The heating line is connected to a surface layer power supply pad of the PCB through a lead hole, a temperature controller outside the PCB controls the temperature of the heating line through the surface layer power supply pad; The insertion loss test circuit and the temperature measuring chip are both connected to a surface layer test pad of the PCB through a lead hole, a test device outside the PCB obtains the insertion loss and the temperature of the test layer through the surface layer test pad.
2. The temperature and insertion loss test PCB structure of claim 1, wherein, The layer of heating circuit is further provided with an internal power supply pad connected with the heating line; the internal power supply pad is connected with the surface layer power supply pad.
3. The temperature and insertion loss test PCB structure of claim 2, wherein, The number of the internal power supply pad is 2, the two internal power supply pads are respectively connected with the head and tail of the heating line.
4. The temperature and insertion loss test PCB structure of claim 1, wherein, The surface layer test pad comprises a surface layer insertion loss pad and a surface layer temperature measuring pad, the test layer further comprises an internal temperature measuring pad; The insertion loss test circuit is connected with the surface layer insertion loss pad; The pin of the temperature measuring chip is connected with the internal temperature measuring pad; the internal temperature measuring pad is connected with the surface layer temperature measuring pad.
5. The temperature and insertion loss test PCB structure of claim 1, wherein, The total layer of test circuit further comprises a first shielding copper layer and a second shielding copper layer located at the outermost layer, the test layer is arranged between the first shielding copper layer and the second shielding copper layer.
6. The temperature and insertion loss test PCB structure of claim 5, wherein, The first shielding copper layer and the test layer are connected by a PP sheet, the second shielding copper layer and the test layer are connected by a core plate.
7. The temperature and insertion loss test PCB structure of claim 1, wherein, The heating line is uniformly laid on the opposite position of the test layer.
8. The temperature and insertion loss test PCB structure of any of claims 1-7, wherein, The heating line is connected with the surface layer power supply pad through a lead wire, the test layer comprises a lead hole allowing the lead wire to pass through, the distance between the lead hole and the edge of the test layer is 1mm.
9. The temperature and insertion loss test PCB structure of any of claims 1-7, wherein, The distance between the temperature measuring chip and the insertion loss test circuit is at least 40mil.
10. A temperature and insertion loss test PCB system, characterized by, The temperature and insertion loss test PCB structure comprises a temperature controller, a test device and the temperature and insertion loss test PCB structure according to any one of claims 1-9, the test device is used for measuring insertion loss and temperature.