Parallel shunt type liquid cooling plate

Abstract

The utility model discloses a parallel shunting type liquid cooling plate, comprising a liquid cooling substrate, the surface of the liquid cooling substrate is provided with a flow channel pipe, the flow channel pipe comprises a main flow channel pipe, the main flow channel pipe is connected in series with a plurality of parallel shunting pipes, the other end of the main flow channel pipe is provided with two branch flow channel pipes, and the two branch flow channel pipes are connected in series. A main body collecting pipe is arranged at the tail end of the runner pipe on the liquid cooling substrate, and is connected with radiating fins; the five flow channels at the liquid inlet pipe orifice are connected in parallel for shunting, the pressure drop of the system can be reduced, and the parallel structure enables the cooling liquid to be more uniformly distributed among the battery monomers through shunting and parallel flowing, so that the temperature difference among the battery packs is reduced, the temperature difference is greatly reduced, and the heat dissipation efficiency of the battery pack is improved by utilizing the advantage of good heat dissipation effect of the parallel structure. And meanwhile, due to the slender flow channel structure design, the flow speed is increased, the structure is optimized and reinforced through the heat dissipation effect, and the heat dissipation efficiency is fully improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to liquid cooling plate technical field, concretely relates to a parallel shunt type liquid cooling plate. BACKGROUND

[0002] Liquid cooling plate is a kind of heat-generating device heat is indirectly transferred to the closed cooling liquid in circulating pipeline by cold plate, and the cold plate is usually a closed cavity made of heat-conducting metals such as copper and aluminum, and the heat is removed by the cooling liquid, and the liquid cooling plate is generally a metal plate or a metal tube extruded or stamped by an aluminum alloy die, which is welded into a shape, and the inlet and outlet of the liquid cooling medium circulation are generally machined from AL6061 material and welded with the liquid cooling plate.

[0003] In the patent with the application number 201922326320.7, a liquid cooling plate is disclosed. Compared with the prior art, the application can reduce the heat generated by the liquid cooling plate to the heat exchange between the battery box and the air outside the battery pack, thereby reducing the heat loss. Therefore, it is not necessary to add thermal insulation material between the battery box and the buffer pad, or to add thermal insulation material around the battery box. It can also play a role in heat preservation and heat loss reduction. It can reduce the cost while ensuring the cooling or heating effect of the liquid cooling plate. In addition, since the thermal insulation part is plastic, the density is lower than that of aluminum, so it can reduce the weight. In combination with the above application, compared with the prior art, although the liquid cooling plate can effectively transfer heat by circulating cooling liquid in the internal flow channel, there is a problem of uneven temperature distribution. There are still deficiencies in the structural design. Among them, the PACK temperature difference of the existing 104s type liquid cooling plate product is mostly controlled within 3℃, to ensure the stability and efficiency of the heat dissipation performance. If the temperature difference between the inlet and outlet of the liquid cooling plate is too large, even if the surface temperature is normal, there may still be hot spots inside, which will adversely affect the life and performance of the element, thereby affecting the heat dissipation efficiency and practicality. Therefore, we propose a parallel shunt type liquid cooling plate. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a parallel shunt type liquid cooling plate to solve the problem of uneven temperature distribution in the existing liquid cooling heat dissipation product, although the liquid cooling plate can effectively transfer heat by circulating cooling liquid in the internal flow channel, there are still deficiencies in the structural design. Among them, the PACK temperature difference of the existing 104s type liquid cooling plate product is mostly controlled within 3℃, to ensure the stability and efficiency of the heat dissipation performance. If the temperature difference between the inlet and outlet of the liquid cooling plate is too large, even if the surface temperature is normal, there may still be hot spots inside, which will adversely affect the life and performance of the element, thereby affecting the heat dissipation efficiency and practicality.

[0005] To achieve the above object, the utility model provides the following technical scheme: a parallel shunt type liquid cooling plate, including liquid cooling substrate, the surface of liquid cooling substrate is provided with flow channel pipe, the flow channel pipe includes main flow channel pipe, and a plurality of parallel shunt pipes are also connected in series on the main flow channel pipe, the other end of main flow channel pipe is provided with two shunt pipes, and the end of flow channel pipe on liquid cooling substrate is provided with main body bus pipe, the main body bus pipe is connected with radiating fin, and the other end of radiating fin is provided with liquid outlet.

[0006] Preferably, a plurality of grooves are equidistantly arranged on the radiating fin, and the grooves are used for increasing the surface area of the radiating fin.

[0007] Preferably, the other end of the parallel shunt pipe is provided with a branch shunt pipe, and the branch shunt pipe is used for shunting.

[0008] Preferably, the branch shunt pipe is symmetrically provided with two shunt pipes.

[0009] Preferably, a plurality of branch shunt pipes are shunted to a shunt pipe and are provided with a branch bus pipe.

[0010] Preferably, the other end of the branch bus pipe is provided with a main body bus pipe, and the main body bus pipe is used for bus.

[0011] Preferably, the other end of the main body bus pipe and one of the parallel shunt pipes are in communication with the radiating fin.

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] (1) the five flow channels at the liquid inlet are parallel shunted, one of the flow channels is divided into two, and the structure can reduce the system pressure drop;

[0014] (2) the parallel structure is shunted and flows in parallel, so that the cooling liquid can be more uniformly distributed between the battery monomers, thereby reducing the temperature difference between the battery packs, the temperature difference is greatly reduced, the advantages of the parallel structure are used, the overall heat dissipation performance is optimized, the flow rate is increased by the slender flow channel structure design, the heat dissipation effect is optimized and reinforced, and the heat dissipation efficiency is fully improved;

[0015] (3) the parallel structure is used, the use of complex pipes and connecting pieces is reduced, and the failure risk is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a structural schematic view of the utility model;

[0017] As shown in the figure: 100, liquid cooling base plate; 101, liquid inlet; 102, main flow channel pipe; 103, two-way flow channel pipe; 104, parallel flow pipe; 105, branch flow pipe; 106, branch flow pipe; 107, main body flow pipe; 108, heat dissipation fin; 109, liquid outlet. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0019] EMBODIMENT

[0020] Please refer to Figure 1 The present application provides a technical solution: a liquid cooling plate is formed by processing flow channels in a metal plate, electronic components are installed on the surface of the water cooling plate and a heat conducting medium is coated in the middle, the cooling liquid in the interior enters from the inlet and flows out from the outlet while carrying the heat of the components, thereby carrying away the heat generated by the electronic elements on the liquid cooling plate to maintain the normal working temperature of the electronic elements. A parallel shunt type liquid cooling plate comprises a liquid cooling base plate 100, a flow channel pipe is formed on the surface of the liquid cooling base plate 100, the flow channel pipe comprises a main flow channel pipe 102, a plurality of parallel shunt pipes 104 are connected in series with the main flow channel pipe 102, a two-way flow channel pipe 103 is arranged at the other end of the main flow channel pipe 102, a main body flow pipe 107 is arranged at the end of the flow channel pipe on the liquid cooling base plate 100, heat dissipation fins 108 are connected to the main body flow pipe 107, a plurality of grooves are equidistantly formed on the heat dissipation fins 108, the grooves are used to increase the surface area of the heat dissipation fins 108, a branch flow pipe 105 is arranged at the other end of the parallel shunt pipe 104, the branch flow pipe 105 is used for shunting, and the shunt pipes on the branch flow pipe 105 are symmetrically arranged in two. When the liquid cooling plate in the present application is used for cooling, the cooling liquid enters the main flow channel pipe 102 through the liquid inlet 101 on the liquid cooling base plate 100, a two-way flow channel pipe 103 is arranged at one end of the main flow channel pipe 102, the two-way flow channel pipe 103 is divided into two, and parallel shunting is performed, so that the structure can reduce the pressure.

[0021] Specifically, the multiple branch flow distribution pipes 105 are connected in parallel and provided with a branch flow collecting pipe 106, the other end of the branch flow collecting pipe 106 is provided with a main body collecting pipe 107, the main body collecting pipe 107 is used for collecting, the other end of the main body collecting pipe 107 and one of the parallel flow distribution pipes 104 are communicated with the radiating fins 108, the rest of the cooling liquid also enters the parallel flow distribution pipe 104 from the main flow channel pipe 102, when the cooling liquid flows to the branch flow distribution pipe 105, the cooling liquid is distributed, the distribution can increase the contact area of the flow channel and the fin column, take away more heat, at the same time, the fine and dense flow channel and the ridge are beneficial to support the box body, reduce the span of the support, at the same time, the slender flow channel structure design makes the flow velocity increase, the structural design of the product effectively utilizes the advantages of series-parallel structure, optimizes the overall heat dissipation performance, the distributed cooling liquid flows to the main body collecting pipe 107 from the branch flow collecting pipe 106 and then enters the radiating fins 108, the radiating fins 108 can dissipate heat and also play a role of disturbing flow, ensure the heat dissipation effect, when the cooling liquid is discharged from the liquid outlet 109, the heat dissipation cycle is completed.

[0022] Although the embodiments of the present application have been shown and described, it is to be understood that for the purpose of the present application, the embodiments can be changed, modified, replaced and varied in many ways without departing from the principles and spirit of the present application, the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A parallel shunt liquid cold plate comprising a liquid cold base plate (100), characterized in that: The surface of the liquid cooling substrate (100) is provided with a flow channel pipe, the flow channel pipe comprises a main flow channel pipe (102), and a plurality of parallel branch pipes (104) are connected in series on the main flow channel pipe (102); the other end of the main flow channel pipe (102) is provided with a two-branch flow channel pipe (103); the end of the liquid cooling substrate (100) located at the flow channel pipe is provided with a main body flow collecting pipe (107); the main body flow collecting pipe (107) is connected with a heat dissipation fin (108); the other end of the heat dissipation fin (108) is provided with a liquid outlet (109).

2. The parallel shunt liquid cold plate of claim 1, wherein: A plurality of slots are equidistantly arranged on the heat dissipation fin (108), and the slots are used to increase the surface area of the heat dissipation fin (108).

3. The parallel shunt liquid cold plate of claim 1, wherein: The other end of the parallel branch pipe (104) is provided with a branch flow branch pipe (105), and the branch flow branch pipe (105) is used for flow distribution.

4. The parallel shunt liquid cold plate of claim 3, wherein: The branch flow branch pipe (105) is symmetrically provided with two branch flow pipes.

5. The parallel flow liquid cold plate of claim 4, wherein: A plurality of branch flow pipes distributed by the branch flow branch pipe (105) are collected and provided with a branch flow collecting pipe (106).

6. The parallel flow liquid cold plate of claim 5, wherein: The other end of the branch flow collecting pipe (106) is provided with a main body flow collecting pipe (107), and the main body flow collecting pipe (107) is used for flow collection.

7. The parallel flow liquid cold plate of claim 6, wherein: The other end of the main body flow collecting pipe (107) and one of the parallel branch pipes (104) are in communication with the heat dissipation fin (108).

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