Novel overvoltage suppression module

Abstract

The utility model discloses a novel overvoltage suppression module, which belongs to the technical field of electric appliances or equipment for protecting electrical equipment from being influenced by voltage spikes, and solves the problems of poor heat dissipation, large volume, high material consumption and high manual control cost of an installation mode of the conventional overvoltage suppressor in a glue filling packaging process. A main body is packaged by an integrated packaging mold technology, an insert is arranged in the main body, an output interface is arranged on the insert, a groove structure is arranged on the front surface of the main body, and post-insulation treatment is carried out in the groove structure; two hooking tables are symmetrically arranged on the end face of the main body, and output interfaces of the inserts are fixed through the hooking tables. According to the utility model, the insulativity and aesthetic property of the device are not affected, and the post-insulation processing technology can effectively improve the insulation performance of the product; the output interface is designed to be in a plug-in mode and can be reliably plugged with an elastic interface of a protected device, the size of the protected device is not affected after plug-in, and the power supply has the advantages of being compact in structure, safe, reliable, attractive, reliable in plug-in and the like.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the electrical or device technical field that protects electrical equipment from voltage peak influence, specifically relates to a novel overvoltage suppression module. BACKGROUND

[0002] At present, the overvoltage suppressor of the low-voltage electrical appliance industry in the domestic production is mostly filled with glue and packaged, and the appearance size is relatively large and shares the wiring terminal with the control circuit of the protected device, and these overvoltage suppressors have the following defects: first, the packaging process of filling glue affects the heat dissipation performance of the overvoltage suppressor, and improper control of the glue filling process will cause bubbles in the glue layer, affecting the insulation performance of the device; second, the overvoltage suppressor packaged by filling glue has a large volume and high material consumption, and after being assembled with the protected device, the appearance size of the protected device is affected, thereby affecting the expandability of the protected device; third, the existing screw mounting method affects the reliability of the customer wiring, the artificial control cost is high, and poor screw mounting will cause the protected device to discharge, short circuit and other problems, affecting the use performance of the protected device. SUMMARY

[0003] The utility model aims at providing a novel overvoltage suppression module to solve the problems of poor heat dissipation, large volume, high material consumption and high artificial control cost of the existing overvoltage suppressor filling and packaging process.

[0004] The technical scheme of the utility model is as follows: a novel overvoltage suppression module, which comprises a main body, the main body is packaged by one-piece packaging mold technology, the main body is internally provided with an embedded part, the embedded part is provided with an output interface, the front surface of the main body is provided with a recess structure, the surface of the recess is roughened for subsequent back insulation treatment in the recess structure; the end surface of the main body is symmetrically provided with two hanging tables, and the output interface of the embedded part is fixed on the hanging tables.

[0005] As a further improvement of the utility model, the front surface and the back surface of the main body are symmetrically provided with multiple thimble process holes, the main body is fixed and packaged through the thimble process holes, and the thimble process holes on the front surface of the main body are covered during back insulation treatment.

[0006] As a further improvement of the utility model, the embedded part is composed of electronic components and a contact plate, and the embedded part is of resistance-capacitance type, pressure-sensitive resistance type or transient suppression diode type.

[0007] As a further improvement of the utility model, two hooks are symmetrically arranged on the back surface of the main body.

[0008] As a further improvement of the utility model, multiple holes are arranged on the back surface of the main body.

[0009] As a further improvement of the utility model, the end surface and the bottom surface of the main body are provided with positioning process grooves.

[0010] The overvoltage suppression module has the advantages that the overvoltage suppression module is packaged by using an integrated packaging mold, the compact structure is provided with a groove structure on the front surface of the main body, the groove structure is subjected to post-insulation treatment, the safety insulation of the main body is improved, the front surface of the main body subjected to the post-insulation treatment can be subjected to laser marking, and the markability and the aesthetic appearance of the main body are improved.

[0011] 1、 This overvoltage suppression module adopts an integrated packaging mold to package the main body insert, has a compact structure, the main body front surface is provided with a groove structure, the groove structure is subjected to post-insulation treatment, the safety insulation of the main body is improved, the front surface of the main body subjected to the post-insulation treatment can be subjected to laser marking, and the markability and the aesthetic appearance of the main body are improved.

[0012] 2、 This overvoltage suppression module is reliably plugged with the elastic terminal of the protected device in a plug-in manner and is embeddedly installed in the protected device, and does not affect the appearance size of the protected device.

[0013] The utility model discloses an overvoltage suppression module packaged by using an integrated packaging mold, compared with the voltage suppressor made of traditional glue filling packaging, the utility model does not affect the insulation and the aesthetic appearance of the device, the groove structure is designed on the front surface of the module main body and is subjected to post-insulation treatment, and the insulation performance of the product can be effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the front surface structure schematic drawing of the utility model;

[0015] Figure 2 It is the front surface structure schematic drawing of the utility model;

[0016] Figure 3 It is the back surface structure schematic drawing of the utility model;

[0017] Figure 4 It is the end surface structure schematic drawing of the utility model;

[0018] Figure 5 It is the bottom surface structure schematic drawing of the utility model;

[0019] Figure 6 It is the insert structure schematic drawing of the utility model.

[0020] In the drawing: 1, main body;2, insert;3, groove;5, thimble process hole;6, hook;7, electronic component;8, contact plate;9, hanging table;10, output interface;11, hole mouth;12, positioning process groove. DETAILED DESCRIPTION

[0021] The utility model will be further explained in detail in combination with the drawings and specific embodiments.

[0022] For example, Figures 1-6As shown, a new overvoltage suppression module includes a main body 1, the main body 1 is packaged by an integrated packaging mold technology, the main body 1 is internally provided with an embedded part 2, the embedded part 2 is provided with an output interface 10, the front surface of the main body 1 is provided with a groove 3 structure, the surface of the groove 3 is roughened, so that the subsequent rear insulation treatment in the groove 3 structure is facilitated; the end surface of the main body 1 is symmetrically provided with two hanging tables 9, the output interface 10 of the embedded part 2 is fixed.

[0023] The front surface and the back surface of the main body 1 are symmetrically provided with a plurality of thimble process holes 5, the main body 1 is fixed by the thimble process holes 5 for integrated packaging, and the thimble process holes 5 on the front surface of the main body 1 are covered by the rear insulation treatment.

[0024] The embedded part 2 is composed of an electronic component 7 and a contact plate 8, and the embedded part 2 is of a resistance-capacitance type, a pressure-sensitive resistor type or a transient suppression diode type.

[0025] The back surface of the main body 1 is symmetrically provided with two hooks 6, and the back surface of the main body 1 is provided with a plurality of hole openings 11. The end surface and the bottom surface of the main body 1 are provided with positioning process grooves 12.

[0026] The main body 1 is packaged by an integrated packaging mold technology, the main body 1 is internally provided with an embedded part 2, the front surface of the main body 1 is provided with a groove 3 structure, the surface of the groove 3 is roughened, so that the subsequent rear insulation treatment in the groove 3 structure is facilitated, the rear insulation treatment can cover the thimble process holes 5 on the front surface of the main body 1, the safety insulation of the main body 1 is improved, and the front surface of the main body 1 after the rear insulation treatment can be laser marked, so that the appearance of the main body 1 is improved.

[0027] The end surface of the main body 1 is symmetrically provided with two hanging tables 9, the output interface 10 of the embedded part 2 is fixed, the output interface 10 can be reliably plugged with the elastic plug-in terminals of the protected device, and the plugging reliability of the output interface 10 and the protected device is improved.

[0028] The integrated packaging mold technology includes the thimble process holes 5 and the positioning process grooves 12 for positioning the main body 1, the thimble process holes 5 are designed on the front surface and the back surface of the main body 1, the positioning process grooves 12 are arranged on the end surface and the bottom surface of the main body 1, the embedded part 2 is packaged in the main body 1, the front surface and the back surface of the main body 1 are symmetrically provided with a plurality of thimble process holes 5, the thimble process holes 5 play a fixing role for the main body 1 in the integrated packaging mold packaging process, the integrated packaging mold packaging process is good, and the packaged main body 1 is compact in structure.

[0029] The embedded part 2 is composed of three types of electronic components 7 and contact plates 8, namely: a resistance-capacitance type, a pressure-sensitive resistor type and a transient suppression diode type, and the embedded parts 2 of the three types all have the ability to suppress or eliminate overvoltage.

[0030] The back of the main body 1 is provided with two hooks 6, and the hooks 6 and the hooking table 9 can enable the main body 1 to be embeddedly installed in the protected device without affecting the size of the protected device.

[0031] The back of the main body 1 is symmetrically provided with four holes 11, and the holes 11 can enhance the heat dissipation performance of the main body 1.

[0032] The positioning process tank 12 can improve the positioning accuracy of the device, and the main body 1 can be conveniently positioned in place through the positioning process tank 12, so that the production efficiency is greatly improved, and the effect is more remarkable in the case of large quantity and tight time; the positioning process tank 12 can also be used in combination with other positioning elements, such as screws, flanges, cones and the like, so that the diversity of the positioning mode is increased, and the positioning is more stable.

[0033] The back insulation treatment refers to a process of further insulating reinforcement or repair of the main body which has been packaged, and in the back insulation treatment, the components need to be thoroughly dusted first to remove the surface contaminants and residual electrophoretic paint or other impurities, the purpose of the dusting treatment is to ensure that the surface of the groove 3 of the main body 1 is clean so as to facilitate subsequent processing; the surface after the dusting treatment is clean and free of impurities, so as to ensure that the insulating paint can be firmly attached to the surface of the groove 3, and the dusting treatment can be completed by using a dust removal device or an air gun; the surface of the groove 3 after the dusting treatment is coated with insulating paint, and the commonly used insulating paint includes epoxy resin, polyester and the like, and the purpose of the coating is to form an insulating layer to prevent current leakage or short circuit; after the insulating layer is coated, solidification treatment must be carried out to firmly combine the insulating layer with the surface of the component, and the solidification can be completed by heating or other chemical methods; the surface after the insulation treatment is inspected to ensure that there is no defect and leakage phenomenon; the inspection can be carried out by visual inspection or using professional tools. Through the back insulation treatment, the electrical safety and service life of the component can be significantly improved, current leakage and short circuit can be prevented, and the stable operation of the equipment can be ensured.

[0034] The utility model discloses a one-piece packaging mold packaging is realized, through the design recess 3 in module main body 1 front and carries out the back insulation treatment, can effectively improve the insulating performance of product, the main body 1 front after the back insulation treatment can carry out laser marking, improve the product's appearance. The output interface 10 of the insert 2 is in the plug-in mode, can be reliably plugged with the elastic interface of the protected device, and the volume of the protected device is not affected after plugging, and the utility model has the advantages of compact structure, safe and reliable, beautiful, reliable plug-in and the like. The utility model as important electronic protector, it can effectively prevent the overvoltage or overcurrent caused by lightning, power grid anomaly and other factors, thereby protecting the safe and stable operation of electronic equipment and power system.

Claims

1. A novel overvoltage suppression module comprising a main body, characterized by: The main body (1) is packaged by one-piece packaging mold technology, the main body (1) is internally provided with an embedded part (2), the embedded part (2) is provided with an output interface (10), the front surface of the main body (1) is provided with a recess (3) structure, the surface of the recess (3) is roughened, and the recess (3) structure is convenient for subsequent back insulation treatment; the end surface of the main body (1) is symmetrically provided with two hanging tables (9), and the output interface (10) of the embedded part (2) is fixed.

2. A novel overvoltage suppression module as claimed in claim 1, wherein: The front surface and the back surface of the main body (1) are symmetrically provided with a plurality of thimble process holes (5), the main body (1) is fixed and packaged by the thimble process hole (5), and the thimble process hole (5) on the front surface of the main body (1) is covered by back insulation treatment.

3. A novel overvoltage suppression module according to claim 1 or 2, characterized in that: The embedded part (2) is composed of an electronic component (7) and a contact plate (8), and the embedded part (2) is of a resistance-capacitance type, a pressure-sensitive resistance type or a transient suppression diode type.

4. A novel overvoltage suppression module according to claim 3, characterized in that: The back surface of the main body (1) is symmetrically provided with two hooks (6).

5. A novel overvoltage suppression module as claimed in claim 4, wherein: The back surface of the main body (1) is provided with a plurality of holes (11).

6. A novel overvoltage suppression module according to claim 5, characterized in that: The end surface and the bottom surface of the main body (1) are provided with positioning process grooves (12).

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