Shielding cover structure, tuner module and electronic equipment

Abstract

The utility model discloses a shielding case structure, a tuner module and electronic equipment. The shielding case structure comprises a shielding case body and an adapter, the shielding case body defines a mounting cavity, and the adapter is connected with one end of the shielding case body and partially located in the mounting cavity. Wherein the shielding case body is a semi-enclosed component, and at least one side, facing the shielding case body, of the mounting cavity is open. According to the technical scheme, the problem of rusting of the shielding cover structure can be reduced or avoided, and the stability of the shielding cover structure is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic components, and in particular to a shielding cover structure, a high-frequency head module and an electronic device. BACKGROUND

[0002] A high-frequency head is a device used by a display device to receive high-frequency signals and demodulate video information, and affects the stability of the image. The high-frequency head is often wrapped with a shielding cover structure to shield electromagnetic interference.

[0003] In related technologies, the shielding cover is usually made of metal material. In a long-term use process, the shielding cover has a problem of rusting on the appearance, which affects the shielding performance of the shielding cover, thereby easily affecting the normal work of the high-frequency head and leading to poor stability of the image. CONTENT OF THE UTILITY MODEL

[0004] Embodiments of the present application provide a shielding cover structure, a high-frequency head module and an electronic device, which can reduce or avoid the problem of rusting of the shielding cover structure and improve the stability of the shielding cover structure.

[0005] The first aspect of the embodiments of the present application provides a shielding cover structure, which comprises

[0006] a shielding cover body defining an installation cavity; and

[0007] an adapter connected to one end of the shielding cover body and partially located in the installation cavity;

[0008] The shielding cover body is a half-enclosed member, and the installation cavity is open to at least one side of the shielding cover body.

[0009] In an embodiment, the bottom of the shielding cover body is provided with an opening, and the installation cavity is open to the bottom of the shielding cover body through the opening.

[0010] In an embodiment, the shielding cover body comprises:

[0011] a top plate arranged opposite to the opening; and

[0012] a side wall plate connected to the top plate along the circumference of the top plate, and one end of the side wall plate away from the top plate defines the opening;

[0013] The top plate and the side wall plate are an integral member, and the adapter is connected to the side wall plate.

[0014] In an embodiment, the connection between the side wall plate and the top plate is provided with a transition part, and the transition part is configured to transitionally connect the outer surfaces of the side wall plate and the top plate.

[0015] In an embodiment, the outer surface of the transition portion is inclinedly arranged relative to the top plate and the side plate.

[0016] In an embodiment, the outer surface of the transition portion is curved, and the outer surface of the transition portion is smoothly connected with the outer surface of the top plate and the outer surface of the side plate.

[0017] In an embodiment, the inner wall of the mounting cavity is provided with a plurality of clamping portions, and the plurality of clamping portions are arranged along the circumference of the open side of the mounting cavity for clamping the circuit board.

[0018] In an embodiment, the material of the shielding cover body is stainless steel; and / or,

[0019] The adapter includes a connecting spring in the mounting cavity, and the material of the connecting spring is stainless steel.

[0020] The second aspect of the embodiments of the present application provides a high-frequency head module, and the high-frequency head module comprises:

[0021] The shielding cover structure according to any one of the above; and

[0022] A circuit board is arranged in the shielding cover structure and electrically connected with the adapter.

[0023] The third aspect of the embodiments of the present application provides an electronic device, and the electronic device comprises:

[0024] A main control board; and

[0025] The high-frequency head module as described above is arranged on the main control board, and the circuit board is electrically connected with the main control board.

[0026] Based on the above embodiments, the shielding cover structure of the embodiments of the present application sets the shielding cover body as a semi-enclosed structure, so that the mounting cavity is partially open. On the one hand, the circuit board can be directly installed through the open side of the shielding cover body, which reduces or avoids the case that the shielding cover body is divided into several parts and then connected through welding points or riveting points, thereby reducing the welding points or riveting points, simplifying the process, improving the assembly efficiency and reducing the cost. On the other hand, reducing the welding points can reduce the influence of the rust of the welding points on the appearance and structure of the shielding cover body, and improve the stability of the shielding cover body, so as to more effectively ensure that the circuit board is not interfered by electromagnetic interference and ensure the image stability. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only represent some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from the structures shown in these drawings without any creative effort.

[0028] Figure 1 Structure schematic diagram of an embodiment of the high-frequency head module of the present application;

[0029] Figure 2 Structure schematic diagram of an embodiment of the high-frequency head module of the present application; Figure 1 Structure schematic diagram of an embodiment of the high-frequency head module of the present application;

[0030] Figure 3 Structure schematic diagram of an embodiment of the high-frequency head module of the present application; Figure 1 Structure schematic diagram of an embodiment of the high-frequency head module of the present application;

[0031] Figure 4 Structure schematic diagram of an embodiment of the shielding cover structure of the present application;

[0032] Figure 5 Structure schematic diagram of an embodiment of the shielding cover structure of the present application; Figure 2 Structure schematic diagram of an embodiment of the shielding cover structure of the present application;

[0033] Explanation of reference numerals:

[0034] 1000, high-frequency head module; 100, shielding cover structure; 10, shielding cover body; 11, mounting cavity; 12, open mouth; 13, top plate; 15, side wall plate; 151, front plate; 1511, positioning groove; 1513, folded part; 153, rear plate; 155, left side plate; 157, right side plate; 1571, positioning protrusion; 17, transition part; 19, buckle part; 30, adapter; 31, connecting spring; 200, circuit board.

[0035] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the present application more clear, the following will further describe the embodiments of the present application in combination with the drawings.

[0037] The following description refers to the accompanying drawings. Unless otherwise indicated, like numbers in the different figures indicate the same or similar elements. The following description, given together with the accompanying drawings, is illustrative of the application and is not intended to limit the application in any manner.

[0038] In the description of the present application, it is understood that the terms "first", "second" and the like are only for the purpose of description and cannot be understood as indicating or implying relative importance. The above terms can be understood in the specific meaning in the present application by the ordinary skill in the art. In addition, in the description of the present application, "a plurality of" means two or more, unless otherwise specified. The association relationship of the associated objects is described, which means that there can be three kinds of relationships, for example, A and / or B can represent the existence of A alone, the existence of A and B at the same time, and the existence of B alone. The character " / " generally represents an "or" relationship between the associated objects before and after it.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terms used in the specification of the present application are only for the purpose of describing the specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more associated listed items.

[0040] Electronic devices such as televisions, smart screens, etc. display audio and video information by converting received digital signals into audio and video information to meet the user's audio and video experience. The electronic device includes a main control board and a high frequency head module, the main control board is provided with a video processing chip, and the high frequency head module is arranged on the main control board and electrically connected with the main control board.

[0041] The video processing chip is used to process video signals to realize the playing and display of high definition and ultra-high definition videos. The high frequency head module is a device used by electronic devices such as televisions and smart screens to receive high frequency signals and demodulate video information. Its function is to amplify weak video signals and process image distortion and interference caused by unstable transmission. The video processing chip in the electronic device determines the resolution of the image, and the high frequency head module affects the stability of the image.

[0042] The high frequency head module includes a circuit board and a shielding cover arranged outside the circuit board. The circuit board is electrically connected with the main control board, and the shielding cover is used to wrap the circuit board to avoid external electromagnetic interference and ensure the stability of the image.

[0043] In the related art, the shielding cover is usually made of metal material. During a long period of use, the shielding cover has the problem of rusting on the appearance. In the assembly process of the high frequency head module, a plurality of welding points need to be arranged on the shielding cover. Not only is the process complex, but also the production efficiency of the production supplier is low, the cost is high, and the more welding points, the more likely to rust. Therefore, the rusting problem of the shielding cover may affect the shielding performance of the shielding cover, thereby easily affecting the normal work of the high frequency head and causing the stability of the image to deteriorate.

[0044] To solve the above problems, please refer to Figures 1 to 3The shielding cover structure 100 provided in the present application comprises a shielding cover body 10 and an adapter 30. The shielding cover body 10 defines an installation cavity 11 for accommodating a circuit board 200 of a high-frequency head module 1000, and the adapter 30 is connected to one end of the shielding cover body 10 and partially located in the installation cavity 11.

[0045] It can be understood that the adapter 30 is electrically connected to the circuit board 200 arranged in the installation cavity 11 to realize signal transmission. The number of adapters 30 is not limited in the embodiments of the present application. In the embodiment shown in FIG. 1, the shielding cover structure 100 comprises two adapters 30, which are arranged side by side on one side of the shielding cover body 10, and each of the two adapters 30 is provided with a connecting spring 31 extending into the installation cavity 11. Correspondingly, the circuit board 200 is provided with two connecting contacts corresponding to the two connecting springs 31. Thus, the electrical connection between the adapter 30 and the circuit board 200 is realized through the connection between the two connecting springs 31 and the two connecting contacts. Figure 3

[0046] In the embodiments of the present application, the shielding cover body 10 is a half-enclosing member. The shielding cover in the related art is composed of two shell bodies, so as to wrap the circuit board 200 inside the shielding cover. During assembly, the circuit board 200 and the shielding cover need to be connected by welding points, and the shell bodies of the shielding cover also need to be connected by welding points. Thus, the circuit board 200 is fully wrapped, which is called a full-enclosing structure. In comparison with the full-enclosing structure, the so-called half-enclosing member is that the shielding cover body 10 of the present application does not completely wrap the circuit board 200. As shown in FIG. 1, in the embodiments of the present application, the installation cavity 11 is open to at least one side of the shielding cover body 10. Figure 3

[0047] Thus, the shielding cover structure 100 of the present application sets the shielding cover body 10 as a half-enclosing structure, so that the installation cavity 11 is partially open. On the one hand, the circuit board 200 can be directly installed through the open side of the shielding cover body 10, which reduces or avoids the case that the shielding cover body 10 is divided into several parts and then connected by welding points or riveting points, thereby reducing the welding points or riveting points, simplifying the process, improving the assembly efficiency and reducing the cost. On the other hand, the reduction of the welding points can reduce the influence of the rusting of the welding points on the appearance and structure of the shielding cover body 10, and improve the stability of the shielding cover body 10, so as to more effectively ensure that the circuit board 200 is not interfered by electromagnetic waves and ensure the image stability.​​

[0048] Please refer to Figures 2 to 4 , and the up-down direction, the front-back direction and the left-right direction shown in Figure 2 and Figure 4 , wherein the up-down direction, the front-back direction and the left-right direction are perpendicular to each other. In some embodiments of the present application, the lower part along the up-down direction is the bottom of the shielding cover body 10, and the bottom of the shielding cover body 10 is provided with an opening 12, and the mounting cavity 11 is open to the bottom of the shielding cover body 10 through the opening 12. Understandably, the shape of the opening 12 can be adapted to the shape of the circuit board 200, for example, the circuit board 200 is a substantially square plate, and the shape of the opening 12 is also adaptively configured as a square opening. Of course, in other embodiments, if the circuit board 200 is a circular plate, the shape of the opening 12 can also be configured as a circular or elliptical opening. In the embodiment of the opening 12 at the bottom of the shielding cover body 10, the circuit board 200 can be mounted into the mounting cavity 11 through the opening 12, which is more convenient for installation. When the high-frequency head module 1000 is installed on the main control board, the opening 12 is covered by the main control board, so that the circuit board 200 is protected in the mounting cavity 11, which ensures the shielding effect of the shielding cover body 10 and improves the stability of the circuit board 200. Understandably, the bottom of the shielding cover can also be provided with connecting feet to be fixedly connected with the main control board.

[0049] Specifically, the shielding cover body 10 includes a top plate 13 and a side wall 15, the top plate 13 is arranged opposite to the opening 12, and the side wall 15 is connected to the top plate 13 along the circumferential direction of the top plate 13, and the end of the side wall 15 away from the top plate 13 defines the opening 12. In combination with Figure 4 , for example, the top plate 13 is arranged in a substantially square shape, and the side wall 15 includes four side plates, which can be a front plate 151, a rear plate 153, a left side plate 155 and a right side plate 157, respectively. The upper end of the front plate 151, the rear plate 153, the left side plate 155 and the right side plate 157 is connected to the four edges of the top plate 13, respectively, and the lower end of the front plate 151, the rear plate 153, the left side plate 155 and the right side plate 157 is connected to the four edges of the top plate 13, respectively. The above-mentioned opening 12 is formed by the lower end of the front plate 151, the rear plate 153, the left side plate 155 and the right side plate 157. Of course, in other embodiments, the top plate 13 can also be pentagonal or triangular, and each edge of the top plate 13 is provided with a corresponding side plate connected thereto, and the embodiments of the present application do not limit this.

[0050] The following will continue to take the example structure shown in Figures 2 to 5 for specific explanation and description:

[0051] In an embodiment of the present application, the top plate 13 and the side plate 15 are an integral component. For example, the top plate 13 and the side plate 15 can be cut from the same prototype plate material, and the side plate 15, i.e., the front plate 151, the rear plate 153, the left plate 155, and the right plate 157, are respectively bent to the same side of the top plate 13, so that the processing is simpler and more efficient. Please refer to Figure 2 and Figure 5 The front and rear ends of the left plate 155 and the right plate 157 are respectively provided with a positioning protrusion 1571, the rear plate 153 is provided with a positioning groove 1511, the front plate 151 is also provided with a positioning groove 1511 and a folding portion 1513 outside the positioning groove 1511, and the positioning protrusions 1571 of the left plate 155 and the right plate 157 respectively extend into the positioning grooves 1511 of the front plate 151 and the rear plate 153, and the folding portion 1513 is attached to the outside of the left plate 155 and the right plate 157, so as to improve the structural strength and stability of the shielding case body 10 as a whole.

[0052] Alternatively, in other embodiments of the present application, the top plate 13 and the side plate 15 can also be directly integrally formed, such as casting, and the present application does not limit the embodiments. It can be understood that the integrally formed top plate 13 and side plate 15 not only facilitate production and processing, improve processing efficiency, but also improve the structural integrity of the shielding case body 10, reduce the riveting points and welding points, and reduce the risk of rusting.

[0053] Please refer to Figure 2 The transition portion 17 is configured to transitionally connect the outer surfaces of the side plate 15 and the top plate 13. In an embodiment, the four transition portions 17 are respectively configured at the connection portions of the front plate 151, the rear plate 153, the left plate 155, and the right plate 157 and the top plate 13. As shown in Figure 5 Optionally, the outer surface of the transition portion 17 is an arc surface, and the outer surface of the transition portion 17 is smoothly connected with the outer surface of the top plate 13 and the outer surface of the side plate 15. Compared with the edge portion of the shielding case in the related art which is arranged at an angle, in the present embodiment, the water at the top plate 13 and the transition portion 17 is guided to other places by the transition portion 17, and is not easily deposited and accumulated at the connection portion of the side plate 15 and the top plate 13, so as to avoid rusting at the connection portion of the side plate 15 and the top plate 13. The arc-shaped transition portion 17 can better guide the water, so as to effectively avoid water accumulation.

[0054] In another embodiment, the outer surface of the transition portion 17 is a guide slope which is arranged obliquely relative to the top plate 13 and the side plate 15. It can be understood that the guide slope connects the outer surface of the top plate 13 and the outer surface of the side plate 15, and can also play a role of guiding water, avoiding water from being deposited and accumulated at the connection between the side plate 15 and the top plate 13, thereby also avoiding rust at the connection between the side plate 15 and the top plate 13.

[0055] In order to further avoid rust of the shielding cover body 10, the shielding cover body 10 is made of stainless steel material, which can not only prevent rust, but also reduce the material cost of the shielding cover body 10. Further, in an embodiment, the shielding cover structure 100 includes two adapters 30, and the two adapters 30 are connected to the front plate 151, and the two connecting springs 31 of the two adapters 30 are arranged in the mounting cavity 11. In this embodiment, the material of the connecting spring 31 is also stainless steel, thereby further reducing the cost and improving the rust prevention performance of the shielding cover structure 100.

[0056] For the mounting relationship between the shielding cover structure 100 and the circuit board 200, in combination with Figure 3 and Figure 4 In an embodiment, the inner wall of the mounting cavity 11 is provided with a plurality of buckle portions 19, and the plurality of buckle portions 19 are arranged at intervals along the circumferential direction of the open side of the mounting cavity 11, so as to be buckled with the circuit board 200. The buckle portion 19 can be arranged at the bottom of the side plate 15, so as to facilitate the installation of the circuit board 200, such as arranging the buckle portion 19 at the inner side of the rear plate 153, the left plate 155 and the right plate 157. In this way, during assembly, the circuit board 200 and the shielding cover structure 100 can be connected in a buckling manner, on the one hand, the assembly is more simple and convenient, and the assembly efficiency is improved, on the other hand, the welding points of the shielding cover structure 100 can be reduced, and the rust condition is further reduced. Alternatively, a plurality of buckling positions can also be arranged on the circuit board 200, and the plurality of buckling positions correspond to the plurality of buckle portions 19 one by one, which is beneficial to improve the stability of the circuit board 200 in the mounting cavity 11, and can also play a foolproof role.

[0057] The above is the specific explanation and description of the shielding cover structure 100 of the embodiment of the present application. It can be understood that, since the high-frequency head module 1000 and the electronic equipment of the embodiment of the present application apply the shielding cover structure 100 described above, all the effects of the above embodiments are also possessed, which will not be described one by one here.

[0058] The same or similar reference numerals in the drawings of the embodiments correspond to the same or similar components; in the description of the present application, it is understood that if the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right" and the like are based on the orientations or positional relationships shown in the drawings, they are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationships in the drawings are only used for exemplary illustration and cannot be understood as a limitation on the present application, for those skilled in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0059] The above is only a preferred embodiment of the present application, and is not used to limit the present application, any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A shield structure, characterized by, The shielding cover body defines a mounting cavity; And The adapter connects one end of the shielding cover body and is partially located in the mounting cavity; Wherein, the shielding cover body is a half-enclosed member, and the mounting cavity is open to at least one side of the shielding cover body. The bottom of the shielding cover body is provided with an opening, and the mounting cavity is open to the bottom of the shielding cover body through the opening.

2. The shield structure of claim 1, wherein, The shielding cover body comprises:

3. The shield structure of claim 2, wherein, a top plate arranged opposite to the opening; and a side wall plate connected to the top plate along the circumference of the top plate, and the end of the side wall plate away from the top plate defines the opening; Wherein, the top plate and the side wall plate are an integral member, and the adapter connects the side wall plate. The transition part is configured to transitionally connect the outer surfaces of the side wall plate and the top plate.

4. The shield structure of claim 3, wherein The outer surface of the transition part is an inclined surface relative to the top plate and the side wall plate.

5. The shield structure of claim 4, wherein, The outer surface of the transition part is a curved surface, and the outer surface of the transition part is smoothly connected with the outer surface of the top plate and the outer surface of the side wall plate.

6. The shield structure of claim 4, wherein, The inner wall of the mounting cavity is provided with a plurality of buckle parts, and the plurality of buckle parts are arranged along the circumference of the open side of the mounting cavity for clamping the circuit board.

7. The shield structure of claim 1, wherein The material of the shielding cover body is stainless steel; and / or 8. The shield structure of any one of claims 1 to 7, wherein, The adapter comprises a connecting spring located in the mounting cavity, and the material of the connecting spring is stainless steel. The shielding cover structure according to any one of claims 1 to 8; 9. A high-frequency head module, characterized in that, And The circuit board is arranged in the shielding cover structure and electrically connected with the adapter. The main control board; And 10. An electronic device, comprising: The high-frequency head module according to claim 9 is arranged on the main control board, and the circuit board is electrically connected with the main control board. ​ ​ ​

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