Double-end pumping slab laser amplifier based on temperature control
By using a temperature-controlled double-ended pumped slab laser amplifier to dynamically adjust the cooling temperature of the pump light, the problem of incomplete absorption of the pump light in the double-ended pumped slab laser amplifier was solved, thus achieving high-energy, high-power laser output and improved beam quality.
Patent Information
- Application Number
- CN202423288371.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing technologies struggle to achieve sub-nanosecond, kilohertz-joule-level high-energy, high-power laser output. Furthermore, in dual-pump slab laser amplifiers, the pump light is difficult to be completely absorbed by the gain medium, leading to residual pump light damaging the pump module and increasing system complexity and cost.
A temperature-controlled dual-pump slab laser amplifier dynamically adjusts the cooling temperature of the pump light by setting temperature detection components and water-cooling equipment at both ends of the slab heat sink module. This ensures full absorption of the pump light, reduces the risk of damage from escaping pump light, and optimizes the pump light distribution through a pump shaping lens group.
It achieves high beam quality laser output at kilohertz, picosecond, and joule levels, reduces the risk of damage from escape pump light, simplifies optical components, reduces manufacturing costs, and extends the lifespan of laser diode array components.
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Figure CN223638781U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of high power solid laser, specifically is a kind of double-end pumped slab laser amplifier based on temperature control. BACKGROUND
[0002] High repetition rate, high energy short pulse laser has wide application prospect in the field of laser processing, laser ignition and photoelectric countermeasure. Short cavity Q-switching technology is a kind of short period laser generation technology, and Q-switching technology is also called Q-switching technology. The continuous laser energy output is compressed to a narrow pulse, so that the peak power of the light source can be increased by several orders of magnitude. But the small mode volume in the short length laser cavity limits the increase of pulse energy.
[0003] And short cavity Q-switching technology combined with master oscillator power amplifier (MOPA) technology can further improve the output energy of short pulse laser. For MOPA technology, the thermal lens effect of gain module is inevitable, which reduces the beam quality of laser output, and even causes damage to optical elements. The characteristics of gain medium in slab laser amplifier are that the ratio of width to thickness is generally large, and the heat is dissipated through two large side surfaces. Compared with rod laser, the heat dissipation area of slab gain medium is increased, and the heat dissipation speed in the thickness direction is accelerated. Moreover, the two-dimensional thermal effect is simplified to one-dimensional thermal effect, so that the thermal effect of slab gain medium is greatly suppressed, and the birefringence effect is reduced, which is convenient for heat management.
[0004] Therefore, slab laser amplifier becomes one of the most effective ways to obtain high power and high beam quality laser output. But at present, slab laser amplifier has not realized kilohertz joule level nanosecond laser output, one of the reasons is that the pumping power is difficult to further improve, so double-end pumping technology appears, which further improves the pumping power. But in the process of double-end pumped slab amplification, the residual pump light is difficult to be completely absorbed by the gain medium, and the residual pump light will enter the other end pumping module through the gain medium, which will damage the pumping module. In order to isolate the residual pump light, a set of isolation system is added, which increases the complexity of the system and the production cost. When improving the pumping power, the uniformity of heat distribution and the stability of pumping wavelength of slab are also reduced. Therefore, the existing technology is difficult to realize near ten thousand watt double-end pumped tunable high energy high power laser output.
[0005] It should be particularly pointed out that the above technical information is only intended to deepen the understanding of the overall background technology of the utility model, and should not be regarded as acknowledging or implying in any form that the above technical information constitutes prior art known to those skilled in the art. CONTENT OF UTILITY MODEL
[0006] In view of the deficiencies in the prior art, the utility model provides a double -end pumping batten laser amplifier based on temperature control, solves the problem that current prior art cannot realize nearly ten thousand watt double -end pumping tunable high -energy high -power laser output.
[0007] The technical scheme of the present application is:
[0008] A double -end pumping batten laser amplifier based on temperature control, including respectively setting in batten heat sink module both ends' end face pumping laser module, pump light from the end face pumping laser module is introduced into the batten gain medium in the batten heat sink module, laser is introduced into the batten gain medium from any end face of the batten gain medium, the end face pumping laser module, the batten heat sink module are connected with temperature detection component and temperature control component, the temperature detection component includes temperature probe one for monitoring the temperature of the end face pumping laser module, temperature probe two for monitoring the side of the batten gain medium, temperature probe three for monitoring the top of the batten gain medium, the temperature control component includes water cooling equipment one for adjusting the temperature of the end face pumping laser module, water cooling equipment four, further including water cooling equipment two for adjusting the temperature of the batten heat sink module, water cooling equipment three.
[0009] Further, the housing is provided with a pump light source component, the pump light is emitted from the pump light source component and then passes through the pump shaping lens group and is introduced into the batten heat sink module through the waveguide.
[0010] Further, the pump shaping lens group includes a cylindrical convex lens one, a cylindrical convex lens two and a cylindrical concave lens arranged in sequence along the light path of the pump light, the cylindrical convex lens one, the cylindrical convex lens two and the cylindrical concave lens are movably connected with the housing, the central axis of the curved surface of the cylindrical convex lens one is arranged in the vertical direction, and the central axes of the curved surfaces of the cylindrical convex lens two and the cylindrical concave lens are arranged in the horizontal direction.
[0011] Further, the water cooling equipment four includes a terminal water cooling plate connected with the pump light source component and a front end water cooling plate arranged between the pump shaping lens group and the waveguide, and the terminal water cooling plate and the front end water cooling plate are connected with the housing.
[0012] Further, the pump light source component includes a laser diode flow guide assembly and a laser diode array assembly connected with each other, the laser diode array assembly is provided with a temperature probe one, and the temperature probe one is connected with a control system one of the water cooling equipment one.
[0013] Further, the plate heat sink module comprises a plate gain medium, both sides of the plate gain medium are provided with heat sink microchannels, outer sides of the heat sink microchannels are provided with heat sink flow guides, the heat sink flow guides are respectively provided with two heat sink water inlets and one heat sink water outlet along the length direction of the plate gain medium, and the heat sink water outlet is arranged between the two heat sink water inlets.
[0014] Further, the contact surface between the heat sink microchannel and the plate gain medium is provided with a groove, the temperature probe two is arranged in the groove, and the temperature probe two is connected with a control system two of a water cooling device two.
[0015] Further, the plate gain medium adopts YAG+NG:YAG+YAG bonded crystals, both ends of the plate gain medium are provided with inclined surfaces, and the laser is introduced into the plate gain medium from the inclined surface of any one end.
[0016] Further, the waveguide is connected with the side surface of the plate gain medium, and the pump light is introduced into the side surface of the plate gain medium from the side surface of the plate gain medium.
[0017] Further, the top and the bottom of the plate heat sink module are provided with cover plate assemblies, the cover plate assemblies comprise upper cover plates and lower cover plates which are detachably connected with the heat sink flow guides respectively, the upper cover plates are provided with strip-shaped holes for sliding of the temperature detection assemblies, and the lower cover plates are connected with fixed bases.
[0018] Further, the temperature detection assembly comprises a sliding block which is in sliding fit with the through hole, the sliding block is connected with a fixing groove for clamping the temperature probe three, the temperature probe three is in contact with the top surface of the plate gain medium, and the temperature probe three is connected with a control system three of a water cooling device three.
[0019] The specific beneficial effects of the utility model include:
[0020] 1. The utility model relates to two end face pumped laser modules, when pump light is introduced into the plate gain medium from two side surfaces of the plate gain medium, the escaped pump light is extremely easy to enter the end face pumped laser module when being output from the side surface of the plate gain medium, and irreversible damage is caused to the internal components, in order to reduce the damage risk, it is necessary to ensure that the absorption of pump light is as full as possible, and the peak wavelength of the output pump light is easy to change with the refrigeration temperature, therefore, the peak wavelength of the pump light is dynamically controlled by dynamically controlling the pump refrigeration temperature, the plate gain medium fully absorbs the pump light, and therefore the damage risk of the escaped pump light is reduced.
[0021] 2. The utility model has compact structure, simplifies optical elements and compresses cost.
[0022] 3. The utility model discloses a refrigeration temperature of pump light is controlled, and the power of escape pump light is greatly reduced, reaches the lossless amplification of double -end pump under the state of no isolation.
[0023] 4. The utility model discloses can realize kilohertz, hundred picosecond, joule level and high laser output of light beam quality;
[0024] 5. The utility model discloses through real -time temperature monitoring, dynamic adjustment board strip temperature distribution, improve laser light beam quality;
[0025] 6. The utility model discloses through temperature control end face pump laser module refrigeration, prolongs laser diode array assembly life's simultaneously, improved board strip gain medium's absorption efficiency to pump light. BRIEF DESCRIPTION OF DRAWINGS
[0026] In order to more clearly illustrate the utility model embodiment, the following will be needed to use the drawing in the embodiment description briefly introduce, obviously, the following description in the drawing only some embodiments of the utility model, for those skilled in the art, under the premise of not paying creative labor, can also obtain other drawings according to these drawings.
[0027] Figure 1 It is the schematic diagram of the utility model;
[0028] Figure 2 It is the sectional view of end face pump laser module;
[0029] Figure 3 It is the schematic diagram of board strip heat sink module;
[0030] Figure 4 It is the schematic diagram of board strip gain medium;
[0031] Figure 5 It is the schematic diagram of cover plate assembly;
[0032] Figure 6 It is the schematic diagram of temperature detection component in cover plate assembly.
[0033] Explanation of the attached drawings:
[0034] 1, end face pump laser module;2, cover plate assembly;
[0035] 3, board strip heat sink module;4, fixed base;
[0036] 1-1, water cooling plate of wiring end;1-2, front end water cooling plate;
[0037] 1-3, waveguide;1-4, laser diode flow guide assembly;
[0038] 1-5, laser diode array assembly;1-6, pump shaping lens group;
[0039] 2-1, upper cover plate; 2-2, heat sink fixing hole;
[0040] 2-3, strip-shaped hole; 2-4, sliding block;
[0041] 2-5, sliding block clamping groove;
[0042] 3-1, heat sink water inlet; 3-2, heat sink water outlet;
[0043] 3-3, heat sink micro-channel; 3-4, batten gain medium;
[0044] 3-5, groove; 3-6, heat sink flow guide block; 3-7, inclined surface;
[0045] 2-4-1, sliding block plate; 2-4-2, threaded column;
[0046] 2-4-3, temperature probe fixing plate; 2-4-4, top screw thread hole;
[0047] 2-4-5, fixing groove. DETAILED DESCRIPTION
[0048] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the core idea of the present application and the following embodiments, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0049] The present application provides these embodiments in order to make the present application thorough and complete, and fully express the scope of the present application to those skilled in the art. It should be noted that: unless otherwise specified, the relative arrangement of components and steps, the composition of materials, numerical expressions and numerical values described in these embodiments should be interpreted as merely exemplary, and not as a limitation.
[0050] It should be noted that, in the description of the present application, unless otherwise specified, the meaning of "several" is greater than or equal to two; the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "axial", "radial" and the like are only for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0051] In addition, the "first", "second", and similar words used in the present application do not indicate any order, number or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.
[0052] It should also be noted that in the description of the present application, unless otherwise explicitly specified and limited, the terms "mount", "connect", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through intermediate medium; can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. When it is described that a specific device is located between the first device and the second device, there can be or can not be an intermediate device between the specific device and the first device or the second device.
[0053] All terms used in the present application have the same meaning as understood by those skilled in the art to which the present application belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art, and should not be interpreted in an idealized or excessively formalized sense, unless otherwise defined explicitly herein.
[0054] Techniques, methods and devices known to those skilled in the relevant art can not be discussed in detail, but in appropriate cases, the corresponding techniques, methods and devices should be considered as part of the specification.
[0055] A temperature-controlled double-end-pumped slab laser amplifier, comprising a slab laser amplifier, a temperature control system, and a temperature sensor, wherein the temperature control system is connected to the slab laser amplifier and the temperature sensor, and the temperature control system is configured to control the temperature of the slab laser amplifier according to the temperature detected by the temperature sensor. Figure 1As shown, the end face pumping laser module 1 is arranged at both ends of the slab heat sink module 3, the pump light is introduced into the slab gain medium 3-4 in the slab heat sink module 3 from the end face pumping laser module 1, and the laser is introduced into the slab gain medium 3-4 from any end face of the slab gain medium 3-4; the end face pumping laser module 1 and the slab heat sink module 3 are connected with temperature detection components and temperature control components; the temperature detection components include a temperature probe one for monitoring the temperature of the end face pumping laser module 1, a temperature probe two for monitoring the temperature of the side of the slab gain medium 3-4, and a temperature probe three for monitoring the top of the slab gain medium 3-4; the temperature control components include a water cooling device one and a water cooling device four for adjusting the temperature of the end face pumping laser module 1, and a water cooling device two and a water cooling device three for adjusting the temperature of the slab heat sink module 3.
[0056] Specifically, the end face pumping laser module 1 outputs pump light to the side input window of the slab gain medium 3-4 of the slab heat sink module 3, and then the pump light is reflected by the end face of the slab gain medium 3-4 and enters the inside of the gain medium, and the laser is incident by the end face of the slab gain medium 3-4 and is transmitted in a zigzag shape. The laser continuously absorbs the pump light energy to achieve the purpose of amplifying the laser. While the slab gain medium 3-4 continuously absorbs the pump light, a large amount of waste heat is accumulated, and uneven heat dissipation of the crystal will cause the laser beam quality to decrease. In order to ensure the uniformity of the heat dissipation of the crystal, temperature detection components are installed in different areas, and each temperature detection component is matched with a water cooling device, so as to ensure the uniformity of the temperature distribution of the slab gain medium 3-4 when pumped at different pump powers, and the water cooling devices exist independently.
[0057] The utility model relates to two end face pumped laser module 1, when pumping light is introduced into the board gain medium 3-4 from the two sides of the board gain medium 3-4 respectively, the escape pumping light (pumping light is not absorbed part) is extremely easy to enter end face pumped laser module 1 when outputting from the side of the board gain medium 3-4, causes the irreversible damage to its internal component, in order to reduce the damage risk, need to ensure that the absorption of pumping light is as full as possible. The peak wavelength of the output pumping light is easy to change with the refrigeration temperature, therefore can be dynamically controlled pumping refrigeration temperature to dynamically control the peak wavelength of pumping light, so that the board gain medium 3-4 fully absorbs pumping light, thereby reduce the damage risk of the escape pumping light.
[0058] On the basis of the above embodiment, as a preferred embodiment, as shown in Figure 2 The housing is provided with a pumping light source component, and the pumping light is emitted from the pumping light source component, passes through the pump shaping lens group 1-6, and is introduced into the board heat sink module 3 through the waveguide 1-3. Specifically, the pumping light source component outputs pumping light, which is shaped by the pump shaping lens group 1-6 and enters the waveguide 1-3. Through the homogenization effect of the waveguide 1-3, the pumping transverse field distribution is further optimized, and the pumping light is introduced into the board heat sink module 3 through the waveguide 1-3.
[0059] On the basis of the above embodiment, as a preferred embodiment, the pump shaping lens group 1-6 includes a cylindrical convex lens one, a cylindrical convex lens two and a cylindrical concave lens arranged in sequence along the optical path of the pumping light. The cylindrical convex lens one, the cylindrical convex lens two and the cylindrical concave lens are movably connected with the housing. The central axis of the curved surface of the cylindrical convex lens one is arranged in the vertical direction, and the central axes of the curved surfaces of the cylindrical convex lens two and the cylindrical concave lens are arranged in the horizontal direction.
[0060] Specifically, the distance between the cylindrical convex lens one and the cylindrical convex lens two is less than the distance between the cylindrical convex lens two and the cylindrical concave lens. The cylindrical convex lens one controls the horizontal spot size of the pumping light, and the cylindrical convex lens two and the cylindrical concave lens cooperate to control the vertical spot size of the pumping light. The distance between the cylindrical convex lens one, the cylindrical convex lens two and the cylindrical concave lens is adjustable, and can be adjusted according to different parameters of the pumping light source component. The bottom of each of the cylindrical convex lens one, the cylindrical convex lens two and the cylindrical concave lens is connected with a moving block, and the moving block is slidingly connected with the housing. The distance between the cylindrical convex lens one, the cylindrical convex lens two and the cylindrical concave lens can be adjusted as needed.
[0061] On the basis of the above-mentioned embodiment, as a preferred embodiment, the water cooling device four comprises a terminal water cooling plate 1-1 connected with the pump light source component, a front-end water cooling plate 1-2 arranged between the pump shaping lens group 1-6 and the waveguide 1-3, and the terminal water cooling plate 1-1 and the front-end water cooling plate 1-2 are both provided with water channels, water inlets and water outlets, and are both connected with the shell.
[0062] On the basis of the above-mentioned embodiment, as a preferred embodiment, the pump light source component comprises a laser diode flow guide assembly 1-4 and a laser diode array assembly 1-5 connected with each other, the laser diode array assembly 1-5 is provided with a temperature probe one, the temperature probe one is connected with a control system one of the water cooling device one, the temperature probe one monitors the temperature of the laser diode array assembly 1-5 in real time, and cooperates with the water cooling device one to dynamically adjust the refrigeration temperature of the laser diode array assembly 1-5, so that the peak wavelength of the pump light output is always stabilized near 808.6 nm under different pump currents, and the absorption efficiency of the pump light by the slab gain medium is improved. By controlling the refrigeration temperature of the pump light, the power of the escaped pump light is greatly reduced, the lossless amplification of the double-end pump in the non-isolated state is achieved, the pump structure is simplified, and the manufacturing cost is compressed.
[0063] Specifically, the temperature probe one is connected with the control system one of the water cooling device one, the control system one receives the temperature data from the temperature probe one, and performs real-time display and storage, compares and judges according to the set temperature range and the received actual temperature data, and if the actual temperature exceeds the set range, the control system will issue an instruction to adjust the water cooling device one through an actuator, and the control system one of the water cooling device one constantly monitors the temperature, compares the deviation, issues an instruction, and adjusts the equipment until the actual temperature reaches the set range.
[0064] Specifically, the laser diode array assembly 1-5 can be replaced as needed.
[0065] Specifically, the terminal water cooling plate 1-1 is fixed on the shell, and a small hole is formed in the lower part of the terminal water cooling plate 1-1 to facilitate the positive and negative wires of the laser diode array assembly 1-5 to pass through. The terminal water cooling plate 1-1 absorbs the reflected pump light on the side of the slab gain medium 3-4, the reflected pump light of the pump shaping lens group 1-6 and the escaped pump light, so as to avoid such light from irradiating the positive and negative wires of the laser diode array assembly 1-5 and causing damage to the wires. The terminal water cooling plate 1-1 absorbs the heat energy generated by the pump light and removes the heat through water flow. The front-end water cooling plate 1-2 is tightly attached to the shell, and the front-end water cooling plate 1-2 absorbs the reflected pump light on the side of the slab gain medium 3-4 and the escaped pump light, so as to avoid the reflected light from irradiating the inner wall of the shell and causing the temperature of the inner wall of the shell to continuously rise.
[0066] On the basis of the above-mentioned embodiments, as a preferred embodiment, as shown in Figure 3 The slab heat sink module 3 includes a slab gain medium 3-4, both sides of the slab gain medium 3-4 are provided with heat sink micro channels 3-3, the outer side of the heat sink micro channels 3-3 is provided with heat sink flow guide blocks 3-6, the heat sink flow guide blocks 3-6 are respectively provided with two heat sink water inlets 3-1 and one heat sink water outlet 3-2 along the length direction of the slab gain medium 3-4, and the heat sink water outlet 3-2 is arranged between the two heat sink water inlets 3-1.
[0067] Specifically, the heat sink micro channel 3-3 is to ensure the rapid heat dissipation of the slab gain medium 3-4, the internal fin thickness is 1 mm, the fin spacing is 1.8 mm, and the fin height is 10 mm. The refrigerated water enters the heat sink micro channel 3-3 from the end face side through the flow guide block, then flows in the micro channel through multiple small branches, rapidly takes away the heat of the red copper fin, and achieves the purpose of cooling.
[0068] On the basis of the above-mentioned embodiments, as a preferred embodiment, the contact surface of the heat sink micro channel 3-3 and the slab gain medium 3-4 is provided with a groove 3-5, a temperature probe two is arranged in the groove 3-5, the temperature probe two is connected with a control system two of a water cooling device two, the control system two receives temperature data from the temperature probe two, and performs real-time display and storage, compares and judges according to the set temperature range and the received actual temperature data, and if the actual temperature exceeds the set range, the control system will issue an instruction to adjust the water cooling device two through an actuator, and the control system two of the water cooling device two constantly monitors the temperature, compares the deviation, issues an instruction, and adjusts the equipment until the actual temperature reaches the set range.
[0069] Specifically, the groove 3-5 is 0.5 mm wide and 0.2 mm deep, and the temperature probe two is glued in the groove 3-5, and the water cooling device two is synchronized to ensure the uniformity of the temperature distribution of the slab gain medium 3-4.
[0070] Specifically, the groove 3-5 is provided with three, the groove 3-5 respectively contacts both ends and the middle position of the slab gain medium 3-4, accurately measures the temperature distribution of different regions of the slab gain medium 3-4, dynamically adjusts and controls the temperature distribution of the slab gain medium 3-4 through the flow and temperature control of the heat sink water inlet 3-1 and the heat sink water outlet 3-2. The slab gain medium 3-4 and the heat sink micro channel 3-3 are welded together through an indium welding process to improve the efficiency of heat transfer from the crystal to the outside.
[0071] Specifically, since the pump is end-pumping, the heat generation at both ends of the slab gain medium 3-4 is high, therefore the heat sink inlet 3-1 of the heat sink flow guide block 3-6 is arranged near both ends of the slab gain medium 3-4, and the heat sink outlet 3-2 is arranged in the middle, so as to ensure the uniform distribution of the temperature of the slab gain medium 3-4.
[0072] On the basis of the above-mentioned embodiments, as a preferred embodiment, as shown in Figure 4 the slab gain medium 3-4 is a YAG+NG:YAG+YAG bonded crystal, and the two ends of the slab gain medium 3-4 are respectively provided with inclined surfaces 3-7, and the laser is introduced into the slab gain medium 3-4 from the inclined surface 3-7 at any one end.
[0073] Specifically, the inclined surface 3-7 is 45°, which prevents the generation of ASE and facilitates the introduction of pump light and zigzag transmission of laser.
[0074] On the basis of the above-mentioned embodiments, as a preferred embodiment, the waveguide 1-3 is connected to the side surface of the slab gain medium 3-4, and the pump light is introduced into the side surface of the slab gain medium 3-4 from the side surface of the slab gain medium 3-4.
[0075] On the basis of the above-mentioned embodiments, as a preferred embodiment, the top and bottom of the slab heat sink module 3 are provided with a cover plate assembly 2, the cover plate assembly 2 includes an upper cover plate 2-1 and a lower cover plate which are respectively detachably connected to the heat sink flow guide block 3-6, the upper cover plate 2-1 is provided with a strip-shaped hole 2-3 for sliding of the temperature detection assembly, and the lower cover plate is connected to the fixed base 4.
[0076] On the basis of the above-mentioned embodiments, as a preferred embodiment, as shown in Figure 5 the temperature detection assembly includes a sliding block 2-4 which is in sliding fit with the through hole 2-3, the sliding block 2-4 is connected with a fixing groove 2-4-5 for clamping a third temperature probe, the third temperature probe is in contact with the top surface of the slab gain medium 3-4, and the third temperature probe is connected with a control system three of a third water cooling device, the control system three receives temperature data from the third temperature probe and performs real-time display and storage, compares and judges according to the set temperature range and the received actual temperature data, and if the actual temperature exceeds the set range, the control system will issue an instruction to adjust the third water cooling device through an actuator, and the control system three of the third water cooling device constantly monitors the temperature, compares the deviation, issues an instruction, and adjusts the device until the actual temperature reaches the set range.
[0077] Specifically, the strip-shaped hole 2-3 facilitates the movement of the third temperature probe on the upper cover plate 2-1 to measure the temperature of more to-be-measured points of the slab gain medium 3-4.
[0078] Specifically, four heat sink fixing holes 2-2 are arranged on the upper cover plate 2-1, which are matched with the holes on the heat sink flow guide block 3-6, so as to fix the two heat sinks of the plate gain medium 3-4, and prevent the heat sink from being damaged due to too large tension and pressure when the refrigeration device is connected. The heat sink fixing hole 2-2 is used to fix the upper cover plate 2-1 and the heat sink flow guide block 3-6 through a screw, so as to ensure that the welded part of the plate gain medium 3-4 and the heat sink is not separated due to too large external force.
[0079] Specifically, the sliding block 2-4 is used to fix or move the temperature probe three.
[0080] Specifically, the upper cover plate 2-1 is provided with a sliding block clamping groove 2-5, the sliding block 2-4 can move forward and backward in the strip-shaped hole 2-3, and the sliding block plate 2-4-1 can be fixed on the sliding block clamping groove 2-5 through cooperation of the threaded column 2-4-2 in the sliding block 2-4 and the nut, as shown in Figure 6 The temperature probe fixing plate 2-4-3 is inserted in the threaded column 2-4-2, the threaded column 2-4-2 is provided with a jackscrew threaded hole 2-4-4, the jackscrew threaded hole 2-4-4 is used to adjust the depth of the temperature probe fixing plate 2-4-3 with the fixing groove 2-4-5 downwards, so as to ensure that the temperature probe three is tightly attached to the side surface of the plate gain medium 3-4, and the accuracy of temperature measurement is improved, wherein the fixing groove 2-4-5 on the sliding block 2-4 fixes the temperature probe three at the same time, the temperature probe three embedded in the fixing groove 2-4-5 blocks most of the external leakage pump light, and the absorption of the pump light by the temperature probe three is greatly reduced.
[0081] The non-exhaustive parts of the utility model are conventional technical means known by those skilled in the art.
[0082] The above shows and describes the basic principle, main features and beneficial effects of the utility model. The above is only a preferred embodiment of the utility model, and does not limit the utility model, and any modification, equivalent replacement, improvement, etc. within the spirit and principle of the utility model should be included in the protection scope of the utility model.
Claims
1. A temperature-controlled dual-end pumped slab laser amplifier, comprising end-face pumped laser modules (1) respectively disposed at both ends of a slab heat sink module (3), wherein pump light is introduced from the end-face pumped laser modules (1) into the slab gain medium (3-4) in the slab heat sink module (3), and laser light is introduced from either end face of the slab gain medium (3-4) into the slab gain medium (3-4), characterized in that: The end-pumped laser module (1) and the slab heat sink module (3) are both connected to a temperature detection component and a temperature control component. The temperature detection component includes a temperature probe 1 for monitoring the temperature of the end-pumped laser module (1), a temperature probe 2 for monitoring the side of the slab gain medium (3-4), and a temperature probe 3 for monitoring the top surface of the slab gain medium (3-4). The temperature control component includes a water cooling device 1 and a water cooling device 4 for adjusting the temperature of the end-pumped laser module (1), and also includes a water cooling device 2 and a water cooling device 3 for adjusting the temperature of the slab heat sink module (3).
2. The temperature-controlled dual-ended pumped slab laser amplifier according to claim 1, characterized in that: The end-face pumped laser module (1) includes a housing, in which a pump light source component is disposed. The pump light is emitted from the pump light source component and passes through the pump shaping lens group (1-6), and is introduced into the slab heat sink module (3) through the waveguide (1-3).
3. The temperature-controlled dual-ended pumped slab laser amplifier according to claim 2, characterized in that: The pump shaping lens group (1-6) includes a cylindrical convex lens one, a cylindrical convex lens two, and a cylindrical concave lens arranged sequentially along the optical path of the pump light. The cylindrical convex lens one, the cylindrical convex lens two, and the cylindrical concave lens are all tunably connected to the housing. The curved central axis of the cylindrical convex lens one is arranged in the vertical direction, and the curved central axes of the cylindrical convex lens two and the cylindrical concave lens are both arranged in the horizontal direction.
4. The temperature-controlled dual-ended pumped slab laser amplifier according to claim 2, characterized in that: The water-cooling device four includes a terminal water-cooled plate (1-1) connected to the pump light source component and a front-end water-cooled plate (1-2) disposed between the pump shaping lens group (1-6) and the waveguide (1-3). Both the terminal water-cooled plate (1-1) and the front-end water-cooled plate (1-2) are connected to the housing.
5. The temperature-controlled dual-ended pumped slab laser amplifier according to claim 2 or 3, characterized in that: The pump light source component includes a laser diode current guiding assembly (1-4) and a laser diode array assembly (1-5) connected together. The temperature probe is installed in the laser diode array assembly (1-5), and the temperature probe is connected to the control system of the water cooling device.
6. The temperature-controlled double-ended pumped slab laser amplifier according to any one of claims 1-3, characterized in that: Heat sink microchannels (3-3) are provided on both sides of the slat gain medium (3-4). Heat sink guide blocks (3-6) are provided on the outer side of the heat sink microchannels (3-3). The heat sink guide blocks (3-6) are provided with two heat sink inlets (3-1) and one heat sink outlet (3-2) along the length of the slat gain medium (3-4). The heat sink outlet (3-2) is located between the two heat sink inlets (3-1).
7. The temperature-controlled dual-ended pumped slab laser amplifier according to claim 6, characterized in that: The contact surface between the heat sink microchannel (3-3) and the slab gain medium (3-4) is provided with a groove (3-5), and the second temperature probe is provided in the groove (3-5). The second temperature probe is connected to the control system of the second water cooling device.
8. The temperature-controlled dual-ended pumped slab laser amplifier according to claim 5, characterized in that: The slab gain medium (3-4) is a YAG+NG:YAG+YAG bonded crystal. Both ends of the slab gain medium (3-4) are respectively set as inclined planes (3-7). The laser is introduced into the slab gain medium (3-4) from the inclined plane (3-7) at either end.
9. The temperature-controlled dual-ended pumped slab laser amplifier according to claim 6, characterized in that: The top and bottom of the slat heat sink module (3) are provided with cover plate assemblies (2). The cover plate assembly (2) includes an upper cover plate (2-1) and a lower cover plate that are detachably connected to the heat sink guide block (3-6). The upper cover plate (2-1) is provided with a strip hole (2-3) for the temperature probe to slide. The lower cover plate is connected to the fixed base (4).
10. The temperature-controlled dual-ended pumped slab laser amplifier according to claim 9, characterized in that: The strip hole (2-3) is slidably fitted with a slider (2-4), and the slider (2-4) is connected to a fixing groove (2-4-5) for snapping the temperature probe three. The temperature probe three is in contact with the top surface of the slab gain medium (3-4), and the temperature probe three is connected to the control system three of the water cooling equipment three.